CN106229421A - Flexible base board manufacture method and flexible base board - Google Patents
Flexible base board manufacture method and flexible base board Download PDFInfo
- Publication number
- CN106229421A CN106229421A CN201610715811.9A CN201610715811A CN106229421A CN 106229421 A CN106229421 A CN 106229421A CN 201610715811 A CN201610715811 A CN 201610715811A CN 106229421 A CN106229421 A CN 106229421A
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- groove
- rigid substrates
- substrate material
- substrates surface
- flexible substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
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Abstract
Embodiments provide a kind of flexible base board manufacture method and flexible base board, solve the problem that process complexity is high and production cost is high of existing flexible base board manufacture method.This flexible base board manufacture method includes: form at least one groove on a rigid substrates surface；At described rigid substrates surface coating flexible backing material, described flexible substrate material covers at least one groove described；And described flexible substrate material is toasted.
Description
Technical field
The present invention relates to display preparing technical field, be specifically related to a kind of flexible base board manufacture method and flexible base board.
Background technology
In flexible liquid crystal screen or flexible OLED (OLED) display screen, thin film transistor (TFT) (TFT) is to prepare
On a flexible base board.The preparation process of this flexible base board is generally: flexible substrate material (such as, polyimides) be coated with
Cloth, on a rigid substrates (such as glass substrate), carries out heated baking to this flexible substrate material, the most again to solidify shape
Become flexible base board.But owing to flexible substrate material is different from the thermal expansion coefficients of rigid substrates, thermal stress can make rigid substrates
Surrounding generation warpage.
In order to solve the problems referred to above, prior art exists two kinds of solutions.One is to enter flexible substrate material
Use tool to fix rigid substrates during row baking, to avoid rigid substrates surrounding generation warpage, but use extra tool to increase
Add the cost of flexible base board manufacturing process.Another kind is the spreading area of manual control flexible substrate material, makes flexible liner ground
Material is divided into a lot of fritter and is respectively coated on the rigid substrate, but this can be greatly increased the complex process of flexible base board manufacturing process
Degree.
Summary of the invention
In view of this, embodiments provide a kind of flexible base board manufacture method and flexible base board, solve existing
For preventing substrate from process complexity height and high the asking of production cost of warpage occurring in baking in flexible base board manufacture method
Topic.
A kind of flexible base board manufacture method and flexible base board that one embodiment of the invention provides include:
At least one groove is formed on a rigid substrates surface；
At described rigid substrates surface coating flexible backing material, described flexible substrate material covers that described at least one is recessed
Groove；And
Described flexible substrate material is toasted.
Wherein, at described rigid substrates surface coating flexible backing material, described flexible substrate material cover described at least
One groove includes:
Only coating flexible backing material, described flexible substrate material at least one groove on described rigid substrates surface
It is only filled with at least one groove described；Or
At described rigid substrates surface coating flexible backing material, described flexible substrate material cover include described at least one
Individual groove is on interior whole rigid substrates surface.
Wherein, coating speed and usage of sizing agent by controlling described flexible substrate material make described flexible substrate material cover
Cover the whole rigid substrates surface including at least one groove described, or make described flexible substrate material be only filled with described in extremely
A few groove.
Wherein, the mode at described rigid substrates surface coating flexible backing material is the one in following items or many
Kind: rotary coating, slit coating and roller type are coated with.
Wherein, at least one groove described, the size of each groove is relative with the size of display screen body to be made
Should.
Wherein, form at least one groove on a rigid substrates surface to include:
At described rigid substrates surface coating photoresist layer；
Use mask plate that described photoresist layer is exposed development so that described photoresist layer forms mask pattern, wherein
It is corresponding with the size of at least one groove described that described mask pattern exposes the size of the part on rigid substrates surface；
The rigid substrates surface exposed is performed etching to form at least one groove described, removes described photoresist layer.
Wherein, the mode at described rigid substrates surface coating photoresist layer is one or more in following items: rotation
Turning coating, slit coating and roller type are coated with.
Wherein, the described rigid substrates surface to exposure performs etching and includes with formation at least one groove described:
Using wet-etching technology to perform etching the described rigid substrates surface exposed to be formed, described at least one is recessed
Groove.
One embodiment of the invention also provides for a kind of flexible base board, including:
Rigid substrates, described rigid substrates surface is provided with at least one groove；
Flexible substrate material, coats described rigid substrates surface and covers at least one groove described.
Wherein, described flexible substrate material covers the whole rigid substrates surface including at least one groove described,
Or it is only filled with at least one groove described.
A kind of flexible base board manufacture method of embodiment of the present invention offer and flexible base board, by being coated with flexible substrate material
Cloth is arranging on reeded rigid substrates, so that flexible material layer to be divided into multiple fritter easily, has disperseed flexible liner ground
Material thermal stress when being heated, it is to avoid rigid substrates surrounding generation warpage when being heated.Meanwhile, whole manufacturing process is not the most adopted
With outside tool, the most do not increase the technology difficulty of flexible substrate material coating, reduce flexible base board compared to existing technology
Manufacturing cost, simplifies technological process.
Accompanying drawing explanation
Fig. 1 show the schematic flow sheet of a kind of flexible base board manufacture method that one embodiment of the invention provides.
Fig. 2 show the structural representation of a kind of rigid substrates that one embodiment of the invention provides.
Fig. 3 show the structural representation of a kind of flexible base board that one embodiment of the invention provides.
Fig. 4 show the structural representation of a kind of flexible base board that another embodiment of the present invention provides.
Fig. 5 show the schematic flow sheet of the flexible base board manufacture method that another embodiment of the present invention is provided.
Fig. 6～Fig. 9 show the principle decomposing schematic representation of the flexible base board manufacture method that one embodiment of the invention is provided.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under not making creative work premise
Execute example, broadly fall into the scope of protection of the invention.
Fig. 1 show the schematic flow sheet of a kind of flexible base board manufacture method that one embodiment of the invention provides.Such as Fig. 1 institute
Show, this flexible base board manufacture method, including:
Step 101: as in figure 2 it is shown, form at least one groove 2 on rigid substrates 1 surface.
The size of this at least one groove 2 need to be corresponding with the size of display screen body to be made, the such as face of groove 2
Long-pending size need to be corresponding with the area size of display screen body to be made.Each groove 2 meets flexible base board technique being filled with
After the flexible substrate material 3 of demand thickness, just can prepare thin film transistor (TFT) further on flexible substrate material 3 surface filled
To make complete display screen body.
Should be appreciated that groove 2 quantity that can be formed on a rigid substrates 1 can be according to the size of rigid substrates 1 and institute
Depending on the size of display screen body to be made, groove 2 quantity included by rigid substrates 1 surface is not limited by the present invention
Fixed.
Step 102: at rigid substrates 1 surface coating flexible backing material 3, it is recessed that flexible substrate material 3 covers at least one
Groove 2.
Specifically, flexible substrate material 3 can have two kinds at the coating method on rigid substrates 1 surface.The first coating side
Formula is as shown in Figure 3, i.e. only coating flexible backing material 3, flexible liner ground at least one groove 2 on rigid substrates 1 surface
Material 3 is only filled with this at least one groove 2.So compared in prior art, flexible substrate material 3 is covered in smooth rigidity
On substrate 1, flexible substrate material 3 be divide at least one fritter by this at least one groove 2, thus has disperseed in follow-up baking
The thermal stress of flexible substrate material 3 during Kao, can effectively avoid rigid substrates 1 that buckling deformation occurs.
As shown in Figure 4, flexible substrate material 3 covers and includes at least one another coating method of flexible substrate material 3
Groove 2 is on interior whole rigid substrates 1 surface.Flexible substrate material 3 has been divided into two by so this at least one groove 2 in fact
Planting thickness, above groove 2, the thickness of flexible substrate material 3 is b, the thickness of groove 2 outer rigid substrates 1 surface flexible backing material 3
Degree is greater than a's for a, b.Owing to the thermal stress of flexible substrate material 3 can reduce with the minimizing of thickness, therefore the outer rigidity of groove 2
The thermal stress of substrate 1 surface flexible backing material 3 can be less than the thermal stress of flexible substrate material 3 above groove 2.Therefore groove is worked as
When above in the of 2, the thickness b of flexible substrate material 3 meets flexible base board process requirements thickness, compared in prior art by flexibility
Backing material 3 all covers on smooth rigid substrates 1, and flood flexible substrate material 3 is as its integral thickness of entirety
It is the most thinning, thus thermal stress during expanded by heating is also smaller；Meanwhile, the flexible liner ground in multiple grooves 2
Material 3 also can disperse the stress of flood flexible substrate material 3, thus avoids rigid substrates 1 that buckling deformation occurs.
Should be appreciated that the selection of both the above coating method can be by controlling coating speed and the slurry of flexible substrate material 3
Material consumption realizes.To make flexible substrate material 3 be only filled with this at least one groove 2, then need the coating to flexible substrate material 3
Speed and usage of sizing agent carry out relatively stringent control；Meanwhile, so that flexible substrate material 3 thickness in groove 2 can
Reaching flexible base board process requirements thickness, the degree of depth of groove 2 also needs corresponding with flexible base board process requirements thickness.Soft to make
Property backing material 3 cover whole rigid substrates 1 surface including at least one groove 2, then without to flexible substrate material 3
Coating speed and usage of sizing agent carry out relatively stringent control, as long as the thickness of flexible substrate material 3 can be expired above groove 2
Foot flexible base board process requirements thickness.No matter use in both the above coating method is any, all can play reduction and
The effect of dispersion flexible substrate material 3 thermal stress, therefore which kind of coating method is the present invention use do not limit to concrete.
Step 103: flexible substrate material 3 is toasted.
Just complete flexible base board is defined after flexible substrate material 3 is toasted, the most just can be at this flexible base board
Upper making thin film transistor (TFT).
As can be seen here, the embodiment of the present invention by being coated on the rigid substrates 1 being provided with groove 2 by flexible substrate material 3
On, flexible material layer to be divided into easily multiple fritter, thermal stress when having disperseed flexible substrate material 3 to be heated, it is to avoid
Rigid substrates 1 is surrounding generation warpage when being heated.Meanwhile, whole manufacturing process does not the most use outside tool, does not the most increase
The technology difficulty of flexible substrate material 3 coating, reduces the production cost of flexible base board compared to existing technology, simplifies technique stream
Journey.
Fig. 5 show the schematic flow sheet of the flexible base board manufacture method that another embodiment of the present invention is provided.Such as Fig. 5 institute
Showing, this flexible base board manufacture method includes:
Step 501: as shown in Figure 6, at rigid substrates 1 surface coating photoresist layer 4.In an embodiment of the present invention, light
The coating method of photoresist layer 4 can use rotary coating (Spin), slit coating (Slit) and roller type coating (Roller)
Etc. one or more in mode.
Step 502: as it is shown in fig. 7, use mask plate 5 photoresist layer 4 to be exposed development so that photoresist layer 4 is formed
Mask pattern, wherein the size of the part that mask pattern exposes rigid substrates 1 surface is relative with the size of at least one groove 2
Should.On mask plate 5 dimension of picture of hollow out need to according to made display screen body size make (such as, 5.5 inches, 4.6
Inch, 7.6 inches etc.).
Step 503: as shown in Figure 8 and Figure 9, performs etching to form at least one to rigid substrates 1 surface exposed recessed
Groove 2, removes photoresist layer 4.In an embodiment of the present invention, can use wet-etching technology that rigid substrates 1 is performed etching place
Reason is the most different according to the etching medicinal liquid that the difference of rigid substrates 1 material is used.The technological parameter of etching is originated by control
(such as temperature, time etc.) just scalable etching depth, the degree of depth of etched groove 2 needs to meet flexible base board process thickness
Require (such as 8 μm, 10 μm, 12 μm etc.).After etching, photoresist layer 4 to rigid substrates 1 surface is peeled off and just be can get institute
Groove 2 structure graph needed.
Step 504: as shown in Figure 3 or Figure 4, in rigid substrates 1 surface coating flexible backing material 3, flexible substrate material 3
Cover at least one groove 2.Carrying coating flexible backing material 3 (such as polyimides) on fluted 2 substrates, coating method can
To use one or more in the modes such as Spin, Slit or Roller, and by controlling technique coating speed and usage of sizing agent
Make flexible substrate material 3 be only filled with this at least one groove 2 Deng painting parameter, or cover including this at least one groove 2
Whole rigid substrates 1 surface.
Step 505: flexible substrate material 3 is toasted.Just flexible base board can be formed after baking, then according to existing
TFT preparation technology flow process just can make TFT and display screen body on this flexible base board.
The embodiment of the present invention also provides for a kind of flexible base board, and this flexible base board includes:
Rigid substrates 1, rigid substrates 1 surface is provided with at least one groove 2；
Flexible substrate material 3, coats rigid substrates 1 surface and covers at least one groove 2.
In an embodiment of the present invention, flexible substrate material 3 covers the whole rigidity base including at least one groove 2
Plate 1 surface (as shown in Figure 4), or it is only filled with at least one groove 2 (as described in Figure 3).
The flexible base board that the embodiment of the present invention is provided, flexible substrate material 3 is divided into many by the groove 2 on rigid substrates 1
Individual fritter, thermal stress when having disperseed flexible substrate material 3 to be heated, it is to avoid rigid substrates 1 surrounding generation warpage when being heated.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Within god and principle, any amendment of being made, equivalent etc., should be included within the scope of the present invention.
Claims (10)
1. a flexible base board manufacture method, it is characterised in that including:
At least one groove is formed on a rigid substrates surface；
At described rigid substrates surface coating flexible backing material, described flexible substrate material covers at least one groove described；
And
Described flexible substrate material is toasted.
Method the most according to claim 1, it is characterised in that at described rigid substrates surface coating flexible backing material,
Described flexible substrate material covers at least one groove described and includes:
Only coating flexible backing material at least one groove on described rigid substrates surface, described flexible substrate material is only filled out
Fill at least one groove described；Or
At described rigid substrates surface coating flexible backing material, described flexible substrate material covers and includes that described at least one is recessed
Groove is on interior whole rigid substrates surface.
Method the most according to claim 2, it is characterised in that by control described flexible substrate material coating speed and
Usage of sizing agent makes described flexible substrate material cover the whole rigid substrates surface including at least one groove described, or makes
Described flexible substrate material is only filled with at least one groove described.
Method the most according to claim 3, it is characterised in that at described rigid substrates surface coating flexible backing material
Mode is one or more in following items: rotary coating, and slit coating and roller type are coated with.
5. according to described method arbitrary in Claims 1-4, it is characterised in that each groove at least one groove described
Size corresponding with the size of display screen body to be made.
Method the most according to claim 5, it is characterised in that described form at least one groove on a rigid substrates surface
Including:
At described rigid substrates surface coating photoresist layer；
Use mask plate that described photoresist layer is exposed development so that described photoresist layer forms mask pattern, wherein said
It is corresponding with the size of at least one groove described that mask pattern exposes the size of the part on rigid substrates surface；
The rigid substrates surface exposed is performed etching to form at least one groove described, removes described photoresist layer.
Method the most according to claim 6, it is characterised in that in the mode of described rigid substrates surface coating photoresist layer
For one or more in following items: rotary coating, slit coating and roller type are coated with.
Method the most according to claim 6, it is characterised in that the described described rigid substrates surface to exposing performs etching
Include with formation at least one groove described:
Wet-etching technology is used to perform etching the described rigid substrates surface exposed to form at least one groove described.
9. a flexible base board, it is characterised in that including:
Rigid substrates, described rigid substrates surface is provided with at least one groove；
Flexible substrate material, coats described rigid substrates surface and covers at least one groove described.
Flexible base board the most according to claim 9, it is characterised in that described flexible substrate material cover include described in extremely
A few groove is on interior whole rigid substrates surface, or is only filled with at least one groove described.
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| CN201610715811.9A CN106229421B (en) | 2016-08-24 | 2016-08-24 | Flexible base board production method and flexible base board |
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|---|---|---|---|
| CN201610715811.9A CN106229421B (en) | 2016-08-24 | 2016-08-24 | Flexible base board production method and flexible base board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653812A (en) * | 2016-12-20 | 2017-05-10 | 武汉华星光电技术有限公司 | Flexible display panel making method |
| CN107359282A (en) * | 2017-07-12 | 2017-11-17 | 武汉华星光电半导体显示技术有限公司 | display panel and preparation method thereof, display |
| CN107611158A (en) * | 2017-08-25 | 2018-01-19 | 武汉华星光电半导体显示技术有限公司 | A kind of preparation method of flexible display panels |
| CN108321309A (en) * | 2018-01-19 | 2018-07-24 | 云谷（固安）科技有限公司 | Separable substrat structure and preparation method thereof |
| CN109273491A (en) * | 2018-08-29 | 2019-01-25 | Oppo（重庆）智能科技有限公司 | Glass substrate, display panel and preparation method, display screen component and electronic equipment |
| CN110085641A (en) * | 2019-04-25 | 2019-08-02 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and display device |
| US10476004B2 (en) | 2017-08-25 | 2019-11-12 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing flexible display panel |
| WO2020020176A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳Tcl新技术有限公司 | Led display screen and manufacturing method therefor |
| CN111384101A (en) * | 2018-12-28 | 2020-07-07 | 乐金显示有限公司 | Flexible display device and electronic apparatus including the same |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110134047A (en) * | 2010-06-08 | 2011-12-14 | 엘지디스플레이 주식회사 | Method for manufacturing display device and display device |
| CN102956668A (en) * | 2011-08-23 | 2013-03-06 | 元太科技工业股份有限公司 | Substrate and structure for manufacturing flexible display device and manufacturing method thereof |
| CN104392901A (en) * | 2014-10-28 | 2015-03-04 | 京东方科技集团股份有限公司 | Flexible underlying substrate and manufacturing method thereof |
| CN104409408A (en) * | 2014-12-02 | 2015-03-11 | 昆山国显光电有限公司 | Manufacture method of rigid substrate and flexible display |
| CN104485344A (en) * | 2014-12-08 | 2015-04-01 | 信利（惠州）智能显示有限公司 | Preparation method for flexible display |
| CN105140393A (en) * | 2015-07-06 | 2015-12-09 | Tcl集团股份有限公司 | Composite membrane structured polymer flexible substrate and manufacturing method thereof |
-
2016
- 2016-08-24 CN CN201610715811.9A patent/CN106229421B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110134047A (en) * | 2010-06-08 | 2011-12-14 | 엘지디스플레이 주식회사 | Method for manufacturing display device and display device |
| CN102956668A (en) * | 2011-08-23 | 2013-03-06 | 元太科技工业股份有限公司 | Substrate and structure for manufacturing flexible display device and manufacturing method thereof |
| CN104392901A (en) * | 2014-10-28 | 2015-03-04 | 京东方科技集团股份有限公司 | Flexible underlying substrate and manufacturing method thereof |
| CN104409408A (en) * | 2014-12-02 | 2015-03-11 | 昆山国显光电有限公司 | Manufacture method of rigid substrate and flexible display |
| CN104485344A (en) * | 2014-12-08 | 2015-04-01 | 信利（惠州）智能显示有限公司 | Preparation method for flexible display |
| CN105140393A (en) * | 2015-07-06 | 2015-12-09 | Tcl集团股份有限公司 | Composite membrane structured polymer flexible substrate and manufacturing method thereof |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10581026B2 (en) | 2016-12-20 | 2020-03-03 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Manufacture method of flexible display panel |
| CN106653812A (en) * | 2016-12-20 | 2017-05-10 | 武汉华星光电技术有限公司 | Flexible display panel making method |
| CN107359282A (en) * | 2017-07-12 | 2017-11-17 | 武汉华星光电半导体显示技术有限公司 | display panel and preparation method thereof, display |
| WO2019010749A1 (en) * | 2017-07-12 | 2019-01-17 | 武汉华星光电半导体显示技术有限公司 | Display panel, manufacturing method therefor, and display |
| US10476004B2 (en) | 2017-08-25 | 2019-11-12 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing flexible display panel |
| CN107611158A (en) * | 2017-08-25 | 2018-01-19 | 武汉华星光电半导体显示技术有限公司 | A kind of preparation method of flexible display panels |
| CN107611158B (en) * | 2017-08-25 | 2019-09-24 | 武汉华星光电半导体显示技术有限公司 | A kind of production method of flexible display panels |
| CN108321309A (en) * | 2018-01-19 | 2018-07-24 | 云谷（固安）科技有限公司 | Separable substrat structure and preparation method thereof |
| WO2020020176A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳Tcl新技术有限公司 | Led display screen and manufacturing method therefor |
| US11769786B2 (en) | 2018-07-25 | 2023-09-26 | Shenzhen Tcl New Technology Co., Ltd. | LED display screen and manufacturing method therefor |
| CN109273491A (en) * | 2018-08-29 | 2019-01-25 | Oppo（重庆）智能科技有限公司 | Glass substrate, display panel and preparation method, display screen component and electronic equipment |
| CN111384101A (en) * | 2018-12-28 | 2020-07-07 | 乐金显示有限公司 | Flexible display device and electronic apparatus including the same |
| CN111384101B (en) * | 2018-12-28 | 2023-12-19 | 乐金显示有限公司 | Flexible display device and electronic apparatus including the same |
| CN110085641A (en) * | 2019-04-25 | 2019-08-02 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and display device |
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Effective date of registration: 20201209 Address after: No.146 Tianying Road, high tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu CHENXIAN photoelectric Co.,Ltd. Address before: No. 188, CHENFENG Road, Kunshan high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan New Flat Panel Display Technology Center Co.,Ltd. |