CN106231794A - Cavity type flexible circuit board structure and preparation method thereof - Google Patents
Cavity type flexible circuit board structure and preparation method thereof Download PDFInfo
- Publication number
- CN106231794A CN106231794A CN201610841457.4A CN201610841457A CN106231794A CN 106231794 A CN106231794 A CN 106231794A CN 201610841457 A CN201610841457 A CN 201610841457A CN 106231794 A CN106231794 A CN 106231794A
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- CN
- China
- Prior art keywords
- copper
- flexible
- layers
- flexible layers
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Push-Button Switches (AREA)
Abstract
The invention provides a kind of cavity type flexible circuit board structure and preparation method thereof.The first flexible substrate layer that this board structure of circuit includes from top to bottom setting gradually, the first flexible layers of copper, tack coat, the second flexible layers of copper and the second flexible substrate layer, wherein, a through hole is offered on described tack coat, it is positioned at the described first flexible copper layer region on the upside of described through hole and forms the first switch contact, be positioned at the described second flexible copper layer region on the downside of described through hole and form the second switch contact coordinated with described first switch contact.The present invention utilizes the cavity in flexible PCB to achieve a switch element, the button being arranged on flexible PCB in alternative prior art or switch, not only save the cost of electronic product, and decrease the production link of electronic product, eliminate printed board to install with the metal dome being connected in the middle of button, there is the feature of simple in construction, low cost.
Description
Technical field
The present invention relates to circuit board manufacturing area, particularly to a kind of cavity type flexible circuit board structure and making side thereof
Method.
Background technology
Flexible printed circuit board (Flexible Printed Circuit Board, abridge FPC) is also called flexible print
Circuit board, or claim flexible printed wiring board.
Along with the development of smart electronics product, FPC product is also carried out the most electronic products and is used, owing to it has
There is the advantage that many rigid printed circuit boards do not possess.Small product size is little, lightweight, is substantially reduced the volume of device, is suitable for electricity
Sub-product is to high density, miniaturization, lightweight, slimming, the needs that highly reliable direction is developed. and there is high deflections, can oneself
By bending, wind, reverse, folding, can three-dimensional wiring, require arbitrarily to arrange, change shape according to space layout, and at three-dimensional space
Interior the most mobile and flexible, thus reach assembly assembling and wire connecting integration etc..
But flexible printing structure is the most traditional, almost identical with ancient rigid printed board.Simply accomplish to connect
The effect of electronic devices and components, almost all of control is required for electronic devices and components and completes.So, electronics is virtually being added
The attachment step of product components and parts, and the purchase cost of components and parts.
Summary of the invention
The invention provides a kind of cavity type flexible circuit board structure and preparation method thereof, to solve prior art needs
Flexible PCB arranges special key switch, not only adds cost, and increase asking of electronic product production link
Topic.
For solving the problems referred to above, as one aspect of the present invention, it is provided that a kind of cavity type flexible circuit board structure, bag
Include the first flexible substrate layer, the first flexible layers of copper, tack coat, the second flexible layers of copper and second from top to bottom set gradually flexible
Substrate layer, wherein, described tack coat offers a through hole, is positioned at the described first flexible copper layer region on the upside of described through hole
Form the first switch contact, be positioned at the described second flexible copper layer region on the downside of described through hole and formed and described first switch contact
The second switch contact coordinated.
Preferably, described tack coat is AD glue-line.
Preferably, described through hole is rounded.
Preferably, the diameter of described through hole is less than 1 centimetre.
Present invention also offers a kind of method for making above-mentioned cavate flexible circuit board structure, including step 1, open
Material: cut the first flexible layers of copper, the second flexible layers of copper and the second flexible substrate layer according to design size；Step 2, pre-treatment: clear
Wash the first flexible layers of copper and the copper face of the second flexible layers of copper, it is ensured that copper face cleaning non-oxidation；Step 3, fits on described copper face
One layer of sensitive material；Step 4, exposure: by predetermined circuitous pattern by the irradiation of ultraviolet light be presented on the first flexible layers of copper with
On the sensitive material of the second flexible layers of copper；Step 5, development: will not join on the copper face of the first flexible layers of copper and the second flexible layers of copper
Wash with the sensitive material irradiated, spill copper face, thus wash the spacing between wire and wire off；Step 6, etching: will leakage
The copper face gone out is etched away by oxidizing process, the copper below the sensitive material of residual, thus forms circuit；Step 7, cut:
Laser is used to cut the first flexible substrate layer, the second flexible substrate layer, AD glue-line；Step 8, pastes epiphragma: making
Fit respectively in first flexible layers of copper of complete circuit and second flexible two surfaces of layers of copper the first flexible substrate layer, the second flexible base
Sheet material layers is with the flexible layers of copper of protection first and the second flexible layers of copper；Step 9, unprotected to the first flexible layers of copper and the second flexible layers of copper
The layers of copper of position carry out electrogilding, to prevent surface oxidation impact contact at pressing, make to possess at pressing wearability simultaneously；Step
Rapid 10, AD glue laminated is closed: the first of two one sides the flexible layers of copper and the second flexible layers of copper are bonded together by AD glue-line, its
In, need para-position during bonding, to ensure that the position of cavity coincides together, need up and down during pressing to place steel plate, to prevent sky
At chamber, pressing stress is subsided and is caused short circuit.
The present invention utilizes the cavity in flexible PCB to achieve a switch element, is arranged in alternative prior art
Button on flexible PCB or switch, not only saved the cost of electronic product, and decreased the production ring of electronic product
Joint, eliminates printed board and installs with the metal dome being connected in the middle of button, improve production efficiency, have simple in construction, low cost
Feature.
Accompanying drawing explanation
Fig. 1 schematically shows the structural representation of the present invention.
Reference in figure: 1, the first flexible substrate layer；2, the first flexible layers of copper；3, tack coat；4, the second flexible layers of copper；
5, the second flexible substrate layer；6, through hole.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the present invention can be defined by the claims
Implement with the multitude of different ways covered.
Refer to Fig. 1, the invention provides a kind of cavity type flexible circuit board structure, be particularly well-suited to the electricity of some pressings
At sub-product switch or button.
This cavity type flexible circuit board structure includes that the first flexible substrate layer 1, first from top to bottom set gradually is flexible
Layers of copper 2, the flexible layers of copper 4 of tack coat 3, second and the second flexible substrate layer 5, wherein, tack coat 3 offers a through hole 6, position
Flexible layers of copper 2 region of on the upside of through hole 6 first forms the first switch contact, is positioned at flexible layers of copper 4 district of second on the downside of through hole 6
Territory forms the second switch contact coordinated with the first switch contact.Preferably, tack coat 3 is AD glue-line.Preferably, described through hole
6 is rounded.Preferably, the diameter of described through hole 6 is less than 1 centimetre.
The present invention takes full advantage of the feature of flexible printed circuit board, will form cavity (i.e. in the part in tack coat 3
Through hole 6), in use, the first flexible layers of copper 2 can be made to occur downwards by the first flexible substrate layer 1 above pressing through hole 6
Deformation, and after making the first switch contact thereon move downward and second switch contact is to form loop, thus produce one
Individual switching signal.Upon release, the first and second beginning contacts then return to initial off-state.
So, the present invention utilizes the cavity in flexible PCB to achieve a switch element, in alternative prior art
The button being arranged on flexible PCB or switch, not only saved the cost of electronic product, and decreased electronic product
Production link, eliminates the metal dome installation being connected in the middle of printed board and button, improves production efficiency, have simple in construction,
The feature of low cost.
Present invention also offers a kind of method for making above-mentioned cavate flexible circuit board structure, including
Step 1, sawing sheet: cut the first flexible flexible layers of copper 4 of layers of copper 2, second and the second flexible parent metal according to design size
Layer 5；
Step 2, pre-treatment: clean the first flexible layers of copper 2 and copper face of the second flexible layers of copper 4, it is ensured that copper face cleaning anaerobic
Change；
Step 3, one layer of sensitive material of fitting on described copper face；
Step 4, exposure: predetermined circuitous pattern is presented on the first flexible layers of copper 2 and second by the irradiation of ultraviolet light
On the sensitive material of flexible layers of copper 4；
Step 5, development: the sensitive material of irradiation will be had neither part nor lot on the copper face of the first flexible layers of copper 2 and the second flexible layers of copper 4
Wash, spill copper face, thus wash the spacing between wire and wire off；
Step 6, etching: the copper face spilt is etched away by oxidizing process, the copper below the sensitive material of residual, thus shape
Become circuit；
Step 7, cut: use laser to cut first flexible substrate layer the 1, second flexible substrate layer 5, AD glue-line
Cut；
Step 8, pastes epiphragma: divide in the flexible layers of copper of made circuit first 2 and second flexible 4 two surfaces of layers of copper
First flexible substrate layer the 1, second flexible substrate layer 5 of not fitting is with the flexible layers of copper of protection first 2 and the second flexible layers of copper 4；
Step 9, carries out electrogilding to the layers of copper of the first flexible layers of copper 2 and the second flexible unprotected position of layers of copper 4, in case
Only surface oxidation impact contact at pressing, makes to possess at pressing wearability simultaneously；
Step 10, AD glue laminated is closed: the first of two one sides the flexible layers of copper 2 and the second flexible layers of copper 4 are glued by AD glue-line
It is combined, wherein, during bonding, needs para-position, to ensure that the position of cavity 6 coincides together, need up and down during pressing to place steel
Plate, causes short circuit preventing pressing stress at cavity from subsiding.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, that is made any repaiies
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (5)
1. a cavity type flexible circuit board structure, it is characterised in that include the first flexible parent metal from top to bottom set gradually
Layer (1), the first flexible layers of copper (2), tack coat (3), the second flexible layers of copper (4) and the second flexible substrate layer (5), wherein, described
Offering a through hole (6) on tack coat (3), the described first flexible layers of copper (2) region being positioned at described through hole (6) upside is formed
First switch contact, the described second flexible layers of copper (4) the region formation being positioned at described through hole (6) downside is touched with described first switch
The second switch contact that point coordinates.
Cavity type flexible circuit board structure the most according to claim 1, it is characterised in that described tack coat (3) is AD glue
Layer.
3. according to the cavity type flexible circuit board structure described in claim 1 and 2, it is characterised in that described through hole (6) is in circle
Shape.
Cavity type flexible circuit board structure the most according to claim 3, it is characterised in that the diameter of described through hole (6) is little
In 1 centimetre.
5. the method being used for making the cavate flexible circuit board structure described in Claims 1-4, it is characterised in that
Step 1, sawing sheet: cut the first flexible layers of copper (2), the second flexible layers of copper (4) and the second flexible parent metal according to design size
Layer (5)；
Step 2, pre-treatment: clean the first flexible layers of copper (2) and the copper face of the second flexible layers of copper (4), it is ensured that copper face cleaning anaerobic
Change；
Step 3, one layer of sensitive material of fitting on described copper face；
Step 4, exposure: predetermined circuitous pattern is presented on the first flexibility layers of copper (2) and second soft by the irradiation of ultraviolet light
On the sensitive material of property layers of copper (4)；
Step 5, development: the sensitive material of irradiation will be had neither part nor lot on the copper face of the first flexible layers of copper (2) and the second flexible layers of copper (4)
Wash, spill copper face, thus wash the spacing between wire and wire off；
Step 6, etching: the copper face spilt is etched away by oxidizing process, the copper below the sensitive material of residual, thus form line
Road；
Step 7, cut: use laser to cut the first flexible substrate layer (1), the second flexible substrate layer (5), AD glue-line
Cut；
Step 8, pastes epiphragma: divide on the flexible layers of copper (2) of made circuit first and second flexible (4) two surfaces of layers of copper
First flexible substrate layer of not fitting (1), the second flexible substrate layer (5) are to protect the first flexible layers of copper (2) and the second flexible layers of copper
(4)；
Step 9, carries out electrogilding to the layers of copper of the first flexible layers of copper (2) and the second flexible layers of copper (4) unprotected position, in case
Only surface oxidation impact contact at pressing, makes to possess at pressing wearability simultaneously；
Step 10, AD glue laminated is closed: the first of two one sides the flexible layers of copper (2) and the second flexible layers of copper (4) are glued by AD glue-line
It is combined, wherein, during bonding, needs para-position, to ensure that the position of cavity (6) coincides together, need up and down during pressing to place
Steel plate, causes short circuit preventing pressing stress at cavity from subsiding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610841457.4A CN106231794B (en) | 2016-09-22 | 2016-09-22 | Cavity type flexible circuit board structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610841457.4A CN106231794B (en) | 2016-09-22 | 2016-09-22 | Cavity type flexible circuit board structure and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106231794A true CN106231794A (en) | 2016-12-14 |
| CN106231794B CN106231794B (en) | 2019-01-18 |
Family
ID=58075966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610841457.4A Active CN106231794B (en) | 2016-09-22 | 2016-09-22 | Cavity type flexible circuit board structure and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231794B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266586A (en) * | 1989-04-07 | 1990-10-31 | Fujikura Ltd | Flexible printed wiring board and manufacture thereof |
| CN201063314Y (en) * | 2007-06-28 | 2008-05-21 | 舒志宏 | Pressure switch for automobile air conditioner |
| KR20090080302A (en) * | 2008-01-21 | 2009-07-24 | (주)인터플렉스 | Manufacturing method of embedded resistor flexible printed circuit board |
| CN203278556U (en) * | 2013-04-29 | 2013-11-06 | 中山大洋电机股份有限公司 | Motor with centrifugal switch |
| CN206164989U (en) * | 2016-09-22 | 2017-05-10 | 深圳市迅捷兴科技股份有限公司 | Cavity formula flexible circuit board structure |
-
2016
- 2016-09-22 CN CN201610841457.4A patent/CN106231794B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266586A (en) * | 1989-04-07 | 1990-10-31 | Fujikura Ltd | Flexible printed wiring board and manufacture thereof |
| CN201063314Y (en) * | 2007-06-28 | 2008-05-21 | 舒志宏 | Pressure switch for automobile air conditioner |
| KR20090080302A (en) * | 2008-01-21 | 2009-07-24 | (주)인터플렉스 | Manufacturing method of embedded resistor flexible printed circuit board |
| CN203278556U (en) * | 2013-04-29 | 2013-11-06 | 中山大洋电机股份有限公司 | Motor with centrifugal switch |
| CN206164989U (en) * | 2016-09-22 | 2017-05-10 | 深圳市迅捷兴科技股份有限公司 | Cavity formula flexible circuit board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106231794B (en) | 2019-01-18 |
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