CN106197782B - Miniature extrinsic Fabry-perot optical fiber pressure sensor - Google Patents
Miniature extrinsic Fabry-perot optical fiber pressure sensor Download PDFInfo
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- CN106197782B CN106197782B CN201510290246.1A CN201510290246A CN106197782B CN 106197782 B CN106197782 B CN 106197782B CN 201510290246 A CN201510290246 A CN 201510290246A CN 106197782 B CN106197782 B CN 106197782B
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Abstract
A kind of miniature extrinsic Fabry-perot optical fiber pressure sensor disclosed by the invention, it is stable to be intended to provide a kind of performance, it can be improved interference signal intensity, reduce noise, and the warpage of silicon wafer and the generation of glass thermal expansion difference can be eliminated, integral strength is big, pressure sensor at low cost, the technical scheme is that: pressure is by sense core by being formed with the high-boron-silicon glass piece 4 of stepped hole cavity, the three-decker composition that high-boron-silicon glass piece 10 and the silicon wafer 6 being installed between above-mentioned high-boron-silicon glass piece 4 and high-boron-silicon glass piece 10 are constituted, form 5 double-layer cavity structure of Fa-Po cavity 7 and venting cavity being isolated by silicon wafer, pressure is assemblied in fiber stub end face by sense core and linked together.The venting cavity and Fa-Po cavity of silicon wafer two sides of the present invention apply different air pressures on silicon wafer, and pressure is held essentially constant in Fa-Po cavity, detect that ambient pressure detection can be realized in the deformation quantity of silicon wafer.
Description
Technical field
The present invention relates to a kind of miniature extrinsic Fabry-perot optical fiber pressure sensors made of MEMS technology, and in particular to
One kind being based on the miniature extrinsic Fabry-perot optical fiber pressure sensor of optical fibre Fabry-perot (Fabry-berot) principle of interference.
Background technique
Currently used some pressure sensors are all based on electricity device, it has not solving for many inherences
Certainly, such as biggish temperature dependency, vulnerable to electromagnetic interference, volume is big, and mechanical performance, temperature persistence, precision, can
It is not satisfactory by property, long-time stability and repeatability aspect.And the coefficient of thermal expansion mismatch between different materials will lead to temperature
Sensitivity affects accuracy of measurement.The service life of this semiconductor transducer is short simultaneously, and reliability is very in corrosive environment
Difference.Fibre optic compression sensor can preferably solve the above problems.If encapsulating well, it can be used for high temperature and pressure and corruption by safety
In corrosion environment.It does not have chemical activity, and size is small, to temperature-insensitive, not by electromagnetic interference, the good characteristic of long-time stability.
Fabry-perot optical fiber type pressure sensor is the back for the monocrystalline silicon for being 100 by crystal orientation with techniques such as photoetching and association reaction ion etchings
The circular cylindrical cavity of certain depth out is corroded in face, the long cavity depth for being equal to etching and obtaining of chamber, with anode linkage technique by silicon knot
Structure and Pyrex are combined closely integrally, are formed one Perot cavity of Fabry (Fabry-Perot, F-P), finally by optical fiber and glass
The sensor that glass is bonded together by epoxy resin.The country successively has Tsinghua University, University Of Tianjin, Sichuan University, Chongqing big
The more units such as, Harbin Institute of Technology, University On The Mountain Of Swallows have carried out basic research to fibre-optical F-P sensor, but because big
What is mostly used is intensity modulation/demodulation method, however it remains the problems such as returning to zero, correct caused by light-intensity variation, demarcating.Film at present
Chip optical fiber Fabry-Perot pressure sensor is that the inner glass tube with outer glass pipe and for fiber optic collimator uses UV glue sticking
The air chamber of composition.It is bonded quartz diaphragm in one end of air chamber, the other end is inserted into multimode fibre, quartz diaphragm and fiber end face
Two reflecting surface mechanics Fabry-Parot interferent chambers composition Fabry-perot optical fiber pressure sensor, such as University Of Tianjin use silicon wafer and high boron
The Fabry-perot optical fiber pressure sensor of silica glass double-layer structure form research and development is to process Fa-Po cavity on high-boron-silicon glass, passes through
Silicon wafer and high-boron-silicon glass are bonded together by vacuum anode linkage technique.The sensor of this structure has the disadvantage that silicon
Piece is directly exposed in use environment, and vulnerable to physical hazard in manufacture, assembly, use process, various strokes are formed on silicon wafer
Trace and rum point change the mechanics parameter of silicon wafer, sensor performance are caused to change, and influence the stability of sensor；Using SOI crystalline substance
Circle production pressure-sensitive silicon wafer, the SOI for purchasing different mechanical layer thickness is generally required when making the sensor of different ranges, is improved
Purchase batch and cost；The sensor of double-layer structure, silicon wafer and high-boron-silicon glass are there are thermal dilation difference, meeting when being influenced by heat
Lead to that warpage is occurred by sense core, needs to improve integral strength by increasing the means such as high-boron-silicon glass thickness；Thicker high boron
Silica glass reduces the recovery efficiency of fiber exit light, to reduce the light intensity of interference signal, influences to resolve rate.
Summary of the invention
The purpose of the present invention is place in view of the deficiency of the prior art, provide that a kind of performance is stable, Neng Gouti
Height interference signal strength, reduces noise, and can eliminate the warpage that silicon wafer and glass thermal expansion difference generate, integral strength is big, at
This low miniature extrinsic Fabry-perot optical fiber pressure sensor.
Above-mentioned purpose of the invention can be reached by the following measures, a kind of miniature extrinsic Fabry-perot optical fiber pressure sensing
Device, including the optical fiber concordant with the end face of fiber stub, pressure is by sense core 1, fiber stub 2 and optical fiber 3, it is characterised in that:
Pressure is by sense core by being formed with the high-boron-silicon glass piece 4 of stepped hole cavity, high-boron-silicon glass piece 10 and being installed in above-mentioned high borosilicate
The three-decker composition that silicon wafer 6 between sheet glass 4 and high-boron-silicon glass piece 10 is constituted, forms the Fa-Po cavity 7 being isolated by silicon wafer 6
With 5 double-layer cavity structure of venting cavity, pressure is assemblied in fiber stub end face by sense core and linked together.
The present invention is based on MEMS processing technologys, realize micro mechanical structure processing, and the sensor of production has small in size, weight
Gently, the advantages such as consistency is good are suitable for mass and manufacture.Extrinsic type Fabry-perot optical fiber pressure sensor belongs to light transmission type sensor,
Optical fiber itself is not involved in sensing, and only as the channel of optical transport, pressure sensing process is completed by pressure by sense core.
The present invention has the advantages that compared with the prior art.
The present invention makees mechanical support using the high-boron-silicon glass 4 for being not involved in pressure sensing process, and thickness can accomplish milli
Meter level improves pressure by the mechanical strength of sense core, reduces or eliminates silicon wafer and stick up with what high-boron-silicon glass thermal dilation difference generated
It is bent.This design reduces the requirement of the mechanical strength to high-boron-silicon glass 10, thickness can be reduced to 100um hereinafter, effectively
Reduce fiber exit end face at a distance from Fa-Po cavity, mention long optical fibers to the rate of recovery of Fa-Po cavity reflected light signal, thus improve into
Enter the light intensity that sensor resolves component, optimizes the signal-to-noise ratio of sensor.
Realize that silicon wafer subtracts thickness by reduced thickness groove on silicon wafer 6 of the invention.Therefore, identical structure and material, as long as selection
Silicon wafer thickness can be thinned to required thickness by different corrosive liquid concentration and etching time, and to adapt to different ranges, sensitivity passes
Sensor needs.
Structure of the invention, processing technology and demodulation principle are identical as fiber optic fabry perot temperature sensor, are convenient for sensor system
System is integrated, optical fiber is routed, solver multiplexing.
The present invention can be used for requiring the measurement of pressure in strong electromagnetism interference and inflammable and explosive environment, can be used for
Oil storage tank pressure detecting in petroleum industry, measurement of air pressure etc. in factories and miness, have broad application prospects.
The present invention is based on the miniature extrinsic Fabry-perot optical fiber pressure sensors of method Fabry-Parot interferent principle development, belong to contact survey
Pressure sensor.
Detailed description of the invention
It elaborates with reference to the accompanying drawings and examples to the present invention.
Fig. 1 is the schematic cross-sectional view of miniature extrinsic Fabry-perot optical fiber pressure sensor structure of the present invention.
Fig. 2 is Fig. 1 pressure by sense core the schematic diagram of the section structure.
In figure: 1 pressure by sense core, 2 fiber stubs, 3 optical fiber, 4 high-boron-silicon glass, 5 venting cavities, 6 silicon wafers, 7 Fa-Po cavities,
8 part reflective semitransparent films, 9 through-holes, 10 high-boron-silicon glass, 11 reduced thickness grooves.
Specific embodiment
Refering to fig. 1, Fig. 2.In the embodiment described below, miniature extrinsic Fabry-perot optical fiber pressure sensor includes and light
The concordant optical fiber in the end face of fine lock pin, pressure is by sense core 1, fiber stub 2 and optical fiber 3.Pressure is by sense core by being formed with step
The high-boron-silicon glass piece 4 of hole cavity, high-boron-silicon glass piece 10 and it is installed in above-mentioned high-boron-silicon glass piece 4 and high-boron-silicon glass piece 10
Between the three-decker composition that constitutes of silicon wafer 6, form 5 double-layer cavity structure of Fa-Po cavity 7 and venting cavity be isolated by silicon wafer 6,
Pressure is assemblied in fiber stub end face by sense core and linked together.Venting cavity 5 is etched on high-boron-silicon glass piece 4 to guarantee
Pressure stepless action has the through-hole 9 for connecting inside and outside gas/liquid pressure in silicon wafer 6, the production of 5 bottom of venting cavity；High-boron-silicon glass piece 10
On be etched with Fa-Po cavity 7, the production of 7 bottom of Fa-Po cavity has part reflective semitransparent film 8, is vacuum environment in Fa-Po cavity 7.It is etched on silicon wafer 6
There is the reduced thickness groove 11 for meeting transducer range and sensitivity design.The present embodiment by production two panels high-boron-silicon glass and glass it
Between silicon wafer three-decker realize that a piece of high-boron-silicon glass 4 etches Fa-Po cavity 7, another high-boron-silicon glass 10 etches venting cavity
5, high-boron-silicon glass 4, high-boron-silicon glass 10 are bonded together with silicon wafer 6 by vacuum bonding technique.
High-boron-silicon glass 4 plays the role of sensor protection and mechanical support, is not involved in pressure sensing process, and thickness can be with
Accomplish grade, to increase pressure by the mechanical strength of sense core.4 two sides of high-boron-silicon glass is ground and is polished, cleaning and
Venting cavity graphic array is made using photoetching technique after drying, etches venting cavity 5,5 depth of venting cavity not shadow using etching technics
Ring sensor performance.Then, through-hole 9 is made using same process process in the venting cavity bottom of production, washes and dries glass
Wafer.Pressure should be met sensor performance demand by the venting cavity 5 of sense core and shape, size and the depth of Fa-Po cavity 7.
Part reflective semitransparent film 8 can use Ta film, penetrate technique by Ta target vacuum key and be coated with, then in high temperature pure oxygen environment
By Ta metal oxygen metaplasia at Ta2O5Part reflective semitransparent film washes and dries wafer.
Silicon wafer 6 selects the production of monocrystalline silicon wafer crystal piece, and after being processed by shot blasting to its surface, photoetching process makes reduced thickness groove figure
Shape, the reduced thickness groove array of depth needed for being etched using etching technics, the silicon wafer thickness of reservation will meet transducer range and sensitive
Degree requires.Monocrystalline silicon piece and the high-boron-silicon glass wafer with venting cavity 5 are bonded together under vacuum conditions, then with band method
The high-boron-silicon glass wafer vacuum bonding of amber chamber 7 is together.
Pressure by sense core can be separated into using quadrangle, hexagon cutting scribing, the corrosion techniques such as scribing pressure by
Feel core.
Using the fiber stub of outer diameter 2.5mm, internal diameter 129um, long 10.5mm, when production, injects high to fiber stub inner hole
Warm solidification glue removes the coat of optical fiber and inserts optical fibers into fiber stub, hot setting.
Insertion core end face is ground using FC/PC fibre-optical splice platform for making, until fiber end face is concordant with insertion core end face, end face
Smooth no marking；Pressure is linked together by sense core and fiber stub using optical cement or laser welding, completes sensor
Production, when connection, need to guarantee that pressure is aligned by sense core with fiber stub center.
Claims (8)
1. a kind of miniature extrinsic Fabry-perot optical fiber pressure sensor, including the optical fiber (3) concordant with the end face of fiber stub (2),
Pressure is by sense core (1), it is characterised in that: pressure is by sense core by being formed with the first high-boron-silicon glass piece (4) of stepped hole cavity
With the second high-boron-silicon glass piece (10) and be installed in above-mentioned first high-boron-silicon glass piece (4) and the second high-boron-silicon glass piece (10) it
Between silicon wafer (6) constitute, and be etched with venting cavity (5) on the first high-boron-silicon glass piece (4), the production of venting cavity (5) bottom has
Perforative through-hole (9), composed three-decker form the bilayer of the Fa-Po cavity (7) and venting cavity (5) be isolated by silicon wafer (6)
Cavity body structure, pressure are assemblied in fiber stub end face by sense core and linked together.
2. miniature extrinsic Fabry-perot optical fiber pressure sensor as described in claim 1, it is characterised in that: the second high-boron-silicon glass
It is etched on piece (10) Fa-Po cavity (7), the production of Fa-Po cavity (7) bottom has part reflective semitransparent film (8).
3. miniature extrinsic Fabry-perot optical fiber pressure sensor as described in claim 1, it is characterised in that: silicon wafer etches on (6)
Have reduced thickness groove (11), the first high-boron-silicon glass piece (4), the second high-boron-silicon glass piece (10) and silicon wafer (6) pass through vacuum bonding work
Skill is bonded together.
4. miniature extrinsic Fabry-perot optical fiber pressure sensor as claimed in claim 3, it is characterised in that: the Fa-Po cavity after bonding
(7) internal is vacuum.
5. miniature extrinsic Fabry-perot optical fiber pressure sensor as described in claim 1, it is characterised in that: part reflective semitransparent film (8)
Using Ta film, technique is penetrated by Ta target vacuum key, by Ta metal oxygen metaplasia at Ta in high temperature pure oxygen environment2O5Part reflective semitransparent film,
Ta film is coated on Fa-Po cavity (7) bottom.
6. miniature extrinsic Fabry-perot optical fiber pressure sensor as described in claim 1, it is characterised in that: silicon wafer (6) is selected single
The production of crystal silicon wafer, after being processed by shot blasting to its surface, uses etching technics etched recesses reduced thickness groove array.
7. miniature extrinsic Fabry-perot optical fiber pressure sensor as described in claim 1, it is characterised in that: fiber stub is using high
Pyrex or ceramic material inject high temperature setting glue to fiber stub inner hole when production, remove the coat of optical fiber simultaneously
Insert optical fibers into fiber stub, hot setting.
8. miniature extrinsic Fabry-perot optical fiber pressure sensor as described in claim 1, it is characterised in that: perpendicular to lock pin axis
Insertion core end face is ground, until fiber end face is concordant with insertion core end face, the smooth no marking in end face；Use optical cement or laser welding work
Skill is linked together pressure by sense core and fiber stub.
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| CN201510290246.1A CN106197782B (en) | 2015-05-31 | 2015-05-31 | Miniature extrinsic Fabry-perot optical fiber pressure sensor |
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| CN201510290246.1A CN106197782B (en) | 2015-05-31 | 2015-05-31 | Miniature extrinsic Fabry-perot optical fiber pressure sensor |
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| CN106197782B true CN106197782B (en) | 2019-05-28 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110618302A (en) * | 2019-10-31 | 2019-12-27 | 国网上海市电力公司 | Manufacturing method of Fabry-Perot cavity probe of partial discharge EFPI optical fiber sensor |
| CN113340491B (en) * | 2021-07-07 | 2024-01-05 | 中北大学 | Optical fiber Fabry-Perot pressure sensor and high-consistency preparation method of sensitive unit thereof |
| CN114279551B (en) * | 2021-12-20 | 2023-10-27 | 哈尔滨工程大学 | Optical fiber sound pressure sensor based on MEMS technology and preparation method thereof |
| CN114486019B (en) * | 2022-01-12 | 2023-07-07 | 西北工业大学 | Optical fiber Fabry-Perot pressure sensor for eliminating interference of third cavity and MEMS manufacturing method |
| CN115790955B (en) * | 2023-02-03 | 2023-04-21 | 广东海洋大学 | Fabry-Perot interference dynamic pressure sensing device and manufacturing method thereof |
| CN116632507B (en) * | 2023-07-21 | 2023-10-10 | 西北工业大学 | MEMS magneto-electric coupling antenna and low-temperature packaging method thereof |
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| CN1614371A (en) * | 2004-10-11 | 2005-05-11 | 南京师范大学 | Pressure sensor of optical fiber micro-electromechanic system |
| CN102607761A (en) * | 2012-03-22 | 2012-07-25 | 天津大学 | Temperature self-correcting and manufacturing methods for Dual-Fabry-Perot optical fiber pressure sensor |
| CN202393549U (en) * | 2011-06-08 | 2012-08-22 | 罗迤凡 | Optical fiber Fabry-Perot pressure sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102384809B (en) * | 2011-08-09 | 2013-05-08 | 天津大学 | High-stability optical fiber Fabry-Perot pressure sensor packaged without glue and manufacturing method |
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Patent Citations (3)
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|---|---|---|---|---|
| CN1614371A (en) * | 2004-10-11 | 2005-05-11 | 南京师范大学 | Pressure sensor of optical fiber micro-electromechanic system |
| CN202393549U (en) * | 2011-06-08 | 2012-08-22 | 罗迤凡 | Optical fiber Fabry-Perot pressure sensor |
| CN102607761A (en) * | 2012-03-22 | 2012-07-25 | 天津大学 | Temperature self-correcting and manufacturing methods for Dual-Fabry-Perot optical fiber pressure sensor |
Non-Patent Citations (2)
| Title |
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| 具有复合式法珀腔的光纤压力传感器的解调;姜丽娟 等;《光子学报》;20120331;第41卷(第3期);第283-287页 |
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