CN106154417A - A kind of manufacture method of planar waveguide device - Google Patents

A kind of manufacture method of planar waveguide device Download PDF

Info

Publication number
CN106154417A
CN106154417A CN201510155452.1A CN201510155452A CN106154417A CN 106154417 A CN106154417 A CN 106154417A CN 201510155452 A CN201510155452 A CN 201510155452A CN 106154417 A CN106154417 A CN 106154417A
Authority
CN
China
Prior art keywords
film layer
group
section
layer section
manufacture method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510155452.1A
Other languages
Chinese (zh)
Other versions
CN106154417B (en
Inventor
杨磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201510155452.1A priority Critical patent/CN106154417B/en
Priority to PCT/CN2015/095750 priority patent/WO2016155344A1/en
Publication of CN106154417A publication Critical patent/CN106154417A/en
Application granted granted Critical
Publication of CN106154417B publication Critical patent/CN106154417B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method

Abstract

The invention provides the manufacture method of a kind of planar waveguide device, comprise the following steps: a. forms first group of film layer section on the surface of waveguide, be spaced apart between the adjacent sections in this first group of film layer section;B. mask is used this first group of film layer section to be exposed, to solidify the required part of this first group of film layer section;C. the marginal portion of uncured in this first group of film layer section is removed;D. second group of film layer section is formed between at least part of adjacent sections in this first group of film layer section;And e. uses mask to be exposed this second group of film layer section, to solidify this second group of film layer section.

Description

A kind of manufacture method of planar waveguide device
Technical field
The present invention relates to the manufacture method of a kind of optics, particularly relate to the manufacturer of a kind of planar waveguide device Method.
Background technology
Large screen display is widely used in various business and daily field.Such as, carry applicant in this case The Chinese patent application gone out the 201210172215.2nd reports a kind of slab guide display pannel, such as Fig. 8 Shown in.This slab guide display pannel 800 mainly includes flat wave-guide, incident from the light of optical projection system 803 Light to this flat wave-guide one end is propagated in the way of total reflection, enters screen along light from conductive area 801 The direction of the light path in region 802 mark off in screen area 802 multiple section (section 1 in such as Fig. 8, 2、3、4);After traveling to selected pixel, this pixel by the light in this flat wave-guide from this position Launch, but, this kind of flat wave-guide display apparatus panel has a problem in that: each section in its surface manufactures more difficulty, Section junction easily occurs that seam affects display effect, or complex process, is unfavorable for producing in enormous quantities.
Summary of the invention
For the above-mentioned technology barrier of prior art, inventor innovatively applies on planar waveguide device Photoetching technique manufactures the planar waveguide device being coated with Multi sectional film layer in waveguide surface.
Specifically, the invention provides the manufacture method of a kind of planar waveguide device, comprise the following steps:
A. on the surface of waveguide, form first group of film layer section, the adjacent sections in this first group of film layer section it Between be spaced apart;
B. mask is used this first group of film layer section to be exposed, needed for solidifying this first group of film layer section Part;
C. the marginal portion of uncured in this first group of film layer section is removed;
D. second group of film layer section is formed between at least part of adjacent sections in this first group of film layer section;With And
E. mask is used this second group of film layer section to be exposed, to solidify this second group of film layer section.
It is preferred that in above-mentioned manufacture method, also include after this step e:
F. the ledge of the junction of this first group of film layer section and this second group of film layer section is removed.
It is preferred that in above-mentioned manufacture method, after this step f, this manufacture method also includes:
Least one set additional layers section is formed between remaining adjacent sections in this first group of film layer section, with This first group of film layer section, this second group of film layer section and this least one set additional layers section is made to constitute the first tunic Layer;
Mask is used this least one set additional layers section to be exposed, to solidify this least one set additional layers Section;And
Remove the ledge of the junction of these least one set additional layers section both sides.
It is preferred that in above-mentioned manufacture method, the formation in this step a and step d includes:
Directly paste the film material of solid-state;
Czochralski method, spin-coating method, spraying process, knife coating, steaming is utilized to cross method or the film layer material of sputtering method coating liquid Material;Or
By the way of printing, print film layer material is on the surface of this waveguide.
It is preferred that the not same district in first group of film layer section in above-mentioned manufacture method, in this step a Section is formed in batches, and in this step d second group or the different sections in least one set additional layers section Formed in batches.
It is preferred that in above-mentioned manufacture method, also included before this step a: make one in waveguide surface The step of initial film layer, this step farther includes: directly paste the initial film layer material of solid-state;Utilize czochralski method, Method or sputtering method coating liquid or the initial film layer material of solid-state are crossed in spin-coating method, spraying process, knife coating, steaming;Or Initial film layer material is printed on the surface of this waveguide by the way of printing.
It is preferred that in above-mentioned manufacture method, also include after this step f:
G. forming the second tunic layer on this first tunic layer, wherein the formation in this step g includes:
Directly paste the film material of solid-state;
Czochralski method, spin-coating method, spraying process, knife coating, steaming is utilized to cross method or the film layer material of sputtering method coating liquid Material;Or
By the way of printing, print film layer material is on the surface of this waveguide.
It is preferred that in above-mentioned manufacture method, this first tunic layer manufactures anti-reflection film further, and should Manufacture method further includes at pastes or coats diffusion barrier, microprism film and/or light increasing further on this anti-reflection film Strong film.
It is preferred that in above-mentioned manufacture method, in this step b and step e, the exposure light of this exposure It is a predetermined angle relative to the surface of this waveguide.
It is preferred that in above-mentioned manufacture method, farther include in this step b and step e: in exposure It is imprinted with at this first group of film layer section, this second group of film layer section or this least one set additional layers section simultaneously Upper formation micro structure, wherein this impressing include imprinting transparent impressing mould in this first group of film layer section, this second On group film layer section or this least one set additional layers section, exposure light is exposed to this first Zu Moceng district simultaneously Section, this second group of film layer section or this least one set additional layers section.
It is preferred that in above-mentioned manufacture method, this impressing mould and this mask are one.
It is preferred that in above-mentioned manufacture method, while forming this micro structure or afterwards, also include by There is scattering or the functional material of reflection function or film layer is directly injected into or affixes in this micro structure.
It is all exemplary and illustrative for should be appreciated that the generality of more than the present invention describes with the following detailed description , and it is intended that the present invention as claimed in claim provides further explanation.
Accompanying drawing explanation
It is that they are included and constitute of the application in order to provide further understanding of the invention including accompanying drawing Point, accompanying drawing shows embodiments of the invention, and plays the effect explaining the principle of the invention together with this specification. In accompanying drawing:
Fig. 1 shows the base of the only manufacture method of the planar waveguide device of two groups of film layer sections according to the present invention The flow chart of this step.
Fig. 2 a-Fig. 2 h shows the configuration diagram in each stage according to the manufacture method shown in Fig. 1.
Fig. 3 shows the embodiment of coating two-layer anti-reflection film.
Fig. 4 shows another embodiment of the planar waveguide device of the present invention.
Fig. 5 a-Fig. 5 b shows the embodiment forming micro structure on film layer section.
Fig. 6 a-Fig. 6 b shows another embodiment forming micro structure on film layer section.
Fig. 7 a-Fig. 7 c shows the process forming functional film layer in micro structure.
Fig. 8 shows the planar waveguide device of the manufacture method being suitable for use with the present invention.
Detailed description of the invention
With detailed reference to accompanying drawing, embodiments of the invention are described now.Now preferred with detailed reference to the present invention Embodiment, its example is shown in the drawings.In the case of any possible, phase will be used in all of the figs Same labelling represents same or analogous part.Although additionally, the term used in the present invention is from public affairs Know selection in public term, but some terms mentioned in description of the invention are probably applicant Select by his or her judgement, the explanation in the relevant portion of description herein of its detailed meanings.Additionally, Require not only by the actual terms used, and be also to the meaning by each term is contained and manage Solve the present invention.
Fig. 1 shows the base of the only manufacture method of the planar waveguide device of two groups of film layer sections according to the present invention The flow chart of this step.The system of this planar waveguide device shown in Fig. 1 is discussed in detail below in conjunction with Fig. 2 a-Fig. 2 h Make method 100.
First, according to step 101, the surface of the waveguide 201 shown in Fig. 2 a forms first group of film layer section 202.Wherein, adjacent sections (section 0 in such as Fig. 2 a, the section 2 in this first group of film layer section 202 And section 4) between be spaced apart.It is preferred that first group of film layer section 202 can be coated with blade coating cutter 203 Surface in waveguide 201.It is, for example possible to use special doctor knife coater, comprise several blade coating cuttves, every blade coating cutter Equipped with different medium material, it is responsible for coating the different medium (dielectric thickness of general blade coating at different sections simultaneously Determine depending on concrete application between 0.5-50um).
It is preferred that first group of film layer section 202 in step 101 can be by straight on the surface of waveguide 201 Connect the mode of film material pasting solid-state, utilize czochralski method, spin-coating method, spraying process, knife coating, steaming cross method or The mode of the film material of sputtering method coating liquid or non-liquid, or the side by printing (such as silk screen printing) Formula print film layer material mode on the surface of this waveguide and formed.
Then, according to step 102, use mask 204 that this first group of film layer section 202 is exposed, with solid Change the required part 205 of this first group of film layer section 202, as shown in Fig. 2 b and Fig. 2 c.
According to step 103, remove the marginal portion 206 of uncured in this first group of film layer section 202, such as figure Shown in 2c, to obtain the structure shown in Fig. 2 d.
Then, according to step 104, on the basis of the structure shown in Fig. 2 d, further at this first group of film layer Second group of film layer section 207, the section 1 in such as Fig. 2 d and district is formed between adjacent sections in section 202 Section 3.Such as, in the preferred embodiment shown in Fig. 2 e, it is possible to use blade coating cutter 203 is by the second Zu Moceng district Section 207 coats the surface of waveguide 201.
Similar with above first group of film layer section 202, second group of film layer section 207 in step 104 is also Czochralski method, spin coating can be utilized by the way of at the film material pasting solid-state directly on a surface of waveguide 201 Method, spraying process, knife coating, steaming cross the mode of the film material of method or sputtering method coating liquid or non-liquid, or Print film layer material mode on the surface of this waveguide by the way of printing (such as silk screen printing) and formed.
On the other hand, in above-mentioned step 101, the different sections in first group of film layer section 202 are (such as Section 0, section 2, section 4) can be to synchronize to be formed, it is also possible to formed in batches.In step 104 Different sections in second group of film layer section 207 are also such.
Finally, according to step 105, use mask 208 that this second group of film layer section 207 is exposed, with solid Change this second group of film layer section 207, as shown in figure 2f.The structure as shown in Fig. 2 g or Fig. 2 h finally given. Wherein, the structure of the desired planar waveguide device manufactured of the present invention it is shown in Fig. 2 h.And, in practical operation Possibly also owing to the problem of processing environment or technology controlling and process forms the structure shown in Fig. 2 g, i.e. at first group of film layer The junction of section 202 and second group of film layer section 207 forms less desirable ledge 209.For this feelings Condition, owing to this ledge 209 is equally without the exposure curing of step 105, therefore can go with comparalive ease Remove, such as, strike off or wash away, to finally give the cross-section structure shown in Fig. 2 h.
The present invention is not limited to the embodiment shown in figure 2 above.Particularly, the present invention can be not limited to Fig. 2 institute The two groups of film layer sections (the i.e. first tunic layer is only made up of first group of film layer section and second group of film layer section) shown Implementation.Particularly, in the application of film layer (such as adding up to 10 with last section) having more Multi sectional, N group film layer section can be formed respectively.In such embodiments it is possible to first part in first group of film layer section Second group of film layer section is formed, subsequently with mask exposure solidification and removal ledge between adjacent sections;Subsequently, Least one set additional layers section the (the such as the 3rd is formed between remaining adjacent sections in first group of film layer section Group, the 4th group ... n-th group additional layers section), the most same enforcement mask exposure solidification and remove prominent Parts etc. process step, so that this first group of film layer section, this second group of film layer section and this least one set supplement film Layer section collectively forms the first tunic layer.
On the other hand, in the embodiment shown in above-mentioned Fig. 1 to Fig. 2 h, can the most also include: The surface of waveguide makes the step of an initial film layer.This step may further include: directly pastes solid-state Initial film layer material;Czochralski method, spin-coating method, spraying process, knife coating, steaming is utilized to cross method or sputtering method coating liquid Or the initial film layer material of non-liquid;Or by the way of printing (such as silk screen printing), print initial film layer material On the surface of this waveguide.
Turning now to Fig. 3, the figure shows the embodiment of coating two membranes layer.Wherein, the first tunic layer includes Section 1, section 2, section 3 and section 4, first group of film layer section in the most above-mentioned embodiment illustrated in fig. 2 The the first tunic layer constituted with second group of film layer section, this first tunic layer can be further added by manufacture one layer anti-reflection Film, the purpose manufacturing anti-reflection film is to increase light absorbance when waveguide enters top dielectric layer section.Anti-reflection Film can use czochralski method, spin-coating method, spraying process, knife coating, steaming to cross the method manufacture such as method or sputtering method.These Section 1-4 can be formed by the manufacture method in above-described embodiment, but in above-mentioned manufacture method for spacing Section 0 is removed.After this, at the upper surface enterprising of section 1, section 2, section 3 and section 4 Walk into the second tunic layer 210, i.e. section 5 in Fig. 3.The formation of this second tunic layer 210 may include that directly Connect the film material pasting solid-state;Czochralski method, spin-coating method, spraying process, knife coating, steaming is utilized to cross method or sputtering method The film material of coating liquid;Or print film layer material is in this ripple by the way of printing (such as silk screen printing) On the surface led.It is preferred that this second tunic layer 210 can be diffusion barrier, microprism film and/or optical reinforced film.
According to another preferred embodiment of the invention, as shown in Figure 4, the required portion of first group of film layer section 202 At least one side divided becomes a predetermined angle relative to the surface of waveguide 201.This structure is by above-mentioned Making exposure light in step of exposure (such as step 102 and step 105) is one relative to the surface of waveguide 201 Predetermined angle and obtain.The intersection making adjacent sections forms mutually certain angle and can eliminate and can arise from The image broken belt of this intersection.
Fig. 5 a-Fig. 5 b shows the embodiment forming micro structure on film layer section.As it can be seen, it is permissible Above-mentioned step 102 and step 105 further include steps of and is imprinted with at this while exposure First group of film layer section (Fig. 5 a) or this second group of film layer section (Fig. 5 b) upper formation micro structure 212 are (such as For realizing the micro-prism structure of the function of part or all of upper layer film layer), wherein this impressing includes transparent pressure Die tool 211 imprints on this first group of film layer section 202 or this second group of film layer section 207, simultaneously will exposure The light direction of illumination of exposure light (arrow in figure represent) expose to this first group of film layer section 202 and this Two groups of film layer sections 207.
Fig. 6 a-Fig. 6 b shows another embodiment forming micro structure on film layer section.With Fig. 5 a-Fig. 5 b institute The embodiment shown is compared, and the embodiment shown in Fig. 6 a-Fig. 6 b is more preferably by the transparent same mask of impressing mould 211 204 form as one, to improve treatment effeciency and performance accuracy further.
It is preferred that as shown in Fig. 7 a-Fig. 7 c, it is also possible in micro structure 212, form the mistake of functional film layer 213 Journey.This functional film layer 213 can be while forming this micro structure 212 or afterwards by the way of being directly injected into (with reference to Fig. 7 a) or the mode (with reference to Fig. 7 b) pasted are formed in this micro structure 212.
Hereinafter describe one and manufacture example so that being more clearly understood that the present invention.First, use 19mm thick Float glass, as waveguide material, uses the method for evaporation to plate multi-layered antireflection coating layer in waveguide surface and makes waveguide The absorbance of the light of middle entrance dielectric layer is more than 95%.This waveguide is sequentially delivered to phase on conveyer belt or cylinder Answer operation.Dielectric layer is divided into 5 sections, in first operation, by blade coating cutter 0,2,4 respectively the Liquid photosensitive medium 0,2,4 is coated so that it is form thickness about 5um dielectric layer on one group of section 0,2,4. In second operation work, waveguide is sent to exposure machine, carries out being automatically positioned rear masking film section 1,3, makes It is exposed with the directional light of 320-400nm, solidifies section 0,2,4.The 3rd road work it is sent to after solidification Sequence, washes the unnecessary liquid medium that section 0,2,4 edge is uncured, is sent to the 4th road work after drying Sequence, uses blade coating cutter 1,3 to coat liquid photosensitive medium 1,3 respectively on second group of section 1,3 and makes it Form the dielectric layer of thickness about 5um.In five processes, waveguide is sent to exposure machine, after being automatically positioned Masking film section 0,2,4, uses the directional light of 320-400nm to be exposed, solidifies section 1,3. It is sent to three process after solidification, washes the unnecessary liquid medium that waveguide surface is uncured.By passing Band is sent to be sent to associated coated anti-reflection film and the technique of upper layer film layer in 3 and 4.Above-mentioned streamline can make With enclosed environment, and some dielectric materials some special environments in coating and exposure process can be realized want Ask, such as temperature requirement, oxygen-free environment (rushing nitrogen) etc..
Additionally, according to Chinese patent application the 201210172215.2nd, the manufacture method of the present invention can also be used for Separately fabricated screen area, after being folded to screen back by light commutation parts by the conductive area additionally manufactured.
Those skilled in the art can be obvious, the above-mentioned exemplary embodiment of the present invention can be carried out various amendment and Modification is without departing from the spirit and scope of the present invention.Will in appended right accordingly, it is intended to make the present invention cover Ask the modifications of the present invention in the range of book and equivalent arrangements thereof and modification.

Claims (12)

1. the manufacture method of a planar waveguide device, it is characterised in that comprise the following steps:
A. on the surface of waveguide, form first group of film layer section, the adjacent sections in described first group of film layer section Between be spaced apart;
B. mask is used described first group of film layer section to be exposed, to solidify described first group of film layer section Required part;
C. the marginal portion of uncured in described first group of film layer section is removed;
D. second group of film layer section is formed between at least part of adjacent sections in described first group of film layer section; And
E. mask is used described second group of film layer section to be exposed, to solidify described second group of film layer section.
2. manufacture method as claimed in claim 1, it is characterised in that also include after described step e:
F. the ledge of the junction of described first group of film layer section and described second group of film layer section is removed.
3. manufacture method as claimed in claim 2, it is characterised in that after described step f, this manufacture Method also includes:
Least one set additional layers section is formed between remaining adjacent sections in described first group of film layer section, So that described first group of film layer section, described second group of film layer section and described least one set additional layers section are constituted First tunic layer;
Use mask that described least one set additional layers section is exposed, additional to solidify described least one set Film layer section;And
Remove the ledge of the junction of described least one set additional layers section both sides.
4. manufacture method as claimed in claim 1, it is characterised in that in described step a and step d Formation includes:
Directly paste the film material of solid-state;
Czochralski method, spin-coating method, spraying process, knife coating, steaming is utilized to cross method or the film layer material of sputtering method coating liquid Material;Or
By the way of printing, print film layer material is on the surface of described waveguide.
5. manufacture method as claimed in claim 2 or claim 3, it is characterised in that first in described step a Different sections in group film layer section are formed in batches, and in described step d second group or least one set attached Different sections in blooming layer section are formed in batches.
6. manufacture method as claimed in claim 1, it is characterised in that also included before described step a: Make the step of an initial film layer in waveguide surface, this step farther includes: directly paste the initial film layer of solid-state Material;Czochralski method, spin-coating method, spraying process, knife coating, steaming is utilized to cross method or sputtering method coating liquid or solid-state Initial film layer material;Or by the way of printing, print initial film layer material on the surface of described waveguide.
7. manufacture method as claimed in claim 2 or claim 3, it is characterised in that also wrap after described step f Include:
G. forming the second tunic layer on described first tunic layer, wherein the formation in described step g includes:
Directly paste the film material of solid-state;
Czochralski method, spin-coating method, spraying process, knife coating, steaming is utilized to cross method or the film layer material of sputtering method coating liquid Material;Or
By the way of printing, print film layer material is on the surface of described waveguide.
8. manufacture method as claimed in claim 2 or claim 3, it is characterised in that enterprising at described first tunic layer One step manufactures anti-reflection film, and this manufacture method further includes at and pastes further on this anti-reflection film or coat diffusion Film, microprism film and/or optical reinforced film.
9. manufacture method as claimed in claim 1, it is characterised in that in described step b and step e, The exposure light of described exposure is a predetermined angle relative to the surface of described waveguide.
10. manufacture method as claimed in claim 3, it is characterised in that enter in described step b and step e Step includes: be imprinted with in described first group of film layer section, described second group of film layer section or institute while exposure State on least one set additional layers section formation micro structure, wherein said impressing include imprinting transparent impressing mould in On described first group of film layer section, described second group of film layer section or described least one set additional layers section, simultaneously Exposure light exposes to described first group of film layer section, described second group of film layer section or described least one set add Film layer section.
11. manufacture methods as claimed in claim 10, it is characterised in that described impressing mould and described mask It it is one.
12. manufacture methods as claimed in claim 10, it is characterised in that while forming described micro structure Or afterwards, also include there is scattering or the functional material of reflection function or film layer are directly injected into or affix to institute State in micro structure.
CN201510155452.1A 2015-04-02 2015-04-02 A kind of manufacturing method of planar waveguide device Active CN106154417B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510155452.1A CN106154417B (en) 2015-04-02 2015-04-02 A kind of manufacturing method of planar waveguide device
PCT/CN2015/095750 WO2016155344A1 (en) 2015-04-02 2015-11-27 Method for manufacturing planar waveguide device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510155452.1A CN106154417B (en) 2015-04-02 2015-04-02 A kind of manufacturing method of planar waveguide device

Publications (2)

Publication Number Publication Date
CN106154417A true CN106154417A (en) 2016-11-23
CN106154417B CN106154417B (en) 2018-12-14

Family

ID=57005435

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510155452.1A Active CN106154417B (en) 2015-04-02 2015-04-02 A kind of manufacturing method of planar waveguide device

Country Status (2)

Country Link
CN (1) CN106154417B (en)
WO (1) WO2016155344A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200604610A (en) * 2004-07-26 2006-02-01 Eternal Chemical Co Ltd Method for producing planar optical waveguide device
US20070054222A1 (en) * 2005-09-02 2007-03-08 Gorczyca Thomas B Self-forming polymer waveguide and waveguide material with reduced shrinkage
CN102004282A (en) * 2010-10-26 2011-04-06 上海理工大学 Method for manufacturing planar waveguide superimposed grating
CN102483491A (en) * 2009-08-25 2012-05-30 株式会社藤仓 Manufacturing method of planar optical waveguide device with grating structure
CN103454847A (en) * 2012-05-29 2013-12-18 杨文君 Planar waveguide display and system thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200604610A (en) * 2004-07-26 2006-02-01 Eternal Chemical Co Ltd Method for producing planar optical waveguide device
US20070054222A1 (en) * 2005-09-02 2007-03-08 Gorczyca Thomas B Self-forming polymer waveguide and waveguide material with reduced shrinkage
CN102483491A (en) * 2009-08-25 2012-05-30 株式会社藤仓 Manufacturing method of planar optical waveguide device with grating structure
CN102004282A (en) * 2010-10-26 2011-04-06 上海理工大学 Method for manufacturing planar waveguide superimposed grating
CN103454847A (en) * 2012-05-29 2013-12-18 杨文君 Planar waveguide display and system thereof

Also Published As

Publication number Publication date
WO2016155344A1 (en) 2016-10-06
CN106154417B (en) 2018-12-14

Similar Documents

Publication Publication Date Title
SE535467C2 (en) Method of printing product characteristics on a substrate sheet
CN100394221C (en) Method for making colour-filter
CN101279555B (en) Method of laser digital coloured drawing
CN105063553A (en) Method for manufacturing magnetic mask plate for coating by evaporation
KR20070083837A (en) Method of multilayered patterned coating
US11281098B2 (en) Touch substrate, manufacturing method thereof and display apparatus
US20090123873A1 (en) Lamination for Printed Photomask
CN102156316A (en) Colorful light filter and manufacturing method thereof
TW201523378A (en) Method of manufacturing a touch panel
JPH08300798A (en) Method and apparatus for forming pattern and display
Tanabe et al. Discharge of viscous UV-curable resin droplets by screen printing for UV nanoimprint lithography
CN101382690A (en) Colourful optical filter substrate, liquid crystal display panel and method for manufacturing the colourful optical filter substrate
CN106154417A (en) A kind of manufacture method of planar waveguide device
CN101241260B (en) Optical film and process for manufacture thereof, and substrate structure using same and display panel
CN104779145B (en) Mask plate and preparation method thereof
CN109587964A (en) Single layer, multi-layer PCB board and its preparation method with Nanometer Copper cream jet printing technique
CN107027244A (en) A kind of preparation method of super thick copper circuit board
US9535315B2 (en) Method of fabricating a color filter array using a multilevel structure
WO2012087075A2 (en) Method for forming fine pattern in large area using laser interference exposure, method for non-planar transfer of the fine pattern formed by the method, and article to which the fine pattern is transferred by the transfer method
CN107731749A (en) A kind of packaging film and preparation method thereof and a kind of OLED display
TWI224213B (en) Method for forming a bank of color filter
CN112198757A (en) Monochromatic gradient film, preparation method thereof and photomask
TWI247164B (en) Method for forming a bank of color filter
CN110412673B (en) Mother board, manufacturing method of mother board and color film substrate
KR102018703B1 (en) Method for manufacturing cliche for offset printing, cliche for offset printing manufactured by method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant