CN106198574A - A kind of lead chi confirms the method for egative film position - Google Patents

A kind of lead chi confirms the method for egative film position Download PDF

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Publication number
CN106198574A
CN106198574A CN201510229951.0A CN201510229951A CN106198574A CN 106198574 A CN106198574 A CN 106198574A CN 201510229951 A CN201510229951 A CN 201510229951A CN 106198574 A CN106198574 A CN 106198574A
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CN
China
Prior art keywords
egative film
chi
lead
lead chi
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510229951.0A
Other languages
Chinese (zh)
Inventor
关雪松
高岩
刘明亮
潘少伟
陈涛
孙佳良
任文凯
刘著民
张贵斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Aircraft Industry Group Co Ltd
Original Assignee
Harbin Aircraft Industry Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin Aircraft Industry Group Co Ltd filed Critical Harbin Aircraft Industry Group Co Ltd
Priority to CN201510229951.0A priority Critical patent/CN106198574A/en
Publication of CN106198574A publication Critical patent/CN106198574A/en
Pending legal-status Critical Current

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Abstract

The present invention relates to a kind of method that lead chi confirms egative film position, comprise before being characterized as ray detection, part entirety is observed, a datum mark is set in non-detection region, as the starting point placing lead chi, can place one or two lead chi as required on two dimensional surface, lead chi must be non-detection region in the position of egative film;Carry out radiography detection, can go out, according to the position resolution of lead chi in egative film, the part position irradiated.

Description

A kind of lead chi confirms the method for egative film position
Technical field
The invention belongs to part technical field of nondestructive testing, relate to a kind of method that lead chi confirms egative film position.
Background technology
For large scale and baroque part, during detection, need the concrete shape according to part and test section Position is cut into different size egative film, and a part is accomplished by up to a hundred egative films, for ease of distinguishing, at electrophotographic process In, need to put code of monitored location, in order to make egative film and tested position one_to_one corresponding, it is simple to search every time.This side The shortcoming of method is: need each position to place mark, loaded down with trivial details and lose time, and easily exists certain artificial Error.
Summary of the invention
The technical problem to be solved in the present invention: a kind of method providing lead chi to confirm egative film position, can solve The problem distinguishing egative film correspondence part position, improves detection efficiency, improves accuracy.
Technical scheme:
A kind of lead chi confirms the method for egative film position, comprises the steps:
The first step, sets datum mark, before ray detection, observes part entirety, sets one in non-detection region Datum mark, as the starting point of placement lead chi, the detection arranging beneficially part of this datum mark;
Second step, prepares a special lead chi, and scale above is font, can demonstrate on egative film;
3rd step, arranges lead chi in non-detection region, before part transillumination, and can be as required on two dimensional surface Placing one or two lead chi, lead chi must be non-detection region in the position of egative film;
4th step, radiography detects, carries out radiography detection, go out photograph according to the position resolution of lead chi in egative film The part position penetrated.
Beneficial effects of the present invention: lead chi of the present invention confirms the method for egative film position, is positioned by lead chi, decreases Put the work of code of monitored location, shorten transillumination and arrange the time.
Detailed description of the invention
Below in conjunction with specific embodiment, the step of the present invention is described in detail.
The present embodiment selects main blade, it is carried out the location of the lead chi before ray detection, comprises the following steps:
The first step, sets datum mark, before ray detection, observes main blade entirety, owing to whole main blade all needs Ray detection to be carried out, its length is about about 6 meters, so the either end of main blade is set as datum mark, As the starting point placing lead chi.
Second step, prepares a special lead chi, and scale above is font, can demonstrate on egative film;
3rd step, arranges lead chi from one end of main blade to the other end, runs through the whole length of part, actually detected Middle according to exposure parameter difference, main blade is divided into different detection regions, these regions along radially dividing, Consistent with the arranged direction of lead chi, such lead chi just can translate, and meeting lead chi in the position of egative film is non-detection zone The requirement in territory;
4th step, carries out radiography detection by region to main blade, goes out photograph according to the position resolution of lead chi in egative film The part position penetrated.Such as the position at 950mm, for the initiating terminal of coating iron at the leading edge, in the position of 6000mm for joining Weight box.The relevant position of main blade can be quickly found by lead chi.

Claims (1)

1. the method that lead chi confirms egative film position, comprises the steps:
The first step, sets datum mark, before ray detection, observes part entirety, sets one in non-detection region Datum mark, as the starting point of placement lead chi, the detection arranging beneficially part of this datum mark;
Second step, prepares a special lead chi, and scale above is font, can demonstrate on egative film;
3rd step, arranges lead chi in non-detection region, before part transillumination, and can be as required on two dimensional surface Placing one or two lead chi, lead chi must be non-detection region in the position of egative film;
4th step, radiography detects, carries out radiography detection, go out photograph according to the position resolution of lead chi in egative film The part position penetrated.
CN201510229951.0A 2015-05-07 2015-05-07 A kind of lead chi confirms the method for egative film position Pending CN106198574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510229951.0A CN106198574A (en) 2015-05-07 2015-05-07 A kind of lead chi confirms the method for egative film position

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510229951.0A CN106198574A (en) 2015-05-07 2015-05-07 A kind of lead chi confirms the method for egative film position

Publications (1)

Publication Number Publication Date
CN106198574A true CN106198574A (en) 2016-12-07

Family

ID=57459604

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510229951.0A Pending CN106198574A (en) 2015-05-07 2015-05-07 A kind of lead chi confirms the method for egative film position

Country Status (1)

Country Link
CN (1) CN106198574A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201508150U (en) * 2009-10-14 2010-06-16 国营红阳机械厂 X-ray internal defect accurate location scale
CN102279198A (en) * 2011-04-25 2011-12-14 中国十九冶集团有限公司 Sheet bonding method and structure for pipe welding seam ray detection
CN202735654U (en) * 2012-08-30 2013-02-13 李超 Lead word code
CN103439409A (en) * 2013-09-03 2013-12-11 宁夏共享集团有限责任公司 Positioning method for groove weld defects of large-wall-thickness pipe fitting
CN104173065A (en) * 2013-05-21 2014-12-03 上海联影医疗科技有限公司 Overall-length shooting marking ruler device
CN204049645U (en) * 2014-09-10 2014-12-31 李�杰 A kind of soft dip stick developed under X-ray
CN204654941U (en) * 2015-05-19 2015-09-23 南方医科大学 A kind of scale of locating for DSA image, measuring and calibrating
EP2705793B1 (en) * 2012-09-07 2016-05-25 Samsung Electronics Co., Ltd Method of displaying virtual ruler on separate image or medical image of object

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201508150U (en) * 2009-10-14 2010-06-16 国营红阳机械厂 X-ray internal defect accurate location scale
CN102279198A (en) * 2011-04-25 2011-12-14 中国十九冶集团有限公司 Sheet bonding method and structure for pipe welding seam ray detection
CN202735654U (en) * 2012-08-30 2013-02-13 李超 Lead word code
EP2705793B1 (en) * 2012-09-07 2016-05-25 Samsung Electronics Co., Ltd Method of displaying virtual ruler on separate image or medical image of object
CN104173065A (en) * 2013-05-21 2014-12-03 上海联影医疗科技有限公司 Overall-length shooting marking ruler device
CN103439409A (en) * 2013-09-03 2013-12-11 宁夏共享集团有限责任公司 Positioning method for groove weld defects of large-wall-thickness pipe fitting
CN204049645U (en) * 2014-09-10 2014-12-31 李�杰 A kind of soft dip stick developed under X-ray
CN204654941U (en) * 2015-05-19 2015-09-23 南方医科大学 A kind of scale of locating for DSA image, measuring and calibrating

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Application publication date: 20161207