CN106158696A - A kind of method and system improving manufacture board cavity output efficiency - Google Patents
A kind of method and system improving manufacture board cavity output efficiency Download PDFInfo
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- CN106158696A CN106158696A CN201510186200.5A CN201510186200A CN106158696A CN 106158696 A CN106158696 A CN 106158696A CN 201510186200 A CN201510186200 A CN 201510186200A CN 106158696 A CN106158696 A CN 106158696A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The present invention provides a kind of method and system improving and manufacturing board cavity output efficiency, including: obtain and keep in technological parameter value and the technique end time of cavity last batch product；Calculating last flake products technique of last batch terminates to enter cavity to next batch first product and starts spacing value standby time of technique, judge that whether described time interval value is more than preset value, if described time interval value is more than preset value, then carries out warming-up operation, otherwise proceed Product Process；Carrying out warming-up operation, in monitoring warming-up process, the technological parameter value of cavity, if the technological parameter value monitoring cavity in warming-up process reaches temporary technological parameter value, then stops warming-up；Record the warming-up control wafer quantity required for different time interval value correspondences, provide reference for warming-up operation next time.Can quickly judge whether cavity can continue to produce by this system, improve utilization rate and the output efficiency of board greatly, and the usage amount of warming-up control wafer in production can be reduced, cost-effective.
Description
Technical field
The present invention relates to semiconductor process technique field, particularly relate to a kind of improve manufacture board cavity output efficiency method and
System.
Background technology
Having a lot of technique to manufacture board in the semiconductor chip technological process of production is apparatus, such as, and physical vapour deposition (PVD)
The process equipments such as equipment, chemical vapor depsotition equipment, etching apparatus.In process of production, the most sometimes because producing
Product are not concentrated and are caused cavity to leave unused (Chamber idle), because being that Multicarity manufactures board, so during each cavity idle
Between be different.
After board cavity leaves unused a period of time, when the product of next batch to enter the board cavity left unused, in order to reduce
First product produces the situation of defect, it is generally required to idle cavity carries out warming-up (Dummy season) operation.At present,
Factory is all rule of thumb to determine cavity standby time, generally exceedes a certain set time T (such as 15 minutes), to chamber
Body carries out fixing warming-up control wafer quantity Q (such as 3) during warming-up.
If Fig. 1 is the schematic top plan view that Multicarity manufactures board, this board comprises tri-processing technique cavitys of A, B, C.Obviously,
If the long period does not has product needed to process below, it is assumed that the standby time of cavity C is Tc, then during cavity A idle
The display time for Tc-t (the such as the 24th flake products), cavity B of waiting is Tc-t (the such as the 25th flake products).It can be seen that
Standby time is different, if warming-up process all uses identical fixing warming-up control wafer number, then causes the waste of warming-up control wafer, board
Production capacity is wasted.
Therefore, how to realize the detection data according to reaction cavity, the temperature of such as reaction cavity, pressure and gas flow etc.,
Carry out the sheet number of the elastic warming-up control wafer selecting and needing, the warming-up control wafer sheet number of the most intelligent each cavity of management and control is art technology
Personnel need the problem solved.
Summary of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of raising and manufactures board cavity output efficiency
Method and system, be used for solving each reaction cavity warming-up control wafer quantity in prior art and fix, cause board production capacity to waste
Problem.
For achieving the above object and other relevant purposes, the present invention provides a kind of system improving and manufacturing board cavity output efficiency,
Described system at least includes:
Acquiring unit, at the end of obtaining technological parameter value and the technique of described manufacture board cavity last batch product
Between；
Temporary storage location, is connected with described acquiring unit, described condition parameter values and technique end time is kept in；
Computing unit, is connected with described temporary storage location, calculates last batch Product Process and terminates to next batch first product to enter
Cavity starts spacing value standby time of technique；
Monitoring means, monitoring next batch product starts the technological parameter value of cavity in the warming-up process before technique；
Judging unit, is connected with described computing unit and monitoring means, it is judged that whether the time interval that described computing unit calculates surpasses
Cross preset value, judge whether the technological parameter value of cavity in warming-up process reaches the condition ginseng that described temporary storage location is temporary simultaneously
Numerical value；
Record unit, records the warming-up control wafer quantity required for different time interval value correspondences, provides ginseng for warming-up operation next time
Examine.
As the scheme of a kind of optimization improving the system manufacturing board cavity output efficiency, described acquiring unit obtains last batch
The technological parameter value of last flake products.
As improving the scheme of a kind of optimization of the system manufacturing board cavity output efficiency, described in state technological parameter value and include
The force value of described cavity, temperature value and process gas flow value.
As the scheme of a kind of optimization improving the system manufacturing board cavity output efficiency, described manufacture board is for multiple for having
The board of cavity.
As the scheme of a kind of optimization improving the system manufacturing board cavity output efficiency, described warming-up control wafer is silicon chip.
It is 15 minutes as preset value described in the scheme of a kind of optimization improving the system manufacturing board cavity output efficiency, warming-up control
Sheet quantity is less than or equal to 3.
Improve the scheme of a kind of optimization of the system manufacturing board cavity output efficiency as the present invention, existed by ITC data interface
The cavity technique end time is kept in and recorded to lane database.
The present invention also provides for a kind of method improving and manufacturing board cavity output efficiency, and described method at least includes step:
Obtain and keep in technological parameter value and the technique end time of described manufacture board cavity last batch product；
Calculating last flake products technique of last batch terminates to enter cavity to next batch first product and starts the standby time of technique
Spacing value, it is judged that described time interval value, whether more than preset value, if described time interval value is more than preset value, then carries out warming-up
Operation, otherwise proceeds Product Process；
Carrying out warming-up operation, the technological parameter value of cavity in monitoring warming-up process, if monitoring the work of cavity in warming-up process
Skill condition parameter values reaches temporary technological parameter value, then stop warming-up, continues Product Process；
Record the warming-up control wafer quantity required for different time interval value correspondences, provide reference for warming-up operation next time.
As it has been described above, the present invention's improves the method and system manufacturing board cavity output efficiency, including step: obtain and keep in
The technological parameter value of described manufacture board cavity last batch product and technique end time；Calculate last batch last
Flake products technique terminates to enter cavity to next batch first product and starts spacing value standby time of technique, it is judged that between the described time
Every value whether more than preset value, if described time interval value is more than preset value, then carries out warming-up operation, otherwise proceed product
Technique；Carrying out warming-up operation, the technological parameter value of cavity in monitoring warming-up process, if monitoring cavity in warming-up process
Technological parameter value reaches temporary technological parameter value, then stop warming-up, continues Product Process；Record the different time
Warming-up control wafer quantity required for spacing value correspondence, provides reference for warming-up operation next time.Chamber can be quickly judged by this system
Whether body can continue to produce, and improves the utilization rate of board greatly, and can reduce the usage amount of warming-up control wafer in production, joint
About cost.
Accompanying drawing explanation
Fig. 1 is the schematic top plan view of the Multicarity manufacture board of prior art.
Fig. 2 is that the present invention improves the system schematic manufacturing board cavity output efficiency.
Fig. 3 is that the present invention improves the method schematic diagram manufacturing board cavity output efficiency.
Element numbers explanation
1 acquiring unit
2 temporary storage locations
3 computing units
4 monitoring means
5 judging units
6 record unit
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art can be by disclosed by this specification
Content understand other advantages and effect of the present invention easily.The present invention can also be added by the most different detailed description of the invention
To implement or application, the every details in this specification can also be based on different viewpoints and application, in the essence without departing from the present invention
Various modification or change is carried out under god.
Refer to accompanying drawing 2～Fig. 3.It should be noted that the diagram provided in the present embodiment illustrates the present invention the most in a schematic way
Basic conception, the most graphic in component count time only display with relevant assembly in the present invention rather than is implemented according to reality, shape
And size drafting, during its actual enforcement, the kenel of each assembly, quantity and ratio can be a kind of random change, and its assembly layout
Kenel is likely to increasingly complex.
The present invention provides a kind of system manufacturing board cavity output efficiency, as in figure 2 it is shown, described system at least includes: obtain
Unit, temporary storage location, computing unit, monitoring means, judging unit and record unit.
Described acquiring unit is directly connected with the cavity manufacturing board, for obtaining the product of cavity last batch in the fabrication process
Technological parameter value and time of terminating of last batch Product Process.Preferably, utilize that acquiring unit obtains is upper one
The technological parameter of last flake products of batch.Described technological parameter value includes manufacturing the required environment bar controlled of product
Part and tool parameters value, such as, flow value of the temperature value of cavity, force value and process gas etc. before reaction.
Described manufacture board is the board with multiple chamber, for this apparatus, is merely by engineer's machine at present
On platform guidance panel, whether observing response cavity terminates to produce, and so can have a strong impact on the work efficiency of board cavity, the most significantly
Increase the workload of engineer.
Described temporary storage location is connected with described acquiring unit, is used for temporarily storage condition parameter values acquired in acquiring unit and technique
End time.In the present embodiment, set ITC data interface, by ITC data interface, can be at the automatic record of lane database
And the time of temporary storage cavity body technology end of run.And friendly client end interface is provided, engineer can be convenient fast by this interface
Prompt inquiry last flake products of different platform cavity produces the time record terminated.
Described computing unit, is connected with described temporary storage location, is used for calculating last batch Product Process and terminates to next batch first
Flake products enters cavity and starts spacing value standby time of technique.If this, spacing value was the shortest standby time, it is shorter than engineer rule of thumb
The preset value set, then be made without warming-up operation, the technique directly carrying out next batch product.If this standby time is spaced
It is longer than preset value, then needs to carry out warming-up operation.
Described system also includes a monitoring means, monitoring means and the cavity manufacturing board, is needing to carry out the situation of warming-up operation
Under, the technological parameter value of cavity during monitoring warming-up operation.
Described judging unit is connected with described computing unit and detector unit respectively, and on the one hand described judging unit to judge described meter
Whether spacing value standby time calculating unit calculating exceedes preset value, on the other hand the technique bar of cavity in warming-up process to be judged
Whether part parameter value reaches the condition parameter values that described temporary storage location is temporary.It is spaced by the standby time of intelligent management board cavity,
Can the most effectively judge that can reaction cavity normally continue the technique production of next batch product, thus avoid manually calculating, greatly
Width heightens production efficiency, it is ensured that product quality, alleviates the working strength of engineer.
The quantity of the warming-up control wafer of corresponding use standby time that described record unit is different, provides well for warming-up next time
Reference.If standby time exceeds user preset value, system shows that needs are warm the most in time and remembers sheet number.If not using this invention
System, then need to spend a large amount of manpower and time to go to judge.
It should be noted that the control wafer employed in warming-up operation process is silicon chip, can be the silicon chip again recycled, also
Can be that any other can bring test film used, not limit at this.
Rule of thumb, the default settings that typically would sit idle for the time is 15 minutes to engineer, then needs to warm up more than 15 minutes
Machine operates, and fixing warming-up control wafer in prior art is 3.And the present invention is according to the practical situation of warming-up process conditional parameter value,
Suitably reducing the quantity of control wafer, warming-up control wafer can be less than or equal to 3.Certainly, according to the technique of different product, growth or
The product thickness needing etching is different, and preset value standby time of setting can be revised.This system has become engineer's intellectuality pipe
The instrument of control board reaction cavity standby time, provides an efficient management different product at same reaction chamber to engineer
Body quantity-produced solution, can improve the utilization rate of equipment board greatly, improves technique output, reduces production simultaneously
The usage amount of middle warming-up control wafer, reduces the cost.
The present invention also provides for utilizing said system to improve the method manufacturing board cavity output efficiency, and flow process as shown in Figure 3 is shown
Being intended to, described method at least includes step:
First, obtain and keep in technological parameter value and the technique end time of described manufacture board cavity last batch product；
In the present embodiment, preferably select the process parameter value obtaining last flake products of last batch, such as cavity temperature, pressure, work
Process gases flow etc.；
Then, calculating last flake products technique of last batch terminates to enter cavity to next batch first product and starts the spare time of technique
Put time interval value t, it is judged that whether described time interval value t is more than preset value, if described time interval value is more than preset value, then
Carry out warming-up operation, the most do not carry out warming-up operation, but then continue to carry out the Product Process of next batch；
Then, to carry out warming-up operation, then the technological parameter value of cavity in monitoring warming-up process, if supervising in warming-up process
Measure the technological parameter value that the technological parameter value of cavity reaches temporary, then stop warming-up, continue Product Process；If it is warm
Monitor the technological parameter value that the technological parameter value of cavity is not reaching to keep in during machine, then continue warming-up；
Finally, record the warming-up control wafer quantity required for different time interval value correspondences, provide reference for warming-up operation next time.
In sum, the present invention provides a kind of method and system improving and manufacturing board cavity output efficiency, including: obtain and temporary
Deposit technological parameter value and the technique end time of cavity last batch product；Calculate last flake products technique of last batch
Terminate to enter cavity to next batch first product and start spacing value standby time of technique, it is judged that described time interval value is the biggest
In preset value, if described time interval value is more than preset value, then carries out warming-up operation, otherwise proceed Product Process；Carry out
Warming-up operation, the technological parameter value of cavity in monitoring warming-up process, if monitoring the process conditions ginseng of cavity in warming-up process
Numerical value reaches temporary technological parameter value, then stop warming-up；Record the warming-up control required for different time interval value correspondences
Sheet quantity, provides reference for warming-up operation next time.Can quickly judge whether cavity can continue to produce, greatly by this system
Improve the utilization rate of board and output efficiency, and the usage amount of warming-up control wafer in production can be reduced, cost-effective.
So, the present invention effectively overcomes various shortcoming of the prior art and has high industrial utilization.
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any it is familiar with this skill
Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage of art.Therefore, such as
All that in art, tool usually intellectual is completed under without departing from disclosed spirit and technological thought etc.
Effect is modified or changes, and must be contained by the claim of the present invention.
Claims (8)
1. one kind is improved the system manufacturing board cavity output efficiency, it is characterised in that described system at least includes:
Acquiring unit, for obtaining technological parameter value and the technique knot of described manufacture board cavity last batch product
The bundle time；
Temporary storage location, is connected with described acquiring unit, described condition parameter values and technique end time is kept in；
Computing unit, is connected with described temporary storage location, calculates last batch Product Process and terminates to next batch first to produce
Product enter cavity and start spacing value standby time of technique；
Monitoring means, monitoring next batch product starts the technological parameter value of cavity in the warming-up process before technique；
Judging unit, is connected with described computing unit and monitoring means, it is judged that the time interval that described computing unit calculates is
No exceed preset value, judge whether the technological parameter value of cavity in warming-up process reaches described temporary storage location temporary simultaneously
Condition parameter values；
Record unit, records the warming-up control wafer quantity required for different time interval value correspondences, provides for warming-up operation next time
Reference.
The system improving manufacture board cavity output efficiency the most according to claim 1, it is characterised in that: described acquiring unit obtains
Take the technological parameter value of last flake products of last batch.
The system improving manufacture board cavity output efficiency the most according to claim 1, it is characterised in that: described process conditions are joined
Numerical value includes the force value of described cavity, temperature value and process gas flow value.
The system improving manufacture board cavity output efficiency the most according to claim 1, it is characterised in that: described manufacture board is
For having the board of multiple cavity.
The system improving manufacture board cavity output efficiency the most according to claim 1, it is characterised in that: described warming-up control wafer is
Silicon chip.
The system improving manufacture board cavity output efficiency the most according to claim 1, it is characterised in that: described preset value is
15 minutes, warming-up control wafer quantity was less than or equal to 3.
The system improving manufacture board cavity output efficiency the most according to claim 1, it is characterised in that: connect by ITC data
Mouth is in lane database record temporary storage cavity body technology end time.
8. utilize system described in any one of claim 1～7 to improve the method manufacturing board cavity output efficiency, it is characterised in that institute
Method of stating at least includes step:
Obtain and keep in technological parameter value and the technique end time of described manufacture board cavity last batch product；
Calculating last flake products technique of last batch terminates to enter cavity to next batch first product and starts the idle of technique
Time interval value, it is judged that whether described time interval value, more than preset value, if described time interval value is more than preset value, then enters
Row warming-up operation, otherwise proceeds Product Process；
Carrying out warming-up operation, the technological parameter value of cavity in monitoring warming-up process, if monitoring cavity in warming-up process
Technological parameter value reaches temporary technological parameter value, then stop warming-up, continues Product Process；
Record the warming-up control wafer quantity required for different time interval value correspondences, provide reference for warming-up operation next time.
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| CN201510186200.5A CN106158696B (en) | 2015-04-17 | 2015-04-17 | A kind of method and system improving manufacture board cavity output efficiency |
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| CN109324483A (en) * | 2017-07-31 | 2019-02-12 | 台湾积体电路制造股份有限公司 | The method for manufacturing semiconductor structure |
| CN110400733A (en) * | 2019-08-16 | 2019-11-01 | 北京北方华创微电子装备有限公司 | Intelligent warming-up method and system |
| CN111501003A (en) * | 2020-04-22 | 2020-08-07 | 北京北方华创微电子装备有限公司 | Warm-up control method and semiconductor processing equipment |
| CN111755353A (en) * | 2019-03-26 | 2020-10-09 | 北京北方华创微电子装备有限公司 | Warming-up method and etching method |
| CN112445077A (en) * | 2019-08-30 | 2021-03-05 | 长鑫存储技术有限公司 | Alignment error correction method and system of photoetching machine and photoetching machine |
| CN113097095A (en) * | 2019-12-23 | 2021-07-09 | 长鑫存储技术有限公司 | Control method and system for semiconductor process |
| CN113161263A (en) * | 2021-03-04 | 2021-07-23 | 北京北方华创微电子装备有限公司 | Warming-up method for semiconductor process equipment and semiconductor process equipment |
| US11442440B1 (en) | 2021-03-24 | 2022-09-13 | Changxin Memory Technologies, Inc. | Method and apparatus of handling control wafer, method of testing by using control wafer |
| TWI820472B (en) * | 2021-08-19 | 2023-11-01 | 天虹科技股份有限公司 | Warm-up method of physical vapor deposition chamber |
| US11988969B2 (en) | 2020-06-19 | 2024-05-21 | Changxin Memory Technologies, Inc. | Dispatch method for production line in semiconductor process, storage medium and semiconductor device |
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| US11988969B2 (en) | 2020-06-19 | 2024-05-21 | Changxin Memory Technologies, Inc. | Dispatch method for production line in semiconductor process, storage medium and semiconductor device |
| CN113161263A (en) * | 2021-03-04 | 2021-07-23 | 北京北方华创微电子装备有限公司 | Warming-up method for semiconductor process equipment and semiconductor process equipment |
| CN113161263B (en) * | 2021-03-04 | 2024-05-17 | 北京北方华创微电子装备有限公司 | Warming-up method for semiconductor process equipment and semiconductor process equipment |
| US11442440B1 (en) | 2021-03-24 | 2022-09-13 | Changxin Memory Technologies, Inc. | Method and apparatus of handling control wafer, method of testing by using control wafer |
| TWI820472B (en) * | 2021-08-19 | 2023-11-01 | 天虹科技股份有限公司 | Warm-up method of physical vapor deposition chamber |
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| Publication number | Publication date |
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| CN106158696B (en) | 2018-12-14 |
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