CN106154051A - Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm - Google Patents

Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm Download PDF

Info

Publication number
CN106154051A
CN106154051A CN201610435978.XA CN201610435978A CN106154051A CN 106154051 A CN106154051 A CN 106154051A CN 201610435978 A CN201610435978 A CN 201610435978A CN 106154051 A CN106154051 A CN 106154051A
Authority
CN
China
Prior art keywords
temperature
complex dielectric
plate material
measured
dielectric permittivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610435978.XA
Other languages
Chinese (zh)
Inventor
张云鹏
李恩
余承勇
陈亮亮
刘天恒
郭高凤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Electronic Science and Technology of China
Original Assignee
University of Electronic Science and Technology of China
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Electronic Science and Technology of China filed Critical University of Electronic Science and Technology of China
Priority to CN201610435978.XA priority Critical patent/CN106154051A/en
Publication of CN106154051A publication Critical patent/CN106154051A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2617Measuring dielectric properties, e.g. constants

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Resistance Or Impedance (AREA)

Abstract

nullThe present invention proposes a kind of free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm,Belong to microwave and millimeter wave dielectric substance complex dielectric permittivity technical field of measurement and test,The present invention is based on free space terminal short circuit,Detected materials under the condition of high temperature is made longitudinal layered process by temperature gradient distribution,The method using the linear interpolation of Temperature Distribution derives the complex dielectric permittivity expression formula of each layer temperature and correspondence thereof,The cascade network formed after utilizing layering sets up the relation of one port scattering parameter and each layer complex dielectric permittivity,By the complex dielectric permittivity of dielectric material under vector network analyzer test one port scattering parameter and then acquisition actual temperature,Use such scheme,Can more precisely carry out material complex dielectric permittivity high temperature test,By setting up thermal stratification matching algorithm,Reduce the test error that material its internal temperature uneven distribution at high operating temperatures introduces.

Description

Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm
Technical field
The invention belongs to microwave, millimeter wave dielectric Material Testing Technology field, multiple particularly to material at high temperature or superhigh temperature Dielectric constant method of testing.
Background technology
High temperature microwave material is often used in the field such as space flight and aviation, missile guidance.The aircraft of high airflight, lead Bullet, rocket, spacecraft etc., owing to the friction under high-speed flight state and between air causes the temperature of its Surface microwave material Spending the highest, and the electromagnetic parameter that microwave material is under the high temperature conditions is nonlinear change, their Changing Pattern is difficult to grasp.This Aircraft antenna will be sent, receive signal generation strong influence by sample.Therefore, accurately test, analyze these microwave materials Jie Electrical quantity situation of change in high temperature environments, under the design of the parts such as aircraft antenna house and high-speed flight state can By Journal of Sex Research, there is most important effect.For in high temperature environments the electromagnetic parameter of microwave material being launched testing research, no The scope of application of method of testing to be considered, is accounted in the realization of high temperature test simulated environment and hot environment more simultaneously For complicated influence factor.The complexity of high-temperature test system, comprehensive more much higher than under normal temperature environment, especially test Accuracy is more much lower than under normal temperature condition, the most accurately tests out the electromagnetic parameter under microwave dielectric material high temperature and remains one A difficult problem.
For the selection of method of testing, it is excellent that terminal short circuit has that test operation is simple, systematic error is few, heating is convenient etc. Point.Terminal short circuit partial wave again leads terminal short circuit and free space terminal short circuit.The former advantage is test fixture structure Simply, sample size is little and can thermally equivalent etc.;Shortcoming is that high temperature waveguide is expensive and service life is short, sample size Need to match with waveguide cross-section.The latter's advantage be the focusing anteena as test fixture away from sample, its thermal radiation Acting on little, thus service life is longer, sample is relatively low to requirement on machining accuracy simultaneously;Shortcoming is sample latter dimensional requirement relatively Greatly (generally higher than 3 times of focal spots of focusing anteena), and sample be heated uneven (near heating platform side detected materials temperature ratio Higher, and the detected materials temperature ratio away from heating platform side is relatively low).
For free space terminal short circuit, uneven owing to being heated in heating process, within detected materials temperature Being extremely unstable, the distribution of each portion temperature is different from.The only some region of temperature of test sample (in traditional test As obtain the temperature of sample area of platform of being close to generate heat by measuring metal heating platform temperature) and overall as sample Temperature, and along with the rising of temperature, especially under superhigh temperature, other region actual temperatures of sample can be the most inclined with test temperature Difference, this causes measuring the complex dielectric permittivity obtained and is not correspond to actual temperature, causes test error.Therefore treat under the condition of high temperature Measure and monitor the growth of standing timber and expect that the analysis of physical model must carry out distribution process to different temperatures region, and use suitable algorithm to revise these High temperature test error, more precisely to obtain the complex dielectric permittivity under actual temperature.
Summary of the invention
Present invention aims in existing free space terminal short circuit high-temperature complex dielectric measuring technology not Consider that Temperature Distribution affects this problem, propose a kind of material at high temperature dielectric constant temperature for free space terminal short-circuit system Degree layering and matching algorithm.
Technical solution of the present invention is as follows:
A kind of free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm, comprises the following steps:
Step 1: test system is carried out free space single port calibration;
Step 2: load plate material to be measured, plate material thickness to be measured is l, and its lateral dimension is more than point focusing lens sky 3 times of focal spots of line, plate material to be measured is close to metal heating platform and makes plate material upper surface to be measured as test reference face;
Step 3: utilize metal heating platform to treat master plate material and heat, measure plate material to be measured upper and lower Temperature T of both sidesOn ()And TUnder (), it is apparent from TOn ()≤TUnder ()
Step 4: as temperature difference i.e. T in allowed band Δ T of the upper and lower both sides of plate material to be measuredUnder ()-TOn ()≤ΔT Time, being approximately considered plate material temperature perseverance to be measured is TUnder (), utilize vector network analyzer to measure at plate material upper surface to be measured Reflection coefficient S11, according to formulaCalculate temperature TUnder ()Corresponding plate material to be measured Relative complex dielectric permittivity εr, wherein γ0For the propagation constant in free space, γ0=j2 π/λ0, λ0For free space wavelength;
Step 5: continue heating, when the temperature difference of the upper and lower both sides of plate material to be measured reaches Δ T critical state, record Upper and lower side test temperature TOn ()And TUnder (), and by the T under this critical stateUnder ()It is designated as Tc;Now will plate material to be measured as One layer, step 4 obtain TcCorresponding relative complex dielectric permittivity εrc
Step 6: continue heating, after the temperature difference of upper and lower both sides exceeds Δ T, presses longitudinal temperature by plate material to be measured Be distributed in be perpendicular to metal heating platform direction be divided into N shell, ground floor to be close to heating platform, its temperature is T1, corresponding is relative Complex dielectric permittivity is εr1;The temperature of n-th layer is TN, corresponding relative complex dielectric permittivity is εrN, every layer thickness is d=l/N;
Step 7: continue heating and make TOn ()=Tc, now have TN=Tc, εrNrc;With TcCorresponding dielectric relatively again is normal Number εrcOn the basis of, by introducing ground floor temperature T1And complex dielectric permittivity ε of correspondencer1And combine number of plies N, to each layer after layering Material temperature value carries out interpolation calculation with relative complex permittivity values and obtains temperature T of every layernAnd complex dielectric permittivity εrn, further By each layer thickness d and complex dielectric permittivity εrnObtain the transmission matrix of layers of material, in conjunction with cascade characteristic and the transmission of transmission matrix Parameter and the transformational relation of scattering parameter, by measuring S11And substitute into complex dielectric permittivity ε solving ground floor materialr1, and then obtain Obtain the complex dielectric permittivity under remaining layers of material different temperatures;Obtain different temperature from low temperature to high temperature temperature variation testing one by one to divide Layer state, obtains during high temperature the complex dielectric permittivity of material under actual temperature the most more accurately.
It is preferred that, described step 7 further includes steps of
Step 7-1: continue heating and make side test temperature T on plate material to be measuredOn ()Equal to Tc, then the lower n-th layer material of layering Temperature T that material is correspondingN=Tc, corresponding relative complex dielectric permittivity εrNrc, the 1st layer material temperature T simultaneously1On the downside of test Temperature obtains;
Step 7-2: by the temperature value of the 1st layer He n-th layer, choose suitable interpolating function in conjunction with temperature changing regularity and enter Row interpolation calculates, it is thus achieved that the temperature of plate material n-th layer to be measured is Tn, think that n-th layer material is relative to complex dielectric permittivity ε simultaneouslyrn Interpolation expression formula have and TnIdentical form, at εrNWith N known in the case of only with n and εr1Relevant;
Step 7-3: N shell plate material is regarded as N number of Two-port netwerk cascade network, and the transmission matrix of each network isWherein Z0For free space natural impedance, Z0= 120πΩ;γnFor the propagation constant in n-th layer material,The cascade characteristic utilizing transmission matrix derives N shell material Expect total transmission matrixAnd be converted to scattering parameter matrix [S], it is thus achieved that treat Reflection coefficient expression formula at master plate material upper surfaceThis expression formula is only containing unknown number εr1
Step 7-4: utilize vector network analyzer to measure under this temperature distribution state at plate material upper surface to be measured Reflection coefficient S11, utilize S described in step 7-311Expression formula calculates εr1;By εr1With εrNSubstitute into ε described in step 7-2rnExpression After formula, different n values obtain T1With TNBetween relative complex dielectric permittivity corresponding to remaining temperature spot;
Step 7-5: continue heating and make side test temperature TOn ()Equal to a front thermal stratification state side test temperature at present Degree TUnder (), obtain T during this time thermal stratification state equallyNWith εrN, the 1st layer material temperature T simultaneously1By temperature on the downside of test Degree obtains;Repeat step 7-2 to 7-4, obtain the complex dielectric permittivity that under condition of high temperature actual temperature, material is corresponding the most successively.
It is preferred that, the interpolating function in step 7-2 is polynomial function.
It is preferred that, step 7-2 is chosen unitary one order polynomial and carries out linear interpolation as interpolating function, then have
It is preferred that, the temperature of the upper and lower both sides of plate material to be measured is recorded by thermocouple.
It is preferred that, same model thermocouple, wherein downside thermocouple is placed in the upper and lower both sides of plate material to be measured Being placed in metal heating platform interior, upside thermocouple is placed in detected materials edge, is gone out the temperature of upper and lower both sides by thermocouple measurement Degree TOn ()And TUnder ()
The invention have the benefit that the present invention considers the impact of material internal temperature gradient distribution under the condition of high temperature, By layers of material defines multiple Two-port netwerk cascade network, the relation of concatenation matrix and collision matrix is utilized to establish each layer Relation between complex dielectric permittivity and the one port scattering parameter of measurement, and then obtain material under condition of high temperature actual temperature Complex dielectric permittivity.The present invention can more precisely carry out complex dielectric permittivity temperature variation testing, especially superhigh temperature test.By building Vertical thermal stratification matching algorithm, reduces the test error that material its internal temperature uneven distribution at high operating temperatures introduces.
Accompanying drawing explanation
Fig. 1 is that free space terminal short circuit tests system schematic.
Fig. 2 is that thermal stratification matching algorithm of the present invention is layered schematic diagram.
Wherein, 1 is test reference face, and 2 is upside thermocouple, and 3 is upside temp controlled meter, and 4 is downside thermocouple, and 5 is downside Temp controlled meter, 6 is metal heating platform, and 11 is vector network analyzer, and 12 is program control computer, and 13 is microwave cable, and 14 is poly- Burnt antenna, 15 is plate material to be measured, and 16 is heater.
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art can be by this specification Disclosed content understands other advantages and effect of the present invention easily.
Fig. 1 is free space terminal short circuit material testing system schematic diagram.As it is shown in figure 1, free space terminal short circuit The main test instrunment of method material testing system is vector network analyzer 11, and one port connects focusing sky by microwave cable 13 Line 14 (conventional spot-focusing lens antenna), antenna aperture is the most vertically placed.Metal heating is placed at focusing anteena focal plane Platform 6, its upper surface needs flat smooth, and surface roughness is less than 1.6 μm, and lateral dimension is more than 3 times of Jiao of spot-focusing lens antenna Speckle.After METAL HEATING PROCESS platform is heated by the heater 16 being placed in inside, it is conducted to heat be close to METAL HEATING PROCESS platform And the plate material 15 to be measured that lateral dimension is suitable with heating platform.Vector network analyzer can be by LAN bus by program control meter Calculation machine 12 carries out data acquisition and calculating.
Fig. 2 is that thermal stratification matching algorithm is layered schematic diagram.Heat is conducted to plate material to be measured by METAL HEATING PROCESS platform After, the detected materials temperature near heating platform side is higher, and the detected materials temperature away from heating platform side compares Low, in order to obtain the layer distributed of material temperature under the high temperature conditions, thermoelectricity is placed in the upside being first close to plate material to be measured Idol 2 also connects temp controlled meter 3, measures temperature T on the upside of detected materialsN;Place thermocouple 4 and connect temperature control in metal heating platform Table 5, measures temperature T on the downside of detected materials1.Then the method further according to linear interpolation determines each layer of detected materials flat board Temperature Distribution.Not exclusively it is consistent with the Temperature Distribution of material under hot conditions although so processing, but sees with by detected materials Becoming same steady temperature to compare, its measuring accuracy will be greatly improved.Due to material its interior temperature distribution thousand at high operating temperatures Becoming ten thousand changes, different materials its internal Temperature Distribution at the same temperature is also not quite similar, so at high temperature to set up one It is extremely difficult to the model being suitable under different materials different temperatures, therefore uses the method for the linear interpolation of Temperature Distribution to exist It is feasible to a certain extent, is also a kind of processing method.
Utilize this method carry out free space terminal short circuit material at high temperature dielectric constant test step as follows:
Step 1: test system carries out free space single port calibration, makes the calibration plane of reference be positioned on metal heating platform Surface.
Step 2: the plate material to be measured that thickness is l is close to metal heating platform and places.Can lead to after known materials thickness Cross cascade characteristic by test reference face by calibrating the plane of reference, i.e. heating platform upper surface moves to plate material upper surface to be measured.
Step 3: utilize metal heating platform to treat master plate material and heat, in the upper and lower both sides of plate material to be measured Placing same model thermocouple, thermocouple selects Wre5-26 thermocouple, and its test temperature upper limit is 2300 DEG C.Downside thermocouple Being placed in metal heating platform interior, upside thermocouple is placed in detected materials edge in order to avoid reflected signal is produced impact.By heat Temperature T of upper and lower both sides measured by galvanic coupleOn ()And TUnder (), it is apparent from TOn ()≤TUnder ()
Step 4: the temperature difference (T in allowed band Δ T recorded when upper and lower both sides thermocoupleUnder ()-TOn ()≤ Δ T) time, Being approximately considered plate material temperature perseverance to be measured is TUnder ().Δ T can require to determine according to measuring accuracy, is chosen in this embodiment 50℃.Vector network analyzer is utilized to measure the reflection coefficient S at plate material upper surface to be measured11, according to formulaTemperature T can be calculatedUnder ()Relative complex dielectric permittivity ε of corresponding plate material to be measuredr, Wherein γ0For the propagation constant in free space, γ0=j2 π/λ0, λ0For free space wavelength.
Step 5: continue heating, when the temperature difference that upper and lower both sides thermocouple records reaches Δ T critical state, on record, Downside thermocouple assay temperature TOn ()And TUnder (), and by the T under this critical stateUnder ()It is designated as Tc;Now will plate material to be measured As one layer, step 4 obtain TcCorresponding relative complex dielectric permittivity εrc
Step 6: continue heating, after upper and lower side thermocouple assay temperature difference is beyond Δ T, by plate material to be measured by vertical To Temperature Distribution be perpendicular to metal heating platform direction be divided into N shell, for ensure certain precision avoid relatively intensive, N simultaneously Value is typically taken as 3~5.Ground floor is close to heating platform, and its temperature is T1, corresponding relative complex dielectric permittivity is εr1;N-th layer Temperature is TN, corresponding relative complex dielectric permittivity is εrN, every layer thickness is d=l/N.
Step 7: continue heating and make TOn ()=Tc, now have TN=Tc, εrNrc;With TcCorresponding dielectric relatively again is normal Number εrcOn the basis of, by introducing ground floor temperature T1And complex dielectric permittivity ε of correspondencer1And combine number of plies N, to each layer after layering Material temperature value carries out interpolation calculation with relative complex permittivity values and obtains temperature T of every layernAnd complex dielectric permittivity εrn.Further By each layer thickness d and complex dielectric permittivity εrnObtain the transmission matrix of layers of material, in conjunction with cascade characteristic and the transmission of transmission matrix Parameter and the transformational relation of scattering parameter, by measuring S11And substitute into complex dielectric permittivity ε solving ground floor materialr1, and then obtain Obtain the complex dielectric permittivity under remaining layers of material different temperatures.Obtain different temperature from low temperature to high temperature temperature variation testing one by one to divide Layer state, can obtain during high temperature the complex dielectric permittivity of material under actual temperature more accurately.Specifically comprise the following steps that
Step 7-1: continue heating and make upside thermocouple assay temperature TOn ()Equal to Tc, then the lower n-th layer material of layering is corresponding Temperature TN=Tc, corresponding relative complex dielectric permittivity εrNrc.1st layer material temperature T simultaneously1Can be surveyed by downside thermocouple Examination obtains.
Step 7-2: the temperature obtaining plate material n-th layer to be measured according to the method for linear interpolation is The relative complex dielectric permittivity that n-th layer material is corresponding can be approximatelyDue to εrNWith N it is known that therefore Layers of material is relative to complex dielectric permittivity εrnOnly with εr1Relevant with n.
Step 7-3: N shell plate material is regarded as N number of Two-port netwerk cascade network, and the transmission matrix of each network isWherein Z0For free space natural impedance, Z0= 120πΩ;γnFor the propagation constant in n-th layer material,The cascade characteristic utilizing transmission matrix derives N shell material Expect total transmission matrixAnd be converted to scattering parameter matrix [S], can obtain Reflection coefficient expression formula at plate material upper surface to be measuredThis expression formula is only containing unknown number εr1
Step 7-4: utilize vector network analyzer to measure under this temperature distribution state at plate material upper surface to be measured Reflection coefficient S11, utilize S described in step 7-311Expression formula can calculate εr1.By εr1With εrNSubstitute into ε described in step 7-2rnTable After reaching formula, T can be obtained1With TNBetween relative complex dielectric permittivity corresponding to remaining temperature spot.
Step 8: continue heating and make upside thermocouple assay temperature TOn ()Equal to heat on the downside of during a front thermal stratification state Galvanic couple test temperature TUnder (), T during this time thermal stratification state can be obtained equallyNWith εrN, the 1st layer material temperature T simultaneously1Can Obtained by downside thermocouple assay.Repeat step 7-2 to 7-4, material pair under condition of high temperature actual temperature can be obtained successively The complex dielectric permittivity answered.
For improving material temperature layer distributed model further, can use the most smart in conjunction with the heat conduction property of detected materials True interpolating function, such as polynomial functions such as exponential function, logarithmic function, power functions, to obtain higher measuring accuracy.
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any ripe Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage knowing this technology.Cause This, have usually intellectual such as complete with institute under technological thought without departing from disclosed spirit in art All equivalences become are modified or change, and must be contained by the claim of the present invention.

Claims (6)

1. a free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm, it is characterised in that include with Lower step:
Step 1: test system is carried out free space single port calibration;
Step 2: load plate material to be measured, plate material thickness to be measured is l, and its lateral dimension is more than spot-focusing lens antenna 3 Times focal spot, plate material to be measured is close to metal heating platform and makes plate material upper surface to be measured as test reference face;
Step 3: utilize metal heating platform to treat master plate material and heat, measure the upper and lower both sides of plate material to be measured Temperature TOn ()And TUnder (), it is apparent from TOn ()≤TUnder ()
Step 4: as temperature difference i.e. T in allowed band Δ T of the upper and lower both sides of plate material to be measuredUnder ()-TOn ()During≤Δ T, approximation Think that plate material temperature perseverance to be measured is TUnder (), utilize vector network analyzer to measure the reflection at plate material upper surface to be measured Coefficient S11, according to formulaCalculate temperature TUnder ()Corresponding plate material to be measured relative Complex dielectric permittivity εr, wherein γ0For the propagation constant in free space, γ0=j2 π/λ0, λ0For free space wavelength;
Step 5: continue heating, when the temperature difference of the upper and lower both sides of plate material to be measured reaches Δ T critical state, record upper and lower Side test temperature TOn ()And TUnder (), and by the T under this critical stateUnder ()It is designated as Tc;Now will plate material to be measured as one layer, T is obtained by step 4cCorresponding relative complex dielectric permittivity εrc
Step 6: continue heating, after the temperature difference of upper and lower both sides exceeds Δ T, presses longitudinal temperature distribution by plate material to be measured Being divided into N shell, ground floor to be close to heating platform being perpendicular to metal heating platform direction, its temperature is T1, corresponding relatively multiple Jie Electric constant is εr1;The temperature of n-th layer is TN, corresponding relative complex dielectric permittivity is εrN, every layer thickness is d=l/N;
Step 7: continue heating and make TOn ()=Tc, now have TN=Tc, εrNrc;With TcCorresponding relative complex dielectric permittivity εrc On the basis of, by introducing ground floor temperature T1And complex dielectric permittivity ε of correspondencer1And combine number of plies N, to layers of material after layering Temperature value carries out interpolation calculation with relative complex permittivity values and obtains temperature T of every layernAnd complex dielectric permittivity εrn, further by respectively Layer thickness d and complex dielectric permittivity εrnObtain the transmission matrix of layers of material, in conjunction with cascade characteristic and the transmission parameter of transmission matrix With the transformational relation of scattering parameter, by measure S11And substitute into complex dielectric permittivity ε solving ground floor materialr1, and then obtain it Complex dielectric permittivity under remaining layers of material different temperatures;Different thermal stratification shapes is obtained to high temperature temperature variation testing one by one from low temperature State, obtains during high temperature the complex dielectric permittivity of material under actual temperature the most more accurately.
Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm the most according to claim 1, It is characterized in that described step 7 further includes steps of
Step 7-1: continue heating and make side test temperature T on plate material to be measuredOn ()Equal to Tc, then the lower n-th layer material pair of layering Temperature T answeredN=Tc, corresponding relative complex dielectric permittivity εrNrc, the 1st layer material temperature T simultaneously1By temperature on the downside of test Obtain;
Step 7-2: by the temperature value of the 1st layer He n-th layer, choose suitable interpolating function in conjunction with temperature changing regularity and insert Value calculates, it is thus achieved that the temperature of plate material n-th layer to be measured is Tn, think that n-th layer material is relative to complex dielectric permittivity ε simultaneouslyrnInsert Value expression has and TnIdentical form, at εrNWith N known in the case of εrnOnly with n and εr1Relevant;
Step 7-3: N shell plate material is regarded as N number of Two-port netwerk cascade network, and the transmission matrix of each network isWherein Z0For free space natural impedance, Z0= 120πΩ;γnFor the propagation constant in n-th layer material,The cascade characteristic utilizing transmission matrix derives N shell material Expect total transmission matrixAnd be converted to scattering parameter matrix [S], it is thus achieved that treat Reflection coefficient expression formula at master plate material upper surfaceThis expression formula is only containing unknown number εr1
Step 7-4: utilize vector network analyzer to measure under this temperature distribution state the reflection at plate material upper surface to be measured Coefficient S11, utilize S described in step 7-311Expression formula calculates εr1;By εr1With εrNSubstitute into ε described in step 7-2rnExpression formula after, T is obtained by different n values1With TNBetween relative complex dielectric permittivity corresponding to remaining temperature spot;
Step 7-5: continue heating and make side test temperature TOn ()Equal to a front thermal stratification state side test temperature at present TUnder (), obtain T during this time thermal stratification state equallyNWith εrN, the 1st layer material temperature T simultaneously1By temperature on the downside of test Obtain;Repeat step 7-2 to 7-4, obtain the complex dielectric permittivity that under condition of high temperature actual temperature, material is corresponding the most successively.
Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm the most according to claim 2, It is characterized in that: the interpolating function in step 7-2 is polynomial function.
Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm the most according to claim 1, It is characterized in that: step 7-2 is chosen unitary one order polynomial and carries out linear interpolation as interpolating function, then have
Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm the most according to claim 1, It is characterized in that: the temperature of the upper and lower both sides of plate material to be measured is recorded by thermocouple.
Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm the most according to claim 5, It is characterized in that: place same model thermocouple in the upper and lower both sides of plate material to be measured, wherein downside thermocouple is placed in metal and sends out Hot platform interior, upside thermocouple is placed in detected materials edge, is gone out temperature T of upper and lower both sides by thermocouple measurementOn ()With TUnder ()
CN201610435978.XA 2016-06-16 2016-06-16 Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm Pending CN106154051A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610435978.XA CN106154051A (en) 2016-06-16 2016-06-16 Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610435978.XA CN106154051A (en) 2016-06-16 2016-06-16 Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm

Publications (1)

Publication Number Publication Date
CN106154051A true CN106154051A (en) 2016-11-23

Family

ID=57353412

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610435978.XA Pending CN106154051A (en) 2016-06-16 2016-06-16 Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm

Country Status (1)

Country Link
CN (1) CN106154051A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109580661A (en) * 2018-12-14 2019-04-05 电子科技大学 A kind of free space material complex reflection coefficient test method
CN110470871A (en) * 2019-09-20 2019-11-19 西安电子科技大学 Based on the multi-mode material electromagnetic parameter test device and method of single port
CN114994414A (en) * 2022-05-27 2022-09-02 电子科技大学 System and method for testing dielectric property under high temperature and high pressure by free space terminal short circuit method
US20240002682A1 (en) * 2022-07-01 2024-01-04 Ayro, Inc. Coating gradient property management for sustainable vehicles, systems, methods, and apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005351728A (en) * 2004-06-10 2005-12-22 Matsushita Electric Ind Co Ltd Apparatus for measuring dielectric constant, and apparatus for measuring dielectric loss
CN101158702A (en) * 2007-10-30 2008-04-09 电子科技大学 Dielectric materials high-temperature complex dielectric constant measurement method based on terminal short circuit method
CN101545931A (en) * 2009-05-08 2009-09-30 电子科技大学 Method for measuring high-temperature complex dielectric constants based on terminal short-circuit method
CN103344841A (en) * 2013-05-09 2013-10-09 电子科技大学 Free space terminal short-circuit system for temperature changing measurement of dielectric property of dielectric material
CN104391181A (en) * 2014-11-27 2015-03-04 电子科技大学 High temperature calibration device for testing microwave dielectric material and calibration method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005351728A (en) * 2004-06-10 2005-12-22 Matsushita Electric Ind Co Ltd Apparatus for measuring dielectric constant, and apparatus for measuring dielectric loss
CN101158702A (en) * 2007-10-30 2008-04-09 电子科技大学 Dielectric materials high-temperature complex dielectric constant measurement method based on terminal short circuit method
CN101545931A (en) * 2009-05-08 2009-09-30 电子科技大学 Method for measuring high-temperature complex dielectric constants based on terminal short-circuit method
CN103344841A (en) * 2013-05-09 2013-10-09 电子科技大学 Free space terminal short-circuit system for temperature changing measurement of dielectric property of dielectric material
CN104391181A (en) * 2014-11-27 2015-03-04 电子科技大学 High temperature calibration device for testing microwave dielectric material and calibration method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
寇彬彬: "分层材料介电性能变温测试技术研究", 《中国优秀硕士学位论文全文数据库工程科技Ⅱ辑》 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109580661A (en) * 2018-12-14 2019-04-05 电子科技大学 A kind of free space material complex reflection coefficient test method
CN109580661B (en) * 2018-12-14 2021-03-30 电子科技大学 Method for testing complex reflection coefficient of free space material
CN110470871A (en) * 2019-09-20 2019-11-19 西安电子科技大学 Based on the multi-mode material electromagnetic parameter test device and method of single port
CN110470871B (en) * 2019-09-20 2024-03-29 西安电子科技大学 Single-port multi-state-based material electromagnetic parameter testing device and method
CN114994414A (en) * 2022-05-27 2022-09-02 电子科技大学 System and method for testing dielectric property under high temperature and high pressure by free space terminal short circuit method
US20240002682A1 (en) * 2022-07-01 2024-01-04 Ayro, Inc. Coating gradient property management for sustainable vehicles, systems, methods, and apparatus

Similar Documents

Publication Publication Date Title
CN108303443B (en) Sheet material heat-conducting performance steady-state testing method
CN106154051A (en) Free space terminal short circuit material high temperature complex dielectric constant thermal stratification matching algorithm
Varadan et al. Free-space, broadband measurements of high-temperature, complex dielectric properties at microwave frequencies
CN107687899B (en) A kind of infrared measurement of temperature method and system
CN104391181B (en) Microwave dielectric material test high temperature calibrating installation and its calibration method
CN105974345B (en) Free space terminal short circuit complex dielectric permittivity tests system high temperature calibration method
Larsson et al. Waveguide Measurements of the Permittivity and Permeability at Temperatures of up to 1000$^{\circ}\hbox {C} $
CN105388363A (en) System and method for acquiring material dielectric constant in high temperature environment
CN109324079B (en) Material thermal expansion coefficient measuring method based on ultrasound
CN110687510B (en) High-temperature target RCS test calibration method
CN109163810A (en) High-temperature rotor radiation temperature measurement device and method
CN108872740B (en) Method for calibrating and predicting ignition temperature rise of exposed bridge wire of electric explosion device under steady state
Hyde et al. Broadband characterization of materials using a dual-ridged waveguide
CN117630502A (en) Dielectric property test system and method of wave-transparent material at high temperature and high pressure
CN114609189B (en) Defect depth information extraction method based on microwave heating
CN108918580B (en) Nondestructive steady-state thermal conductivity measurement method
Cohick et al. High temperature W-band complex permittivity measurements of thermally cycled ceramic-metal composites: AlN: Mo with 0.25 to 4.0 vol% Mo from 25° C to 1000° C in air
CN113551778B (en) Thermal imaging system relative temperature measurement performance evaluation device
CN105445564A (en) Dielectric constant high-temperature space calibration method
Bassett A Free‐Space Focused Microwave System to Determine the Complex Permittivity of Materials to Temperatures Exceeding 2000° C
KR20140054777A (en) Test module of heat spreading sheets
Knisely et al. Uniaxial anisotropic material measurement using a single port waveguide probe
Wollack et al. Radiometric-waveguide calibrators
Ivšic et al. Thermal considerations on adiabatic coaxial line for microcalorimeter measurements
Zou et al. Research on De-Embedding Algorithm Based on the Theory of Electromagnetic Field Transmission in Multi-Layer Medium

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20161123

WD01 Invention patent application deemed withdrawn after publication