CN106158480B - A kind of thin film switch and preparation method thereof - Google Patents
A kind of thin film switch and preparation method thereof Download PDFInfo
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- CN106158480B CN106158480B CN201610616935.1A CN201610616935A CN106158480B CN 106158480 B CN106158480 B CN 106158480B CN 201610616935 A CN201610616935 A CN 201610616935A CN 106158480 B CN106158480 B CN 106158480B
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- upper epidermis
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/704—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/056—Laminating
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- Push-Button Switches (AREA)
- Manufacture Of Switches (AREA)
Abstract
The present invention relates to a kind of thin film switches and preparation method thereof, it includes upper epidermis, layer and the interlayer for being set to the upper epidermis and the layer, it is distributed on the interlayer spaced multiple every hole, it is respectively formed with described every the corresponding upper circuit in hole and lower circuit on the upper epidermis and the opposite surface of the layer, the interlayer is bonding in the first glue-line of its lower surface and the layer by covering, and the second glue-line and the upper epidermis by covering surface thereon are bonding；It is formed and the air flue mechanism being connected every hole between the layer and first glue-line.By using the first glue-line and the second hot melt glue connection interlayer and upper epidermis, layer, it thus is avoided that and carries out bonding using glue and be conducive to environmental protection；And the air flue mechanism being connected with every hole is formed between layer and the first glue-line, is conducive to completely cut off air, steam etc., improves its service life.
Description
Technical field
The invention belongs to electronic switch fields, are related to a kind of thin film switch, and in particular to a kind of thin film switch and its making
Method.
Background technology
With the continuous development of science and technology, various electronic equipments emerge in multitude.Keyboard is that many electronic equipments are common
Device common are computor-keyboard, communication apparatus keyboard, family's key shelf etc. for inputting word information etc..On thin film switch is
The component for stating keyboard, now tends to thin design, flexible and direction at low cost is developed, and with small, light-weight, operation
The advantages that simple, be widely used in intelligent electronic instrument, Medical Instruments, numerically-controlled machine tool, communication apparatus, office appliance, household electrical appliances,
In the various products such as computor-keyboard.
Conventional thin film switch structure is as shown in Figure 1, it includes mainly upper epidermis 110 ', layer 120 ' and is set to
PET interlayers 130 ' between upper epidermis 110 ' and layer 120 ', PET interlayers 130 ' are distributed with multiple every hole 132 ', upper epidermis
110 ' inner surface is formed with every the corresponding upper circuit 112 ' in hole 132 ', and the inner surface of layer 120 ' is formed with and powers on
The corresponding lower circuit 122 ' in road 112 ', upper epidermis 110 ' and layer 120 ' are bonded in PET interlayers by gelatine layer 140 '
On 130 ' two surfaces.Based on such structure, manufacture craft is generally：(1) divide in upper epidermis 110 ', layer 120 '
It Yin Shua not upper circuit 112 ', lower circuit 122 '；(2) ATE tests are then carried out to ensure upper circuit 112 ' and lower circuit 122 '
Printing quality；(3) glue printing is carried out to upper epidermis 110 ', layer 120 ' respectively；(4) PET interlayers 130 ' and glue are printed
Upper epidermis 110 ' after brush carries out bonding combination, is combined with layer 120 ' after point sanction；(5) above-mentioned three-decker is carried out
Rolling.There are following problems for existing thin film switch production technology：The CPK values of making technology are only 1.105, need to be carried
It is high；Water resistance is bad；It needs to carry out glue twice to print, environmental pollution is heavier；And need to carry out glue twice and print,
IR is dried twice, and energy consumption is larger；And due to the factor every 130 ' thickness of 132 ' size of hole and PET interlayers, cause button right
Thin film switch easily causes the unstable of loading when applying pressure so that current lead-through rate declines, and influences the use of thin film switch
Service life.
Invention content
A kind of thin film switch is provided the invention aims to overcome the deficiencies in the prior art.
In order to achieve the above objectives, the technical solution adopted in the present invention is：A kind of thin film switch, it include upper epidermis, under
Surface layer and the middle interlayer being set between the upper epidermis and the layer are distributed on the middle interlayer spaced
It is multiple to be respectively formed with circuit and lower circuit on the upper epidermis and the opposite surface of the layer every hole, it is described to power on
It is respectively provided on road and the lower circuit with described every the corresponding conductive silver point in hole and lower conductive silver point, it is characterised in that：
The middle interlayer is bonding in the first glue-line of its lower surface and the layer by covering, and by covering surface thereon
The second glue-line and the upper epidermis it is bonding；It is formed between the layer and first glue-line and is connected every hole with described
Air flue mechanism, first glue-line and second glue-line are hot melt adhesive.
Optimally, the air flue mechanism includes being formed in the air flue groove body of the following table layer surface and being formed in described
One film surface and air flue cover board corresponding with the air flue groove body.
Optimally, the thickness of the middle interlayer is 0.03~0.04mm, the thickness of first glue-line and second glue-line
The thickness of degree independently of one another 0.1~0.2mm, the upper epidermis and the layer is independently of one another 0.05~0.1mm.
Another object of the present invention is to provide a kind of preparation method of above-mentioned thin film switch, it includes the following steps：
Step (a) is printed on two surfaces of middle interlayer forms hot melt adhesive film, MARK points is stamped and formed out to it and every hole,
And the part to form air flue mechanism is printed in its any surface；
Step (b) prints the lower circuit for being formed with PIN on any surface of layer, and on the surface of layer
It is upper to print the remainder for forming air flue mechanism；
Step (c) is printed on any surface of upper epidermis forms the upper circuit without PIN, in making followed by hot melt adhesive film
Interlayer is covered on the surface that the upper epidermis prints the upper circuit；
Upper epidermis, layer and middle interlayer be laminated compound by step (d), carry out hot rolling.
Optimally, the step (b) includes：
Step (b1) prints silver paste on any surface of layer, and silver wire is formed after infra-red drying；
Step (b2) printing UV ink on the surface of layer, shape is covered after ultra-violet curing in the silver wire
At UV insulating layers；
Step (b3) prints silver paste on the UV insulating layers, silver-colored wire jumper is formed after infra-red drying, and in corresponding position
Place's printing forms carbon PIN；
Treated that upper table is placed on 140~160 DEG C of dryings is formed within 60~120 minutes by step (b3) for step (b4)
The upper circuits of PIN；And the printing UV ink on the surface of upper circuit, the remainder of air flue mechanism is formed after solidification；
The step (c) includes：
Step (c1) prints silver paste on any surface of upper epidermis, and silver wire is formed after infra-red drying；
Step (c2) printing UV ink on the surface of upper epidermis, shape is covered after ultra-violet curing in the silver wire
At UV insulating layers；
Step (c3) prints silver paste on the UV insulating layers, and silver-colored wire jumper is formed after infra-red drying；
Treated that upper table is placed on that 140~160 DEG C of dryings form nothing in 60~120 minutes by step (c3) for step (c4)
The upper circuits of PIN；So that middle interlayer is covered followed by the hot melt adhesive film and prints the upper circuit to be formed in the upper epidermis
On surface.
Further, the temperature of the infra-red drying is 130~140 DEG C；The UV intensity is 80~150mJ/cm2；
In step (d), the rolling parameter is：Temperature is 100~200 DEG C, rolling speed is 1 μm/s~1cm/s, pressure 0.5MPa
~5MPa.
The present invention also provides a kind of thin film switches, it is comprising upper epidermis, layer and is set to the upper epidermis and institute
State the middle interlayer between layer, be distributed on the middle interlayer it is spaced multiple every hole, the upper epidermis and it is described under
It is respectively formed with circuit and lower circuit on the opposite surface in surface layer, is respectively provided on the upper circuit and the lower circuit and institute
It states every the corresponding conductive silver point in hole and lower conductive silver point, it is characterised in that：The upper epidermis and the layer are opposite
The insulation pad level enclosed around the upper conductive silver point and the lower conductive silver point, the insulation are respectively formed on surface
The thickness of pad level is more than the thickness of the upper conductive silver point or the lower conductive silver point.
Optimally, it further include be set between the middle interlayer and the layer and with the gas being connected every hole
Road mechanism.
Further, the middle interlayer is bonding in the first glue-line of its lower surface and the layer by covering, and
It is bonding by the second glue-line and the upper epidermis that cover surface thereon.
Further, the air flue mechanism includes being formed in the air flue groove body of the following table layer surface and being formed in described
First film surface and air flue cover board corresponding with the air flue groove body.
Further, the thickness of the middle interlayer is 0.03~0.04mm, first glue-line and second glue-line
Thickness is independently of one another 0.1~0.2mm, and the thickness of the upper epidermis and the layer is independently of one another 0.05~
0.1mm。
It is still another object of the present invention to provide a kind of production methods of above-mentioned thin film switch, it includes the following steps：
Step (a) centering interlayer is stamped and formed out MARK points and every hole；
Step (b) prints the lower circuit for being formed with PIN and insulation pad level on any surface of layer；
Step (c) prints the upper circuit and insulation pad level formed without PIN on any surface of upper epidermis；
Upper epidermis, layer and middle interlayer be laminated compound by step (d).
Since above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：The double-deck hot melt of the invention
Film thin film switch thus is avoided that use by using the first glue-line and the second hot melt glue connection interval layer and upper epidermis, layer
Glue bond and be conducive to environmental protection；And the air flue being connected with every hole is formed between layer and the first glue-line
Mechanism is conducive to completely cut off air, steam etc., improves its service life.
Description of the drawings
Attached drawing 1 is existing thin film switch structure schematic diagram；
Attached drawing 2 is the structural schematic diagram of the double-deck hot melt film thin film switch of the present invention；
Attached drawing 3 is the schematic cross-section of the double-deck hot melt film thin film switch of the present invention；
Attached drawing 4 is the parameter schematic diagram of environmental testing；
Attached drawing 5 is the structural schematic diagram of thin film switch of the present invention；
Attached drawing 6 is the vertical view of 5 lower part of attached drawing；
Attached drawing 7 is the upward view on 6 top of attached drawing；
Wherein, 110 ', upper epidermis；112 ', upper circuit；120 ', layer；122 ', lower circuit；130 ', PET interlayers；
132 ', every hole；140 ', gelatine layer；110, upper epidermis；112, upper conductive silver point；120, layer；122, lower conductive silver point；
130, middle interlayer；132, every hole；140, the first glue-line；150, the second glue-line；160, air flue mechanism；162, air flue groove body；164,
Air flue cover board；110 ", upper epidermis；112 ", upper circuit；113 ", upper conductive silver point；120 ", layer；122 ", lower circuit；
123 ', lower conductive silver point；130 ", middle interlayer；132 ", every hole；140 ", first glue-line；150 ", second glue-line；160 ", air flue machine
Structure；170 ", insulate pad level；171 ", cross-over block.
Specific implementation mode
The preferred embodiment of the invention is described in detail below in conjunction with attached drawing.
First embodiment
The double-deck hot melt film thin film switch as shown in Figures 2 and 3 includes mainly upper epidermis 110, layer 120 and interval
Layer 130, middle interlayer 130 is set between upper epidermis 110 and layer 120.
Wherein, it is distributed on middle interlayer 130 spaced multiple every hole 132.In upper epidermis 110 with 120 phase of layer
To surface on form upper circuit 112, the surface opposite with upper epidermis 110 forms lower circuit 122, upper circuit in layer 120
112 it is corresponding with lower circuit 122 and with it is corresponding every 132 position of hole, i.e., on the opposite surface of upper epidermis 110 and layer 120
Be respectively formed with every the corresponding upper circuit 112 in hole 132 and lower circuit 122.Middle interlayer 130 is by covering in its lower surface
First glue-line 140 and layer 120 are bonding, and the second glue-line 150 and 110 phase of upper epidermis by covering surface thereon are viscous
Knot thus is avoided that and is carried out bonding using glue and be conducive to environmental protection.Between layer 120 and the first glue-line 140 formed with
Every the air flue mechanism 160 that hole 132 is connected, is conducive to completely cut off air, steam etc., improves its service life.
In the present embodiment, air flue mechanism 160 includes being formed in the air flue groove body 162 on 120 surface of layer and being formed
In 140 surface of the first glue-line and air flue cover board corresponding with air flue groove body 162 164.The thickness of middle interlayer 130 be 0.03~
The thickness of 0.04mm, the first glue-line 140 and the second glue-line 150 is independently of one another 0.1~0.2mm, upper epidermis 110 and layer
120 thickness is independently of one another 0.05~0.1mm.
Second embodiment
The present embodiment provides the production methods of the double-deck hot melt film thin film switch in above-mentioned first embodiment, it includes following step
Suddenly：
Step (a) is printed on two surfaces of middle interlayer 130 forms hot melt adhesive film, it is stamped and formed out MARK points and every
Hole 132, and in its any surface printing UV ink, through 80mJ/cm2Ultraviolet radiation-curable after form air flue cover board 164.
Step (b) prints the lower circuit for being formed with PIN on any surface of layer 120, and prints on a surface
Form air flue groove body 162.Specially：
According to the design of thin film switch, silver paste is printed on any surface of layer 120, using IR in 130 DEG C of dryings
(usually 30~120 seconds dry, similarly hereinafter) forms the silver wire of correspondingly-shaped and trend afterwards；
Step (b2) continues printing UV ink on a surface, through 80mJ/cm2Ultraviolet radiation-curable after in silver wire
Covering forms UV insulating layers；
Step (b3) continues to print silver paste with reference to the method for step (b1) on UV insulating layers, through infrared in 130 DEG C of dryings
Silver-colored wire jumper is formed afterwards；Silver-colored wire jumper is also silver wire, it has UV insulating layers to be isolated between the silver wire in step (b1), prevents it
Between occur short circuit；Further according to design or the common knowledge of those skilled in the art, in 120 surface corresponding position of layer
Place prints corresponding silver paste, and dry (conventional selection, 30~120 seconds) is to form carbon PIN；
Treated that layer 120 dried comprehensively by step (b3) for step (b4) (be placed in 140 DEG C drying 120 minutes)
It is formed with circuit 122 under PIN；The layer 120 of circuit 122 under the formation is placed on ATE automated test devices and is surveyed
Examination judges whether lower circuit 122 is connected, whether has short circuit place；According to design, the corresponding position of detection qualified products into
Row is stamped and formed out notch and LED aperture needed for thin film switch；And printing UV ink on a surface, through 80mJ/cm2Ultraviolet light
Air flue groove body 162 is formed after irradiation solidification.
Step (c) is printed on any surface of upper epidermis forms the upper circuit without PIN, in making followed by hot melt adhesive film
Interlayer is covered on the surface that the upper epidermis prints the upper circuit.Specially：
Step (c1) according to the design of thin film switch, (usually making by such as the conducting wire arrangement of thin film switch, Position Design etc.
Make to complete before thin film switch makes), printing (using common process such as the silk-screen printings) silver on any surface of upper epidermis 110
Slurry forms the silver wire of correspondingly-shaped and trend using IR at 130 DEG C after drying；
Step (c2) continues printing UV ink on a surface, through 80mJ/cm2Ultraviolet radiation-curable after in silver wire
Covering forms UV insulating layers；
Step (c3) continues to print silver paste with reference to the method for step (c1) on UV insulating layers, through infrared in 130 DEG C of dryings
Silver-colored wire jumper is formed afterwards；Silver-colored wire jumper is also silver wire, it has UV insulating layers to be isolated between the silver wire in step (c1), prevents it
Between occur short circuit；The upper epidermis 110 of circuit 112 in the formation is placed on ATE automated test devices and is tested, is sentenced
Whether disconnected upper circuit 112 is connected, whether has short circuit place；According to design, rushed in the corresponding position of detection qualified products
Swaging is at the notch and LED aperture needed for thin film switch.
Upper epidermis 110, layer 120 and middle interlayer 130 be laminated compound by step (d) so that lower circuit 122 with it is upper
Circuit 112 is oppositely arranged, and air flue cover board 164 corresponds to box cover on air flue groove body 162, carries out hot rolling, specific to join
Number is：Temperature is 100 DEG C, hot rolling speed is 1cm/s, pressure 5MPa..
The process capability CPu values of high waterproof membrane's switch obtained are 1.474, CPk values are 1.687, CPl values are
1.474。
And carry out liquid-proof test：The escape hole for sealing thin film switch is dipped in the normal-temperature water of 2cm depths, and first 2 hours every
Half an hour tests 1 time, and test in then every 1 hour is primary, until unqualified；The water-proofing time of high waterproof membrane's switch is small up to 10
When.
Environmental testing：The double-deck hot melt film thin film switch obtained is handled according to Parameter Conditions shown in Fig. 4, and is surveyed
Its resistance change rate before and after the processing is tried, the resistance change rate for measuring high waterproof membrane's switch in the present embodiment is 100.8%.
3rd embodiment
The present embodiment provides a kind of environmentally friendly production method of the double-deck hot melt film thin film switch, specific steps are implemented with second
It is almost the same in example, unlike：In step (d), the rolling parameter is：Temperature is 200 DEG C, hot rolling speed be 1 μm/
S, pressure is 0.5MPa.After tested：CPu values are 1.450, CPk values are 1.580, CPl values are 1.454；High waterproof membrane opens
The water-proofing time of pass was up to 8 hours；Resistance change rate is 101.7%.
Fourth embodiment
The present embodiment provides a kind of environmentally friendly production method of the double-deck hot melt film thin film switch, specific steps are implemented with second
It is almost the same in example, unlike：The temperature of infra-red drying is 135 DEG C；UV intensity is 100mJ/cm2；In step (d),
The rolling parameter is：Temperature is 150 DEG C, hot rolling speed is 0.5cm/s, pressure 3MPa.After tested：CPu values are
1.455, CPk values are 1.575, CPl values are 1.455；The water-proofing time of high waterproof membrane's switch was up to 9 hours；Resistance change rate
It is 102.8%.
5th embodiment
Thin film switch as shown in Figures 5 to 7, it includes mainly upper epidermis 110 ", layer 120 " and middle interlayer 130 "；
Middle interlayer 130 " is arranged between upper epidermis 110 " and layer 120 ", is distributed on it spaced multiple every hole 132 ".
Wherein, the lower surface (the opposite surface with layer 120 ") of upper epidermis 110 " is formed with upper circuit 112 " and (is formed
Mode is using conventional, such as silk-screen printing), upper circuit 112 " have with every the corresponding multiple upper conductive silvers in hole 132 "
Point 113 "；The upper surface (the opposite surface with upper epidermis 110 ") of layer 120 " is formed with lower circuit 122 ", lower circuit 122 "
With with every the corresponding multiple lower conductive silver points in hole 132 " 123 "；113 " position phase of lower conduction silver point 123 " and upper conductive silver point
It is corresponding；When they are in contact, thin film switch is connected.It is respectively formed on upper epidermis 110 " and the opposite surface of layer 120 "
Enclose the insulation pad level 170 " around upper conductive silver point 113 " and lower conductive silver point 123 "；That is the lower surface of upper epidermis 110 "
It is formed with the insulation pad level 170 " being disposed around around conductive silver point 113 ", the thickness of insulation pad level 170 " is more than upper conduction
The thickness of silver point 113 "；The upper surface of layer 120 " is also formed with the insulation pad level being disposed around around lower conductive silver point 123 "
170 ", the thickness for the pad level 170 " that insulate herein is more than the thickness of lower conductive silver point 123 ".Thin film switch is enabled in this way
Loading and conducting pressure dissipation are uniform, and the on-state rate in raising between conductive silver point 113 " and lower conductive silver point 123 " improves it
Service life.
In the present embodiment, insulation pad level 170 " is surrounded by spaced multiple cross-over blocks 171 ", and insulation is padded
The shape of 170 " end face of layer can be varied, such as whole rounded, direction.It is set between middle interlayer 130 " and layer 120 "
There is the air flue mechanism 160 " being connected with every hole 132 ", is conducive to completely cut off air, steam etc., further increases its service life；
Air flue mechanism 160 " can be connected with insulation pad level 170 ", manufacture craft can be simplified in this way, reduce cost.Middle interlayer
130 is bonding by covering the first glue-line 140 " and layer 120 " in its lower surface, and by covering surface thereon
Second glue-line 150 " and upper epidermis 110 " are bonding；First glue-line 140 " and the second glue-line 150 " are independently of one another hot melt adhesive layer
Or gelatine layer, certain first glue-line 140 " and the second glue-line 150 " are both preferably hot melt adhesive layer, are conducive to manufacturing process in this way
In pollution to environment, and processing step can be simplified, reduce cost.
The preparation method of above-mentioned thin film switch, and it is essentially identical in second embodiment, unlike：Step (b) and step
Suddenly in (c) respectively layer, upper epidermis surface on printing formed insulation pad level 170 " so that insulation pad level 170 " with
Air flue mechanism 160 " is connected.
Comparative example 1
It is and almost the same in embodiment 1 the present embodiment provides a kind of conventional fabrication process of thin film switch, it is different
It is：Hot melt adhesive film is not used in step (a4), but is coated with glue.Final product obtains after tested：CPu values are 1.102, CPk
Value is that 1.102, CPl values are 1.243；The water-proofing time of thin film switch is only 5 hours；Resistance change rate is 115.6%.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (4)
1. a kind of production method of thin film switch, the thin film switch is comprising upper epidermis, layer and is set to the upper table
Middle interlayer between layer and the layer, be distributed on the middle interlayer it is spaced multiple every hole, the upper epidermis and
It is respectively formed with circuit and lower circuit on the opposite surface of the layer, has respectively on the upper circuit and the lower circuit
Have with described every the corresponding conductive silver point in hole and lower conductive silver point, which is characterized in that production method includes the following steps：
Step（a）Printing forms hot melt adhesive film on two surfaces of middle interlayer, MARK points is stamped and formed out to it and every hole, and
Its any surface prints the part to form air flue mechanism；
Step（b）Printing is formed with the lower circuit of PIN on any surface of layer, and is printed on the surface of layer
Scopiform at air flue mechanism remainder；
Step（c）Printing forms the upper circuit without PIN on any surface of upper epidermis, makes middle interlayer followed by hot melt adhesive film
It covers on the surface that the upper epidermis prints the upper circuit；
Step（d）Upper epidermis, layer and middle interlayer be laminated compound, carries out hot rolling.
2. the production method of thin film switch according to claim 1, which is characterized in that the step（b）Including：
Step（b1）Silver paste is printed on any surface of layer, forms silver wire after infra-red drying；
Step（b2）The printing UV ink on the surface of layer, covering forms UV in the silver wire after ultra-violet curing
Insulating layer；
Step（b3）Silver paste is printed on the UV insulating layers, forms silver-colored wire jumper after infra-red drying, and print in corresponding position
Scopiform is at carbon PIN；
Step（b4）By step（b3）Following table that treated is placed on 140 ~ 160 DEG C of dryings and is formed within 60 ~ 120 minutes electricity under PIN
Road；And the printing UV ink on the surface of lower circuit, the remainder of air flue mechanism is formed after solidification；
The step（c）Including：
Step（c1）Silver paste is printed on any surface of upper epidermis, forms silver wire after infra-red drying；
Step（c2）The printing UV ink on the surface of upper epidermis, covering forms UV in the silver wire after ultra-violet curing
Insulating layer；
Step（c3）Silver paste is printed on the UV insulating layers, forms silver-colored wire jumper after infra-red drying；
Step（c4）By step（c3）Upper table that treated is placed on 140 ~ 160 DEG C of dryings formation in 60 ~ 120 minutes and is powered on without PIN
Road；Middle interlayer is set to cover on the surface that the upper epidermis prints the upper circuit to be formed followed by the hot melt adhesive film.
3. the production method of thin film switch according to claim 2, it is characterised in that：The temperature of the infra-red drying be 130 ~
140℃；The UV intensity is 80 ~ 150mJ/cm2；Step（d）In, the parameter of the heat rolling is：Temperature is 100 ~ 200
DEG C, rolling speed be 1 μm/s ~ 1cm/s, pressure is 0.5MPa ~ 5MPa.
4. a kind of production method of thin film switch, which is characterized in that it includes the following steps：
Step（a）Centering interlayer is stamped and formed out MARK points and every hole；
Step（b）Printing is formed with the lower circuit and insulation pad level of PIN on any surface of layer；
Step（c）Printing forms upper circuit and insulation pad level without PIN on any surface of upper epidermis；
Step（d）Upper epidermis, layer and middle interlayer be laminated compound.
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| CN201610616935.1A CN106158480B (en) | 2016-08-01 | 2016-08-01 | A kind of thin film switch and preparation method thereof |
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|---|---|---|---|
| CN201610616935.1A CN106158480B (en) | 2016-08-01 | 2016-08-01 | A kind of thin film switch and preparation method thereof |
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| CN106158480A CN106158480A (en) | 2016-11-23 |
| CN106158480B true CN106158480B (en) | 2018-10-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI627649B (en) | 2017-02-23 | 2018-06-21 | 禎信股份有限公司 | Membrane switch |
| CN107993869A (en) * | 2017-12-21 | 2018-05-04 | 昆山兴协和光电科技有限公司 | Keyboard pcb and its manufacture method |
| CN109300724B (en) * | 2018-08-28 | 2020-05-08 | 上海幂方电子科技有限公司 | Thin film switch and manufacturing method thereof |
| CN110544595B (en) * | 2019-09-07 | 2024-02-27 | 厦门铭彩电子科技有限公司 | Antistatic membrane switch and manufacturing method thereof |
| CN215377281U (en) * | 2021-08-11 | 2021-12-31 | 昆山兴协和科技股份有限公司 | Membrane switch |
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| CN106158480A (en) | 2016-11-23 |
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