CN106141894A - Grinding pad method for sorting and grinder station - Google Patents
Grinding pad method for sorting and grinder station Download PDFInfo
- Publication number
- CN106141894A CN106141894A CN201510197706.6A CN201510197706A CN106141894A CN 106141894 A CN106141894 A CN 106141894A CN 201510197706 A CN201510197706 A CN 201510197706A CN 106141894 A CN106141894 A CN 106141894A
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- CN
- China
- Prior art keywords
- grinding pad
- abrasive disk
- disk
- rotating disk
- ground
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
Abstract
The invention provides a kind of grinding pad method for sorting and grinder station, when being ground wafer, abrasive disk presses to grinding pad to arrange grinding pad, and described abrasive disk and the rotating disk carrying described grinding pad carry out equidirectional rotation；During before extremely lower wafer being ground after having ground wafer, abrasive disk presses to grinding pad to arrange grinding pad, described abrasive disk and the rotating disk carrying described grinding pad carry out opposite direction rotation, and/or, described abrasive disk and carry described grinding pad rotating disk in one static and another one rotates.So that the force direction suffered by contact surface that abrasive disk contacts with grinding pad is different, on grinding pad, residual particles is easier to remove, and improves the cleannes on the grinding pad surface after arrangement, it is to avoid residual particles pollutes the phenomenon of wafer, improves product yield.
Description
Technical field
The present invention relates to cmp field, particularly to a kind of grinding pad method for sorting and grinder station.
Background technology
Generally, the CMP carried out in semiconductor technology workshop refers to cmp
(Chemical Mechanical Polishing) technique or referred to as CMP process.Chemical machinery grinds
Grinding process is a complicated technical process, and it is to be contacted with the lapped face of grinding pad, so by crystal column surface
After, by the relative motion between crystal column surface and lapped face by flattening wafer surface, generally employing
Learn mechanical grinding device, also referred to as grinder station or polishing machine platform and carry out chemical mechanical milling tech.
As it is shown in figure 1, existing grinder station includes grinding pad 110, grinding head 120 and grinder pad finisher
And lapping liquid supply line 150, described dismembyator reorganizer includes the abrasive disk for arranging grinding pad 110
130 and drive mechanism 140, described drive mechanism 140 drives described abrasive disk 130 to rotate, described abrasive disk
130 is circular, the working surface of described abrasive disk 130 be provided with abrasive grains and be provided with some from inside to outside
Groove, described groove is used for getting rid of lapping liquid by-product.
When being ground technique, it would be desirable to the wafer of grinding is attached on grinding head 120, the waiting of this wafer is ground
Flour milling downwards and contacts the grinding pad 110 rotated against, and this wafer is pressed by the downforce that grinding head 120 provides
On grinding pad 110, described grinding pad 110 is to be pasted on platform, when this platform is under the drive of motor
During rotation, meanwhile, grinding head 110 is also carried out corresponding sports；Meanwhile, lapping liquid is supplied by lapping liquid
Answer pipeline 105 to be transported to grinding pad 110, and be evenly distributed on grinding pad 110 by centrifugal force.Grind
The lapping liquid that technique is used has generally comprised chemical mordant and abrasive grains, by chemical mordant and institute
The chemical reaction stating surface to be ground generates the softer material being easily removed, then will by mechanical friction
These softer materials remove from the surface being ground wafer, reach the effect of global planarizartion.
In process of lapping, grinding pad 110 not stall is moved, and wafer (not shown) is pressed in by grinding head 120
On grinding pad 110, and grinding head 120 does rotation one edge grinding pad 110 radial direction and swings back and forth,
Grinding pad leaves movement locus 100, finally, it is achieved the grinding to wafer.Meanwhile, owing to grinding
During mill, the surface of grinding pad 110 easily occurs grinding away phenomenon in dirt or surface, it is therefore desirable to use simultaneously
Grinding pad 110 is cleaned or improves grinding pad surface appearance by grinder pad finisher, to obtain preferably
Grinding effect.
But, use existing grinding pad method for sorting to remove grinding pad surface institute's residual soil or abrasive grains,
The most how its effect or not ideal enough, provide raising the grinding pad method for sorting of yield of wafer, grinding
Pad reorganizer and grinder station are the technical problems that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
It is an object of the invention to provide a kind of grinding pad method for sorting and grinder station, to solve due to cannot
Thoroughly remove dirt or abrasive grains that grinding pad surface is remained, cause the dirt of residual or abrasive grains dirty
Dye wafer, the problem reducing product yield.
For solving above-mentioned technical problem, the present invention provides a kind of grinding pad method for sorting, and described grinding pad arranges
Method includes: when being ground wafer, and abrasive disk presses to grinding pad to arrange grinding pad, institute
State abrasive disk and carry out equidirectional rotation with the rotating disk carrying described grinding pad；
During before being extremely ground lower wafer after having ground wafer, abrasive disk presses to
Grinding pad is to arrange grinding pad, and described abrasive disk and the rotating disk carrying described grinding pad carry out opposite direction
Rotate, and/or, described abrasive disk and carry described grinding pad rotating disk in one static and another one rotates.
Optionally, in described grinding pad method for sorting, grind after wafer to lower wafer
During before being ground, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described abrasive disk stops operating, and described rotating disk is rotated further along former direction.
Optionally, in described grinding pad method for sorting, grind after wafer to lower wafer
During before being ground, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described rotating disk stops operating, and described abrasive disk is rotated further along former direction.
Optionally, in described grinding pad method for sorting, described abrasive disk reversely turns with described rotating disk
Time dynamic, the rotating speed of described rotating disk is 60～65rpm/min, and the rotating speed of described abrasive disk is 15～20rpm/min,
It is 4.50～4.65psi that described abrasive disk is applied to the pressure on described grinding pad.
Optionally, in described grinding pad method for sorting, described abrasive disk stops operating, described rotating disk edge
When former direction is rotated further, the rotating speed of described rotating disk is 30～35rpm/min, and described abrasive disk is applied to described
Pressure on grinding pad is 0.50～1.00psi.
Optionally, in described grinding pad method for sorting, when being ground wafer, abrasive disk presses to
Grinding pad is to arrange grinding pad, and described abrasive disk is applied to the pressure on described grinding pad and is
4.85～5.15psi, the rotating speed of described rotating disk is 60～65rpm/min, and the rotating speed of described abrasive disk is
28～32rpm/min.
Optionally, in described grinding pad method for sorting, described equidirectional rotation is to rotate clockwise or inverse
Hour hands rotate.
The present invention also provides for a kind of grinder station, and described grinder station includes: grinding pad, carry described grinding
The rotating disk of pad, drive rotary disc driving mechanism that described rotating disk rotates, in order to arrange described grinding pad abrasive disk,
And drive the abrasive disk drive mechanism that described abrasive disk rotates, it is characterised in that
When being ground wafer, abrasive disk presses to grinding pad to arrange grinding pad, described grinding
Dish and the rotating disk carrying described grinding pad carry out equidirectional rotation；
During before being extremely ground lower wafer after having ground wafer, abrasive disk presses to
Grinding pad is to arrange grinding pad, and described abrasive disk and the rotating disk carrying described grinding pad carry out opposite direction
Rotate, and/or, described abrasive disk and carry described grinding pad rotating disk in one static and another one rotates.
Optionally, in described grinder station, to lower wafer is ground after having ground wafer
During before mill, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described abrasive disk stops operating, and described rotating disk is rotated further along former direction.
Optionally, in described grinder station, to lower wafer is ground after having ground wafer
During before mill, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described rotating disk stops operating, and described abrasive disk is rotated further along former direction.
In grinding pad method for sorting provided by the present invention and grinder station, when wafer is ground, grind
Mill presses to grinding pad to arrange grinding pad, described abrasive disk and the rotating disk carrying described grinding pad
Carry out equidirectional rotation；During before extremely lower wafer being ground after having ground wafer,
Abrasive disk presses to grinding pad to arrange grinding pad, described abrasive disk with carry turning of described grinding pad
Dish carries out opposite direction rotation, and/or, described abrasive disk with carry described grinding pad rotating disk in one static and
Another one rotates.So that the force direction suffered by contact surface that abrasive disk contacts with grinding pad is different, grind
The upper residual particles of mill pad is easier to remove, improve the cleannes on the grinding pad surface after arrangement, it is to avoid residual
Stay the phenomenon of particle contamination wafer, improve product yield.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing grinder station；
Fig. 2 is the flow chart of the grinding pad method for sorting of the present invention；
Fig. 3 a～3c is the structural representation of grinding pad method for sorting different step in the embodiment of the present invention one.
Detailed description of the invention
The grinding pad method for sorting proposed the present invention below in conjunction with the drawings and specific embodiments and grinder station are made
Further describe.According to following explanation and claims, advantages and features of the invention will be apparent from.
It should be noted that, accompanying drawing all uses the form simplified very much and all uses non-ratio accurately, only in order to convenient,
Aid in illustrating the purpose of the embodiment of the present invention lucidly.
Refer to Fig. 2, it is the flow chart of grinding pad method for sorting of the present invention, as in figure 2 it is shown, described
Grinding pad method for sorting, specifically includes following steps:
First, performing step S1, when being ground wafer, abrasive disk presses to grinding pad with to grinding pad
Arranging, described abrasive disk and the rotating disk carrying described grinding pad carry out equidirectional rotation；
Concrete, when being ground wafer, abrasive disk presses to grinding pad to arrange grinding pad,
(when namely wafer carries out cmp, the method for sorting of grinding pad), described abrasive disk and described turn
Dish carries out equidirectional rotation, and it is 4.85～5.15psi that described abrasive disk is applied to the pressure on described grinding pad, institute
The rotating speed stating rotating disk is 60～65rpm/min, and the rotating speed of described abrasive disk is 28～32rpm/min.Wherein, institute
Stating equidirectional rotation is to rotate clockwise or rotate counterclockwise.
Then, step S2 is performed, the mistake before extremely lower wafer being ground after having ground wafer
Cheng Zhong, abrasive disk presses to grinding pad to arrange grinding pad, described abrasive disk with carry described grinding
Pad rotating disk carry out opposite direction rotation, and/or, described abrasive disk with carry described grinding pad rotating disk in one
Static and another one rotates.
After execution step S2 has carried out cmp mainly for wafer, grinding pad is arranged
Method, be also the core place of the technical scheme of the application.Concrete, for described abrasive disk and carrying
In the rotating disk of described grinding pad, one static and another one rotates and specifically includes following two embodiments.
Embodiment one:
During before extremely lower wafer being ground after having ground wafer, including: first,
Described abrasive disk and described rotating disk carry out opposite direction rotation；Then, described abrasive disk stops operating, described turn
Dish is rotated further along former direction.
Further, described abrasive disk stops operating, when described rotating disk is rotated further along former direction, and described turn
The rotating speed of dish is 30～35rpm/min, and described abrasive disk is applied to the pressure on described grinding pad and is
0.50～1.00psi.
In order to be better understood from technical scheme, carry out concrete elaboration with embodiment one here, tool
Body understands incorporated by reference to the content shown in Fig. 3 a～3c.
As shown in Figure 3 a, it is for when being ground wafer, and abrasive disk is pressed down and arranged grinding pad
Structural representation, now abrasive disk and rotating disk all rotate counterclockwise (the most also can be all clockwise movement),
For during this, the process of the work such as abrasive disk and abrasive disk is known in those skilled in the art, this
Place just repeats no more.
As shown in Figure 3 b, its for after having ground wafer to proceed by lower wafer grinding before
During, described abrasive disk and described rotating disk carry out counter-rotational structural representation.Fig. 3 b turntable does the inverse time
Pin rotates, and abrasive disk does counterclockwise movement.Owing to abrasive disk rotates backward with rotating disk so that grind
In the direction of the power on the surface that dish contacts with grinding pad and before Fig. 3 a during equidirectional rotation on the contrary, on grinding pad
Residual particles is under force, it is easier to removes, improves the cleannes of grinding pad.
As shown in Figure 3 c, its for after having ground wafer to proceed by lower wafer grinding before
During, described abrasive disk stops operating, the structural representation that described rotating disk is rotated further along former direction.Fig. 3 c
In, rotating disk is along rotating counterclockwise as shown in Figure 3 b, and now abrasive disk has stopped operating, now abrasive disk
Still swing back and forth along described grinding pad radial direction under the driving of drive mechanism.
Embodiment two:
During before extremely lower wafer being ground after having ground wafer, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described rotating disk stops operating, and described abrasive disk is rotated further along former direction.
Wherein, in embodiment one or embodiment two, when described abrasive disk and described rotating disk rotate backward,
The rotating speed of described rotating disk is 60～65rpm/min, and the rotating speed of described abrasive disk is 15～20rpm/min, described in grind
It is 4.50～4.65psi that mill is applied to the pressure on described grinding pad.
Detailed process for embodiment two refer to exemplifications set out in embodiment one, the most not superfluous
State.
It should be noted that in step S1 and step S2, grinding pad adds lapping liquid and is preferably SiO2
Granule density is the lapping liquid of 5%～18%.
Accordingly, the application also provides for a kind of grinder station, including grinding pad, carries turning of described grinding pad
Dish, drive rotary disc driving mechanism that described rotating disk rotates, in order to arrange described grinding pad abrasive disk and
Driving the abrasive disk drive mechanism that described abrasive disk rotates, when being ground wafer, abrasive disk presses to grind
Mill pad is to arrange grinding pad, and described abrasive disk and the rotating disk carrying described grinding pad carry out equidirectional turn
Dynamic；During before being extremely ground lower wafer after having ground wafer, abrasive disk presses to
Grinding pad is to arrange grinding pad, and described abrasive disk and the rotating disk carrying described grinding pad carry out opposite direction
Rotate, and/or, described abrasive disk and carry described grinding pad rotating disk in one static and another one rotates.
Further, to during before lower wafer is ground after having ground wafer,
Including: first, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described abrasive disk stops operating, and described rotating disk is rotated further along former direction.
Further, to during before lower wafer is ground after having ground wafer, bag
Including: first, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described rotating disk stops operating, and described abrasive disk is rotated further along former direction
To sum up, in grinding pad method for sorting provided by the present invention and grinder station, wafer is ground
Time, abrasive disk presses to grinding pad to arrange grinding pad, described abrasive disk with carry described grinding pad
Rotating disk carry out equidirectional rotation；Mistake before extremely lower wafer being ground after having ground wafer
Cheng Zhong, abrasive disk presses to grinding pad to arrange grinding pad, described abrasive disk with carry described grinding
Pad rotating disk carry out opposite direction rotation, and/or, described abrasive disk with carry described grinding pad rotating disk in one
Static and another one rotates.So that the force direction suffered by contact surface that abrasive disk contacts with grinding pad is not
With, on grinding pad, residual particles is easier to remove, and improves the cleannes on the grinding pad surface after arrangement, keeps away
Exempt from residual particles and polluted the phenomenon of wafer, improve product yield.
Foregoing description is only the description to present pre-ferred embodiments, not any restriction to the scope of the invention,
Any change that the those of ordinary skill in field of the present invention does according to the disclosure above content, modification, belong to power
The protection domain of profit claim.
Claims (10)
1. a grinding pad method for sorting, it is characterised in that including:
When being ground wafer, abrasive disk presses to grinding pad to arrange grinding pad, described grinding
Dish and the rotating disk carrying described grinding pad carry out equidirectional rotation；
During before being extremely ground lower wafer after having ground wafer, abrasive disk presses to
Grinding pad is to arrange grinding pad, and described abrasive disk and the rotating disk carrying described grinding pad carry out opposite direction
Rotate, and/or, described abrasive disk and carry described grinding pad rotating disk in one static and another one rotates.
2. grinding pad method for sorting as claimed in claim 1, it is characterised in that after having ground wafer
During before extremely lower wafer being ground, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described abrasive disk stops operating, and described rotating disk is rotated further along former direction.
3. grinding pad method for sorting as claimed in claim 1, it is characterised in that after having ground wafer
During before extremely lower wafer being ground, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described rotating disk stops operating, and described abrasive disk is rotated further along former direction.
4. the grinding pad method for sorting as described in Claims 2 or 3, it is characterised in that described abrasive disk
When rotating backward with described rotating disk, the rotating speed of described rotating disk is 60～65rpm/min, described abrasive disk
Rotating speed is 15～20rpm/min, and it is 4.50～4.65psi that described abrasive disk is applied to the pressure on described grinding pad.
5. grinding pad method for sorting as claimed in claim 2, it is characterised in that described abrasive disk stops turning
Dynamic, when described rotating disk is rotated further along former direction, the rotating speed of described rotating disk is 30～35rpm/min, described in grind
It is 0.50～1.00psi that mill is applied to the pressure on described grinding pad.
6. grinding pad method for sorting as claimed in claim 1, it is characterised in that when wafer is ground,
Abrasive disk presses to grinding pad to arrange grinding pad, and described abrasive disk is applied on described grinding pad
Pressure is 4.85～5.15psi, and the rotating speed of described rotating disk is 60～65rpm/min, and the rotating speed of described abrasive disk is
28～32rpm/min.
Grinding pad method for sorting the most as described in the appended claim 1, it is characterised in that described equidirectional rotation
It is to rotate clockwise or rotate counterclockwise.
8. a grinder station, the rotating disk including grinding pad, carrying described grinding pad, drives described rotating disk to turn
Dynamic rotary disc driving mechanism, in order to arrange the abrasive disk of described grinding pad and to drive described abrasive disk to rotate
Abrasive disk drive mechanism, it is characterised in that
When being ground wafer, abrasive disk presses to grinding pad to arrange grinding pad, described grinding
Dish and the rotating disk carrying described grinding pad carry out equidirectional rotation；
During before being extremely ground lower wafer after having ground wafer, abrasive disk presses to
Grinding pad is to arrange grinding pad, and described abrasive disk and the rotating disk carrying described grinding pad carry out opposite direction
Rotate, and/or, described abrasive disk and carry described grinding pad rotating disk in one static and another one rotates.
9. grinder station as claimed in claim 8, it is characterised in that ground after wafer to under
Wafer be ground before during, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described abrasive disk stops operating, and described rotating disk is rotated further along former direction.
10. grinder station as claimed in claim 8, it is characterised in that the most right after having ground wafer
Lower wafer be ground before during, including:
First, described abrasive disk and described rotating disk carry out opposite direction rotation；
Then, described rotating disk stops operating, and described abrasive disk is rotated further along former direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510197706.6A CN106141894A (en) | 2015-04-23 | 2015-04-23 | Grinding pad method for sorting and grinder station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510197706.6A CN106141894A (en) | 2015-04-23 | 2015-04-23 | Grinding pad method for sorting and grinder station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106141894A true CN106141894A (en) | 2016-11-23 |
Family
ID=57346855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510197706.6A Pending CN106141894A (en) | 2015-04-23 | 2015-04-23 | Grinding pad method for sorting and grinder station |
Country Status (1)
| Country | Link |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040023602A1 (en) * | 2002-07-31 | 2004-02-05 | Ebara Technologies Incorporated | Chemical mechanical polishing and pad dressing method |
| CN103522188A (en) * | 2012-07-02 | 2014-01-22 | 中芯国际集成电路制造(上海)有限公司 | Method for arranging grinding pad, grinding pad arranging device and grinder table |
| JP2014076533A (en) * | 2012-09-24 | 2014-05-01 | Ebara Corp | Polishing method and polishing device |
| CN103817600A (en) * | 2012-11-16 | 2014-05-28 | 有研半导体材料股份有限公司 | Finishing process of polishing cloth for double-sided polishing |
| CN103878687A (en) * | 2014-03-20 | 2014-06-25 | 上海华力微电子有限公司 | System for preventing wafer from being scratched by grinding mat |
| CN204221615U (en) * | 2014-10-15 | 2015-03-25 | 易德福 | A kind of polishing pad automatic cleaning apparatus |
-
2015
- 2015-04-23 CN CN201510197706.6A patent/CN106141894A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040023602A1 (en) * | 2002-07-31 | 2004-02-05 | Ebara Technologies Incorporated | Chemical mechanical polishing and pad dressing method |
| CN1485180A (en) * | 2002-07-31 | 2004-03-31 | Chemical mechanical polishing and pad dressing method | |
| CN103522188A (en) * | 2012-07-02 | 2014-01-22 | 中芯国际集成电路制造(上海)有限公司 | Method for arranging grinding pad, grinding pad arranging device and grinder table |
| JP2014076533A (en) * | 2012-09-24 | 2014-05-01 | Ebara Corp | Polishing method and polishing device |
| CN103817600A (en) * | 2012-11-16 | 2014-05-28 | 有研半导体材料股份有限公司 | Finishing process of polishing cloth for double-sided polishing |
| CN103878687A (en) * | 2014-03-20 | 2014-06-25 | 上海华力微电子有限公司 | System for preventing wafer from being scratched by grinding mat |
| CN204221615U (en) * | 2014-10-15 | 2015-03-25 | 易德福 | A kind of polishing pad automatic cleaning apparatus |
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Application publication date: 20161123 |