CN106224124B - A kind of heat engine device based on Seebeck effect - Google Patents
A kind of heat engine device based on Seebeck effect Download PDFInfo
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- CN106224124B CN106224124B CN201610810783.9A CN201610810783A CN106224124B CN 106224124 B CN106224124 B CN 106224124B CN 201610810783 A CN201610810783 A CN 201610810783A CN 106224124 B CN106224124 B CN 106224124B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02G—HOT GAS OR COMBUSTION-PRODUCT POSITIVE-DISPLACEMENT ENGINE PLANTS; USE OF WASTE HEAT OF COMBUSTION ENGINES; NOT OTHERWISE PROVIDED FOR
- F02G1/00—Hot gas positive-displacement engine plants
- F02G1/04—Hot gas positive-displacement engine plants of closed-cycle type
- F02G1/043—Hot gas positive-displacement engine plants of closed-cycle type the engine being operated by expansion and contraction of a mass of working gas which is heated and cooled in one of a plurality of constantly communicating expansible chambers, e.g. Stirling cycle type engines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02G—HOT GAS OR COMBUSTION-PRODUCT POSITIVE-DISPLACEMENT ENGINE PLANTS; USE OF WASTE HEAT OF COMBUSTION ENGINES; NOT OTHERWISE PROVIDED FOR
- F02G1/00—Hot gas positive-displacement engine plants
- F02G1/04—Hot gas positive-displacement engine plants of closed-cycle type
- F02G1/043—Hot gas positive-displacement engine plants of closed-cycle type the engine being operated by expansion and contraction of a mass of working gas which is heated and cooled in one of a plurality of constantly communicating expansible chambers, e.g. Stirling cycle type engines
- F02G1/045—Controlling
Abstract
The invention belongs to new energy application field, a kind of heat engine device based on Seebeck effect.The present invention includes heat engine device internal core structure, heat engine device guidance panel and heat engine device circuit；Heat engine device internal core structure includes a hot junction heating plate, two Peltier semiconductors, a heat-pipe radiator and two fans；Heat engine device guidance panel is including cold junction temperature is shown, the load both end voltage of Peltier semiconductor 1 is shown, hot-side temperature is shown, heat engine fundamental diagram, ohmic load, supply hub；Heat engine device circuit includes display circuit, temperature collection circuit, voltage collection circuit, thermoregulator.The present invention realizes the constant control to cold junction temperature using pid algorithm.The output voltage of regulation hot junction external power supply realizes the control of hot-side temperature.The relation of efficiency of heat engine and temperature difference can be studied, hot-side temperature can be directly displayed on guidance panel with cold junction temperature, simple to operate, intuitive display.
Description
Technical field
The invention belongs to new energy application field, a kind of heat engine device based on Seebeck effect.
Background technology
World today's energy shortage, people are constantly searching for the new energy always.Development and technology with science and technology
Progressive, the heat engine of various new-generation modes is arisen at the historic moment.
Most commonly used heat engine surely belongs to internal combustion engine in the market, and interior energy is converted into mechanical energy, but structure by doing work
More complicated, volume is larger, and parts machining required precision is higher.There is many utilize to clean in published Chinese patent literature
The energy designs the technical information of heat engine, and Authorization Notice No. is CN101994666A " solar thermal machine ", and the patent formula proposes
A kind of mechanical device using solar energy as power source, solve the pollution problem of conventional heat engines, but at night and rainy days
This heat engine can be stopped.Authorization Notice No. is CN103062889A " sail heat supply machine ", and the patent proposes to turn wind energy
The heat engine of heat energy is turned to, but its purposes regional extent is narrower, it is necessary to used in the very strong area of wind-force.
Principle and the application of above heat engine are different from, the present invention is according to Seebeck effect using Peltier semiconductor structure nothing
Noise, pollution-free, delicate structure heat engine device, electric energy is converted directly into by heat energy, is load supplying.By measuring load
The power of power and external power supply can measure the efficiency of heat engine device.The physics that the heat engine device is applied to institution of higher learning is real
Teaching is tested, student can be made fully to grasp the principle and Seebeck effect of heat engine.According to the principle of the present invention, using Ground Heat
Source or steel mill's hot waste water waste gas are generated electricity.
The content of the invention
It is an object of the invention to provide a kind of heat engine device based on Seebeck effect.
The object of the present invention is achieved like this：
A kind of heat engine device based on Seebeck effect, including heat engine device internal core structure, heat engine device operating surface
Plate and heat engine device circuit；Heat engine device internal core structure include a hot junction heating plate, two Peltier semiconductors, one
Heat-pipe radiator and two fans；Heat engine device guidance panel is shown including cold junction temperature, the load two of Peltier semiconductor (1)
Terminal voltage is shown, hot-side temperature is shown, heat engine fundamental diagram, ohmic load, supply hub；Heat engine device circuit includes display
Circuit, temperature collection circuit, voltage collection circuit, thermoregulator；
Heat engine device internal core structure, hot junction heating plate generate high temperature as Peltier half in the presence of external power supply
The hot junction of conductor 1；Peltier semiconductor 2 produces paltie effect in the state of energization and causes the one side temperature of Peltier semiconductor 2
Degree reduces, the rise of another side temperature；Cold end of the low one side of temperature as Peltier semiconductor 1；Heat-pipe radiator and two wind
Fan composition cooling system is close to the high one side of the temperature of Peltier semiconductor 2, carries out radiating treatment, ensures that cold junction temperature is controllable；
The hot junction of P-type semiconductor and N-type semiconductor is connected to form P-N pairs by Peltier semiconductor 1 by sheet metal,
Then DC current is exported in the cold end of P-type semiconductor and the cold end of N-type semiconductor；
Run pid algorithm using single-chip microcomputer controls the temperature of cold end constant at 1 DEG C by adjuster；Single-chip microcomputer is to cold end temperature
The magnitude of voltage at the load both ends of degree, hot-side temperature and Peltier semiconductor 1 gathers display in real time；
Panel integrated resistor has 1.2 Ω, 3.0 Ω, 5.1 Ω, 10 Ω, by the way that external wire is combined into loading to resistance
To the output of Peltier semiconductor 1, the external different resistances loads of heat engine device are realized, for measuring load consuming power, optimal
Load, pyroconductivity, the efficiency of heat engine；
It can show that cold junction temperature, hot-side temperature and Peltier semiconductor 1 load the magnitude of voltage at both ends on guidance panel.
The beneficial effects of the present invention are：
Existing heat engine is different from, heat energy is directly changed into by electric energy using Seebeck effect.
Constant control to cold junction temperature is realized using pid algorithm.The output voltage for adjusting hot junction external power supply realizes heat
Hold the control of temperature.The relation of efficiency of heat engine and temperature difference can be studied, hot-side temperature can be directly displayed at cold junction temperature
It is simple to operate on guidance panel, intuitive display.
Conversion, research efficiency of heat engine and the relation of load can be combined to the resistance on heat engine device guidance panel.
Brief description of the drawings
Fig. 1 Seebeck effect schematic diagrams；
Fig. 2 heat engine device circuit function block diagrams；
Fig. 3 pid algorithm program work flows；
Fig. 4 heat engine device operation principles；
Fig. 5 heat engine device internal core structures；
Fig. 6 heat engine device workflows；
Fig. 7 heat engine device guidance panels.
Embodiment
The present invention provides a kind of according to Seebeck effect, the heat engine device designed using Peltier semiconductor, in order that specially
The technical spirit of the present invention is well understood in sharp office auditor and the public, and the specific embodiment of the invention is carried out specifically below
It is bright：
The invention main device includes following aspect：
1. heat engine device of the present invention is built-up using Peltier semiconductor according to Seebeck effect.
Design principle of the present invention application is Seebeck effect, Seebeck effect refer in two kinds of different metallic conductors or
Person's semiconductor group into closed-loop path in, when temperature difference be present between the contact point of two kinds of different conductive materials, in loop
The phenomenon of electric current will be produced.Peltier semiconductor converts heat into electric energy, Seebeck effect principle using Seebeck effect
As shown in Figure 1.Peltier semiconductor internal structure unit is the P-type semiconductor and N-type semiconductor being together in series by sheet metal, is led to
Cross and connect many such basic structural units, then they are encapsulated in ceramic package, finally draws two again
Lead just constitutes a Paar paster respectively as positive pole and negative pole.When its both ends has temperature difference, in N-type semiconductor
Electronics is spread from hot junction to cold end, makes the cold end of N-type semiconductor negatively charged and hot junction positively charged；Sky in P-type semiconductor simultaneously
Cave also from hot junction to cold end spread, make P-type semiconductor cold end positively charged and hot junction positively charged, p-type is partly led by sheet metal
The hot junction of body and N-type semiconductor connects to form P-N pairs, then in the cold end of P-type semiconductor and the cold end output of N-type semiconductor
Electric current, multiple P-N in Peltier semiconductor be can be obtained by into larger electric current output to being together in series.
2. the hot junction of heat engine device of the present invention realizes that low-temperature receiver uses using the heating power of voltage-stabilized power supply control power resistor
Pid algorithm is constant at 1 DEG C by temperature.Temperature difference caused by hot and cold side is acted on Peltier semiconductor 1, so as to produce electric energy.
Caused electric energy is powered for load resistance, and single-chip microcomputer is acquired to the voltage signal for loading both ends, and is operated in heat engine device
Shown on panel.Hot junction and cold end are embedded into using pt100 micro temperature sensors, temperature survey is carried out, passes through temperature pick-up
Temperature signal is converted to 4-20mA current signals by device, and single-chip microcomputer is acquired conversion to current signal, and temperature value is included
On panel.Single-chip microcomputer controls cold end adjuster to make cold junction temperature constant at 1 DEG C according to the temperature signal of cold end by pid algorithm.
Its circuit function block diagram is as shown in Figure 2.Pid algorithm is compared the deviation between 1 DEG C of the actual value of cold junction temperature and setting value
Example, integrate and differentiate, operation result acts on cold end adjuster the temperature for controlling cold end, and temperature control precision is up to 0.25
℃。
Pid algorithm expression formula is：
U (k)=Pe (k)+I [e (k)+e (k-1)+...+e (0)]+D [e (k)-e (k-1)] (1)
In formula：U (k) is the controlled quentity controlled variable that the single-chip microcomputer of kth time sampling instant calculates；P is proportionality coefficient；I is integral coefficient；
D is differential coefficient；E (k) is this deviation；
The workflow diagram of pid algorithm program as shown in figure 3, be defined first to each variable, then to deviation with
Institute is devious and carries out initialization clearing, calculates the deviation of this sampling, that is, cold junction temperature actual value and setting value 1
DEG C deviation.Whether the value of judgment bias is 0.If deviation is not 0, P value is calculated, judges whether this deviation is less than and sets
Fixed maximum deflection difference value (0.25 DEG C), if being less than maximum deflection difference value, calculate all deviations and I value is calculated, if being more than maximum
Deviation (0.25 DEG C), then I=0；This deviation and the difference of preceding deviation are calculated simultaneously, before then this deviation is assigned to
Secondary deviation, calculate D value.If this deviation is 0, regulation terminates.
3. the heat engine device that the present invention is built can measure its actual efficiency and Carnot efficiency.Heat engine device operation principle is such as
Shown in Fig. 4, according to law of conservation of energy, heat engine input energy is equal to heat engine work done plus the heat exhaust to cold end, obtains
QH=W+QC (2)
In formula：QHThe total amount of heat absorbed from hot junction is represented, W represents heat engine work done, QCRepresent the heat discharged to cold end
Amount.
Conversion efficiency e is calculated as follows：
What it is due to heat engine device measurement is power rather than energy, so formula (2) can be expressed as：
PH=PW+PC (4)
In formula：PHRepresent the general power in hot junction, PWRepresent the power of heat engine acting, PCRepresent the power to cold end transmission；Work(
Rate PWThe power of load acting is referred to, is obtained by loading both end voltage value and load computing the resistor value；Power PHRefer to external
The general power of power supply, current value can be read from power supply and magnitude of voltage is calculated.
The efficiency e of heat engine can be rewritten as：
Carnot efficiency eCarnotTemperature difference only between hot junction and cold end is relevant, and calculation formula is as follows：
In formula：THRepresent hot-side temperature, TCCold junction temperature is represented, is directly read from heat engine device guidance panel, it is necessary to change
It is counted as thermodynamic temperature.
1. the realization of heat engine device generating function
Heat engine device specifically includes：Heat engine device internal core structure, heat engine device circuit, heat engine device guidance panel.
(1) heat engine device internal core structure
As shown in figure 5, including：Hot junction heating plate, Peltier semiconductor 1, Peltier semiconductor 2, heat-pipe radiator and two
Individual fan.Hot junction heating plate produces hot junction of the high temperature as Peltier semiconductor 1 in the presence of external power supply.Peltier is partly led
Body 2 produces paltie effect in the state of energization and causes the reduction of the one side temperature of Peltier semiconductor 2, the rise of another side temperature.
Cold end of the low one side of temperature as Peltier semiconductor 1.Heat-pipe radiator and two fan composition cooling systems are close to Paar
The high one side of the temperature of semiconductor 2 is pasted, carries out radiating treatment, ensures that cold junction temperature is controllable.Peltier semiconductor 1 is in hot junction and cold end
In the presence of produce Seebeck effect, so as to export electric energy.
(2) heat engine device circuit
Including display circuit, temperature collection circuit, voltage collection circuit, thermoregulator.The heating plate in hot junction is external
High temperature action is produced in the presence of source of stable pressure on Peltier semiconductor 1, single-chip microcomputer gathers the temperature in hot junction and send display in real time.
Single-chip microcomputer runs pid algorithm and controls the temperature of cold end to make temperature constant at 1 DEG C by adjuster, and collection real-time to cold junction temperature is simultaneously
Send display.Peltier semiconductor 1 produces Seebeck effect output current, single-chip microcomputer collection load both ends in the presence of temperature difference
Magnitude of voltage simultaneously send display.Heat engine device workflow is as shown in Figure 6.
(3) heat engine device guidance panel
As shown in fig. 7, comprises cold junction temperature is shown, the output voltage of Peltier semiconductor 1 shows that hot-side temperature is shown, heat
Machine fundamental diagram, ohmic load, supply hub.Can is to heat engine when external power supply is connected to supply hub on guidance panel
Heating plate heats.Resistance on guidance panel has 1.2 Ω, 3.0 Ω, 5.1 Ω, 10 Ω, and group is carried out to resistance by external wire
Close the output for being loaded into Peltier semiconductor 1.The optimum load resistance of Peltier semiconductor 1 is 6.3 Ω.
2. specific works mode
Operating procedure is as follows：
(1) supply hub connects external power supply on heat engine device guidance panel；
(2) by external wire, suitable load resistance is selected to Peltier semiconductor 1；
(3) it is powered to instrument, adjusting the voltage of external source of stable pressure makes hot-side temperature reach requirement；
(4) when cold junction temperature is stabilized to 1 DEG C under PID adjustment controls, cold junction temperature, hot-side temperature, load resistance are recorded
Voltage in value and load；
(5) heat engine actual efficiency and Carnot efficiency are calculated by formula (4) and (5)；
(6) voltage for adjusting external power supply changes temperature difference, change outer meeting resistance can research different temperatures difference with not
With the efficiency of heat engine under loading condition.
Claims (1)
- A kind of 1. heat engine device based on Seebeck effect, it is characterised in that：Filled including heat engine device internal core structure, heat engine Put guidance panel and heat engine device circuit；Heat engine device internal core structure includes a hot junction heating plate, two Peltiers half Conductor, a heat-pipe radiator and two fans；Heat engine device guidance panel include cold junction temperature show, Peltier semiconductor Both end voltage is shown, hot-side temperature is shown, heat engine fundamental diagram, ohmic load, supply hub for load；Heat engine device circuit bag Include display circuit, temperature collection circuit, voltage collection circuit, thermoregulator；Heat engine device internal core structure, hot junction heating plate generate high temperature as Peltier semiconductor in the presence of external power supply Hot junction；Peltier semiconductor produces paltie effect in the state of energization and causes the reduction of Peltier semiconductor one side temperature, Another side temperature raises；Cold end of the low one side of temperature as Peltier semiconductor；Heat-pipe radiator and two fan compositions dissipate Hot systems are close to the high one side of Peltier conductor temperature, carry out radiating treatment, ensure that cold junction temperature is controllable；The hot junction of P-type semiconductor and N-type semiconductor is connected to form P-N pairs by Peltier semiconductor by sheet metal, then in P The cold end of type semiconductor and the cold end output DC current of N-type semiconductor；Run pid algorithm using single-chip microcomputer controls the temperature of cold end constant at 1 DEG C by adjuster；Single-chip microcomputer to cold junction temperature, The magnitude of voltage at the load both ends of hot-side temperature and Peltier semiconductor gathers display in real time；Panel integrated resistor has 1.2 Ω, 3.0 Ω, 5.1 Ω, 10 Ω, and pa is loaded into by the way that external wire is combined to resistance The output of your patch semiconductor, realize the external different resistances load of heat engine device, for measure load consuming power, optimum load, Pyroconductivity, the efficiency of heat engine；The magnitude of voltage of cold junction temperature, hot-side temperature and Peltier semiconductor load both ends can be shown on guidance panel；Low-temperature receiver is constant at 1 DEG C by temperature using pid algorithm；Temperature difference caused by hot and cold side is acted on Peltier semiconductor, from And produce electric energy；Caused electric energy is powered for load resistance, and single-chip microcomputer is acquired to the voltage signal for loading both ends, and in heat Shown on machine device guidance panel；Hot junction and cold end are embedded into using pt100 micro temperature sensors, carry out temperature survey, is led to Temperature signal is converted to 4-20mA current signals by excess temperature transmitter, and single-chip microcomputer is acquired conversion to current signal, by temperature Angle value is shown on panel；Single-chip microcomputer controls cold end adjuster to make cold junction temperature according to the temperature signal of cold end by pid algorithm It is constant at 1 DEG C；Deviation between 1 DEG C of the actual value of cold junction temperature and setting value is carried out ratio, integration and differential and transported by pid algorithm Calculate, operation result acts on cold end adjuster the temperature for controlling cold end, and temperature control precision is up to 0.25 DEG C；Pid algorithm expression formula is：U (k)=Pe (k)+I [e (k)+e (k-1)+...+e (0)]+D [e (k)-e (k-1)]In formula：U (k) is the controlled quentity controlled variable that the single-chip microcomputer of kth time sampling instant calculates；P is proportionality coefficient；I is integral coefficient；D is Differential coefficient；E (k) is this deviation；The workflow of pid algorithm program includes, and each variable is defined first, then to deviation with institute it is devious and Initialization clearing is carried out, calculates the deviation of this sampling, that is, the deviation of 1 DEG C of cold junction temperature actual value and setting value；Sentence Whether the value of disconnected deviation is 0；If deviation is not 0, P value is calculated, judges whether this deviation is less than the maximum of setting partially Difference, if being less than maximum deflection difference value, calculate all deviations and I value is calculated, if being more than maximum deflection difference value, I=0；Simultaneously This deviation and the difference of preceding deviation are calculated, this deviation is then assigned to preceding deviation value, calculates D value；If this Deviation is 0, then regulation terminates.
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| CN110718624A (en) * | 2019-08-27 | 2020-01-21 | 天津大学 | Peltier effect cooling device and method for TDC chip |
| CN112004312B (en) * | 2020-09-25 | 2022-03-18 | 广州小鹏汽车科技有限公司 | Printed circuit board and overcurrent upper limit adjusting method of printed circuit board |
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| FR2419479A1 (en) * | 1978-03-07 | 1979-10-05 | Comp Generale Electricite | Heat pump for air conditioning system - has thermal semi-conductor units in contact with electrically conducting heat exchanger bodies |
| US6959555B2 (en) * | 2001-02-09 | 2005-11-01 | Bsst Llc | High power density thermoelectric systems |
| US7293416B2 (en) * | 2004-12-23 | 2007-11-13 | Nanocoolers, Inc. | Counterflow thermoelectric configuration employing thermal transfer fluid in closed cycle |
| US8039726B2 (en) * | 2005-05-26 | 2011-10-18 | General Electric Company | Thermal transfer and power generation devices and methods of making the same |
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