CN106183233A - A kind of soft aluminum-based copper-clad plate of resistance to bending and manufacture method thereof - Google Patents
A kind of soft aluminum-based copper-clad plate of resistance to bending and manufacture method thereof Download PDFInfo
- Publication number
- CN106183233A CN106183233A CN201610556334.6A CN201610556334A CN106183233A CN 106183233 A CN106183233 A CN 106183233A CN 201610556334 A CN201610556334 A CN 201610556334A CN 106183233 A CN106183233 A CN 106183233A
- Authority
- CN
- China
- Prior art keywords
- copper
- aluminum
- adhesive layer
- clad plate
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a kind of soft aluminum-based copper-clad plate of resistance to bending, including aluminum base layer, layers of copper and the adhesive layer between described aluminum base layer and layers of copper, wherein: by weight percentage, described adhesive layer is made up of following components: epoxy resin: 30 40%, nitrile rubber: 20 30%, filler: 20 30%, 2 Methylimidazole .s: 0.05 0.1%, dicyandiamide: 1 2%, dimethylformamide: 1 2%, butanone: 3 6%, white carbon: 0.5 1.5%, polyvinyl butyral resin: 1 2%.Its manufacturing step includes: after 1) each component of adhesive layer being mixed by above-mentioned percentage by weight, after being uniformly mixed under room temperature, grinds and crosses 200 mesh sieves, obtaining adhesive layer；2) adhesive layer is coated in layers of copper, toast 58 minutes at 130 160 DEG C subsequently, obtain the layers of copper of semi-solid preparation；3) semi-solid preparation layers of copper is bonded to each other with aluminum base layer, and vacuum pressing-combining i.e. obtains described aluminum-based copper-clad plate.The aluminum-based copper-clad plate that the present invention prepares has the bend resistance performance of excellence, is particularly well-suited to the special-shaped lighting field such as lamp, car light.
Description
Technical field
The present invention relates to a kind of aluminum-based copper-clad plate, be specifically related to a kind of soft aluminum-based copper-clad plate of resistance to bending and manufacturer thereof
Method.
Background technology
Aluminum-based copper-clad plate as printed circuit board manufacture in baseplate material, printed circuit board is acted primarily as interconnection,
Insulation and the effect supported.In field of lamp illumination, along with the fast development of the LED lamp of energy-conserving and environment-protective, to aluminum-based copper-clad plate
Demand the most day by day increase.But, the bending resistance folding endurance of existing aluminum-based copper-clad plate is poor, it is difficult to be applicable to such as abnormity lamp, vapour
The lighting fields such as car light.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, it is provided that a kind of aluminum base with excellent bending resistance folding endurance covers
Copper coin.Another object of the present invention is to provide the manufacture method of a kind of described aluminum-based copper-clad plate.
For achieving the above object, the present invention is by the following technical solutions:
A kind of soft aluminum-based copper-clad plate of resistance to bending, including aluminum base layer, layers of copper and between described aluminum base layer and layers of copper
Adhesive layer, wherein: by weight percentage, described adhesive layer is made up of following components: epoxy resin: 30-40%, fourth
Nitrile rubber: 20-30%, filler: 20-30%, 2-methylimidazole: 0.05-0.1%, dicyandiamide: 1-2%, dimethylformamide:
1-2%, butanone: 3-6%, white carbon: 0.5-1.5%, polyvinyl butyral resin: 1-2%.
Preferably: described adhesive layer is made up of following components: epoxy resin: 34.6%, nitrile rubber: 26.95%,
Filler: 27.7%, 2-methylimidazole: 0.08%, dicyandiamide: 1.39%, dimethylformamide: 1.39%, butanone: 5.5%, white
White carbon black: 1%, polyvinyl butyral resin: 1.39%.
Preferably: described epoxy resin is the mixture of bisphenol A epoxide resin and novolac epoxy resin, and described bis-phenol
The consumption of A epoxy resin is the 50%-70% of the total consumption of epoxy resin.
Preferably: the epoxide equivalent of described bisphenol A epoxide resin is 450-500, the epoxy of described novolac epoxy resin
Equivalent is 200-230.
Preferably: described filler is aluminium oxide and/or barium sulfate.
Another object of the present invention, the manufacture method of a kind of aluminum-based copper-clad plate as above, it includes that following manufacture walks
Rapid:
1), after each component of adhesive layer being mixed by above-mentioned percentage by weight, stir 8-15 hour to each group under room temperature
After dividing mix homogeneously, grind 6-10 hour and cross 200 mesh sieves, obtaining adhesive layer；
2) by step 1) in the adhesive layer that obtains coat in layers of copper, toast 5-8 minute at 130-160 DEG C subsequently,
Obtain the layers of copper of semi-solid preparation；
3) by step 2) in the semi-solid preparation layers of copper that obtains bonded to each other with aluminum base layer, and vacuum pressing-combining at 140-210 DEG C
Obtain described aluminum-based copper-clad plate.
Coating thickness in preferably: step 2) is 20 μm-200 μm
The beneficial effects of the present invention is, the aluminum-based copper-clad plate preparation method of the present invention is simple, and obtained aluminum base covers copper
Plate bends with 18mm water pipe, still can ensure that layers of copper, aluminum base layer and adhesive layer do not rupture, flawless produces after bending 360 °
Raw, show the bend resistance performance of excellence, be particularly well-suited to the lighting fields such as special-shaped lamp illumination, automobile lamp.
Detailed description of the invention
Below in conjunction with specific embodiment, the detailed description of the invention of the present invention is described further.But the present invention also not only limits
In following embodiment.If not illustrating, each raw material employed in the present invention all can be commercially available by market.
Aluminum-based copper-clad plate of the present invention, it includes aluminum base layer, layers of copper and between described aluminum base layer and layers of copper
Adhesive layer, wherein, by weight percentage, described adhesive layer is made up of following components: epoxy resin: 25-30%, fourth
Nitrile rubber: 10-15%, filler: 30-40%, 2-methylimidazole: 0.2-0.35%, dicyandiamide: 10-20%, dimethylformamide
(DMF): 10-12%, butanone: 15-20%, white carbon: 1-3%, polyvinyl butyral resin: 1-4%.Wherein, described asphalt mixtures modified by epoxy resin
Fat is the mixture of bisphenol A epoxide resin and novolac epoxy resin, and the consumption of described bisphenol A epoxide resin is that epoxy resin mixes
The 50%-70% of the total consumption of compound, further, the epoxide equivalent of described bisphenol A epoxide resin is 450-500, described phenolic aldehyde
The epoxide equivalent of epoxy resin is 200-230；Described filler is aluminium oxide and/or barium sulfate.
Present invention aluminum-based copper-clad plate as above, its manufacturing step includes:
1), after each component of adhesive layer being mixed by above-mentioned percentage by weight, stir 8-15 hour to each group under room temperature
After dividing mix homogeneously, grind 6-10 hour and cross 200 mesh sieves, obtaining adhesive layer；
2) by step 1) in the adhesive layer that obtains coat in layers of copper, coating thickness is 20 μm-200 μm, subsequently in
Toast 5-8 minute at 130-160 DEG C, obtain the layers of copper of semi-solid preparation；
3) by step 2) in the semi-solid preparation layers of copper that obtains bonded to each other with aluminum base layer, and vacuum pressing-combining at 140-210 DEG C
Obtain aluminum-based copper-clad plate of the present invention.
Embodiment 1
A kind of aluminum-based copper-clad plate, including aluminum base layer, layers of copper and the adhesive layer between described aluminum base layer and layers of copper,
Wherein, by weight percentage, described adhesive layer is made up of following components: 901 epoxy resin: 22.5%, 704 asphalt mixtures modified by epoxy resin
Fat: 12.1%, nitrile rubber: 26.95%, aluminium oxide: 27.7%, 2-methylimidazole: 0.08%, dicyandiamide: 1.39%, DMF:
1.39%, butanone: 5.5%, white carbon: 1%, polyvinyl butyral resin 1.39%.
The manufacturing step of described aluminum-based copper-clad plate includes:
1), after each component of adhesive layer being mixed by above-mentioned percentage by weight, under room temperature, 10 hours are stirred to each component
After mix homogeneously, grind 10 hours and cross 200 mesh sieves, obtaining adhesive layer；
2) by step 1) in the adhesive layer that obtains coat in layers of copper, coating thickness is 50 μm, dries subsequently at 150 DEG C
Roasting 5 minutes, obtain the layers of copper of semi-solid preparation；
3) by step 2) in the semi-solid preparation layers of copper that obtains bonded to each other with aluminum base layer, and vacuum pressing-combining and get final product at 180 DEG C
Described aluminum-based copper-clad plate.
Embodiment 2
A kind of aluminum-based copper-clad plate, including aluminum base layer, layers of copper and the adhesive layer between described aluminum base layer and layers of copper,
Wherein, by weight percentage, described adhesive layer is made up of following components: 901 epoxy resin: 19.5%, 704 asphalt mixtures modified by epoxy resin
Fat: 19.5%, nitrile rubber: 28%, barium sulfate: 20%, 2-methylimidazole: 0.1%, dicyandiamide: 2%, DMF:2%, butanone:
6%, white carbon: 1.2%, polyvinyl butyral resin 1.7%.
Its manufacture process is with embodiment 1.
The present invention is by preferred embodiment having carried out detailed explanation.But, by studying carefully, to respectively above
Change and the increase of embodiment are also apparent to one of ordinary skill in the art.It is intended that all this
A little changes and increase fall in the protection domain of the claims in the present invention.Term used herein is only concrete enforcement
Example is illustrated, and it is not intended to limit the invention.Unless otherwise defined, all terms used herein (include
Technical term and scientific terminology) all identical with the understanding of those skilled in the art of the art.Any this product is entered
The modification of row and improvement, in the scope of the claims or category, the similar or replacement of close material and use, belong to patent of the present invention
Protection domain.
Claims (7)
1. the soft aluminum-based copper-clad plate of resistance to bending, including aluminum base layer, layers of copper and between described aluminum base layer and layers of copper
Adhesive layer, it is characterised in that: by weight percentage, described adhesive layer is made up of following components: epoxy resin: 30-
40%, nitrile rubber: 20-30%, filler: 20-30%, 2-methylimidazole: 0.05-0.1%, dicyandiamide: 1-2%, dimethyl
Methanamide: 1-2%, butanone: 3-6%, white carbon: 0.5-1.5%, polyvinyl butyral resin: 1-2%.
Aluminum-based copper-clad plate the most according to claim 1, it is characterised in that: described adhesive layer is made up of following components: ring
Epoxy resins: 34.6%, nitrile rubber: 26.95%, filler: 27.7%, 2-methylimidazole: 0.08%, dicyandiamide: 1.39%, two
Methylformamide: 1.39%, butanone: 5.5%, white carbon: 1%, polyvinyl butyral resin: 1.39%.
Aluminum-based copper-clad plate the most according to claim 1 and 2, it is characterised in that: described epoxy resin is bisphenol A epoxide resin
With the mixture of novolac epoxy resin, and the 50%-70% that the consumption of described bisphenol A epoxide resin is the total consumption of epoxy resin.
Aluminum-based copper-clad plate the most according to claim 3, it is characterised in that: the epoxide equivalent of described bisphenol A epoxide resin is
450-500, the epoxide equivalent of described novolac epoxy resin is 200-230.
Aluminum-based copper-clad plate the most according to claim 1 and 2, it is characterised in that: described filler is aluminium oxide and/or sulphuric acid
Barium.
6. the manufacture method of an aluminum-based copper-clad plate as claimed in claim 1 or 2, it is characterised in that: include that following manufacture walks
Rapid:
1), after each component of adhesive layer being mixed by above-mentioned percentage by weight, stir under room temperature 8-15 hour and mix to each component
After closing uniformly, grind 6-10 hour and cross 200 mesh sieves, obtaining adhesive layer；
2) by step 1) in the adhesive layer that obtains coat in layers of copper, toast 5-8 minute at 130-160 DEG C subsequently, obtain
The layers of copper of semi-solid preparation；
3) by step 2) in the semi-solid preparation layers of copper that obtains bonded to each other with aluminum base layer, and vacuum pressing-combining and get final product at 140-210 DEG C
Described aluminum-based copper-clad plate.
Manufacture method the most according to claim 6, it is characterised in that: step 2) in coating thickness be 20 μm-200 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556334.6A CN106183233A (en) | 2016-07-13 | 2016-07-13 | A kind of soft aluminum-based copper-clad plate of resistance to bending and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610556334.6A CN106183233A (en) | 2016-07-13 | 2016-07-13 | A kind of soft aluminum-based copper-clad plate of resistance to bending and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106183233A true CN106183233A (en) | 2016-12-07 |
Family
ID=57475880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556334.6A Pending CN106183233A (en) | 2016-07-13 | 2016-07-13 | A kind of soft aluminum-based copper-clad plate of resistance to bending and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106183233A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110396381A (en) * | 2019-08-14 | 2019-11-01 | 清远市普诺光电科技有限公司 | Composite material, FPC soft board and its preparation process for FPC soft board |
| CN111002690A (en) * | 2019-12-31 | 2020-04-14 | 江门市华锐铝基板股份公司 | Bonding method of aluminum-based copper-clad plate |
| CN111234734A (en) * | 2020-02-27 | 2020-06-05 | 招远春鹏电子科技有限公司 | Environment-friendly glue solution for flexible copper-clad plate and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020961A (en) * | 2010-11-12 | 2011-04-20 | 华烁科技股份有限公司 | High-heat-conduction flexible aluminum base copper-clad plate for LED heat radiating substrate |
| CN102516718A (en) * | 2011-12-01 | 2012-06-27 | 珠海全宝电子科技有限公司 | Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer |
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN104629263A (en) * | 2015-01-19 | 2015-05-20 | 珠海全宝电子科技有限公司 | Bending-resistant aluminum-base copper-clad laminate and preparation method thereof |
-
2016
- 2016-07-13 CN CN201610556334.6A patent/CN106183233A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020961A (en) * | 2010-11-12 | 2011-04-20 | 华烁科技股份有限公司 | High-heat-conduction flexible aluminum base copper-clad plate for LED heat radiating substrate |
| CN102516718A (en) * | 2011-12-01 | 2012-06-27 | 珠海全宝电子科技有限公司 | Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer |
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN104629263A (en) * | 2015-01-19 | 2015-05-20 | 珠海全宝电子科技有限公司 | Bending-resistant aluminum-base copper-clad laminate and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110396381A (en) * | 2019-08-14 | 2019-11-01 | 清远市普诺光电科技有限公司 | Composite material, FPC soft board and its preparation process for FPC soft board |
| CN111002690A (en) * | 2019-12-31 | 2020-04-14 | 江门市华锐铝基板股份公司 | Bonding method of aluminum-based copper-clad plate |
| CN111234734A (en) * | 2020-02-27 | 2020-06-05 | 招远春鹏电子科技有限公司 | Environment-friendly glue solution for flexible copper-clad plate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106183233A (en) | A kind of soft aluminum-based copper-clad plate of resistance to bending and manufacture method thereof | |
| US9629239B2 (en) | Resin composition, and prepreg as well as laminate using the same | |
| CN104379668B (en) | Resin combination, prepreg, clad with metal foil plywood and printed wiring board | |
| CN107428970A (en) | FRP molded material, its manufacture method and article shaped | |
| CN105199103B (en) | A kind of siliceous modified, high temperature resistant cyanate ester resin, its preparation method and application | |
| CN105838028A (en) | High-heat-conductive resin composition and preparation method thereof | |
| CN101323698B (en) | Flame retardant composition copper clad laminate and preparation thereof | |
| CN105172270A (en) | Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate | |
| DE10333250A1 (en) | A prepreg including a heat hardenable resin composition (D) containing an Al hydroxide/boehmite composite useful as a printed conductor plate for electronic components | |
| CN104364290A (en) | Curable resin composition, resin composition, resin sheet formed by using said curable resin composition and resin composition, and hardener for said curable resin composition and resin composition | |
| CN108219371A (en) | Composition epoxy resin, prepreg, laminate and printed circuit board | |
| CN103409041A (en) | Application of flexible thermal conductive insulation adhesive on LED (Light Emitting Diode) heat dissipation substrate | |
| CN104002524B (en) | Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate | |
| CN104109347B (en) | A kind of halogen-free thermosetting resin composite, prepreg and laminate | |
| CN104927353A (en) | Inflaming-retarding halogen-free and phosphorus-free resin composition and use thereof and preparation method applying to half-curing piece, laminated board and copper-clad plate | |
| CN104559807B (en) | A kind of heat conduction bonding agent | |
| CN104985909A (en) | Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate | |
| CN105315845A (en) | High-strength water-resistant corrosion-resistant epoxy resin powder coating | |
| CN108503814B (en) | Epoxidized polyester resin and preparation method and application thereof | |
| CN106751801A (en) | A kind of weather resistant lightweight shading dumb light PA56/ASA alloy materials and preparation method thereof | |
| CN104151777B (en) | Thermosetting resin composition | |
| CN105694451A (en) | A halogen-free resin composition, a prepreg, a laminated plate and a circuit board | |
| JP5309788B2 (en) | Epoxy resin composition, cured product thereof, prepreg, copper-clad laminate, and resin composition for build-up adhesive film | |
| TWI548696B (en) | Electronic material composition | |
| CN111334201A (en) | Production process of heat-conducting adhesive tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161207 |
|
| WD01 | Invention patent application deemed withdrawn after publication |