CN106188579B - 配向膜材料的溶剂、配向膜溶液、配向膜的制造方法 - Google Patents

配向膜材料的溶剂、配向膜溶液、配向膜的制造方法 Download PDF

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CN106188579B
CN106188579B CN201610554239.2A CN201610554239A CN106188579B CN 106188579 B CN106188579 B CN 106188579B CN 201610554239 A CN201610554239 A CN 201610554239A CN 106188579 B CN106188579 B CN 106188579B
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任维
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TCL China Star Optoelectronics Technology Co Ltd
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Abstract

本发明公开了一种配向膜材料的溶剂，该配向膜材料的溶剂包括甲基吡咯烷酮、乙二醇丁醚以及1,2‑二乙氧基乙烷，溶剂中的甲基吡咯烷酮含量不高于50％，乙二醇丁醚的含量为35～45％，1,2‑二乙氧基乙烷的含量为5～15％，含量为质量百分比，溶剂的表面张力不高于27dyne/cm2，本发明还公开了一种配向膜溶液以及一种配向膜的制造方法，通过上述方式，本发明能够提高配向膜溶液涂布的均匀性。

Description

配向膜材料的溶剂、配向膜溶液、配向膜的制造方法
技术领域
本发明涉及显示技术领域，特别是涉及一种配向膜材料的溶剂、配向膜溶液、配向膜的制造方法。
背景技术
随着技术发展，无论手机或电视市场需求，高解析度的显示面板需求越来越大，且为了达到更好的屏幕显示视角，FFS(Fringe Field Switching，边缘场开关技术)光配向技术日益成熟。而我们高解析度(如8K，4K或400ppi以上)的薄膜晶体管阵列基板的地形相对较为复杂，其像素尺寸较小，线宽更窄，过孔尺寸小，面板内地形(图案)较低解析度薄膜晶体管阵列基板的地形差异较大，进而在Cell工艺中影响的PI液(用来制作配向膜的化学液体)的涂布，地形(图案)的复杂和尺寸精细的程度会影响到PI液流动性，PI液的涂布不均会造成产品画面显示品质不佳，尤其是在过孔尺寸较小的情况下，PI液无法流入过孔，导致过孔处无PI液覆盖。
因此，需要提供一种配向膜材料的溶剂、配向膜溶液、配向膜的制造方法，以解决上述技术问题。
发明内容
本发明主要解决的技术问题是提供一种配向膜材料的溶剂、配向膜溶液、配向膜的制造方法，能够提高配向膜溶液涂布的均匀性。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种配向膜材料的溶剂，该溶剂包括：甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷，其中，溶剂中的甲基吡咯烷酮含量不高于50％，乙二醇丁醚的含量为35～45％，1,2-二乙氧基乙烷的含量为5～15％，含量为质量百分比，溶剂的表面张力的不高于27dyne/cm2。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种配向膜溶液，该配向膜溶液包括上述溶剂和溶于溶剂中的配向膜材料，
配向膜材料为聚酰亚胺。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种配向膜的制造方法，该配向膜的制造方法包括：配制包含甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷的溶剂，且使溶剂中的甲基吡咯烷酮含量不高于50％，乙二醇丁醚的含量为35～45％，1,2-二乙氧基乙烷的含量为5～15％，含量为质量百分比，溶剂的表面张力的不高于27dyne/cm2；将配向膜材料溶于溶剂得到配向膜溶液；将配向膜溶液涂布于一基板上；等待预定时间以使配向膜溶液在基板上充分流动；将基板和配向膜溶液进行烘烤以在基板上形成配向膜。
其中，等待预定时间以使配向膜溶液在基板上充分流动包括：等待1～2分钟以使配向膜溶液在基板上充分流动。
其中，基板上包括过孔，过孔的深度为2.5～3um，过孔的底部尺寸为5～8um，使配向膜溶液在基板上充分流动包括：使配向膜溶液在基板上流平且使配向膜溶液充分流入过孔。
本发明的有益效果是：区别于现有技术的情况，本发明通过配制配向膜材料的溶剂包括甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷，调整溶剂的极性即表面张力，使得溶剂的表面张力小，可以有效改善配向膜溶液的涂布性，流动性更佳，能够提高配向膜溶液涂布的均匀性，尤其是在薄膜晶体管阵列基板上有精细过孔的情况下，效果更为明显。
附图说明
图1是本发明配向膜的制造方法的流程图。
具体实施方式
下面结合附图和实施例对本发明进行详细的说明。
配向膜材料的溶剂的实施例1：
配向膜材料的溶剂包括：甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷。
配向膜材料的溶剂中的甲基吡咯烷酮含量不高于50％，乙二醇丁醚的含量为35～45％，1,2-二乙氧基乙烷的含量为5～15％。优选地，含量均为质量百分数，指占溶剂总质量的百分比数。
在其他实施例中，配向膜材料的溶剂还可以包括γ-羟基丁酸内酯。
甲基吡咯烷酮，中文名称：N-甲基吡咯烷酮，英文名称：1-Methyl-2-pyrrolidinone，中文别名：NMP；1-甲基-2-吡咯烷酮；N-甲基吡咯烷酮(工业级)；N-甲基吡咯烷酮(电子级)；N-甲基吡咯烷。
乙二醇丁醚，又称BC。
中文名称：1,2-二乙氧基乙烷中文别名：二乙基溶纤剂；1,2-二一氧基硅烷英文名称：Ethene,1,2-diethoxy-(9CI)。
γ-羟基丁酸内酯，又称GBL。
优选地，溶剂的表面张力的不高于27dyne/cm2。
本实施例通过配制配向膜材料的溶剂包括甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷，调整溶剂的极性即表面张力，使得溶剂的表面张力小，可以有效改善配向膜溶液的涂布性，流动性更佳，能够提高配向膜溶液涂布的均匀性，尤其是在薄膜晶体管阵列基板上有精细过孔的情况下，效果更为明显。在溶剂中的甲基吡咯烷酮含量不高于50％，乙二醇丁醚的含量为35～45％，1,2-二乙氧基乙烷的含量为5～15％时，溶剂的表面张力的不高于27dyne/cm2。
配向膜材料的溶剂的实施例2：
配向膜材料的溶剂包括：甲基吡咯烷酮、乙二醇丁醚、1,2-二乙氧基乙烷以及γ-羟基丁酸内酯。
配向膜材料的溶剂中的甲基吡咯烷酮含量为1％，乙二醇丁醚的含量为35％，1,2-二乙氧基乙烷的含量为5％，γ-羟基丁酸内酯的含量为59％。优选地，含量均为质量百分数，指占溶剂总质量的百分比数。
利用最大压力气泡法测得溶剂表面张力为19.87dyne/cm2。
配向膜材料的溶剂的实施例3：
配向膜材料的溶剂包括：甲基吡咯烷酮、乙二醇丁醚、1,2-二乙氧基乙烷以及γ-羟基丁酸内酯。
配向膜材料的溶剂中的甲基吡咯烷酮含量25％，乙二醇丁醚的含量为40％，1,2-二乙氧基乙烷的含量为10％，γ-羟基丁酸内酯的含量为25％。优选地，含量均为质量百分数，指占溶剂总质量的百分比数。
利用最大压力气泡法测得溶剂表面张力为14.68dyne/cm2。
配向膜材料的溶剂的实施例4：
配向膜材料的溶剂包括：甲基吡咯烷酮、乙二醇丁醚、1,2-二乙氧基乙烷。
配向膜材料的溶剂中的甲基吡咯烷酮含量50％，乙二醇丁醚的含量为45％，1,2-二乙氧基乙烷的含量为5％。优选地，含量均为质量百分数，指占溶剂总质量的百分比数。
利用最大压力气泡法测得溶剂表面张力为12.73dyne/cm2。
配向膜材料的溶剂的实施例5：
配向膜材料的溶剂包括：甲基吡咯烷酮、乙二醇丁醚、1,2-二乙氧基乙烷以及γ-羟基丁酸内酯。
配向膜材料的溶剂中的甲基吡咯烷酮含量50％，乙二醇丁醚的含量为35％，1,2-二乙氧基乙烷的含量为15％。优选地，含量均为质量百分数，指占溶剂总质量的百分比数。
利用最大压力气泡法测得溶剂表面张力为13.56dyne/cm2。
表一配向膜材料的溶剂组分和表面张力对应表
请参阅如上表一，表一为配向膜材料的溶剂组分和表面张力对应表。
在实施例2中甲基吡咯烷酮、乙二醇丁醚、1,2-二乙氧基乙烷使用量均较少，γ-羟基丁酸内酯使用较多，测得溶剂表面张力为19.87dyne/cm2相比其他实施例较大，流动性相对较差，但是也符合要求，由于γ-羟基丁酸内酯价格较甲基吡咯烷酮低，可以在控制成本的情况下，制得流动性符合要求的溶剂，其主要优势在于成本低。
在实施例3中甲基吡咯烷酮、乙二醇丁醚、1,2-二乙氧基乙烷、γ-羟基丁酸内酯使用量均为中等水平，测得溶剂表面张力为14.87dyne/cm2比实施例1小，溶剂的流动性有明显提升，但成本相对于实施例1高，其主要优势在于成本和流动性考虑因素折中，综合效能强。
在实施例4中甲基吡咯烷酮、乙二醇丁醚使用量均较高、1,2-二乙氧基乙烷为最低水平，测得溶剂表面张力为12.73dyne/cm2为最小，溶剂的流动性最高，但成本也是最高的，其主要优势在于溶剂流动性强。
在实施例5中甲基吡咯烷酮用量较高，乙二醇丁醚使用量为中等水平、1,2-二乙氧基乙烷用量较高，测得溶剂表面张力为13.56dyne/cm2相比实施例4低一点，溶剂的流动性也达到了较高的水平，成本比实施例4稍低。
本发明的配向膜溶液包括溶剂和溶于溶剂中的配向膜材料，溶剂为上述任意一实施例描述的配向膜材料的溶剂。
优选地，配向膜材料为聚酰亚胺。优选地，聚酰亚胺带有紫外线光敏基团。
请参阅图1，图1是本发明配向膜的制造方法的流程图。在本实施例中，配向膜的制造方法包括以下步骤：
步骤S11：配制包含甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷的溶剂。
在步骤S11中，配制包含甲基吡咯烷酮、乙二醇丁醚、1,2-二乙氧基乙烷以及γ-羟基丁酸内酯的溶剂包括：配制包含甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷的溶剂且使溶剂中的甲基吡咯烷酮含量不高于50％，乙二醇丁醚的含量为35～45％，1,2-二乙氧基乙烷的含量为5～15％。配制包含甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷的溶剂包括：配制包含甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷的溶剂且使溶剂的表面张力的不高于27dyne/cm2。配向膜材料的溶剂还可以包括γ-羟基丁酸内酯。具体请参见上文的配向膜材料的溶剂的各个实施例。
步骤S12：将配向膜材料溶于溶剂得到配向膜溶液。
在步骤S12中，优选地，配向膜材料为聚酰亚胺。优选地，聚酰亚胺带有紫外线光敏基团。
步骤S13：将配向膜溶液涂布于一基板上。
在步骤S13中，采用inkjet(喷涂)法将配向膜溶液涂布于一基板上，优选地，基板为薄膜晶体管阵列基板。
步骤S14：等待预定时间以使配向膜溶液在基板上充分流动。
在步骤S14中，等待预定时间以使配向膜溶液在基板上充分流动包括：等待1～2分钟以使配向膜溶液在基板上充分流动。优选地，基板上包括过孔，过孔的深度为2.5～3um，过孔的底部尺寸为5～8um，使配向膜溶液在基板上充分流动包括：使配向膜溶液在基板上流平且使配向膜溶液充分流入过孔。
步骤S15：将基板和配向膜溶液进行烘烤以在基板上形成配向膜。
在步骤S15中，将基板和配向膜溶液进行烘烤包括：1、预烤；2、后烤。
综上所述，本发明通过配制配向膜材料的溶剂包括甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷，调整溶剂的极性即表面张力，使得溶剂的表面张力小，可以有效改善配向膜溶液的涂布性，流动性更佳，能够提高配向膜溶液涂布的均匀性，尤其是在薄膜晶体管阵列基板上有精细过孔的情况下，效果更为明显。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (5)

1.一种配向膜材料的溶剂，其特征在于，所述溶剂包括：甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷；
其中，所述溶剂中的所述甲基吡咯烷酮含量不高于50％，所述乙二醇丁醚的含量为35～45％，所述1,2-二乙氧基乙烷的含量为5～15％，所述含量为质量百分比，所述溶剂的表面张力不高于27dyne/cm2。
2.一种配向膜溶液，其特征在于，所述配向膜溶液包括如权利要求1所述的溶剂和溶于所述溶剂中的配向膜材料，所述配向膜材料为聚酰亚胺。
3.一种配向膜的制造方法，其特征在于，所述配向膜的制造方法包括：
配制包含甲基吡咯烷酮、乙二醇丁醚以及1,2-二乙氧基乙烷的溶剂，且使所述溶剂中的所述甲基吡咯烷酮含量不高于50％，所述乙二醇丁醚的含量为35～45％，所述1,2-二乙氧基乙烷的含量为5～15％，所述含量为质量百分比，所述溶剂的表面张力的不高于27dyne/cm2；
将配向膜材料溶于所述溶剂得到配向膜溶液；
将配向膜溶液涂布于一基板上；
等待预定时间以使所述配向膜溶液在所述基板上充分流动；
将所述基板和所述配向膜溶液进行烘烤以在所述基板上形成配向膜。
4.根据权利要求3所述的制造方法，其特征在于，所述等待预定时间以使所述配向膜溶液在所述基板上充分流动包括：
等待1～2分钟以使所述配向膜溶液在所述基板上充分流动。
5.根据权利要求3所述的制造方法，其特征在于，所述基板上包括过孔，所述过孔的深度为2.5～3um，所述过孔的底部尺寸为5～8um，所述使所述配向膜溶液在所述基板上充分流动包括：
使所述配向膜溶液在所述基板上流平且使所述配向膜溶液充分流入所述过孔。
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