CN106206370A - Manufacture device and manufacture method - Google Patents

Manufacture device and manufacture method Download PDF

Info

Publication number
CN106206370A
CN106206370A CN201610366184.2A CN201610366184A CN106206370A CN 106206370 A CN106206370 A CN 106206370A CN 201610366184 A CN201610366184 A CN 201610366184A CN 106206370 A CN106206370 A CN 106206370A
Authority
CN
China
Prior art keywords
swivel knife
light
cut
shut
optical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610366184.2A
Other languages
Chinese (zh)
Other versions
CN106206370B (en
Inventor
片冈昌
片冈昌一
望月启人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN106206370A publication Critical patent/CN106206370A/en
Application granted granted Critical
Publication of CN106206370B publication Critical patent/CN106206370B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006Cutting members therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The present invention relates to manufacture device and manufacture method, use 1 sensor mechanism and the breakage of 1 the drive mechanism detection swivel knife making shut-off mechanism lift and abrasion.Shut-off mechanism is provided with the swivel knife testing agency including sensor mechanism, rotating member, rotary shaft and pressing member, the drive mechanism of Z axis makes sensor mechanism essence lift, and selects swivel knife lower end to be positioned at the sensor mechanism position of state of set off-position and sensor mechanism optical axis is positioned at the sensor mechanism position of state of set position of readiness.Detect the breakage of swivel knife when set off-position when swivel knife lower end is positioned at the substrate cutting that will have sealed, detect the abrasion of swivel knife when optical axis is positioned at set position of readiness when not cutting off the substrate sealed.Sensor mechanism and the drive mechanism of Z axis is used to detect the abrasion of swivel knife with damaged.

Description

Manufacture device and manufacture method
Technical field
The present invention relates to a kind of manufacture and the cut-out of cut-off thing singualtion are formed multiple goods Manufacture device and manufacture method.
Background technology
Printed base plate or the substrate that is made up of lead frame etc. are virtually divided into cancellate many Individual region, and after regional is provided with the element (such as semiconductor chip) of shaped like chips, Substrate entirety is carried out resin seal and obtains the so-called substrate sealed.Rotated by use The substrate cutting that the shut-off mechanisms such as cutter will seal, and the shape with regional for unit singualtion Become goods.
It is known that use set by the substrate that sealed of shut-off mechanism in the manufacturing apparatus Region is cut off by shearing devices such as swivel knife.First, cut-off thing is (i.e., close The substrate of envelope) load and be adsorbed in the platform for cutting off.Secondly, the substrate that will have sealed Carry out being directed at (position alignment).By alignment, set the imaginary cutting line in the multiple region of zoning Position.Secondly, make to be adsorbed with the platform for cut-out and the shut-off mechanism phase of the substrate sealed To movement.The place of incision of the substrate sealed is sprayed cutting water, and passes through shut-off mechanism The substrate sealed is cut off along the cutting line being set in the substrate sealed.Manufacture logical Cross the substrate cutting that sealed and the goods of singualtion.
In shut-off mechanism, swivel knife is connected by rotary shaft with drive mechanism.Shut-off mechanism leads to Cross the substrate cutting utilizing drive mechanism to make swivel knife high-speed rotary then will seal.Swivel knife by Gradually wear away in cut-out repeatedly.If swivel knife produces and wears away, the diameter of swivel knife diminishes, because of This corresponding abrasion loss must deepen penetraction depth.It is therefore desirable to detect the abrasion of swivel knife all the time Amount is to adjust penetraction depth.So-called " penetraction depth " refers to that swivel knife is relative to cut-off thing (through-thickness enters) degree of depth of incision.So-called " set penetraction depth " refers to The bottom of the outer rim of swivel knife extends slightly from the degree of depth of degree below cut-off thing.
If proceeding the cut-out of the substrate sealed, the most sometimes due to the abrasive grains of swivel knife Blocking or the impact such as filling, cut-out load and cause the point of a knife of swivel knife produce damaged (disappearance, Rupture).If producing breakage, then cannot be carried out cutting off normally, causing cutting off quality deterioration.? When producing damaged situation, if being changed without swivel knife, then may produce defective products.Therefore, Ask to hold all the time and whether do not produce breakage.In the cut-out using swivel knife, it is desirable to hold all the time The abrasion of swivel knife and the breakage of swivel knife.
Cutting dress as the damage testing with Abrasion detecting that can correctly carry out cutting tip Put, it is proposed that following topping machanism, it include to be cut cutting tip that thing cuts, Detect the blade detection sensor of the state of cutting tip optically, make blade detect sensor Relative to cutting tip peripheral part close to or away from mobile device and according to blade detect The breakage of the testing result detection cutting tip of sensor and the blade state test section (example of abrasion As, with reference to the paragraph [0012] of patent documentation 1, Fig. 4 to Fig. 6).
Patent documentation 1: Japanese Unexamined Patent Publication 2006-287111 publication.
Summary of the invention
But, according to the topping machanism disclosed in patent documentation 1, problems with can be produced.As Shown in Fig. 4 to Fig. 6 of patent documentation 1, the damage testing of cutting tip is entering being cut thing The period of row cutting is carried out.When carrying out the damage testing of cutting tip, made by mobile device The blade detection sensor 30 being positioned at Abrasion detecting position moves to damage testing position.By blade State detecting section 40 switches to damage testing portion 50, carries out machined object at cutting tip 22 During cutting, damage testing portion 50 carries out the damage testing of cutting tip 22.Cutting tip Abrasion detecting is not being carried out being cut the period that thing cuts.At the mill carrying out cutting tip During consumption detection, make the blade detection sensor 30 being positioned at damage testing position by mobile device Mobile to Abrasion detecting position.Blade state test section 40 is switched to Abrasion detecting portion 60, mill The period that machined object is not cut by consumption test section 60 at cutting tip 22 is (the most regular Ground) carry out the Abrasion detecting of cutting tip 22.
According to existing topping machanism, cutting can be detected by 1 blade detection sensor 30 The breakage of blade 22 and abrasion.It is necessary to utilize independent special mobile device 70 to make Blade detection sensor 30 is respectively moved to damage testing position and mill by mobile device 70 Consumption detection position.Further, it is necessary to detect the position of sensor 30 accordingly by blade-like with blade State test section 40 electrical (as circuit) switches to damage testing portion 50 and Abrasion detecting portion 60. Therefore, it is necessary to arrange make the blade detection special mobile device 70 that moves of sensor 30 and The switching device of blade state test section 40.These arrange the composition complexity making topping machanism, because of This makes the manufacturing cost of topping machanism rise.
The present invention is used for solving the problems referred to above, its object is to provide a kind of and detects swivel knife Breakage and the manufacture device and the manufacture method that wear away and can suppress manufacturing cost.
In order to solve the problems referred to above, the manufacture device of the present invention includes: putting down of the cut-off thing of mounting Platform, cut off cut-off thing shut-off mechanism, be arranged at shut-off mechanism swivel knife, make platform with 1st travel mechanism of shut-off mechanism relative movement and make platform and shut-off mechanism OQ t The 2nd travel mechanism, and use the 1st travel mechanism and by swivel knife cut off be cut off Thing and use when manufacturing multiple goods, this manufacture device is characterised by, including sensor machine Structure, it is arranged at shut-off mechanism, the state of the peripheral part of detection swivel knife;Rotating member, its Being arranged at shut-off mechanism, at one end portion is fixed with sensor mechanism;Rotary shaft, it is fixed on cuts Breaking mechanism, is installed on rotating member and rotating member can be made to rotate;Pressing member, it is fixed In shut-off mechanism, and it is set to contact with the other end of rotating member;Stop member, It is fixed on shut-off mechanism, and uses rotating member to be cut off unlike certain being located closer to The mode of thing makes rotating member stop;Light-emitting device, it is contained in sensor mechanism, and is revolving Arranging in the way of being configured at the side of swivel knife in the peripheral part of rotor, light is irradiated in injection;It is subject to Electro-optical device, it is contained in sensor mechanism, and to be arranged in rotation in the peripheral part of swivel knife The mode of the opposite side of cutter is arranged, and accepts by the incident illumination constituted at least partially irradiating light; Optical axis, it has jointly for light-emitting device and infrared rays receiver;And control portion, it is at least controlled The lifting of swivel knife processed;By using the 2nd travel mechanism to make shut-off mechanism relative to platform phase Decline over the ground and make the lower end of swivel knife be positioned at set off-position when being cut off by cut-off thing State under, infrared rays receiver accepts the 1st incident illumination that do not blocked by swivel knife;By using 2nd travel mechanism makes shut-off mechanism relatively rise relative to platform and make optical axis be positioned at and do not cut off Under the state of set position of readiness during cut-off thing, infrared rays receiver accepts not hidden by swivel knife 2nd incident illumination of gear;So that light income ratio based on the 1st incident illumination is based on the 2nd incident illumination The mode that light income is few adjusts the position of optical axis;By detecting light income based on the 1st incident illumination Change and detect the breakage of swivel knife;By detecting the change of light income based on the 2nd incident illumination Change and detect the abrasion of swivel knife.
The manufacture device of the present invention manufactures as described above device, it is characterised in that light-emitting device be subject to Electro-optical device is arranged at the top of swivel knife.
The manufacture device of the present invention manufactures as described above device, it is characterised in that under swivel knife End is positioned at set off-position, and the other end of rotating member separates with pressing member, and logical Under the state crossing stop member and make rotating member stop, accepting the 1st incident illumination;By making The other end of rotating member contacts with pressing member and makes rotating member rotate, so that optical axis Mobile to the state of set position of readiness, accept the 2nd incident illumination.
The manufacture device of the present invention manufactures as described above device, it is characterised in that be both positioned at optical axis Under the state of fixed position of readiness, optical axis is positioned at the photoelectricity that infrared rays receiver produces according to light income The relation of the position of change and the optical axis of stream have the central part of linear scope or light income from The set part that central part increases.
The manufacture device of the present invention manufactures as described above device, it is characterised in that control portion is by inspection Survey the change of light income based on the 2nd incident illumination and calculate the abrasion loss of swivel knife;Control portion By making shut-off mechanism relatively decline the length equal with the abrasion loss calculated relative to platform Degree, makes the lower end of swivel knife drop to set off-position.
The manufacture device of the present invention manufactures as described above device, it is characterised in that includes being arranged at and sends out The slit of at least one party between electro-optical device and swivel knife and between infrared rays receiver and swivel knife.
The manufacture device of the present invention manufactures as described above device, it is characterised in that cut-off thing is The substrate sealed.
The manufacture device of the present invention manufactures as described above device, it is characterised in that cut-off thing be The multiple regions the most corresponding with multiple goods are incorporated with the tabular component of function element.
In order to solve the problems referred to above, the manufacture method of the present invention comprises the following steps: will be cut-off Thing is placed in platform;By using the 1st travel mechanism to make platform and shut-off mechanism relative movement Cut-off thing is cut off by the swivel knife using shut-off mechanism to be had;And use the 2nd moving machine Structure makes platform and shut-off mechanism OQ t;And by swivel knife, cut-off thing is cut off and manufacture Multiple goods, this manufacture method is characterised by: comprise the following steps: prepare to be respectively arranged at The sensor mechanism of shut-off mechanism, rotating member, pressing member and stop member, above-mentioned biography Sensor mechanism comprises light-emitting device and the infrared rays receiver with common optical axis, above-mentioned rotating member One end is fixed with sensor mechanism, and above-mentioned pressing member can connect with the other end of rotating member Touching, above-mentioned stop member uses and makes rotating member unlike certain position closer to cut-off thing Mode makes rotating member stop;By light-emitting device with infrared rays receiver with the peripheral part across swivel knife Mode configure;Selfluminous device irradiates light to swivel knife injection;Accepted not by infrared rays receiver The irradiation light blocked by swivel knife;And by using the 2nd travel mechanism to make shut-off mechanism phase Platform is relatively declined and make that the lower end of swivel knife is positioned at when being cut off by cut-off thing set Off-position ground state under, use swivel knife cut-off thing is cut off;Light step have with Lower step: when the lower end of swivel knife is positioned at set off-position, infrared rays receiver connects By the 1st incident illumination not blocked by swivel knife;By using the 2nd travel mechanism to make cutting machine Set the treating that structure relatively rises relative to platform and makes optical axis be positioned at not when cutting off cut-off thing Under the state that seat in the plane is put, infrared rays receiver accepts the 2nd incident illumination not blocked by swivel knife;And Divide in the way of making light income based on the 1st incident illumination fewer than light income based on the 2nd incident illumination Do not adjust the position of optical axis;In the step accepting the 1st incident illumination, by detection based on the 1st The change of the light income of incident illumination and detect the breakage of swivel knife;In the step accepting the 2nd incident illumination In Zhou, detect the abrasion of swivel knife by detecting the change of light income based on the 2nd incident illumination.
The manufacture method of the present invention manufactures as described above method, it is characterised in that in preparation process, Light-emitting device and infrared rays receiver are arranged at the top of swivel knife.
The manufacture method of the present invention manufactures as described above method, it is characterised in that light step includes Following steps: by making shut-off mechanism relatively decline and by rotating member relative to platform The other end and pressing member are pulled away from and make the lower end of swivel knife be positioned at the shape of set off-position Under state, rotating member is made to stop by stop member;And make shut-off mechanism relative to platform Relatively rise and make and make rotation under the state that the other end of rotating member contacts with pressing member Component rotates, and thus makes optical axis move to set position of readiness.
The manufacture method of the present invention manufactures as described above method, it is characterised in that be both positioned at optical axis Under the state of fixed position of readiness, optical axis is positioned at the photoelectricity that infrared rays receiver produces according to light income The relation of the position of change and the optical axis of stream have the central part of linear scope or light income from The set part that central part increases.
The manufacture method of the present invention manufactures as described above method, it is characterised in that enter accepting the 2nd Penetrate in the step of light, calculate rotation by detecting the change of light income based on the 2nd incident illumination The abrasion loss of rotor;It is further equipped with following steps: by making shut-off mechanism relative to platform phase Decline the length equal with the abrasion loss calculated over the ground, make the lower end of swivel knife both drop to Fixed off-position.
The manufacture method of the present invention manufactures as described above method, it is characterised in that in preparation process, Prepare be arranged between light-emitting device and swivel knife and between infrared rays receiver and swivel knife extremely The slit of a few side.
The manufacture method of the present invention manufactures as described above method, it is characterised in that cut-off thing is The substrate sealed.
The manufacture method of the present invention manufactures as described above method, it is characterised in that cut-off thing be The multiple regions the most corresponding with multiple goods are incorporated with the tabular component of function element.
According to the present invention, in the manufacturing apparatus, including being arranged at shut-off mechanism and to swivel knife The state of peripheral part carries out the sensor mechanism detected.Sensor mechanism comprises and has common optical axis Light-emitting device and infrared rays receiver.By use the 2nd travel mechanism make shut-off mechanism relative to Platform relatively declines and makes the lower end of swivel knife be positioned at set the cutting when being cut off by cut-off thing Under the state of disconnected position, infrared rays receiver accepts the 1st incident illumination not blocked by swivel knife.Logical Crossing use the 2nd travel mechanism makes shut-off mechanism relatively rise relative to platform and make optical axis be positioned at Under the state of set position of readiness when not cutting off cut-off thing, infrared rays receiver accepts not by revolving The 2nd incident illumination that rotor blocks.By detecting the base fewer than light income based on the 2nd incident illumination The breakage of swivel knife is detected in the change of light income of the 1st incident illumination.By detection than based on The change of the light income based on the 2nd incident illumination that the light income of the 1st incident illumination is many and detect rotation The abrasion of cutter.By using 1 sensor mechanism and 1 the 2nd travel mechanism, rotation can be detected The breakage of rotor and the abrasion of swivel knife.Therefore, the composition of manufacture device can be made to simplify, thus Can the manufacturing cost of restraining device.
Accompanying drawing explanation
Fig. 1 a to Fig. 1 c is to show to be positioned in the lower end of swivel knife will to be sealed by shut-off mechanism Substrate cutting time set off-position state under detect the damaged state of swivel knife Skeleton diagram, Fig. 1 a is front view, and Fig. 1 b is the side view observed from the side of swivel knife.
Fig. 2 a to Fig. 2 c is in display shut-off mechanism shown in Fig. 1, is positioned at optical axis and does not cut off The state of the abrasion of swivel knife is detected under the state of the set position of readiness of the substrate sealed Skeleton diagram, Fig. 2 a is front view, and Fig. 2 b is the side view observed from the side of swivel knife.
The state that Fig. 3 a to Fig. 3 b wears away with the swivel knife in the shut-off mechanism shown in Fig. 1 is right As, Fig. 3 a is that display optical axis is positioned at set position of readiness when not cutting off the substrate sealed The skeleton diagram of state, Fig. 3 b is the skeleton diagram of the state of the abrasion of display detection swivel knife.
Fig. 4 a to Fig. 4 b is right with the state that the swivel knife in the shut-off mechanism shown in Fig. 1 is damaged As, Fig. 4 a is to show set the cutting when lower end of swivel knife is positioned at the substrate cutting that will have sealed The skeleton diagram of the state of disconnected position, Fig. 4 b is the outline of the damaged state of display detection swivel knife Figure.
Fig. 5 is the skeleton diagram of the composition of sensor mechanism in display shut-off mechanism shown in Fig. 1.
Fig. 6 is the top view of the summary manufacturing device of the display present invention.
Symbol description
1: shut-off mechanism
2: fixed plate
The guide rail of 3:Z axle
The drive mechanism (the 2nd travel mechanism) of 4:Z axle
5: ball screw
6: lift component
7: main shaft body portion
8: main shaft
9: rotary shaft
10: swivel knife
The swivel knife of 10a: new product
The swivel knife of 10b: abrasion
11: the substrate (cut-off thing) sealed
12: swivel knife testing agency
13: sensor mechanism
14: rotating member
15: rotary shaft
16: retainer (stop member)
17: pressing member
18: light-emitting device
19: infrared rays receiver
20: irradiate light
21: incident illumination
22: light-emitting component
23,28: fibre bundle
24,29: collecting lens
25,30: prism
26: transmissive window
27: photo detector
31: light receiving window
32: control portion
33: monitor portion
34: manufacture device
35: substrate feed mechanism
36: cut off with platform (platform)
37: travel mechanism (the 1st travel mechanism)
38: rotating mechanism
39: inspection platform
40: the substrate having been turned off
41: pallet
A: substrate feed unit
AX: optical axis
B: substrate cutting unit
C: inspection unit
D: effective diameter
P: goods
S: range of exposures
SL1, SL2: slit.
Detailed description of the invention
As illustrated by figures 1 a-1 c, shut-off mechanism 1 is provided with and includes sensor mechanism 13, rotation structure The swivel knife testing agency 12 of part 14, rotary shaft 15 and pressing member 17.By using Z The drive mechanism 4 of axle makes sensor mechanism 13 lift substantially, and selects swivel knife 10 The position of the sensor mechanism 13 under the state that lower end is positioned at set off-position and sensor Sensor mechanism 13 under the state that the optical axis AX of mechanism 13 is positioned at set position of readiness Position.Set the cutting when being cut off by the substrate 11 sealed it is positioned in the lower end of swivel knife 10 Under the state of disconnected position, the breakage of detection swivel knife 10.Optical axis AX be positioned at do not cut off the closeest Under the state of the set position of readiness during substrate 11 sealed, the abrasion of detection swivel knife 10. By using 1 sensor mechanism 13 to detect swivel knife 10 with the drive mechanism 4 of 1 Z axis Abrasion with damaged.
[embodiment 1]
With reference to Fig. 1 a to Fig. 4 b, for the example manufacturing device as the present invention, by the closeest The shut-off mechanism of the substrate cutting of envelope illustrates.For the either figure of the application, in order to easily Carry out suitable omission in understanding or the most schematically described.For identical composition unit Part marks identical symbol and suitably omits the description.
As illustrated by figures 1 a-1 c, the shut-off mechanism 1 that manufacture device is had includes fixed plate 2.Logical Crossing fixed plate 2 uses guide rail (not shown) to move in X direction and make cut-out along along X-axis Mechanism 1 moves in X direction.Fixed plate 2 is provided with the guide rail 3 of Z axis and driving of Z axis Motivation structure 4.Such as servo motor or stepper motor etc. are fixed on fixed plate as drive mechanism 4 2.Drive mechanism 4 makes lift component 6 lift by ball screw 5.Lift component 6 is fixing main Axle body 7.Ball screw 5 is made to rotate by drive mechanism 4, it is possible to make to be fixed on lifting structure The main shaft body portion 7 of part 6 lifts along the guide rail 3 of Z axis.
Internally installed main shaft (spindle) 8 in main shaft body portion 7.In the rotation that main shaft 8 is had Swivel knife 10 is installed in the leading section of rotating shaft 9.Swivel knife 10 can be loaded and unloaded relative to rotary shaft 9, and Replaceable.Swivel knife 10 high speed rotating is made by spindle motor (not shown), will be as being cut The substrate 11 sealed of disconnected thing cuts off.In Fig. 1 a-1c, display main shaft body portion 7 is had The lower end of swivel knife 10 drop to set off-position, will be sealed by swivel knife 10 Substrate 11 cut off state.So-called set off-position, refers to that swivel knife 10 drops to Rotary shaft sword 10 under the state that the lower end of swivel knife 10 outer rim is positioned at set penetraction depth The position of lower end.
As shown in Figure 1a, shut-off mechanism 1 is provided with the abrasion for detecting swivel knife 10 with broken The swivel knife testing agency 12 damaged.Swivel knife testing agency 12 includes as optical detection device , the sensor of the front side being arranged at main shaft body portion 7 (being provided with the side of swivel knife 10) Mechanism 13.Swivel knife testing agency 12 includes being fixed with sensor as mechanicalness composed component The rotating member 14 of mechanism 13.Rotating member 14 such as has the shapes such as bar-shaped.Rotating member The pars intermedia of 14 is provided with rotary shaft 15.Rotating member 14 centered by rotary shaft 15 partly Rotate.In the lower section of rotating member 14, the installed in front in main shaft body portion 7 has for limiting The retainer 16 of the position of the downside of sensor mechanism 13.Sensor mechanism 13 is fixed on rotation The one end (end in left side in figure) of component 14.
Fixed disk 2 is provided with the other end (end on right side in the figure) phase with rotating member 14 To pressing member 17.Pressing member 17 for example, cam follower, roller follower etc..Logical Cross pressing member 17 to be pressed downward the end on the right side of rotating member 14, thus, rotate Component 14 rotates centered by rotary shaft 15 the most partly.At rotating member 14 State not in contact with pressing member 17 of the end on right side under, in other words, right side end not Under the state pressed downward by pressing member 17, rotating member 14 contacts retainer 16.? Under this state, in the way of making rotating member 14 generally horizontal, adjust the position of rotating member 14 Put.In other words, in certain position that rotating member 14 is generally horizontal, rotating member 14 Contact retainer 16 and stop.
As shown in Figure 1 b, it is fixed on the sensor mechanism 13 of the end in the left side of rotating member 14, With the side extended in the direction (-Z direction in figure) orthogonal with the direction that rotating member 14 extends Formula is arranged.As shown in Figure 1a, sensor mechanism 13 is for including light-emitting device 18 and infrared rays receiver The optical non-contact sensor of 19.Light-emitting device 18 and infrared rays receiver 19 have identical light Axle (common optical axis) AX.Light 20 is irradiated to infrared rays receiver 19 injection from light-emitting device 18.Send out Being shaped as with identical light of the light area of the light-emitting zone of electro-optical device 18 and infrared rays receiver 19 The circle with identical effective diameter D (with reference to Fig. 1 c) centered by axle AX.Will be respectively The light-emitting zone with effective diameter D is referred to as range of exposures S with light area.Irradiate light 20 to The scope that swivel knife 10 is irradiated is same with range of exposures S-phase.
Such as, light-emitting device 18 is light emitting diode (light emitting diode:LED), is subject to Electro-optical device 19 is photodiode (photodiode:PD).Light-emitting device 18 and infrared rays receiver 19 are preferably to configure in the way of the top of the outer rim of swivel knife 10.Light-emitting device 18 with Infrared rays receiver 19 is preferably to configure in the way of the top of the outer rim of swivel knife 10.By This, can be avoided the cutting water near due to the cut-off part of supply to cut-off thing, cold But the drop that water etc. produce is attached to light-emitting device 18 and infrared rays receiver 19.
As shown in Figure 1a, between light-emitting device 18 and infrared rays receiver 19, there is swivel knife 10. The part irradiated in light 20 irradiated to swivel knife 10 is blocked by swivel knife 10.Irradiate light 20 In the irradiation light 20 not blocked by swivel knife 10 arrive infrared rays receiver 19.Infrared rays receiver 19 The irradiation light 20 arriving infrared rays receiver 19 is accepted as incident illumination 21.Infrared rays receiver 19 Produce the photoelectric current of the value corresponding with the intensity (light income) of the incident illumination 21 accepted.Thus, Infrared rays receiver 19 detects the intensity of incident illumination 21.In infrared rays receiver 19, produced photoelectric current is more Greatly, then the degree that irradiation light 20 is blocked by swivel knife 10 is the least.Infrared rays receiver 19 produces Photoelectric current is the least, then the degree that irradiation light 20 is blocked by swivel knife 10 is the biggest.
The irradiation light that the light-emitting device 18 adjusted along Z-direction from sensor mechanism 13 is irradiated The position of 20 illustrates.In other words, light-emitting device 18 and infrared rays receiver are adjusted to along Z-direction The position of the 19 identical optical axis AX being had illustrates.
As shown in Figure 2 b, when making main shaft body portion 7 rise, at certain height and position (along Z side To position), being contacted in pressing member 17 times of the end on the right side of rotating member 14 Face.Making main shaft body portion 7 increase by continuing, the pressing of pressing member 17 relative property ground rotates structure The end on the right side of part 14.Thus, in swivel knife testing agency 12, rotating member 14 with Start toward the clockwise direction centered by rotary shaft 15 to rotate.Generally horizontal along with being adjusted to Rotating member 14 rotates, along-Z direction extend sensor mechanism 13 entirety toward the clockwise direction Rotate.Thus, the identical optical axis AX edge that light-emitting device 18 is had with infrared rays receiver 19 The circular arc centered by rotary shaft 15 to rotate.
Pressing member 17 relative property press rotating member 14 the amount of end on right side less Time, make the rotary motion of the optical axis AX being had along the sensor mechanism 13 of-Z direction extension It is similar to the linear motion along the shorter line segment extended along +Z direction.Therefore, to rotate structure The time point below pressing member 17 that is contacted over of the end on the right side of part 14 is basic point The ascending amount approximately equal of ascending amount and optical axis AX in contact main shaft body portion 7.In other words, Make main shaft body portion 7 increase and pressing member 17 relative property press rotating member 14, thus make Optical axis AX rises substantially.Make main shaft body portion 7 decline and revolve when pressing member 17 is observed Rotating shaft 15 declines, and thus makes optical axis AX decline substantially.
By adjusting the height and position irradiating light 20 irradiated from light-emitting device 18, and can adjust The whole amount irradiating light 20 do not blocked by swivel knife 10.In other words, it is possible to adjust infrared rays receiver 19 light incomes accepting incident illumination 21.Therefore, by adjusting the height position of sensor mechanism 13 Put, strict for, by adjusting the height and position of the optical axis AX that sensor mechanism 13 is had, And the light income that infrared rays receiver 19 accepts can be adjusted.Had by adjusting sensor mechanism 13 The height and position of some optical axis AX such that it is able to be used for making swivel knife 10 move along Z-direction Drive mechanism 4 and 1 sensor mechanism 13 of 1 dynamic Z axis detect swivel knife 10 Abrasion and damaged (following).
With reference to Fig. 1 a-1c, the damaged operation to detecting swivel knife 10 as the 1st operation is entered Row explanation.The sensor mechanism 13 being arranged at swivel knife testing agency 12 is used to detect swivel knife The breakage of 10.First, in the outside of the substrate 11 sealed, rotate making swivel knife 10 Under state, the lower end making main shaft body portion 7 drop to swivel knife 10 is positioned at set off-position. In other words, the bottom making the outer rim that main shaft body portion 7 drops to swivel knife 10 is positioned at set Penetraction depth.Secondly, make swivel knife 10 such as with 30,000 to 40, the degree of about 000rpm Carry out high speed rotating.By making swivel knife 10 and being placed in cut-out platform (not shown) Substrate 11 relative movement sealed is (by making the substrate 11 sealed along +Y direction in Fig. 1 b Mobile) and the substrate 11 sealed is cut off along cutting line.
Set cut-out when being cut off by the substrate 11 sealed it is positioned in the lower end of swivel knife 10 Under the state of position, irradiate light 20 from light-emitting device 18 towards relative infrared rays receiver 19. As depicted in figs. lb-lc, irradiation light 20 in light-emitting device 18 irradiation ground has effective diameter D mm's Circular range of exposures S.It is positioned at the substrate that swivel knife 10 will seal in the lower end of swivel knife 10 Under the state of set off-position during 11 cut-out, pre-adjust sensor machine as follows The height and position of the optical axis AX (with reference to Fig. 1 a) of structure 13.Employing makes to shine from light-emitting device 18 The more than half mode blocked by swivel knife 10 irradiating range of exposures S that light 20 is had penetrated is pre- First adjust the height and position of optical axis AX.Such as, swivel knife 10 for new product the shape without abrasion Under state, pre-adjust the height and position of optical axis AX, so that not blocked by swivel knife 10 and entering The incident illumination 21 being incident upon infrared rays receiver 19 accounts for about 5% in range of exposures S irradiating light 20 Area.In other words, preset the height and position of optical axis AX, so that irradiating light 20 In range of exposures S about 95% is blocked by swivel knife 10.
Along with swivel knife 10 wears away, irradiate being hidden by swivel knife 10 in range of exposures S of light 20 The area of gear reduces.For example, it is assumed that the effective diameter D irradiating light 20 is 1mm.? The face blocked by swivel knife 10 when swivel knife 10 wears away to certain degree, in effective diameter 1mm Amass and become pettiness.Therefore, it is difficult to detect the breakage of swivel knife 10.Thus, sensor mechanism 13 Range of exposures S be preferably the size of certain degree.Therefore, the effective diameter D of range of exposures S It is preferably the size of certain degree.Specifically, light-emitting area and the effective diameter D of light-receiving area It is preferably more than 3mm, more preferably more than 4mm.
On the other hand, if light-emitting area is excessive with the effective diameter D of light-receiving area, then swivel knife The area of 10 breakages reduces relative to the ratio of the area suitable with effective diameter D.Therefore, inspection Survey the damaged sensitivity decrease of swivel knife 10.For the damaged spirit by detection swivel knife 10 Sensitivity is maintained on certain level, and effective diameter D is preferably below 6mm, and more preferably 5 Below mm.
Assuming that swivel knife 10 is in complete unbroken state for new product.Such as set in advance one Sample, the incident illumination 21 being incident to infrared rays receiver 19 is the irradiation light 20 irradiated from light-emitting device 18 About 5%.Incident illumination 21 is slowly increased along with the abrasion of swivel knife 10.In swivel knife 10 Peripheral part when producing damaged, incident illumination 21 is incident to infrared rays receiver 19 from this damaged portion.By This, light income pulse feature within the short time that infrared rays receiver 19 detects at damaged portion increases. Therefore, infrared rays receiver 19 detects the change (increasing) of the incident illumination 21 passing through swivel knife 10 As the change of light income, it is possible to detect the breakage of swivel knife 10.Thus, it is not necessary to increase Step, under conventional production status, uses swivel knife testing agency 12 just can detect swivel knife The breakage of 10.
To the effective diameter D of range of exposures S and the damaged abrasion loss that swivel knife 10 can be detected The relation of scope illustrates.Term " abrasion loss " refers to the state that swivel knife 10 is new product Under diameter and abrasion after the difference of diameter.
The scope of the damaged abrasion loss of swivel knife 10 can be detected, depend on such as swivel knife 10 Damaged size, shape, the rotating speed of swivel knife 10, the various conditions such as diameter.Such as, from rotation Rotor 10 be the state of new product rise until irradiate in range of exposures S of light 20 about 25% by Till swivel knife 10 is blocked, the breakage of swivel knife 10 can be detected.In other words, from swivel knife The state that 10 is new product rises until incident illumination 21 is gradually increased becomes photograph along with the increase of abrasion Till penetrating about the 75% of light 20, the breakage of swivel knife 10 can be detected.In swivel knife 10 it is Under the state of new product, preset the height and position of optical axis AX so that irradiating the irradiation model of light 20 About 95% enclosed in S is blocked (about 5% irradiated in light 20 is accepted) by swivel knife 10. Be equivalent to irradiate light 20 thus, it is possible to the damaged scope of detection swivel knife 10 is incident illumination 21 The scope of about 5 to 75%.Therefore, the amplitude of damaged scope of swivel knife 10 can be detected for having 70% (=75%-5%) left and right of effect diameter D.
When using the sensor mechanism 13 that effective diameter D is 4mm of range of exposures S, Reach amount (the i.e. 2.8mm suitable for 70% (=75%-5%) of effective diameter D with 4mm The abrasion loss of left and right) before, the breakage of swivel knife 10 can be detected.Therefore, swivel knife 10 From the state of new product till the abrasion loss of about 2.8mm, it is not necessary to change optical axis AX's Height and position just can detect the breakage of swivel knife 10.At the effective diameter D using range of exposures S During for the sensor mechanism 13 of 5mm, in 70% phase of the effective diameter D reached with 5mm When amount (i.e. the abrasion loss of about 3.5mm) before, the breakage of swivel knife 10 can be detected.
In the examples described above, generally horizontal by contact retainer 16 at rotating member 14 State under, swivel knife 10 from new product state start abrasion until abrasion loss is about 2.8mm Till period, the breakage of swivel knife 10 can be detected.Thus, it is not necessary to change optical axis AX's Height and position just can detect the swivel knife 10 abrasion loss from new product state abrasion to about 2.8mm Till the breakage of swivel knife 10 of period.It is therefore not necessary to be provided for making sensor mechanism 13 The special drive mechanism of movement, just can become a certain value (such as 2.8mm) in abrasion loss The breakage of period detection swivel knife 10.
With reference to Fig. 2 a-2c, the operation to the abrasion detecting swivel knife 10 as the 2nd operation is entered Row explanation.Use and be arranged at the sensor mechanism 13 of swivel knife testing agency 12 to detect rotation The abrasion of cutter 10.After the cut-out of the substrate 11 sealed completes, use driving of Z axis Motivation structure 4 makes main shaft body portion 7 rise, until optical axis AX is positioned at set position of readiness is Only.As shown in Figure 2 b, when making main shaft body portion 7 rise, at certain position rotating member 14 Being contacted over below pressing member 17 of end on right side.Make main shaft body by continuing Portion 7 slightly rises, and rotating member 14 the most slightly revolves centered by rotary shaft 15 Turn.Slightly rotated by rotating member 14 and make the optical axis AX of sensor mechanism 13 gently towards Top (+Z direction) is mobile.Arrive the time point of set position of readiness at optical axis AX, make The rising in main shaft body portion 7 stops.
Such as shown in Fig. 2 b-2c, so-called set position of readiness refers to from sensor mechanism 13 Irradiate in light 20 50% optical axis that can arrive infrared rays receiver 19 that irradiates of light-emitting device 18 AX is in the position of short transverse.In other words, employing makes in irradiation light 20 50% by swivel knife 10 modes blocked, the position of readiness making optical axis AX and this set is consistent.In main shaft body portion 7 when not cutting off the substrate 11 sealed, and uses and makes optical axis AX become set position of readiness Mode, makes sensor mechanism 13 stop.Hereinafter, this will be referred to as " making sensor mechanism 13 exist Set position of readiness stops ".
At set position of readiness, infrared rays receiver 19 accepts to irradiate 50% in light 20.Thus, At change and the central part of the change proportional band of photoelectric current of light income, detect swivel knife The abrasion of 10.In other words, have linearly with the relation of the change of photoelectric current in the change of light income The central part of scope, the abrasion of detection swivel knife 10.Therefore, can stablize and precision well The abrasion of detection swivel knife 10.
Statement " in irradiation light 20 50% " refers to the light income of infrared rays receiver 19 acceptance The situation of the 50% of irradiation light 20.It is subject to additionally, statement " in irradiation light 20 50% " comprises The light income that electro-optical device 19 accepts is positioned at the model of the change of light income and the ratio that is changing into of photoelectric current The situation near central part enclosed.Statement " set position of readiness " refers to optical axis AX's The relation of the change of height and position and photoelectric current has the central part of linear scope and (comprises central authorities Near portion) the height and position of optical axis AX.
Operation to the abrasion of detection swivel knife 10 sequentially illustrates.First, in swivel knife 10 Lower end be positioned at set cut-out position when being cut off by the substrate 11 sealed by swivel knife 10 Under the state put, sensor mechanism 13 is used to confirm that swivel knife 10 is without breakage.
Secondly, after the cut-out of the substrate 11 sealed completes, main shaft body portion 7 is made to increase To set position of readiness.Even if not cutting off the set position of readiness of the substrate 11 sealed, Also swivel knife 10 can be made to use the rotating speed identical with when cutting off or rotate than rotating speed slow when cutting off.
Secondly, at set position of readiness, infrared rays receiver 19 will irradiate from light-emitting device 18 The light not blocked by swivel knife 10 irradiated in light 20 accepts as incident illumination 21.To make For new product without abrasion swivel knife 10 be installed on rotary shaft 9 state under, use make light fill The light income putting 19 acceptance becomes the mode of irradiate light 20 about 50% to preset main shaft The position of readiness of body 7.
When main shaft body portion 7 stops at set position of readiness, at shut-off mechanism 1 Middle the optical axis AX of sensor mechanism 13 is maintained at identical height and position all the time.When due to rotation When rotor 10 wears away and makes the diameter of swivel knife 10 diminish, irradiate in light 20 not by swivel knife 10 light blocked (that is incident illumination 21) increase.Therefore, the incidence that infrared rays receiver 19 accepts The light income of light 21 increases.The change of the abrasion loss of pre research swivel knife 10 and incident illumination 21 The relation of change of light income, and this relation is stored in control portion (not shown).Control portion The increments of stored relation with light income is compared.Thus, swivel knife 10 can be detected Abrasion loss.It is therefore not necessary to increase step, under conventional production status, use swivel knife inspection Survey mechanism 12 and just can detect the abrasion of swivel knife 10.
By arranging swivel knife testing agency 12 at shut-off mechanism 1, it is possible to swivel knife 10 times It is broken that end is positioned under the state of set off-position when being cut off by the substrate 11 sealed detection Damage, and can the set position of readiness detection when not cutting off the substrate 11 sealed wear away. It is therefore not necessary to increase the step of the breakage Yu abrasion in order to detect swivel knife 10, carrying out routine Production during, just can detect breakage and the abrasion of swivel knife 10.Additionally, by using The drive mechanism 4 of 1 sensor mechanism 13 and 1 Z axis, it is possible to detection swivel knife 10 Abrasion are with damaged.
As shown in Figure 3 a-3b, when the cut-out of the substrate 11 persistently carrying out several piece has been sealed, Swivel knife 10 gradually wears away and makes the diameter of swivel knife 10 diminish.In Fig. 3 a-3b, by swivel knife 10 for new product, the swivel knife of state without abrasion represents with the swivel knife 10a of new product, will grind The swivel knife of consumption represents with swivel knife 10b.Wear away as the swivel knife 10a of new product and become rotation During the state of cutter 10b, irradiate the light not blocked in light 20 by swivel knife 10b (that is, incident Light 21) increase.Therefore, the light income of the incident illumination 21 that infrared rays receiver 19 accepts increases.Logical Cross and detect the change (increasing) of this light income and the abrasion loss of swivel knife 10 can be calculated.
Operation to the abrasion of detection swivel knife 10 specifically illustrates.First, by experiment Obtain abrasion loss and the light income relation relative to the ratio of luminous quantity in advance.Such as, lead in advance Cross measuring swivel knife 10 to be light income during new product, accepted when 0.1mm wears away Light income, the light income accepted when 0.2mm wears away, accepted when 0.3mm wears away Light income ... and the light income accepted when X mm wears away.Assuming that by reality The ratio of the luminous quantity testing the light income of acquisition and irradiate light 20 according to said sequence be a0%, a1%, A2%, a3% ..., ax%.Each abrasion loss is closed relative to the ratio of luminous quantity with light income It is mathematical expression and obtains relational expression.The relational expression obtained is stored in control portion (not shown). Each abrasion loss and light income can also be made synopsis relative to the proportionate relationship of luminous quantity (Lookup Table:LUT), and this LUT is stored in control portion.By by infrared rays receiver 19 light incomes detected contrast with the relational expression being stored in control portion or LUT, it is possible to Calculate the abrasion loss of swivel knife 10.
Secondly, as shown in Figure 3 a, stop at set position of readiness in sensor mechanism 13, Under the state that swivel knife 10 rotates, the abrasion of detection swivel knife 10.In this condition, first, Use and make to irradiate not hidden by the swivel knife 10a of new product light 20 from what light-emitting device 18 irradiated The mode that light income is 50% of the light (that is, incident illumination 21) of gear, pre-adjusts sensor machine The height and position of structure 13.Thus, sensor mechanism 13 is made to stop at set position of readiness.
Secondly, as shown in fig. 4 a, the substrate 11 that the swivel knife 10b using abrasion will have been sealed The situation cut off illustrates.Now it is necessary to make main shaft body portion 7 drop to the rotation of abrasion The bottom of cutter 10b is (deeper with set incision than position deep below the substrate 11 sealed Spend suitable position).When using the swivel knife 10b of abrasion, it is necessary to the rotation using new product Penetraction depth during cutter 10a compares, and makes main shaft body portion 7 decline the swivel knife 10b worn away The amount of abrasion loss.In the present embodiment, stop at not cut off in sensor mechanism 13 and sealed Under the state of set position of readiness during substrate 11, infrared rays receiver 19 is used to measure light income.
In order to calculate the swivel knife 10b of abrasion by using infrared rays receiver 19 to measure light income Abrasion loss, use following two method any one.First method is by by being measured Light income carries out contrasting to calculate the rotation worn away with the relational expression or LUT that are stored in control portion The method of the abrasion loss of rotor 10b.By by the light income measured be stored in control portion Relational expression or LUT carry out contrasting and can calculating the abrasion loss of the swivel knife 10b of abrasion.
Second method is such method: be positioned at the state of set position of readiness from optical axis AX Rise, use the drive mechanism 4 of Z axis to make main shaft body portion 7 decline, until measured is subject to Till light quantity approximates 50%.Make distance that main shaft body portion 7 declines and make sensor mechanism 13 Optical axis AX decline distance approximation.Make by calculating the drive mechanism 4 using Z axis Main shaft body portion 7 decline distance (≈ makes the distance that optical axis AX declines) and abrasion can be calculated The abrasion loss of swivel knife 10b.Make from the state that optical axis AX is positioned at set position of readiness The distance that main shaft body portion 7 declines can be approximately equal with the abrasion loss of swivel knife 10b.
First method can also be combined with second method.Rotation is calculated using second method During the abrasion loss of rotor 10b, if the abrasion of swivel knife 10b increase, it is following shape the most sometimes State: make main shaft body portion 7 decline and make the generally horizontal certain position of rotating member 14 (ginseng According to Fig. 1 b), the light income measured is the state beyond 50%.Once become this state, due to Rotating member 14 contacts retainer 16, and rotating member 14 therefore cannot be made again to rotate counterclockwise. Therefore, this state is the state that light income cannot be made to become 50%.When becoming this state, will The method of the abrasion loss calculating swivel knife 10b changes into first method from second method.Thus, Even if when light income is beyond 50%, it is possible to use first method continues to calculate mill The abrasion loss of the swivel knife 10b of consumption.
When optical axis AX is positioned at set position of readiness, infrared rays receiver 19 accepts irradiation In light 20 50%.In addition, it is also possible to be positioned at set position of readiness at optical axis AX Under state, the ratio making infrared rays receiver 19 light in irradiation light 20 is the value (example more than 50% Such as 75%).When optical axis AX is positioned at set position of readiness, irradiate in light 20 As long as the pass cording of the change of the change of the ratio light income of infrared rays receiver 19 light and photoelectric current The median of linear scope or the set value beyond median.In other words, it is being subject to The change of light quantity has in linear scope with the relation of the change of photoelectric current, if optical axis AX The set part that centrally located portion or light income increase from central part.Thus, rotating When the abrasion of cutter 10b increase, it is possible to strengthen and use the detectable abrasion loss of above-mentioned second method Amplitude (measurement range).
Main shaft body portion 7 is made to decline the length equal with the abrasion loss calculated.Carry out and mill The correction that consumption is corresponding, the bottom of the swivel knife 10b of abrasion arrives set penetraction depth. Thus, when making the bottom of swivel knife 10b of abrasion arrive set penetraction depth, The substrate 11 sealed is cut off.It is therefore not necessary to increase step, just can be at conventional production shape Under state, when being cut off by the substrate sealed 11, the incision of the swivel knife 10b controlling abrasion is deep Degree.Owing to being able to maintain that the penetraction depth of certain swivel knife 10, it is possible to stably maintain Cut-out quality when the substrate 11 sealed is cut off.
With reference to Fig. 5, the composition for the sensor mechanism 13 shown in Fig. 1 a-1c illustrates. In sensor mechanism 13, light-emitting device 18 has light-emitting component 22, fibre bundle 23, optically focused Lens 24, prism 25 and transmissive window 26.Infrared rays receiver 19 has photo detector 27, light Fine bundle 28, collecting lens 29, prism 30 and light receiving window 31.As light-emitting component 22, example As light emitting diode (LED) or laser diode (LD) etc. can be used.As photo detector 27, photodiode (PD) etc. can be used.Fibre bundle 23,28 will be for will have 0.2mm extremely Multiple fiber optic fibers, plastics of the diameter of about 0.3mm collect and constitute.
As it is shown in figure 5, light-emitting device 18 has light-emitting component 22, infrared rays receiver 19 has and is subject to Optical element 27.It is preferably and slit SL1 is set between light-emitting device 18 and swivel knife 10.Excellent Elect as and slit SL2 is set between infrared rays receiver 19 and swivel knife 10.Slit SL1 is positioned at and sends out Between electro-optical device 18 and swivel knife 10 and be set to very close to transmissive window 26.Slit SL2 position Between infrared rays receiver 19 and swivel knife 10 and be set to very close to light receiving window 31.Slit SL1 The body of light-emitting device 18 can also be installed on.Slit SL2 can also be installed on infrared rays receiver The body of 19.Any one in slit SL1 and slit SL2 can also be set.
Slit SL1 and slit SL2 is respectively provided with the elongate gap extended along Z-direction.By such The width (size of Y-direction) in gap is set as optimal value.Such as, the width in such gap It is preferably 0.5mm to 1.2mm.When the width in gap is excessive, breaking of detection swivel knife 10 The analytic ability damaged reduces.When the width in gap is too small, light income reduces, therefore in detection Swivel knife 10 is vulnerable to the harmful effect of noise time damaged.
As it is shown in figure 5, in light-emitting device 18, from the light of light-emitting component 22 irradiation via light Fine bundle 23 is also converted into directional light by collecting lens (collimating lens) 24.It is converted into parallel The light of light is advanced towards prism 25 and reflects 90 degree by prism 25, thus becomes along-X side Progressive irradiation light 20.Irradiate light 20 and sequentially pass through the transmissive window 26 of light-emitting device 18 with narrow The gap of seam SL1.The part irradiating light 20 is blocked by swivel knife 10.Irradiate light 20 not by The remainder that swivel knife 10 is blocked sequentially passes through the gap of slit SL2 as incident illumination 21 Light receiving window 31 with infrared rays receiver 19.At infrared rays receiver 19, incident illumination 21 is by prism 30 Reflect 90 degree, and advance along +Z direction.The incident illumination 21 of reflection is gathered by collecting lens 29 Light.The light of optically focused arrives photo detector 27 via fibre bundle 28.
The light accepted by photo detector 27 is carried out opto-electronic conversion, and by corresponding with light income It is sent to control portion 32 as electric signal by optical signal.The light being sent to control portion 32 is believed Number suitable amplification is also AD converted, for damage testing and the Abrasion detecting of swivel knife 10. Will be by optical signal amplification and be shown in monitor portion 33.It addition, control portion 32 is except having detection rotation Outside the breakage of rotor 10 or the function of abrasion, also there is operation, the cut-out bar performing to manufacture device The functions such as the setting of part etc., control.
Light-emitting component 22 and photo detector 27 can also be arranged at the inside in control portion 32.This Time, use longer fibre bundle 23 to be sent by the light-emitting component 22 of the inside in control portion 32 Light guide in light-emitting device 18, and irradiate as irradiating light 20.Use longer light The incident illumination 21 accepted in infrared rays receiver 19 is guided to control portion 32 by fine bundle 28 Internal photo detector 27.
In sensor mechanism 13, it is arranged at the transmissive window 26 of light-emitting device 18 and is arranged at light The light receiving window 31 of device 19 is provided in round window in the position of relative direction.Therefore, from sending out The irradiation light 20 that electro-optical device 18 irradiates has range of exposures S of circle.It is being provided with slit SL1 During with at least one in slit SL2, the incident illumination 21 that infrared rays receiver 19 accepts has along Z The elongated shape that direction extends.Sensor mechanism 13 is made to lift and make transmissive window 26 and light receiving window 31 liftings, thus adjust the position of the optical axis AX that sensor mechanism 13 is had.Can be according to light The position of axle AX and the size of transmissive window 26, adjust the irradiation light towards swivel knife 10 irradiation Irradiation dose.Can adjust not by swivel knife according to the position of the position of optical axis AX Yu light receiving window 31 10 light quantity (that is, the light of the incident illumination 21 that infrared rays receiver 19 accepts irradiating light 20 blocked Amount).Therefore, can be by adjusting the height and position of the optical axis AX that sensor mechanism 13 is had Detect the abrasion of swivel knife 10 with damaged.
According to the present embodiment, desirable following effect.First, due to can by use 1 Sensor mechanism 13 detects abrasion and the breakage of swivel knife 10, manufactures dress therefore, it is possible to simplify The composition put.Therefore, it is possible to suppression manufactures the cost of device.
Second, use the drive mechanism 4 for the Z axis making swivel knife 10 decline, make sensing The position of the optical axis AX that device mechanism 13 has lifts substantially.Thus, it is not necessary to arrange and make sensing The special drive mechanism of the position lifting of the optical axis AX that device mechanism 13 has.Therefore, it is possible to press down System manufactures the cost of device.
3rd, damaged in the period detection that the substrate 11 sealed is cut off by swivel knife 10, The period detection abrasion do not cut off.Thus, it is not necessary to increase step, just can be at conventional production shape Swivel knife testing agency 12 is used to detect breakage and the abrasion of swivel knife 10 under state.Therefore, The productivity being prevented from manufacturing device reduces.
4th, use make light-emitting device 18 that optical pickocff 13 has and infrared rays receiver 19 every The mode of the top of swivel knife 10 to arrange light-emitting device 18 and infrared rays receiver 19.Thus, The attachments such as the spittle that when being prevented from cutting off the substrate 11 sealed, cutting water or cooling water produce In sensor mechanism 13.Optical pickocff 13 is not easily susceptible to the harmful effect of drop etc..Therefore, Optical pickocff 13 can stably and precision detects breakage and the abrasion of swivel knife 10 well.
5th, do not cut off the period of the substrate 11 sealed in swivel knife 10, detect and calculate Go out the abrasion loss of swivel knife 10.By the abrasion loss making main shaft body portion 7 decline and be calculated Equal length, and make the set of the substrate 11 that the bottom of swivel knife 10 drops to seal Penetraction depth.When the bottom of swivel knife 10 is positioned at set penetraction depth, rotation The substrate 11 sealed is cut off by rotor 10.Therefore, the cut-out of the substrate 11 sealed can be made Quality all-the-time stable is in certain state.
6th, the period not cutting off the substrate 11 sealed in swivel knife 10 detects swivel knife 10 abrasion loss time, infrared rays receiver 19 accepts to irradiate 50% in light 20.Thus, in light The change of amount and the central part of the change proportional band of photoelectric current, detect the mill of swivel knife 10 Consumption.In other words, the change of the photoelectric current produced according to light income at infrared rays receiver and optical axis The relation of position has the central part of linear scope, the abrasion of detection swivel knife 10.Therefore, Optical pickocff 13 can stably and precision detects the abrasion of swivel knife 10 well.
When supposing to use the swivel knife 10 with multiple different-diameter, as long as detecting in swivel knife Mechanism 12 is provided with the many groups of axle holes arranged for rotary shaft 15 and such as pin-shaped The combination in the pin hole that retainer 16 is arranged.In axle hole, bearing can also be set.Make With when having the swivel knife 10 of multiple different-diameter, select with the swivel knife 10 used is straight The combination in axle hole corresponding to footpath and pin hole.Rotary shaft 15 is inserted and fixed in selected Axle hole, and pin-shaped retainer 16 is inserted into selected pin hole.Therefore, it is possible to The swivel knife 10 with multiple different-diameter is object, uses 1 optical pickocff 13 to detect The breakage of swivel knife 10 and abrasion.In order to corresponding with the swivel knife 10 with multiple different-diameter, Optical pickocff 13 can also be installed in using the mechanism having screw rod.Now, at Fig. 1 a-1c Can move along Z-direction relative to rotating member 14 with optical pickocff 13 under shown state Mode, optical pickocff 13 is fixed on rotating member 14.For example, it is possible to feed screw, Micrometer first-class installation optical pickocff 13, makes optical pickocff 13 by making screw rod rotate Lifting.
[embodiment 2]
Illustrate for the manufacture device of the present embodiment with reference to Fig. 6.As shown in Figure 6, manufacture Device 34 is the device that cut-off thing singualtion is formed multiple goods.Manufacture device 34 to wrap Include substrate feed unit A, substrate cutting unit B and inspection unit C, using as structure Become element.Each composed component (each unit A to C) can fill relative to other composed components respectively Unload and change.
Substrate feed unit A is provided with substrate feed mechanism 35.Will be equivalent to cut-off thing The substrate 11 sealed takes out of from substrate feed mechanism 35, by transfer mechanism (not shown) It is transferred to substrate cutting unit B.Substrate feed unit A be provided with execution manufacture device 34, The operation of shut-off mechanism 1, swivel knife testing agency 12 and sensor mechanism 13 etc. or control Control portion 32.
The manufacture device that manufacture device 34 is single-blade Cutting platform formula shown in Fig. 6.Therefore, exist Substrate cutting unit B arranges 1 cut-out platform 36.Cut off with platform 36, pass through moving machine Structure 37 and can move along Y-direction in the drawings, and can be along θ side by rotating mechanism 38 To rotation.Load on cut-out platform 36 and adsorb the substrate 11 sealed.
Shut-off mechanism 1 (the reference including main shaft body portion 7 it is provided with in substrate cutting unit B Fig. 1 a-1c, Fig. 2 a-2c).Manufacturing device 34 is the single main shaft including 1 main shaft body portion 7 The manufacture device constituted.Main shaft body portion 7 can move with Z-direction independently along X-direction.? Main shaft body portion 7 is provided with swivel knife 10.By making cut-out platform 37 and main shaft body portion 7 Relatively move and the substrate 11 sealed is cut off.Swivel knife 10 is by comprising Y-direction Transfer to cut off the substrate 11 sealed with the face inward turning of Z-direction.
To have the swivel knife testing agency 12 (with reference to Fig. 1 a to Fig. 2 c) of sensor mechanism 13 It is arranged at shut-off mechanism 1.Thus, the lower end in swivel knife 10 is positioned at the substrate 11 that will have sealed Under the state of set off-position during cut-out, the breakage of detection swivel knife 10.At optical axis AX is positioned under the state of set position of readiness when not cutting off the substrate 11 sealed, detection The abrasion of swivel knife 10.
At inspection unit C, inspection platform 39 is set.Load by by inspection platform 39 The substrate 11 sealed cut off and aggregation that multiple goods P of singualtion are constituted (that is, The substrate 40 cut off).Multiple goods P are checked by the camera (not shown) checked, With screening non-defective unit and defective products.Non-defective unit is contained in pallet 41.
In the present embodiment, for single-blade Cutting platform formula and be the manufacture device 34 that constitutes of single main shaft Illustrate.But the present invention is not limited to this, in single-blade Cutting platform formula and be double main shaft structures Become manufacture device or double Cutting platform formula and be double main shaft composition manufacture device etc. in, also The shut-off mechanism 1 of the present invention can be suitable for.
In embodiments, it has been shown that the substrate 11 sealed of the element comprising shaped like chips is made The situation cut off for cut-off thing.But be not limited to this, using following cut-off thing as removing Cut-off thing beyond the substrate 11 that sealed cuts off and can also be suitable for this during singualtion Bright.First, it is loaded into component, the MEMS being made up of silicon, compound semiconductor The semiconductor crystal wafer of function element such as (Micro Electro Mechanical Systems) The situation of (semiconductor wafer) singualtion.Second, it is loaded into resistor, electric capacity The singualtion such as the ceramic substrate of the function element such as device, sensor, surface acoustic wave element and manufacture core The situation of the goods such as sheet resistance, chip capacitor, chip-shaped sensor, surface acoustic wave element. When this two kinds of situations, semiconductor crystal wafer, ceramic substrate etc. are equivalent to be incorporated with in multiple regions The tabular component of the most corresponding function element.3rd, by the resin forming product list of tabular component Sheet, to manufacture the situation of the optical elements such as lens, optics module, light guide plate.Now, thoroughly Mirror, optics module and light guide plate etc. are equivalent to function element.4th, by resin forming product list Sheet is to manufacture the situation of general molded article.Now, molded article is equivalent to function element. Under the various situations comprising above-mentioned four kinds of situations, applicable foregoing.
The present invention is not limited to the various embodiments described above, can be in the scope without departing from spirit of the present invention In, arbitrarily and suitably it is combined according to needing, changes or select and use.

Claims (16)

1. manufacturing a device, it includes loading the platform of cut-off thing, cutting off described being cut off The shut-off mechanism of thing, it is arranged at the swivel knife of described shut-off mechanism, makes described platform cut with described 1st travel mechanism of breaking mechanism relative movement and make described platform and described shut-off mechanism phase The 2nd travel mechanism to lifting, and using described 1st travel mechanism and by described rotation Cutter uses when cutting off described cut-off thing and manufacture multiple goods, and this manufacture device is characterised by:
Including:
Sensor mechanism, it is arranged at described shut-off mechanism, detects the peripheral part of described swivel knife State;
Rotating member, it is arranged at described shut-off mechanism, and at one end portion is fixed with described sensor Mechanism;
Rotary shaft, it is fixed on described shut-off mechanism, is installed on described rotating member and can make Described rotating member rotates;
Pressing member, it is fixed on described shut-off mechanism, and is configured to and described rotation structure The other end contact of part;
Stop member, it is fixed on described shut-off mechanism, and with described rotating member unlike one The fixed mode being located closer to described cut-off thing makes described rotating member stop;
Light-emitting device, it is contained in described sensor mechanism, and at the peripheral part of described swivel knife The mode of the side that middle employing is configured at described swivel knife is arranged, and light is irradiated in injection;
Infrared rays receiver, it is contained in described sensor mechanism, and at the peripheral part of described swivel knife The mode of the opposite side that middle employing is configured at described swivel knife is arranged, and accepts by described irradiation light The incident illumination constituted at least partially;
Optical axis, it has jointly for described light-emitting device and described infrared rays receiver;And
Control portion, it at least controls the lifting of described swivel knife;
By using described 2nd travel mechanism to make described shut-off mechanism relative to described platform phase Decline over the ground and make that the lower end of described swivel knife is positioned at when being cut off by described cut-off thing set Under the state of off-position, described infrared rays receiver accepts the 1st not entered by what described swivel knife was blocked Penetrate light;
By using described 2nd travel mechanism to make described shut-off mechanism relative to described platform phase Set position of readiness when rising over the ground and make described optical axis be positioned at not to cut off described cut-off thing State under, described infrared rays receiver accepts the 2nd incident illumination that do not blocked by described swivel knife;
Using makes light income based on described 1st incident illumination be subject to than based on described 2nd incident illumination The mode that light quantity is few adjusts the position of described optical axis;
Described swivel knife is detected by detecting the change of light income based on described 1st incident illumination Breakage;
Described swivel knife is detected by detecting the change of light income based on described 2nd incident illumination Abrasion.
Manufacture device the most according to claim 1, wherein, described light-emitting device is with described Infrared rays receiver is arranged at the top of described swivel knife.
Manufacture device the most according to claim 1, wherein, in the lower end of described swivel knife It is positioned at described set off-position, described the other end of described rotating member and described pressing Component separates, and under the state making described rotating member stop by described stop member, acceptance Described 1st incident illumination;
Make by making described the other end of described rotating member contact with described pressing member Described rotating member rotates, so that described optical axis moves the shape to described set position of readiness Under state, accept described 2nd incident illumination.
Manufacture device the most according to claim 1, wherein, is positioned at described at described optical axis Under the state of set position of readiness, described optical axis is positioned at described infrared rays receiver according to described light The change of the photoelectric current measured and produce has linear scope with the relation of the position of described optical axis The set part that central part or light income increase from described central part.
Manufacture device the most according to claim 1, wherein, described control portion is by detection The change of light income based on described 2nd incident illumination and calculate the abrasion loss of described swivel knife;
Described control portion relatively declines relative to described platform and institute by making described shut-off mechanism The length that the described abrasion loss that calculates is equal, make the lower end of described swivel knife drop to described in both Fixed off-position.
Manufacture device the most according to claim 1, it possesses and is arranged at described light-emitting device And at least one party between described swivel knife and between described infrared rays receiver and described swivel knife Slit.
Manufacture device the most according to any one of claim 1 to 6, wherein, described quilt Cutting off thing is the substrate sealed.
Manufacture device the most according to any one of claim 1 to 6, wherein, described quilt Cutting off thing is the plate being incorporated with function element in multiple regions the most corresponding with the plurality of goods Shape component.
9. a manufacture method, it comprises the following steps: cut-off thing is placed in platform;Logical Crossing use the 1st travel mechanism makes described platform and shut-off mechanism relative movement use described cut-out Described cut-off thing is cut off by the swivel knife included by mechanism;And use the 2nd travel mechanism Make described platform and shut-off mechanism OQ t;And by described swivel knife by described cut-off Thing cuts off and manufactures multiple goods, and this manufacture method is characterised by:
Comprise the following steps:
Prepare to be respectively arranged at the sensor mechanism of described shut-off mechanism, rotating member, pressing structure Part and stop member, described sensor mechanism comprises the light-emitting device with common optical axis With infrared rays receiver, the one end of described rotating member is fixed with described sensor mechanism, described presses Pressure component can contact with the other end of described rotating member, and described stop member uses described Rotating member makes described rotation unlike certain mode being located closer to described cut-off thing Component stops;
Described light-emitting device and described infrared rays receiver used the peripheral part across described swivel knife Mode configures;
Light is irradiated to described swivel knife injection from described light-emitting device;
The irradiation light not blocked is accepted by described swivel knife by described infrared rays receiver;And
By using described 2nd travel mechanism to make described shut-off mechanism relative to described platform phase Decline over the ground and make that the lower end of described swivel knife is positioned at when being cut off by described cut-off thing set Under the state of off-position, described swivel knife is used to be cut off by described cut-off thing;
Described light step comprises the following steps:
When the lower end of swivel knife is positioned at described set off-position, described light fills Put the 1st incident illumination accepting not blocked by described swivel knife;
By using described 2nd travel mechanism to make described shut-off mechanism relative to described platform phase Set position of readiness when rising over the ground and make described optical axis be positioned at not to cut off described cut-off thing State under, described infrared rays receiver accepts the 2nd incident illumination that do not blocked by described swivel knife;With And
Using makes light income based on described 1st incident illumination be subject to than based on described 2nd incident illumination The mode that light quantity is few adjusts the position of described optical axis respectively;
In the step accepting described 1st incident illumination, by detection based on described 1st incident illumination The change of light income and detect the breakage of described swivel knife;
In the step accepting described 2nd incident illumination, by detection based on described 2nd incident illumination The change of light income and detect the abrasion of described swivel knife.
Manufacture method the most according to claim 9, wherein, in described preparation process, Described light-emitting device and described infrared rays receiver are arranged at the top of described swivel knife.
11. manufacture methods according to claim 9, wherein, described light step include with Lower step:
By making described shut-off mechanism relatively decline relative to described platform and by described rotation Described the other end of component is pulled away from described pressing member and makes the lower end of described swivel knife be positioned at Under the state of described set off-position, described rotating member is made to stop by described stop member Only;And
Relatively rise relative to described platform making described shut-off mechanism and make described rotating member The state that contacts with described pressing member of described the other end under make described rotating member rotate, Described optical axis is thus made to move to described set position of readiness.
12. manufacture methods according to claim 9, wherein, are positioned at described at described optical axis Under the state of set position of readiness, described optical axis is positioned at described infrared rays receiver according to described light The change of the photoelectric current measured and produce has linear scope with the relation of the position of described optical axis The set part that central part or light income increase from described central part.
13. manufacture methods according to claim 9, wherein, incident accepting the described 2nd In the step of light, calculate by detecting the change of light income based on described 2nd incident illumination The abrasion loss of described swivel knife;
It is further equipped with following steps: by making described shut-off mechanism relative relative to described platform Ground declines the length equal with the described abrasion loss calculated, and makes under the lower end of described swivel knife It is down to described set off-position.
14. manufacture methods according to claim 9, wherein, in described preparation process, Prepare to be arranged between described light-emitting device and described swivel knife and described infrared rays receiver and institute State the slit of at least one party between swivel knife.
15. according to the manufacture method according to any one of claim 9 to 14, wherein, and described quilt Cutting off thing is the substrate sealed.
16. according to the manufacture method according to any one of claim 9 to 14, wherein, and described quilt Cutting off thing is the plate being incorporated with function element in multiple regions the most corresponding with the plurality of goods Shape component.
CN201610366184.2A 2015-05-29 2016-05-27 Manufacturing device and manufacturing method Active CN106206370B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-110741 2015-05-29
JP2015110741A JP6491044B2 (en) 2015-05-29 2015-05-29 Manufacturing apparatus and manufacturing method

Publications (2)

Publication Number Publication Date
CN106206370A true CN106206370A (en) 2016-12-07
CN106206370B CN106206370B (en) 2019-09-13

Family

ID=57453490

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610366184.2A Active CN106206370B (en) 2015-05-29 2016-05-27 Manufacturing device and manufacturing method

Country Status (4)

Country Link
JP (1) JP6491044B2 (en)
KR (1) KR101800120B1 (en)
CN (1) CN106206370B (en)
TW (1) TWI617392B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108943444A (en) * 2017-05-24 2018-12-07 株式会社迪思科 Cutting apparatus
CN114102718A (en) * 2020-08-26 2022-03-01 Towa株式会社 Cutting device and method for manufacturing cut product
CN116167271A (en) * 2023-04-26 2023-05-26 中建隧道装备制造有限公司 Cutter head design and optimization method based on finite element analysis

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6462761B2 (en) * 2017-04-26 2019-01-30 Towa株式会社 Product manufacturing apparatus and manufacturing method
JP6612372B2 (en) * 2018-01-30 2019-11-27 Towa株式会社 Flange replacement mechanism, cutting device, flange replacement method, and method of manufacturing a cut product
KR102187996B1 (en) * 2018-12-31 2020-12-07 코리아테크(주) Cutting Wheel Wear Compensation System
IT201900001053A1 (en) * 2019-01-24 2020-07-24 Faspar S P A AUTOMATIC BLADE CONTROL SYSTEM
CN116252398A (en) * 2022-12-20 2023-06-13 苏州镁伽科技有限公司 Control device and control method
KR102636880B1 (en) * 2023-02-17 2024-02-14 전호대 Cutting apparatus for metal rod without using cutting oil

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2603667Y2 (en) * 1993-07-07 2000-03-15 株式会社ディスコ Blade detection means
TW413100U (en) * 1998-09-30 2000-11-21 Ind Tech Res Inst Non-contact tool position detecting device
JP2002370140A (en) * 2001-06-12 2002-12-24 Disco Abrasive Syst Ltd Blade monitoring device
JP2003124152A (en) * 2001-10-18 2003-04-25 Tokyo Seimitsu Co Ltd Dicing device having mobile blade detector
JP2005125459A (en) 2003-10-24 2005-05-19 Nitto Denko Corp Method of cutting protective tape for semiconductor wafer, and device for cutting the protective tape
JP4679209B2 (en) * 2005-04-04 2011-04-27 株式会社ディスコ Cutting apparatus and blade state detection method
JP4890067B2 (en) * 2006-03-28 2012-03-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate transfer method
JP2009054904A (en) * 2007-08-29 2009-03-12 Disco Abrasive Syst Ltd Cutting method and cutting device
JP5068621B2 (en) * 2007-10-03 2012-11-07 株式会社ディスコ Cutting equipment
US7495759B1 (en) * 2007-10-23 2009-02-24 Asm Assembly Automation Ltd. Damage and wear detection for rotary cutting blades
JP2009231760A (en) * 2008-03-25 2009-10-08 Tokyo Seimitsu Co Ltd Device for detecting breakage/abrasion of blade
JP5603175B2 (en) 2010-09-03 2014-10-08 株式会社ディスコ Cutting blade detection mechanism of cutting equipment
JP6151531B2 (en) 2013-02-20 2017-06-21 株式会社ディスコ Cutting blade detection mechanism
CN104658975A (en) * 2013-11-15 2015-05-27 台湾暹劲股份有限公司 Wafer cutting method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108943444A (en) * 2017-05-24 2018-12-07 株式会社迪思科 Cutting apparatus
CN108943444B (en) * 2017-05-24 2021-11-19 株式会社迪思科 Cutting device
CN114102718A (en) * 2020-08-26 2022-03-01 Towa株式会社 Cutting device and method for manufacturing cut product
CN114102718B (en) * 2020-08-26 2024-01-30 Towa株式会社 Cutting device and method for manufacturing cut product
CN116167271A (en) * 2023-04-26 2023-05-26 中建隧道装备制造有限公司 Cutter head design and optimization method based on finite element analysis

Also Published As

Publication number Publication date
TWI617392B (en) 2018-03-11
JP2016221629A (en) 2016-12-28
CN106206370B (en) 2019-09-13
KR20160140406A (en) 2016-12-07
KR101800120B1 (en) 2017-11-21
TW201641213A (en) 2016-12-01
JP6491044B2 (en) 2019-03-27

Similar Documents

Publication Publication Date Title
CN106206370A (en) Manufacture device and manufacture method
KR102379652B1 (en) Part receiving device with optical sensor
KR100367272B1 (en) High precision semiconductor component alignment systems
CN108789104B (en) Product manufacturing apparatus and manufacturing method
KR101280744B1 (en) Measuring device for workpiece supported by chuck table and laser beam machining apparatus
EP0186278B1 (en) Detecting defects in transparent articles
KR102256561B1 (en) Height position detecting device
US7424773B2 (en) Eyeglass lens processing apparatus
CN101672627B (en) Tyre shape detecting device and tyre shape detecting method
JP5565936B2 (en) Inspection equipment
US7294837B2 (en) Tablets press with integral NIR measuring device
CN107303695A (en) The method to set up of topping machanism
CN109425619A (en) Optical measuring system and method
KR20190016445A (en) Laser machining method
KR101199082B1 (en) Method and Device for surface inspection
CN108573889A (en) The fluctuating detection method and grinding attachment of chip
CN103176115A (en) Optical test device
CN111924455B (en) Floating mechanism, charging tray floating inspection equipment and charging tray conveying system
JP2017090080A (en) Inspection device
JP2018155604A (en) Gauge unit
JPH11214334A (en) Blade set-up system
CN105472961B (en) Component holding head of surface mounting machine
JP6708756B2 (en) Monitoring method of laser scribing process for forming separation groove in solar module
JP5010975B2 (en) Coplanarity inspection apparatus inspection method and apparatus
KR102025370B1 (en) A component holding head for surface mounter

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant