CN106154760A - A kind of exposure device and exposure method - Google Patents
A kind of exposure device and exposure method Download PDFInfo
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- CN106154760A CN106154760A CN201510175999.8A CN201510175999A CN106154760A CN 106154760 A CN106154760 A CN 106154760A CN 201510175999 A CN201510175999 A CN 201510175999A CN 106154760 A CN106154760 A CN 106154760A
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Abstract
One exposure device of the present invention, it is characterised in that including a: illuminator, is used for the light beam providing exposure used；One projection objective array, including N number of projection objective, the graphic projection being used for will be located on a mask plate is to a substrate, and N is the natural number more than 1；One six degree of freedom detector array, is made up of some six degree of freedom detectors, for measure the level of an alignment mark to vertical to position；One mask platform, is used for carrying described mask plate and providing displacement；One work stage, is used for carrying described substrate and providing displacement；Described mask plate moves with described substrate relative synchronization.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, particularly relate to a kind of exposure device and exposure method.
Background technology
Along with the development of liquid crystal display industry, liquid crystal size constantly increases, and the requirement to the resolution of scanning litho machine also improves constantly.Alignment sensor and focusing and leveling sensor as level important in litho machine to vertical pose measurement sensor, to requiring more to measure a little, higher precision, higher repeatability, and can adapt to the deformation of big glass substrate and the complexity of Technology.Simultaneously, the structure of many objective lens array, also require that alignment and focusing and leveling sensor possess less bulk.
In patent CN100524024, nikon company of Japan proposes a kind of exposure device for advanced lines TFT, as it is shown in figure 1, this exposure device is by compositions such as transparent system IL, mask platform, Substrate table, objective lens array PLa ~ PLg.This device moves along X as shown in Figure 1 to being scanned, and objective lens array PLa ~ PLg realizes the exposure to glass substrate by it at the exposure field 50a ~ 50g of real estate.And before exposure, in order to ensure the precision of lines and alignment, must carry out locating tab assembly and focusing are measured, as shown in Figure 2, the program is in the width range of glass substrate, arrange and multiple point is measured in locating tab assembly point and multiple focusing, can carry out multiple fields locating tab assembly and focusing are measured simultaneously, thus realize the parallel measurement that locating tab assembly and focusing are measured.For the technical scheme provided in this patent, on the one hand, because of factors such as the deformation of glass substrate, warpages in scanning process, easily make alignment mark generation out of focus phenomenon, focusing separates layout with alignment, it is impossible to obtain the accurate defocusing amount of alignment mark, cannot be carried out compensating in result of calculation.On the other hand, focusing and the separation to locating tab assembly point are arranged, cannot be carried out focusing and measure, add the time that scanning runs while also making to need locating tab assembly in whole scanning process.
Summary of the invention
In order to overcome defect present in prior art, the present invention provides a kind of higher focusing leveling device of certainty of measurement.
In order to realize foregoing invention purpose, the open a kind of exposure device of the present invention, including: an illuminator, it is used for the light beam providing exposure used；One projection objective array, including N number of projection objective, for will be located in graphic projection on a mask plate to a substrate,
N is the natural number more than 1；One six degree of freedom detector array, is made up of some six degree of freedom detectors, for measure the level of an alignment mark to vertical to position；One mask platform, is used for carrying described mask plate and providing displacement；One work stage, is used for carrying described substrate and providing displacement；Described mask plate moves with described substrate relative synchronization, scan exposure mode, can be to be synchronized with the movement in the same direction, or be synchronized with the movement in opposite direction.
Further, this projection objective array, by N number of projection objective, is staggered at least two groups along X-axis, N be the natural number more than 1 it is also preferred that the left this projection objective array is made up of two groups of projection objectives, often group includes three projection objectives.
Further, this six degree of freedom detector array is formed along X-axis arrangement by N number of six degree of freedom detector, and the X of the corresponding projection objective in the position of each six degree of freedom detector is to center.
Further, this six degree of freedom detector array is formed along X-axis arrangement by 2N-1 six degree of freedom detector, the X of the most corresponding projection objective in the position of the most N number of six degree of freedom detector is to center, and additionally N-1 six degree of freedom detector is positioned at the center of adjacent two six degree of freedom detector.
Further, this six degree of freedom detector array is formed along X-axis arrangement by N × 2 six degree of freedom detector, wherein along the X of the corresponding projection objective in position of parallel two the six degree of freedom detectors of Y-axis to center.
Further, this six degree of freedom detector includes that a level shares a spectroscopic imaging unit to the vertical detector of detector and, this level to detector and vertical detector.
Further, the emergent light of one light source of this spectroscopic imaging unit sequentially passes through group before one first Amici prism, the second Amici prism, imaging after an illuminating mirror group, after group before this imaging, this second Amici prism is entered after this substrate reflects, the emergent light of this second Amici prism is partly into this level and enters this vertical detector to detector, another part through this first Amici prism.
Further, this level is group and an area array CCD after sensor includes an optical filter, an imaging, and this vertically includes group and a line array CCD after group before a detection, a prism assemblies, a detection to sensor.
Further, one light source of this spectroscopic imaging unit sequentially passes through an illuminating mirror group, an illumination adjustments unit after a wavelength selection unit, one Amici prism, a spectrophotometric unit is entered after this substrate reflects, this spectrophotometric unit be partly into this vertical detector, another part enters this level to detector through this Amici prism.
Further, this vertical detector is an interference photo-detector, and this level is a machine vision detector to detector.
Present invention simultaneously discloses a kind of exposure method, including: step one, beginning scanning survey, work stage is moved to the scanning starting position of first exposure field；Step 2, scanning first row alignment mark, calculate simultaneously first row alignment mark level to and vertical position；Step 3, scanning secondary series alignment mark, calculate simultaneously secondary series alignment mark level to and vertical position；After step 4, the first exposure field have scanned, calculate alignment position and the focusing position of the first exposure field；If there is out of focus the vertical position of alignment mark, defocusing amount is compensated.
Compared with prior art, the present invention utilizes the six degree of freedom of more compact structure to measure sensor, can increase and more measure hot spot, thus improve the certainty of measurement of focusing and leveling；In exposure field scanning process, alignment mark can be carried out level to measurement, vertical measurement can be carried out again simultaneously, not only increase productivity, and when alignment mark has out of focus phenomenon, level can be compensated to result, thus improve alignment precision.
Accompanying drawing explanation
Can be described in detail by invention below about the advantages and spirit of the present invention and institute's accompanying drawings is further understood.
Fig. 1 is the exposure device of a kind of typical TFT in prior art；
Fig. 2 is to focus in prior art and be directed at measurement point distribution figure；
Fig. 3 is the structural representation of exposure device involved in the present invention；
Fig. 4 is exposure device and alignment focusing measurement point distribution figure in exposure field involved in the present invention；
Fig. 5 is alignment measurement markers scattergram involved in the present invention；
Fig. 6 is the structural representation that six degree of freedom involved in the present invention measures sensor；
Fig. 7 is exposure field scanning process figure involved in the present invention；
Fig. 8 is one of scanning schematic diagram of exposure field involved in the present invention；
Fig. 9 is the two of the scanning schematic diagram of exposure field involved in the present invention；
Figure 10 is the three of the scanning schematic diagram of exposure field involved in the present invention；
Figure 11 is the four of the scanning schematic diagram of exposure field involved in the present invention；
Figure 12 is the five of the scanning schematic diagram of exposure field involved in the present invention；
Figure 13 be focusing and leveling in the second embodiment that the present invention provides with to locating tab assembly hot spot scattergram；
Figure 14 is the structural representation that the six degree of freedom in the second embodiment that the present invention provides measures sensor；
Figure 15 be focusing and leveling in the 3rd embodiment that the present invention provides with to locating tab assembly hot spot scattergram.
Detailed description of the invention
Describe the specific embodiment of the present invention below in conjunction with the accompanying drawings in detail.
It is an object of the invention to provide a kind of higher focusing leveling device of certainty of measurement.
Fig. 3 is the schematic diagram of exposure device of the present invention, and mask plate 101 is after illuminator 100 illuminates, and by projection objective array 103a ~ 103f exposure glass substrate 107, glass substrate 107 is carried by Substrate table 108.Projection objective array 103a ~ 103f is respectively 105a ~ 105f to glass substrate 107 in the exposure field of real estate.Projection objective array, by N projection objective, is staggered at least two groups along X-axis, and wherein N is the natural number more than 1.In the present embodiment, projection objective array has two groups, one group three, forms the array of a 2*3.Placed 6 six degree of freedom detection sensor 104a ~ 104f in the middle of two groups of object lens, 6 six degree of freedom detection sensors are 106a ~ 106f at the measurement point of real estate, and 6 six degree of freedoms detect sensor along X to distribution.
Fig. 4 is six degree of freedom detection sensor measurement point and the schematic layout pattern of projection objective exposure field on glass substrate, 6 six degree of freedoms detection sensor measurement point 106a ~ 106f are positioned at two row exposure field centers, and each measure point and exposure field X to center corresponding.
Fig. 5 is substrate size and exposure scan visual field, the distribution schematic diagram that is directed at measurement markers.This embodiment assumes that a glass substrate has 4 scan exposure visual fields, in 2 × 2 distributions.Having two rows to be directed at measurement markers in each scan exposure visual field, it is parallel that two rows are directed at measurement markers, and often row has 6 alignment measurement markers, and 6 are directed at measurement markers along X to distribution.Wherein one rank the beginning region in scanning field, an other ranking and the end region of scanning field.The scanning direction of litho machine is Y-direction.
Fig. 6 is the structural representation that a kind of six degree of freedom measures sensor, it is made up of to measurement sensor and vertical measurement sensor level, wherein organizing 305 before light source 301, illuminating mirror group 302, Amici prism 303 and 304, imaging is common components, it is achieved that be irradiated to by light source on workpiece 306.Light source organizes 305 after workpiece 306 reflects before imaging, area array CCD 309 is entered after organizing 308 after second Amici prism 304, optical filter 307, imaging, collectively constitute level to measuring sensor, i.e. alignment sensor, its operation principle is that typical machine vision is directed at measuring principle, can be calculated by image procossing and obtain the level of alignment mark to position.Light source organizes 305 before imaging, line array CCD 312 is entered after organizing 311 after group 310, prism assemblies 311, detection before two Amici prisms 303 and 304, detections, collectively constitute vertical measurement sensor, i.e. focusing and leveling sensor, its operation principle is Spectral Confocal measurement technology, the monochromatic light of different wave length is correspond to measuring difference defocusing amount at workpiece, and at line array CCD end, the monochromatic light of different wave length position on line array CCD is different, i.e. can be exchanged into corresponding defocusing amount by calculating the monochromatic light that on line array CCD, energy is maximum.This measurement sensor can realize level and measure function to while vertical.
Fig. 7 is the exposure process schematic diagram of glass substrate, and it concretely comprises the following steps:
701: by board transport by glass substrate transmission to work stage.
702: calculated the edge of glass substrate and the center of work stage by prealignment.
703: start scanning survey, work stage is moved to the scanning starting position of first exposure field, as shown in Figure 8.
704: while work stage moves to scanning starting position, focusing and leveling sensor opens the function measuring caching, focusing and leveling sensor caches 6 six degree of freedoms according to certain sample frequency and measures the vertical measurement result of sensor, and the level of current work stage is to coordinate；
705: during to work stage scanning to the alignment mark position of first row, as shown in Figure 9, each alignment mark is adopted figure by the area array CCD opening six degree of freedom measurement sensor kind, six degree of freedom measures the vertical measurement result of vertical sensor measurement current glass substrate in sensor simultaneously, i.e. utilize six degree of freedom measure sensor realize the level to alignment mark to and vertical position while measure；
706: work stage is scanned through, as shown in Figure 10, when moving to secondary series mark position, as shown in figure 11, six degree of freedom measure sensor measure simultaneously the level of alignment mark to and vertical position.
707: work stage continues on scanning direction motion, until the scan end position of this exposure field, as shown in figure 12；
708: after work stage arrives the scan end position of exposure field, focusing and leveling sensor closes caching function, stops six degree of freedom being measured the vertical measurement result of sensor and work stage level to the caching on the left side；
709,710: at the end of scanning survey, can start to calculate this alignment position and focusing position.Alignment metrical information (the Xa1 of current exposure field can be obtained by the calculating of alignment sensor, Ya1), (Xb1, Yb1), (Xc1, Yc1), (Xd1, Yd1), (Xe1, Ye1), (Xf1, Yf1), and (Xa2, Ya2), (Xb2, Yb2), (Xc2, Yc2), (Xd2, Yd2), (Xe2, Ye2), (Xf2, Yf2), it is fitted calculating to the position of two row's labellings, this alignment position X, Y, Rz can be tried to achieve；Equally, focusing metrical information (Xi, Yi, Zi, Rxi, Ryi, Rzi, Za ~ fi) by caching, it is fitted (Xi, Yi, Zi, Rxi, Ryi, Rzi, Za ~ fi) calculating, focusing position Z, Rx, Ry that this exposure field is overall can be obtained.In this step, when there is out of focus the vertical position of alignment mark, the compensation of defocusing amount can be carried out in the result of calculation of alignment；
711: judge whether that all of exposure field all completes scanning process；
712: if also exposure field does not completes scanning process, then driving work stage is to next exposure field, and restarts 703 ~ 710 steps；
713: if completing the scanning of all exposure field, then according to the alignment and focusing result scanning each of calculating before, each field is exposed；
714: whole flow process is taken off glass substrate after completing from work stage.
Figure 13 be focusing and leveling in the second embodiment that the present invention provides with to locating tab assembly hot spot scattergram.The difference of the second embodiment and the first embodiment is: total 406a ~ 406k 11 measures hot spot, along X to linear array, and it is distributed in the center of two row exposure field, wherein measure these 6 hot spots of hot spot 406a, 406c, 406e, 406g, 406i, 406k consistent and corresponding to center with the X of each exposure field with 6 measurement facula positions in embodiment 1.Remaining, measure hot spot 406b and be positioned at the center of 406a Yu 406c；Measure hot spot 406d and be positioned at the center of 406c Yu 406e；Measure hot spot 406f and be positioned at the center of 406e Yu 406g；Measure hot spot 406h and be positioned at the center of 406g Yu 406i；Measure hot spot 406j and be positioned at the center of 406i Yu 406k.
Arrangement mode described above, wherein corresponding to center with the X of each exposure field hot spot is corresponding with alignment mark, its measurement hot spot corresponding with alignment mark also carries out vertical elevation carrection in use while to locating tab assembly, remaining hot spot the most only carries out vertical elevation carrection, increases the accuracy of focusing.
Figure 14 is the structural representation that the six degree of freedom in the second embodiment that the present invention provides measures sensor.In this embodiment, level is still traditional alignment sensor that machine vision is principle to measuring, and vertical sensor is then white light interference theory, determines vertical height by the optical path difference measuring the coherent light between reference marker 609 and surface of the work 608.
Figure 15 be focusing and leveling in the 3rd embodiment that the present invention provides with to locating tab assembly hot spot scattergram.The difference of the 3rd embodiment and first, second embodiment is: arrange two row measurement hot spots between two row splicing object lens, and each measurement hot spot pair in each column measurement is corresponding to center with the X of each exposure field.
Arrangement mode described above, wherein the hot spot of string is corresponding with alignment mark, and its measurement hot spot corresponding with alignment mark also carries out vertical elevation carrection in use while to locating tab assembly;Another row hot spot the most only carries out vertical elevation carrection, increases the accuracy of focusing.
The preferred embodiment of the simply present invention described in this specification, above example is only in order to illustrate technical scheme rather than limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (11)
1. an exposure device, it is characterised in that including:
One illuminator, is used for the light beam providing exposure used；
One projection objective array, including N number of projection objective, the graphic projection being used for will be located on a mask plate is to a substrate, and N is the natural number more than 1；
One six degree of freedom detector array, is made up of some six degree of freedom detectors, for measure the level of an alignment mark to vertical to position；
One mask platform, is used for carrying described mask plate and providing displacement；
One work stage, is used for carrying described substrate and providing displacement；Described mask plate moves with described substrate relative synchronization.
2. exposure device as claimed in claim 1, it is characterised in that described projection objective array, by above-mentioned N number of projection objective, is staggered at least two groups along X-axis.
3. exposure device as claimed in claim 1 or 2, it is characterised in that described six degree of freedom detector array is formed along X-axis arrangement by N number of six degree of freedom detector, the X of the corresponding projection objective in the position of each six degree of freedom detector is to center.
4. exposure device as claimed in claim 1 or 2, it is characterized in that, described six degree of freedom detector array is formed along X-axis arrangement by 2n-1 six degree of freedom detector, wherein the X of the position of a n six degree of freedom detector respectively corresponding projection objective is to center, and additionally n-1 six degree of freedom detector is positioned at the center of adjacent two six degree of freedom detector.
5. exposure device as claimed in claim 1 or 2, it is characterized in that, described six degree of freedom detector array is formed along X-axis arrangement by n × 2 six degree of freedom detector, wherein along the X of the corresponding projection objective in position of parallel two the six degree of freedom detectors of Y-axis to center.
6. exposure device as claimed in claim 1, it is characterised in that described six degree of freedom detector includes that a level shares a spectroscopic imaging unit to the vertical detector of detector and, described level to detector and vertical detector.
7. exposure device as claimed in claim 6, it is characterized in that, the emergent light of one light source of described spectroscopic imaging unit sequentially passes through group before one first Amici prism, the second Amici prism, imaging after an illuminating mirror group, after group before described imaging, described second Amici prism is entered after described substrate reflects, the emergent light of described second Amici prism is partly into described level and enters described vertical detector to detector, another part through described first Amici prism.
8. exposure device as claimed in claim 6, it is characterized in that, described level is group and an area array CCD after sensor includes an optical filter, an imaging, described vertically includes group and a line array CCD after group before a detection, a prism assemblies, a detection to sensor.
9. exposure device as claimed in claim 6, it is characterized in that, one light source of described spectroscopic imaging unit sequentially passes through an illuminating mirror group, an illumination adjustments unit after a wavelength selection unit, one Amici prism, a spectrophotometric unit is entered after described substrate reflects, described spectrophotometric unit be partly into described vertical detector, another part through described Amici prism enter described level to detector.
10. exposure device as claimed in claim 6, it is characterised in that described vertical detector is an interference photo-detector, and described level is a machine vision detector to detector.
11. 1 kinds of exposure methods, it is characterised in that including:
Step one, beginning scanning survey, move to the scanning starting position of first exposure field by work stage；
Step 2, scanning first row alignment mark, calculate simultaneously first row alignment mark level to and vertical position；
Step 3, scanning secondary series alignment mark, calculate simultaneously secondary series alignment mark level to and vertical position；
After step 4, the first exposure field have scanned, calculate alignment position and the focusing position of the first exposure field；If there is out of focus the vertical position of alignment mark, defocusing amount is compensated.
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| CN108121162A (en) * | 2016-11-29 | 2018-06-05 | 上海微电子装备（集团）股份有限公司 | A kind of projection aligner and exposure method |
| TWI808346B (en) * | 2019-10-04 | 2023-07-11 | 日商佳能股份有限公司 | Position detection apparatus, position detection method, lithography apparatus, and method of manufacturing article |
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