CN106189975A - A kind of quickly location one-component epoxy adhesive and preparation method thereof - Google Patents
A kind of quickly location one-component epoxy adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN106189975A CN106189975A CN201610674514.4A CN201610674514A CN106189975A CN 106189975 A CN106189975 A CN 106189975A CN 201610674514 A CN201610674514 A CN 201610674514A CN 106189975 A CN106189975 A CN 106189975A
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- China
- Prior art keywords
- epoxy adhesive
- component epoxy
- agent
- mixture
- rubber particles
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of quickly location one-component epoxy adhesive and preparation method thereof, described quickly location one-component epoxy adhesive is with low-viscosity (mobile) liquid epoxy resin, reactive diluent, firming agent, curing accelerator, rubber particles, thixotropic agent as raw material, by being added separately to stir in container, stir under vacuum conditions, discharging i.e. obtains product, obtained quickly location one-component epoxy adhesive 10 20s PhastGel under the conditions of 100 160 DEG C, form certain bonding force, it is adaptable to the electronic devices and components that automated job quickly positions bonding.
Description
Technical field
The present invention relates to a kind of quickly location one-component epoxy adhesive and preparation method thereof, belong to electronics binding agent and lead
Territory.
Background technology
Along with high performance, the development trend of multifunction of electronic devices and components, the update of consumer electronics product
Speed is accelerated, and yield constantly rises, and has higher requirement the electronic pastes stick used.To electronic devices and components bonding and
The production line of protection, automated job degree is higher, and the curing rate of traditional single-component epoxy electronic pastes stick is partially slow, sternly
Heavily govern production efficiency.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, by epoxy resin is modified, it is provided that the single group in a kind of quickly location
Part epoxy cement glue and preparation method thereof, obtained quickly location one-component epoxy adhesive 10-under the conditions of 100-160 DEG C
20s PhastGel, forms certain bonding force, it is adaptable to the electronic devices and components that consumer electronics automated job quickly positions
Bonding.
The technical scheme is that a kind of quickly location single-component epoxy glue and preparation thereof
Method, described quick location single-component epoxy glue is made up of each raw material of following mass parts: liquid epoxies 30-50 part, lives
Property diluent 5-15 part, firming agent: 5-10 part, curing accelerator: 1-5 part, rubber particles 10-50 part, thixotropic agent: 1-10 part.
The invention has the beneficial effects as follows: the present invention is modified by epoxy resin carries out rubber particles, it is provided that a kind of quick
Location one-component epoxy adhesive and preparation method thereof, obtained quickly location one-component epoxy adhesive is at 100-160 DEG C
Under the conditions of 10-20s PhastGel, form certain bonding force, it is adaptable to automated job need quick positioning electronic components and parts
Bonding.
On the basis of technique scheme, the present invention can also do following improvement.
Further, the one during described liquid epoxies is liquid bisphenol A epoxy resin, liquid bisphenol F epoxy resin
Or the most several mixture.
Using above-mentioned further scheme to provide the benefit that, liquid epoxies has relatively low viscosity, is more beneficial for executing
Glue, workable.
Further, described epoxy active diluent is in the glycidyl ether of the glycidyl ether of simple function, two officials
Or the most several a kind of mixture.
Use above-mentioned further scheme to provide the benefit that, reduce the viscosity of system further.
Further, described firming agent is ultra-fine dicyandiamide, mean diameter about 5 μm.
Using above-mentioned further scheme to provide the benefit that, the particle diameter of dicyandiamide is less, reacts more abundant after being uniformly dispersed,
The performance of gained adhesive is more preferably.
Further, described curing accelerator is modified imidazole, a kind of or the most several mixture in modified amine.
Use above-mentioned further scheme to provide the benefit that, after adding modified imidazole or modified amine accelerator, glue can be made
The activation temperature of stick reduces, and can solidify under conditions of lower.
Rubber particles described further is the one in F351, F301, F303, F320, F325 of AICA company or appoints
Anticipate several mixture.
Use above-mentioned further scheme to provide the benefit that, after adding after rubber particles, not only can improve the tough of adhesive
Property, it is also possible to make adhesive have the feature of gel at 110-160 DEG C, preliminary adhesive strength can be formed, quickly position.
Further, described thixotropic agent is that aerosil wins the wound R 202 of Degussa, R 972, R 805, Cabot
A kind of or the most several mixture of TS720, TS610 of company.
Above-mentioned further scheme is used to provide the benefit that, it is possible to obtain well thixotropy, can be according to different applying glues
Condition adjusts the thixotropy that they are different.
Another technical scheme that the present invention solves above-mentioned technical problem is as follows: one quickly positions one-component epoxy adhesive
And preparation method thereof, described preparation method is: liquid epoxies, reactive diluent etc. first join double-planet stirred tank
In, stir 10-30min, the rubber particles then added and thixotropic agent under vacuum state, after mix homogeneously under vacuum conditions
High speed dispersion 1-2h, is eventually adding firming agent and accelerator stirs, then discharging after evacuation stirring at low speed 1-2h.
Detailed description of the invention
Principle and feature to the present invention are described below, and example is served only for explaining the present invention, is not intended to limit
Determine the scope of the present invention.
Embodiment 1
Raw material is weighed according to following mass parts
E51 epoxy resin: 30
862 epoxy resin: 20
Ethylene glycol diglycidyl ether: 5
R 202 6
F351 30
Dicyandiamide 10
PN-23 3
First E51 epoxy resin, 862 epoxy resin, Ethylene glycol diglycidyl ether are joined in stirred tank, stir under vacuum state
Mix 30min, then add thixotropic agent R202 and the sub-F351 of rubber particle, high-speed stirred under vacuum conditions after mix homogeneously
1h, is eventually adding curing agent dicyandiamide and accelerator PN-23 stirs, then discharging after evacuation stirring 1h.
Embodiment 2
Raw material is weighed according to following mass parts
E44 epoxy resin: 30
Carbon 12-14 alkyl glycidyl ether: 15
TS720 aerosil: 10
F301 50
Dicyandiamide: 5
MY-24:5
First E44, carbon 12-14 alkyl glycidyl ether are joined in stirred tank, stir 10min under vacuum state, add the most again
Enter after TS720, rubber particle F301 mix homogeneously high-speed stirred 2h under vacuum conditions, be finally sequentially added into dicyandiamide, change
Property amine type accelerator MY-24 stirs, then discharging after evacuation stirring at low speed 2h.
Embodiment 3
Raw material is weighed according to following mass parts
E51 epoxy resin: 50
Benzyl glycidyl ether: 15
R972 aerosil: 5
Rubber particles F320 10
Dicyandiamide: 9
PN-40:3
First E51, benzyl glycidyl ether are joined in stirred tank, under vacuum state stir 20min, then add R972 and
High-speed stirred 2h under vacuum conditions after rubber particle F320 mix homogeneously, is subsequently adding curing agent dicyandiamide and accelerator
PN-40 stirs, then discharging after evacuation stirring at low speed 1h.
Concrete verification experimental verification
| Embodiment 1 | Embodiment 2 | Embodiment 3 | |
| Density (g/cm3) | 1.2 | 1.19 | 1.22 |
| Gel time (s) | 140℃15s | 140℃10s | 140℃20s |
As can be seen from the above table, the quickly location one-component epoxy adhesive of gained of the present invention has gel time (10-faster
20s), it is adaptable to the electronic devices and components that consumer electronics automated job quickly positions bonding.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (7)
1. a quick location one-component epoxy adhesive, it is characterised in that be made up of each raw material of following mass parts: Breakup of Liquid Ring
Epoxy resins 30-50 part, reactive diluent 5-15 part, firming agent: 5-10 part, curing accelerator: 1-5 part, rubber particles 10-50
Part, thixotropic agent: 1-10 part；
Described rubber particles is a kind of or the most several mixing in F351, F301, F303, F320, F325 of AICA company
Thing.
Epoxy adhesive the most according to claim 1, it is characterised in that described liquid epoxies is liquid bisphenol A ring
One or both mixture in epoxy resins, liquid bisphenol F epoxy resin.
Epoxy adhesive the most according to claim 1, it is characterised in that described reactive diluent is that the shrink of simple function is sweet
Oil ether, two officials glycidyl ether in one or both mixture.
Epoxy adhesive the most according to claim 1, it is characterised in that described firming agent is ultra-fine dicyandiamide, average particle
Footpath 5 μm.
Epoxy adhesive the most according to claim 1, it is characterised in that described curing accelerator is modified imidazole, modified
One or both mixture in amine.
Epoxy adhesive the most according to claim 1, it is characterised in that described thixotropic agent is that aerosil wins wound
The R 202 of Degussa, R 972, R 805, a kind of or the most several mixture of TS720, TS610 of Cabot Co., Ltd.
Epoxy adhesive the most according to claim 1, it is characterised in that preparation method includes: first by liquid epoxies,
Reactive diluent joins in double-planet stirred tank, under vacuum state stir 10-30min, then add rubber particles and touch
Become agent, high speed dispersion 1-2h under vacuum conditions after mix homogeneously, it is eventually adding firming agent and accelerator stirs, then take out
Discharging after vacuum stirring at low speed 1-2h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610674514.4A CN106189975A (en) | 2016-08-17 | 2016-08-17 | A kind of quickly location one-component epoxy adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610674514.4A CN106189975A (en) | 2016-08-17 | 2016-08-17 | A kind of quickly location one-component epoxy adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106189975A true CN106189975A (en) | 2016-12-07 |
Family
ID=57522839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610674514.4A Pending CN106189975A (en) | 2016-08-17 | 2016-08-17 | A kind of quickly location one-component epoxy adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106189975A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108300390A (en) * | 2017-01-13 | 2018-07-20 | 杭州之江新材料有限公司 | A kind of single-component thermosetting epoxy glue and preparation method thereof |
| CN110591623A (en) * | 2019-10-22 | 2019-12-20 | 亿铖达（深圳）新材料有限公司 | Fast-curing epoxy adhesive |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568612A (en) * | 2006-12-20 | 2009-10-28 | 3M创新有限公司 | Thermally B-stageable composition for rapid electronic device assembly |
| CN102666723A (en) * | 2009-11-27 | 2012-09-12 | 欧姆龙株式会社 | Single-component epoxy resin composition and use thereof |
| CN102766426A (en) * | 2012-07-03 | 2012-11-07 | 烟台德邦科技有限公司 | Conductive adhesive for encapsulating semiconductor chip and preparation method thereof |
| CN103409095A (en) * | 2013-07-30 | 2013-11-27 | 烟台德邦科技有限公司 | Flexible one-component epoxy adhesive and preparation method thereof |
-
2016
- 2016-08-17 CN CN201610674514.4A patent/CN106189975A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568612A (en) * | 2006-12-20 | 2009-10-28 | 3M创新有限公司 | Thermally B-stageable composition for rapid electronic device assembly |
| CN102666723A (en) * | 2009-11-27 | 2012-09-12 | 欧姆龙株式会社 | Single-component epoxy resin composition and use thereof |
| CN102766426A (en) * | 2012-07-03 | 2012-11-07 | 烟台德邦科技有限公司 | Conductive adhesive for encapsulating semiconductor chip and preparation method thereof |
| CN103409095A (en) * | 2013-07-30 | 2013-11-27 | 烟台德邦科技有限公司 | Flexible one-component epoxy adhesive and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108300390A (en) * | 2017-01-13 | 2018-07-20 | 杭州之江新材料有限公司 | A kind of single-component thermosetting epoxy glue and preparation method thereof |
| CN108300390B (en) * | 2017-01-13 | 2019-06-11 | 杭州之江新材料有限公司 | A kind of single-component thermosetting epoxy glue and preparation method thereof |
| CN110591623A (en) * | 2019-10-22 | 2019-12-20 | 亿铖达（深圳）新材料有限公司 | Fast-curing epoxy adhesive |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161207 |
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