CN106189916A - Long-acting damp-proof blister packaging materials - Google Patents

Long-acting damp-proof blister packaging materials Download PDF

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Publication number
CN106189916A
CN106189916A CN201610532776.7A CN201610532776A CN106189916A CN 106189916 A CN106189916 A CN 106189916A CN 201610532776 A CN201610532776 A CN 201610532776A CN 106189916 A CN106189916 A CN 106189916A
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damp
resin
content
acting
proof
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姚华鹏
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C08K5/526—Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09J127/18—Homopolymers or copolymers of tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A kind of long-acting damp-proof blister packaging materials, it includes that paper layer is coated with on it without benzene ink successively；Damp-proof layer, it is the resin type adhesive (I) being coated with 0.4mm ＜ L ＜ 1.2mm chopped fiber；Base layer, bonding with paper layer by described resin type adhesive (I), described base layer be thickness be the hard of 20～30 μm or soft state aluminium foil, the side that described damp-proof layer is coated with chopped fiber is adjacent with aluminium foil；Adhesive linkage, for bonding bubble-cap resin plate side, described adhesive linkage uses resin type adhesive (II)；Wherein, described chopped fiber is the composite fibre being mixed to prepare with para-aramid fiber by Plant fiber, and in described composite fibre, Plant fiber is 2:1～3:1 with the ratio of para-aramid fiber.After paper layer, damp-proof layer, base layer and tack coat hot pressing, carrying out with polrvinyl chloride or other stiff sheet sealing, being dried, hardening time is short, and film forming is fast.

Description

Long-acting damp-proof blister packaging materials
Technical field
The present invention relates to a kind of blister packaging materials, particularly to a kind of long-acting damp-proof blister packaging materials.
Background technology
Existing blister package covers aluminium foil, is with the pure aluminum foil of 20～30 μm as carrier layer, at top layer printed patterns And after protective layer, be coated with one layer of PUR through inversion set at medial surface, be used for sealing the organic resin sheets such as PVC, PE, PP, COC Material, initial sealing temperatures is 140 DEG C.
Owing to directly having sealed tablet in bubble-cap up for safekeeping, the protection of environment in bubble-cap was both required that used PUR possessed Long-acting viscosity, keeps dry environment in requiring again bubble-cap for a long time.And in use, after a bubble-cap is opened, adjacent bubble The sealing of cover is often affected, and in its bubble-cap, environment is broken, and is unfavorable for that the preservation of tablet uses, easily causes wave Take.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, it is proposed that a kind of long-acting damp-proof blister packaging materials, it is by bubble Cover packaging material add damp-proof layer to promote the moisture resistance of blister packaging materials.
A kind of long-acting damp-proof blister packaging materials, it includes successively,
Paper layer, it is coated with without benzene ink；
Damp-proof layer, it is the resin type adhesive (I) being coated with 0.4mm ＜ L ＜ 1.2mm chopped fiber；
Base layer, bonding with paper layer by described resin type adhesive (I), described base layer be thickness be 20～30 μm Hard or soft state aluminium foil, the side that described damp-proof layer is coated with chopped fiber is adjacent with aluminium foil；
Adhesive linkage, for bonding bubble-cap resin plate side, described adhesive linkage uses resin type adhesive (II)；
Wherein, described chopped fiber is the composite fibre being mixed to prepare with para-aramid fiber by Plant fiber, described mixing In fiber, Plant fiber is 2:1～3:1 with the ratio of para-aramid fiber.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described resin type adhesive (I) is by poly-four Fluorothene, Oxytarch, POE resin co-extrusion obtain, and adding proportion is 6:4:3.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described resin type adhesive (I) is by poly-four Fluorothene, Oxytarch, EVA resin co-extrusion obtain, and adding proportion is 6:4:3.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described resin type adhesive (II) formula For:
Matrix resin, for POE resin, content is 70～85%, and number-average molecular weight is 20000～25000；
Cross-linking agent, for acrylic amide cross-linking agent, content is 5～7%, and described acrylic amide cross-linker molecules formula is:
Assistant crosslinking agent, for Triallyl isocyanurate, content is 1～3%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 1～2%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with quality Than the mixture for 10:1, content is 5～8%；
Surplus is anti-blushing agent.
Preferably, described long-acting damp-proof blister packaging materials, wherein, also include assisted resin, described auxiliary tree Fat is the one in ethylene vinyl acetate copolymer resin or epoxy resin or two kinds, and content is 5～20%, number-average molecular weight It is 5000～10000.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described resin type adhesive (II) formula For:
Matrix resin, for POE resin, content is 70%, and number-average molecular weight is 20000；
Assisted resin, for ethylene vinyl acetate copolymer resin, content is 5%, and number-average molecular weight is 5000；
Cross-linking agent, content is 3%；
Assistant crosslinking agent, for Triallyl isocyanurate, content is 3%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 2%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with quality Than the mixture for 10:1, content is 8%；
Surplus is anti-blushing agent.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described resin type adhesive (II) formula For:
Matrix resin, for POE resin, content is 85%, and number-average molecular weight is 25000；
Cross-linking agent, content is 5%；
Assistant crosslinking agent, for Triallyl isocyanurate, content is 1%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 1%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with quality Than the mixture for 10:1, content is 5%；
Surplus is anti-blushing agent.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described anti-blushing agent is that nano-sized carbon is silicated Mixing of one or more in compound combined polymerization anti-blushing agent, silane coupled anti-blushing agent, aluminium salt anti-blushing agent, higher fatty acids anti-blushing agent Compound.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described resin type adhesive (II) use with Lower step prepares:
1) by matrix resin, cross-linking agent, assistant crosslinking agent mix homogeneously；
2) auxiliary antioxidant, viscosifier and anti-blushing agent use the mode of mixing spraying join 1) in mixture, and Mixing further；
3) by step 2) mixture prepared pours extruder into and carries out blending extrusion, and temperature controls at 100～160 DEG C, squeezes Go out thing through curtain coating, cooling, baking oven sizing, traction, coiling process, prepared described resin-bonded layer.
Preferably, described long-acting damp-proof blister packaging materials, wherein, described paper layer, described damp-proof layer, described Base layer and described tack coat are hot-forming under the conditions of 100～160 DEG C.
The present invention compared with prior art, possesses following beneficial effect:
1, the present invention uses and is coated with the resin type adhesive of 0.4mm ＜ L ＜ 1.2mm chopped fiber as damp-proof layer, both may be used Increasing and the caking property of paper layer, can play again moisture-proof role, chopped fiber is to be mixed system with para-aramid fiber by Plant fiber The composite fibre obtained, in described composite fibre, Plant fiber is 2:1～3:1 with the ratio of para-aramid fiber, in the range of this Chopped fiber for moisture absorption protection against the tide, there is excellent effect, when chopped fiber is too short, length less than 0.4mm time, moisture absorption moisture-proof role mistake Little, poor effect, when staple length is more than 1.2mm, the fiber the most easily amount of being drawn through is wet, is unfavorable for keeping bubble-cap peripheral environment Drying property, when the ratio of Plant fiber and para-aramid fiber is less than 2:1, then Plant fiber measures on the low side, damp course dampproofing Declining, when the ratio of Plant fiber with para-aramid fiber is more than 3:1, then Plant fiber measures on the high side, under damp-proof layer caking property Fall, is easily accessible dampness；
2, by after paper layer, damp-proof layer, base layer and tack coat hot pressing, carry out with polrvinyl chloride or other stiff sheet sealing, Being dried, hardening time is short, and film forming is fast；Heat-sealing temperature when 140 DEG C, with the heat seal strength of polyvinyl chloride hard sheet more than 9.8 newton/ 15 millimeters (9.8N/15mm), improves more than 45%.
Detailed description of the invention
By particular specific embodiment, embodiments of the present invention being described below, those skilled in the art can be by this explanation Content disclosed by book understands other advantages and effect of the present invention easily.
Embodiment 1
A kind of long-acting damp-proof blister packaging materials, it includes successively,
Paper layer, it is coated with without benzene ink；
Damp-proof layer, it is the resin type adhesive (I) being coated with 0.4mm ＜ L ＜ 1.2mm chopped fiber；
Base layer, bonding with paper layer by described resin type adhesive (I), described base layer be thickness be the hard of 20 μm Matter or soft state aluminium foil, the side that described damp-proof layer is coated with chopped fiber is adjacent with aluminium foil；
Adhesive linkage, for bonding bubble-cap resin plate side, described adhesive linkage uses resin type adhesive (II)；
Wherein, described chopped fiber is the composite fibre being mixed to prepare with para-aramid fiber by Plant fiber, described mixing In fiber, Plant fiber is 2:1 with the ratio of para-aramid fiber.
Described resin type adhesive (I) is obtained by politef, Oxytarch, POE resin co-extrusion, and adding proportion is 6: 4:3.
Described resin type adhesive (II) formula is:
Matrix resin, for POE resin, content is 70%, and number-average molecular weight is 20000；
Assisted resin, for ethylene vinyl acetate copolymer resin, content is 5%, and number-average molecular weight is 5000；
Cross-linking agent, content is 3%；
Assistant crosslinking agent, for Triallyl isocyanurate, content is 3%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 2%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with quality Than the mixture for 10:1, content is 8%；
Surplus is anti-blushing agent.
Described anti-blushing agent is nano-sized carbon silicate compound combined polymerization anti-blushing agent.
Described resin type adhesive (II) is adopted and is prepared by the following steps:
1) by matrix resin, cross-linking agent, assistant crosslinking agent mix homogeneously；
2) auxiliary antioxidant, viscosifier and anti-blushing agent use the mode of mixing spraying join 1) in mixture, and Mixing further；
3) by step 2) mixture prepared pours extruder into and carries out blending extrusion, and temperature controls at 100 DEG C, extrudate warp Curtain coating, cooling, baking oven sizing, traction, coiling process, prepare described resin-bonded layer.
Described paper layer, described damp-proof layer, described base layer and described tack coat are hot-forming under the conditions of 100 DEG C.
Embodiment 2
A kind of long-acting damp-proof blister packaging materials, it includes successively,
Paper layer, it is coated with without benzene ink；
Damp-proof layer, it is the resin type adhesive (I) being coated with 0.4mm ＜ L ＜ 1.2mm chopped fiber；
Base layer, bonding with paper layer by described resin type adhesive (I), described base layer be thickness be the hard of 30 μm Matter or soft state aluminium foil, the side that described damp-proof layer is coated with chopped fiber is adjacent with aluminium foil；
Adhesive linkage, for bonding bubble-cap resin plate side, described adhesive linkage uses resin type adhesive (II)；
Wherein, described chopped fiber is the composite fibre being mixed to prepare with para-aramid fiber by Plant fiber, described mixing In fiber, Plant fiber is 2:1～3:1 with the ratio of para-aramid fiber.
Described resin type adhesive (I) is obtained by politef, Oxytarch, EVA resin co-extrusion, and adding proportion is 6: 4:3.
Described resin type adhesive (II) formula is:
Matrix resin, for POE resin, content is 85%, and number-average molecular weight is 25000；
Cross-linking agent, content is 5%；
Assistant crosslinking agent, for Triallyl isocyanurate, content is 1%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 1%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with quality Than the mixture for 10:1, content is 5%；
Surplus is anti-blushing agent.
Described anti-blushing agent is that silane coupled anti-blushing agent, aluminium salt anti-blushing agent and higher fatty acids anti-blushing agent mix with 1:1:1 The mixture closed.
Described resin type adhesive (II) is adopted and is prepared by the following steps:
1) by matrix resin, cross-linking agent, assistant crosslinking agent mix homogeneously；
2) auxiliary antioxidant, viscosifier and anti-blushing agent use the mode of mixing spraying join 1) in mixture, and Mixing further；
3) by step 2) mixture prepared pours extruder into and carries out blending extrusion, and temperature controls at 160 DEG C, extrudate warp Curtain coating, cooling, baking oven sizing, traction, coiling process, prepare described resin-bonded layer.
Described paper layer, described damp-proof layer, described base layer and described tack coat are hot-forming under the conditions of 160 DEG C.
Embodiment 3
A kind of long-acting damp-proof blister packaging materials, it includes successively,
Paper layer, it is coated with without benzene ink；
Damp-proof layer, it is the resin type adhesive (I) being coated with 0.4mm ＜ L ＜ 1.2mm chopped fiber；
Base layer, bonding with paper layer by described resin type adhesive (I), described base layer be thickness be the hard of 25 μm Matter or soft state aluminium foil, the side that described damp-proof layer is coated with chopped fiber is adjacent with aluminium foil；
Adhesive linkage, for bonding bubble-cap resin plate side, described adhesive linkage uses resin type adhesive (II)；
Wherein, described chopped fiber is the composite fibre being mixed to prepare with para-aramid fiber by Plant fiber, described mixing In fiber, Plant fiber is 2.5:1 with the ratio of para-aramid fiber.
Described resin type adhesive (I) is obtained by politef, Oxytarch, EVA resin co-extrusion, and adding proportion is 6: 4:3.
Described resin type adhesive (II) formula is:
Matrix resin, for POE resin, content is 80%, and number-average molecular weight is 22000；
Cross-linking agent, for acrylic amide cross-linking agent, content is 6%, and described acrylic amide cross-linker molecules formula is:
Assistant crosslinking agent, for Triallyl isocyanurate, content is 2%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 1.5%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with quality Than the mixture for 10:1, content is 6%；
Surplus is anti-blushing agent.
Also including that assisted resin, described assisted resin are epoxy resin, content is 10%, number-average molecular weight be 5000～ 10000。
Described anti-blushing agent is the mixture that silane coupled anti-blushing agent mixes with 1:2 with aluminium salt anti-blushing agent.
Described resin type adhesive (II) is adopted and is prepared by the following steps:
1) by matrix resin, cross-linking agent, assistant crosslinking agent mix homogeneously；
2) auxiliary antioxidant, viscosifier and anti-blushing agent use the mode of mixing spraying join 1) in mixture, and Mixing further；
3) by step 2) mixture prepared pours extruder into and carries out blending extrusion, and temperature controls at 140 DEG C, extrudate warp Curtain coating, cooling, baking oven sizing, traction, coiling process, prepare described resin-bonded layer.
Described paper layer, described damp-proof layer, described base layer and described tack coat are hot-forming under the conditions of 145 DEG C.
Above-described embodiment 1, embodiment 2, the blister material of embodiment 3 and common blister material are placed in 85% humidity environment Lower 3000h, the bubble-cap relatively common blister tensile strength of material using embodiment 1, embodiment 2 and embodiment 3 to prepare improves More than 45% (as shown in the table).
Table 1 heat seal strength comparative result
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any ripe Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage knowing this technology.Cause This, have usually intellectual such as complete with institute under technological thought without departing from disclosed spirit in art All equivalences become are modified or change, and must be contained by the claim of the present invention.

Claims (10)

1. a long-acting damp-proof blister packaging materials, it is characterised in that include successively,
Paper layer, it is coated with without benzene ink；
Damp-proof layer, it is the resin type adhesive (I) being coated with 0.4mm ＜ L ＜ 1.2mm chopped fiber；
Base layer, bonding with paper layer by described resin type adhesive (I), described base layer be thickness be the hard of 20～30 μm Matter or soft state aluminium foil, the side that described damp-proof layer is coated with chopped fiber is adjacent with aluminium foil；
Adhesive linkage, for bonding bubble-cap resin plate side, described adhesive linkage uses resin type adhesive (II)；
Wherein, described chopped fiber is the composite fibre being mixed to prepare with para-aramid fiber by Plant fiber, described composite fibre In, Plant fiber is 2:1～3:1 with the ratio of para-aramid fiber.
Long-acting damp-proof blister packaging materials the most according to claim 1, it is characterised in that described resin type adhesive (I) being obtained by politef, Oxytarch, POE resin co-extrusion, adding proportion is 6:4:3.
Long-acting damp-proof blister packaging materials the most according to claim 1, it is characterised in that described resin type adhesive (I) being obtained by politef, Oxytarch, EVA resin co-extrusion, adding proportion is 6:4:3.
Long-acting damp-proof blister packaging materials the most according to claim 1, it is characterised in that described resin type adhesive (II) formula is:
Matrix resin, for POE resin, content is 70～85%, and number-average molecular weight is 20000～25000；
Cross-linking agent, for acrylic amide cross-linking agent, content is 5～7%, and described acrylic amide cross-linker molecules formula is:
Assistant crosslinking agent, for Triallyl isocyanurate, content is 1～3%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 1～2%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with mass ratio be The mixture of 10:1, content is 5～8%；
Surplus is anti-blushing agent.
Long-acting damp-proof blister packaging materials the most according to claim 4, it is characterised in that also include assisted resin, institute Stating assisted resin is the one in ethylene vinyl acetate copolymer resin or epoxy resin or two kinds, and content is 5～20%, number Average molecular weight is 5000～10000.
Long-acting damp-proof blister packaging materials the most according to claim 5, it is characterised in that described resin type adhesive (II) formula is:
Matrix resin, for POE resin, content is 70%, and number-average molecular weight is 20000；
Assisted resin, for ethylene vinyl acetate copolymer resin, content is 5%, and number-average molecular weight is 5000；
Cross-linking agent, content is 3%；
Assistant crosslinking agent, for Triallyl isocyanurate, content is 3%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 2%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with mass ratio be The mixture of 10:1, content is 8%；
Surplus is anti-blushing agent.
Long-acting damp-proof blister packaging materials the most according to claim 4, it is characterised in that described resin type adhesive (II) formula is:
Matrix resin, for POE resin, content is 85%, and number-average molecular weight is 25000；
Cross-linking agent, content is 5%；
Assistant crosslinking agent, for Triallyl isocyanurate, content is 1%；
Auxiliary antioxidant, for tricresyl phosphite (2,4-di-tert-butyl-phenyl) ester, content is 1%；
Viscosifier, for γ-methacryloxypropyl trimethyl silane with described acrylic amide cross-linking agent with mass ratio be The mixture of 10:1, content is 5%；
Surplus is anti-blushing agent.
Long-acting damp-proof blister packaging materials the most according to claim 4, it is characterised in that described anti-blushing agent is nano-sized carbon One in silicate compound combined polymerization anti-blushing agent, silane coupled anti-blushing agent, aluminium salt anti-blushing agent, higher fatty acids anti-blushing agent or Several mixture.
9. according to the long-acting damp-proof blister packaging materials described in any one of claim 4 to 8, it is characterised in that described resin Type adhesive (II) is adopted and is prepared by the following steps:
1) by matrix resin, cross-linking agent, assistant crosslinking agent mix homogeneously；
2) auxiliary antioxidant, viscosifier and anti-blushing agent use the mode of mixing spraying join 1) in mixture, go forward side by side one Step mixing；
3) by step 2) mixture prepared pours extruder into and carries out blending extrusion, and temperature controls at 100～160 DEG C, extrudate Through curtain coating, cooling, baking oven sizing, traction, coiling process, prepare described resin type adhesive (II).
Long-acting damp-proof blister packaging materials the most according to claim 1, it is characterised in that described paper layer, described anti- Tide layer, described base layer and described tack coat are hot-forming under the conditions of 100～160 DEG C.
CN201610532776.7A 2016-07-08 2016-07-08 Long-acting damp-proof blister packaging materials Pending CN106189916A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101195429A (en) * 2006-12-07 2008-06-11 绵阳新康实业有限公司 Paper backing plastic aluminum compound packing material
CN102975948A (en) * 2012-12-24 2013-03-20 苏州海顺包装材料有限公司 Polytrifluorochloroethylene blister packaging film
CN103009747A (en) * 2012-12-24 2013-04-03 苏州海顺包装材料有限公司 Dehumidification and moisture-proof package film and preparation method thereof
CN104140769A (en) * 2014-08-06 2014-11-12 苏州卓越工程塑料有限公司 Hot melt adhesive for bubble cap packaging
CN204095220U (en) * 2014-08-06 2015-01-14 昆山美乐铝箔印刷有限公司 For the aluminium foil of bubble-cap

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101195429A (en) * 2006-12-07 2008-06-11 绵阳新康实业有限公司 Paper backing plastic aluminum compound packing material
CN102975948A (en) * 2012-12-24 2013-03-20 苏州海顺包装材料有限公司 Polytrifluorochloroethylene blister packaging film
CN103009747A (en) * 2012-12-24 2013-04-03 苏州海顺包装材料有限公司 Dehumidification and moisture-proof package film and preparation method thereof
CN104140769A (en) * 2014-08-06 2014-11-12 苏州卓越工程塑料有限公司 Hot melt adhesive for bubble cap packaging
CN204095220U (en) * 2014-08-06 2015-01-14 昆山美乐铝箔印刷有限公司 For the aluminium foil of bubble-cap

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