CN106131228B - Smart city network node communication system - Google Patents

Smart city network node communication system Download PDF

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CN106131228B
CN106131228B CN201610799395.5A CN201610799395A CN106131228B CN 106131228 B CN106131228 B CN 106131228B CN 201610799395 A CN201610799395 A CN 201610799395A CN 106131228 B CN106131228 B CN 106131228B
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CN106131228A (en
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蒋闯
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Shanghai Fujin Information Technology Co ltd
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Shanghai Fujin Information Technology Co ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L67/00Network arrangements or protocols for supporting network services or applications
    • H04L67/01Protocols
    • H04L67/12Protocols specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks
    • GPHYSICS
    • G08SIGNALLING
    • G08CTRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L41/00Arrangements for maintenance, administration or management of data switching networks, e.g. of packet switching networks
    • H04L41/04Network management architectures or arrangements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L41/00Arrangements for maintenance, administration or management of data switching networks, e.g. of packet switching networks
    • H04L41/06Management of faults, events, alarms or notifications
    • H04L41/0681Configuration of triggering conditions
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04WWIRELESS COMMUNICATION NETWORKS
    • H04W52/00Power management, e.g. TPC [Transmission Power Control], power saving or power classes
    • H04W52/02Power saving arrangements
    • H04W52/0209Power saving arrangements in terminal devices
    • H04W52/0212Power saving arrangements in terminal devices managed by the network, e.g. network or access point is master and terminal is slave
    • H04W52/0216Power saving arrangements in terminal devices managed by the network, e.g. network or access point is master and terminal is slave using a pre-established activity schedule, e.g. traffic indication frame
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04WWIRELESS COMMUNICATION NETWORKS
    • H04W52/00Power management, e.g. TPC [Transmission Power Control], power saving or power classes
    • H04W52/02Power saving arrangements
    • H04W52/0209Power saving arrangements in terminal devices
    • H04W52/0261Power saving arrangements in terminal devices managing power supply demand, e.g. depending on battery level
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00Reducing energy consumption in communication networks
    • Y02D30/70Reducing energy consumption in communication networks in wireless communication networks

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Computing Systems (AREA)
  • General Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Selective Calling Equipment (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Data Exchanges In Wide-Area Networks (AREA)

Abstract

The invention discloses a communication system of intelligent city network nodes, which comprises a plurality of nodes, wherein at least one node is a master node and at least one node is a slave node; each node comprises a power supply and power supply management circuit, an MCU, a GPRS module or/and BDS module, a network communication bus, a vibration sensor and an ultra-low power consumption wireless data module; when the vibration sensor circuit detects that the state is changed, the main node MCU sends an alarm code to the far-end big data platform through the GPRS module or/and the BDS module, and the MCU automatically detects the battery voltage every hour and evaluates the residual electric quantity; when the period wake-up time arrives, the system firstly checks whether a short message instruction exists, and if so, the system firstly processes the short message instruction, then actively connects to a remote data platform, and if the data platform has an instruction execution instruction, the system does not submit a period report. The intelligent city network node communication system provided by the invention can realize low-power consumption communication of each network node.

Description

Smart city network node communication system
Technical Field
The invention belongs to the technical field of Internet of things, relates to a network node communication system, and particularly relates to a smart city network node communication system.
Background
In order to develop smart cities and underground smart pipe network technologies, convenient management is brought to the cities, and network sensors are required to be deployed for the cities. Due to the application environment limitations of some sensors and the signal transmission problems, it is desirable to address the issues of power consumption and signal penetration. However, current devices do not perform well.
In view of this, there is an urgent need to design a new network node communication method so as to overcome the above-mentioned drawbacks of the existing communication method.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: a communication system of intelligent city network nodes is provided, which can realize the low power consumption communication of each network node.
In order to solve the technical problems, the invention adopts the following technical scheme:
a communication system of a smart city network node comprises a plurality of nodes, wherein at least one node is a master node and at least one node is a slave node;
each node comprises a power supply and power supply management circuit, an MCU, a GPRS module or/and BDS module, a network communication bus, a vibration sensor and an ultra-low power consumption wireless data module, and the whole system is sealed in a plastic container;
When the vibration sensor circuit detects that the state is changed, the main node MCU sends an alarm code to the remote big data platform through the GPRS module or/and the BDS module, the MCU automatically detects the battery voltage every hour and evaluates the residual electric quantity, if the electric quantity is sufficient, the current electric quantity is sent at the wake-up time of a sending period interval, otherwise, the data communication module is started in time to inform the big data platform that the big data platform needs to be replaced;
when the period wake-up time arrives, the system firstly checks whether a short message instruction exists, if so, the system firstly processes the short message instruction, then actively connects to a remote data platform, and if the data platform has an instruction execution instruction, the system submits a period report;
if the node is provided with a sensor network, the node automatically gathers the sensor data at the current moment and actively reports back; the read sensor data can be acquired in a manner that the cloud provides a reference time reference and acquires time setting to achieve quasi-synchronous acquisition;
when the slave node needs to alarm, the slave node MCU exchanges data with the master node ultra-low power consumption module through the ultra-low power consumption wireless module, and the master node is responsible for establishing data bridging between the slave node and the remote data platform through the self ultra-low power consumption module and the GPRS module or/and the BDS module;
When the remote data platform needs to establish communication, the remote data platform directly initiates data to the master node, and the master node wakes up the slave node through the ultra-low power consumption data module to establish data connection for exchanging data or control; when the slave node also needs to bridge other sensors, the data is forwarded and received from the network communication bus; the product is applied to remote meter reading, remote alarm sensors, remote environment sensors and urban manhole cover monitoring;
the power supply and power management circuit comprises a battery, a voltage regulator LDO and a controllable power switch; the battery BAT3 is a main working power supply of the system, and is a solar battery, and a power supply circuit formed by a thirty-ninth capacitor C39, a fortieth capacitor C40, a thirty-eighth capacitor C38 and a sixth chip U6 provides uninterrupted power supply for the MCU;
the positive pole VCC of the battery BAT3 is connected with the input port of the sixth chip U6, the positive pole of the thirty-ninth capacitor C39 and the positive pole of the fortieth capacitor C40, the input port of the sixth chip U6 is connected with the positive pole of the thirty-eighth capacitor C38, the negative pole of the thirty-ninth capacitor C39, the negative pole of the fortieth capacitor C40, the negative pole of the thirty-eighth capacitor C38 and the negative pole of the battery BAT3 are grounded;
the controllable DCDC composed of a forty-third capacitor C43, a forty-fourth capacitor C44, a forty-fifth capacitor C45, a forty-ninth capacitor C49, a forty-second capacitor C42, a forty-eighth capacitor C48, a forty-sixth capacitor C46, a forty-seventh capacitor C47, a thirty-seventh resistor R37, a thirty-sixth resistor R36, a thirty-eighth resistor R38, a second diode D2, a first inductor L1 and a seventh chip U7 provides a power supply capable of being turned off for the data communication module, and a control signal is supplied from GPS_S of the MCU to a third pin EN control port of the seventh chip U7 through the thirty-seventh resistor R37;
The positive electrode of the battery BAT3 is connected with the positive electrode of the forty-third capacitor C43, the positive electrode of the forty-fourth capacitor C44, the positive electrode of the forty-fifth capacitor C45 and the VIN port of the seventh chip U7, the EN port of the seventh chip U7 is connected with the MCU through a thirty-seventh resistor, and the SS port of the seventh chip U7 is grounded; the seventh port of the seventh chip U7 is connected with the first end of the forty-second capacitor C42, and the SW port of the seventh chip U7 is connected with the second end of the forty-second capacitor C42, the cathode of the second diode D2 and the first end of the first inductor L1; the GS port of the seventh chip U7 and the anode of the second diode D2 are grounded; the second end of the first inductor L1 is connected with the first end of a forty-eighth capacitor C48, the first end of a thirty-sixth resistor R36, the positive electrode of the forty-sixth capacitor C46 and the positive electrode of a forty-seventh capacitor C47; the FB port of the seventh chip U7 is connected with the second end of the forty-eighth capacitor C48, the second end of the thirty-sixth resistor R36 and the first end of the thirty-eighth resistor R38, and the second end of the thirty-eighth resistor R38 is grounded;
the MCU comprises a first chip U1, a first high-low frequency crystal oscillator OSC1, a second high-low frequency crystal oscillator OSC2, a power-down monitoring chip U2, an auxiliary battery BAT1, a plurality of resistors and a plurality of capacitors; the system mainly provides serial ISP synchronous serial port and AD sampling, battery voltage detection, disconnection detection and mechanical motion detection action control capability; the circuit formed by the seventeenth resistor R17, the twenty first resistor R21, the twenty second resistor R22, the twenty third resistor R23 and the second MOS tube M2 is used for collecting the voltage condition of the main battery and evaluating the residual electric quantity; after the acquisition is finished, the second MOS tube M2 is turned off to avoid extra power consumption current of the circuit; the P1 port is used for debugging and program filling;
The data communication module comprises a SIM card circuit and a communication circuit; the SIM card circuit comprises a third chip U3, a twenty-first capacitor C20, a sixteenth capacitor C16, a twenty-third capacitor C23, a twenty-fourth capacitor C24, a twenty-fifth capacitor C25, a twenty-sixth capacitor C26 and a twenty-second capacitor C22;
the communication circuit comprises a fifth chip U5, a first diode D1, a first LED lamp LED1, a thirty-third capacitor C33, a thirty-second capacitor C32, a thirty-first capacitor C31, a thirty-fifth capacitor C35, a thirty-fourth capacitor C34, a thirty-seventh capacitor C37, a thirty-sixth capacitor C36, a forty-first capacitor C41, a twenty-ninth capacitor R29, a thirty-first capacitor R30, a thirty-second capacitor R31, a thirty-third capacitor R32, and an antenna ANT1BT-ANT; the communication system is mainly responsible for data communication between the MCU and the cloud, is started when necessary, and is closed after the communication is finished;
the negative electrode of the first diode D1 is connected with the first end of the thirty-third capacitor C33, the first end of the thirty-second capacitor C32, the first end of the thirty-first capacitor C31, the positive electrode of the thirty-fifth capacitor C35, the positive electrode of the thirty-fourth capacitor C34 and the fifth chip U5, the second end of the thirty-third capacitor C33, the second end of the thirty-second capacitor C32, the second end of the thirty-first capacitor C31, the negative electrode of the thirty-fifth capacitor C35 and the negative electrode of the thirty-fourth capacitor C34 are grounded;
The network communication bus comprises a fourth chip U4, a fifteenth resistor R15, a sixteenth resistor R16, an eighteenth resistor R18, a twentieth resistor R20, a nineteenth resistor R19, a twenty-fourth resistor R24, an eighth resistor R28, a twenty-seventh capacitor C27, a twenty-ninth capacitor C29, a twenty-eighth capacitor C28, a thirty-eighth capacitor C30, a third MOS tube M3 and a network transformer B2; the method mainly provides the conversion of the data signal mode, realizes low power consumption and high isolation, and improves the reliability and IPI level of the product; the twentieth resistor R20 serves as a terminal device resistor, the eighteenth resistor R18 and the nineteenth resistor R19 are configurable terminal resistors, and the configuration determines whether the resistor is loaded or unloaded;
the vibration sensor comprises a fifty-first decoupling capacitor C51, a fifty-second decoupling capacitor C52, a forty-third resistor R43, a forty-second resistor R42 and a sensor U1, and is mainly used for waking up the MCU in time through interruption when a product senses large vibration and the product turns over, so that the MCU processes an alarm signal to inform a cloud; the vibration sensor uses a semiconductor acceleration inclination sensor;
the ultra-low power wireless data module includes a tenth chip U10, a ninth chip U9, an eleventh chip U11, and a ninth capacitor C9, a fifty-seventh capacitor C50, a fifty-third capacitor C53, a fifty-fourth capacitor C54, a seventeenth capacitor C55, a seventeenth capacitor C56, a seventeenth capacitor C57, a fifty-eighth capacitor C58, a fifty-ninth capacitor C59, a sixty-fourth capacitor C60, a sixty-first capacitor C61, a sixty-second capacitor C62, a sixty-third capacitor C63, a sixty-fourth capacitor C64, a sixty-fifth capacitor C65, a sixty-sixth capacitor C66, a sixty-seventh capacitor C67, a sixty-eighth capacitor C68, a sixty-ninth capacitor C69, a seventeenth capacitor C70, a seventy-first capacitor C71, a seventy-second capacitor C72, a seventy-third capacitor C73, a seventy-fourth capacitor C74, a seventy-fifth capacitor C75, a seventy-sixth capacitor C76, a seventy-seventh capacitor C77, a seventy-eighth capacitor C78, a seventy-eighth capacitor C86, a seventy-eighth capacitor C82, the second inductor L2, the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, the seventh inductor L7, the eighth inductor L8, the ninth inductor L9, the tenth inductor L10, the eleventh inductor L11, the twelfth inductor L12, the thirteenth inductor L13, the fourteenth inductor L14, the fifteenth inductor L15, the third high-low frequency crystal oscillator OSC3, the second resistor R2, the third resistor R3, the thirty-ninth resistor R39 and the fortieth resistor R40;
The tenth chip U10 is connected with the first end of the fourth inductor L4 and the first end of the third inductor L3, the second end of the fourth inductor L4 is grounded, and the second end of the third inductor L3 is connected with the first end of the fifty-fourth capacitor C54 and the first end of the fifty-fourth capacitor C50; the second end of the fifty-fourth capacitor C54 is grounded, and the second end of the fifty-third capacitor C50 is connected with the ninth chip U9 through a second resistor R2 and a fifty-third capacitor C53;
the tenth chip U10 is connected to the first end of the eighth inductor L8, the first end of the sixty-fourth capacitor C64, and the first end of the sixty-capacitor C60, the second end of the eighth inductor L8 is connected to the first end of the tenth inductor L10, the first end of the sixty-fifth capacitor C65, the first end of the sixty-sixth capacitor C66, the second end of the sixty-fourth capacitor C64 is grounded, and the second end of the sixty-capacitor C60 is connected to the first end of the fifth inductor L5; the second end of the fifth inductor L5 is connected to the first end of the sixty-first capacitor C61, the first end of the sixth inductor L6, and the first end of the fifty-seventh capacitor C57; the second end of the sixty-first capacitor C61 is grounded, the second end of the sixth inductor L6, the second end of the fifty-seventh capacitor C57, the first end of the fifty-eighth capacitor C58 and the first end of the seventh inductor L7 are connected with the first end of the sixty-second capacitor C62, and the second end of the sixty-second capacitor C62 is grounded; the ninth chip U9 is connected with the second end of the fifty-eighth capacitor C58, the second end of the seventh inductor L7, the first end of the sixty-third capacitor C63, and the second end of the sixty-third capacitor C63 is grounded;
The tenth chip U10 is connected with the first end of the ninth inductor L9, the second end of the ninth inductor L9 is connected with the first end of the seventy-fifth capacitor C75 and the first end of the seventy-fifth capacitor C70, and the second end of the seventy-fifth capacitor C75 is grounded; the second end of the seventy capacitor C70 is connected with the first end of the eleventh inductor L11; the second end of the eleventh inductor L11 is connected to the first end of the seventy-first capacitor C71, the first end of the twelfth inductor L12, the first end of the sixty-seventh capacitor C67, and the second end of the seventy-first capacitor C71 is grounded; the second end of the twelfth inductor L12, the second end of the sixty-seventh capacitor C67, the first end of the thirteenth inductor L13, and the first end of the sixty-eighth capacitor C68 are connected to the first end of the seventy-second capacitor C72, and the second end of the seventy-second capacitor C72 is grounded; the eleventh chip U11 is connected to the second end of the thirteenth inductor L13, the second end of the sixty-eighth capacitor C68, the first end of the seventy-eighth capacitor C78, and the second end of the seventy-eighth capacitor C78 is grounded;
the tenth chip U10 is connected to the first end of the tenth inductor L10, the second end of the eighth inductor L8, the first end of the sixty-fifth capacitor C65, and the first end of the sixty-sixth capacitor C66; a second end of the sixty-fifth capacitor C65 and a second end of the sixty-sixth capacitor C66 are grounded;
The tenth chip U10 is connected to the first end of the fifteenth inductor L15 and the first end of the eighty-fourth capacitor C84, and the second end of the fifteenth inductor L15 is connected to the first end of the eighty-fifth capacitor C85 and the first end of the eighty-capacitor C80; a second end of the eighty-fourth capacitor C84 and a second end of the eighty-fifth capacitor C85 are grounded; the second end of the eighty capacitor C80 is sequentially connected with a thirty-ninth resistor R39 and an eighty-first capacitor C81 in series and is connected with an eleventh chip U11;
the tenth chip U10 is connected with the first pin of the third high-low frequency crystal oscillator OSC3 and the first end of the seventy-eighth capacitor C78, the second pin of the third high-low frequency crystal oscillator OSC3 is connected with the first end of the seventy-ninth capacitor C79, and the third pin of the third high-low frequency crystal oscillator OSC3, the second end of the seventy-eighth capacitor C78 and the second end of the seventy-ninth capacitor C79 are grounded;
the ninth chip U9 is connected with the first end of the second inductor L2 and the first end of the fifty-fifth capacitor C55, the second end of the second inductor L2 is connected with the first end of the fifty-sixth capacitor C56, and the second end of the fifty-fifth capacitor C55 and the second end of the fifty-sixth capacitor C56 are grounded;
the eleventh chip U11 is connected to the first end of the fourteenth inductor L14 and the first end of the eighteenth capacitor C82, and the second end of the fourteenth inductor L14 is connected to the first end of the eighteenth capacitor C83, and the second end of the eighteenth capacitor C82 and the second end of the eighteenth capacitor C83 are grounded.
A communication system of a smart city network node comprises a plurality of nodes, wherein at least one node is a master node and at least one node is a slave node;
each node comprises a power supply and power supply management circuit, an MCU, a GPRS module or/and BDS module, a network communication bus, a vibration sensor and an ultra-low power consumption wireless data module;
when the vibration sensor circuit detects that the state is changed, the main node MCU sends an alarm code to the remote big data platform through the GPRS module or/and the BDS module, the MCU automatically detects the battery voltage every interval set time and evaluates the residual electric quantity, if the electric quantity is sufficient, the current electric quantity is sent at the transmission period interval wake-up time, otherwise, the data communication module is started in time to inform the big data platform that the big data platform needs to be replaced;
when the period wake-up time arrives, the system firstly checks whether a short message instruction exists, and if so, the system firstly processes the short message instruction, then actively connects to a remote data platform, and if the data platform has an instruction execution instruction, the system does not submit a period report.
As a preferable scheme of the invention, if the node is provided with a sensor network, the node automatically gathers the sensor data at the current moment and actively reports back; the read sensor data can be acquired in a manner that the cloud provides a reference time reference and acquires time setting to achieve quasi-synchronous acquisition;
When the slave node needs to alarm, the slave node MCU exchanges data with the master node ultra-low power consumption module through the ultra-low power consumption wireless module, and the master node is responsible for establishing data bridging between the slave node and the remote data platform through the self ultra-low power consumption module and the GPRS module or/and the BDS module;
when the remote data platform needs to establish communication, the remote data platform directly initiates data to the master node, and the master node wakes up the slave node through the ultra-low power consumption data module to establish data connection for exchanging data or control; when the slave node also needs to bridge other sensors, the data is forwarded and received from the network communication bus; the product is applied to remote meter reading, remote alarm sensors, remote environment sensors and urban manhole cover monitoring.
As a preferred scheme of the invention, the power supply and power management circuit comprises a battery, a voltage regulator LDO and a controllable power switch; the battery BAT3 is a main working power supply of the system, and is a solar battery, and a power supply circuit formed by a thirty-ninth capacitor C39, a fortieth capacitor C40, a thirty-eighth capacitor C38 and a sixth chip U6 provides uninterrupted power supply for the MCU;
the positive pole VCC of the battery BAT3 is connected with the input port of the sixth chip U6, the positive pole of the thirty-ninth capacitor C39 and the positive pole of the fortieth capacitor C40, the input port of the sixth chip U6 is connected with the positive pole of the thirty-eighth capacitor C38, the negative pole of the thirty-ninth capacitor C39, the negative pole of the fortieth capacitor C40, the negative pole of the thirty-eighth capacitor C38 and the negative pole of the battery BAT3 are grounded;
The controllable DCDC composed of a forty-third capacitor C43, a forty-fourth capacitor C44, a forty-fifth capacitor C45, a forty-ninth capacitor C49, a forty-second capacitor C42, a forty-eighth capacitor C48, a forty-sixth capacitor C46, a forty-seventh capacitor C47, a thirty-seventh resistor R37, a thirty-sixth resistor R36, a thirty-eighth resistor R38, a second diode D2, a first inductor L1 and a seventh chip U7 provides a power supply capable of being turned off for the data communication module, and a control signal is supplied from GPS_S of the MCU to a third pin EN control port of the seventh chip U7 through the thirty-seventh resistor R37;
the positive electrode of the battery BAT3 is connected with the positive electrode of the forty-third capacitor C43, the positive electrode of the forty-fourth capacitor C44, the positive electrode of the forty-fifth capacitor C45 and the VIN port of the seventh chip U7, the EN port of the seventh chip U7 is connected with the MCU through a thirty-seventh resistor, and the SS port of the seventh chip U7 is grounded; the seventh port of the seventh chip U7 is connected with the first end of the forty-second capacitor C42, and the SW port of the seventh chip U7 is connected with the second end of the forty-second capacitor C42, the cathode of the second diode D2 and the first end of the first inductor L1; the GS port of the seventh chip U7 and the anode of the second diode D2 are grounded; the second end of the first inductor L1 is connected with the first end of a forty-eighth capacitor C48, the first end of a thirty-sixth resistor R36, the positive electrode of the forty-sixth capacitor C46 and the positive electrode of a forty-seventh capacitor C47; the FB port of the seventh chip U7 is connected to the second end of the forty-eighth capacitor C48, the second end of the thirty-sixth resistor R36, the first end of the thirty-eighth resistor R38, and the second end of the thirty-eighth resistor R38 is grounded.
As a preferable scheme of the invention, the MCU comprises a first chip U1, a first high-low frequency crystal oscillator OSC1, a second high-low frequency crystal oscillator OSC2, a power failure monitoring chip U2, an auxiliary battery BAT1, a plurality of resistors and a plurality of capacitors; the system mainly provides serial ISP synchronous serial port and AD sampling, battery voltage detection, disconnection detection and mechanical motion detection action control capability; the circuit formed by the seventeenth resistor R17, the twenty first resistor R21, the twenty second resistor R22, the twenty third resistor R23 and the second MOS tube M2 is used for collecting the voltage condition of the main battery and evaluating the residual electric quantity; after the acquisition is finished, the second MOS tube M2 is turned off to avoid extra power consumption current of the circuit; the P1 port is used for debugging and filling programs.
As a preferable scheme of the invention, the data communication module comprises a SIM card circuit and a communication circuit; the SIM card circuit comprises a third chip U3, a twenty-first capacitor C20, a sixteenth capacitor C16, a twenty-third capacitor C23, a twenty-fourth capacitor C24, a twenty-fifth capacitor C25, a twenty-sixth capacitor C26 and a twenty-second capacitor C22;
the communication circuit comprises a fifth chip U5, a first diode D1, a first LED lamp LED1, a thirty-third capacitor C33, a thirty-second capacitor C32, a thirty-first capacitor C31, a thirty-fifth capacitor C35, a thirty-fourth capacitor C34, a thirty-seventh capacitor C37, a thirty-sixth capacitor C36, a forty-first capacitor C41, a twenty-ninth capacitor R29, a thirty-first capacitor R30, a thirty-second capacitor R31, a thirty-third capacitor R32, and an antenna ANT1BT-ANT; the communication system is mainly responsible for data communication between the MCU and the cloud, is started when necessary, and is closed after the communication is finished;
The negative electrode of the first diode D1 is connected to the first end of the thirty-third capacitor C33, the first end of the thirty-second capacitor C32, the first end of the thirty-first capacitor C31, the positive electrode of the thirty-fifth capacitor C35, the positive electrode of the thirty-fourth capacitor C34, the fifth chip U5, the second end of the thirty-third capacitor C33, the second end of the thirty-second capacitor C32, the second end of the thirty-first capacitor C31, the negative electrode of the thirty-fifth capacitor C35, and the negative electrode of the thirty-fourth capacitor C34.
As a preferred solution of the present invention, the network communication bus includes a fourth chip U4, a fifteenth resistor R15, a sixteenth resistor R16, an eighteenth resistor R18, a twentieth resistor R20, a nineteenth resistor R19, a twenty fourth resistor R24, a twenty eighth resistor R28, a twenty seventh capacitor C27, a twenty ninth capacitor C29, a twenty eighth capacitor C28, a thirty second capacitor C30, a third MOS transistor M3, and a network transformer B2; the method mainly provides the conversion of the data signal mode, realizes low power consumption and high isolation, and improves the reliability and IPI level of the product; the twentieth resistor R20 serves as a termination device resistor, the eighteenth resistor R18 and the nineteenth resistor R19 are configurable termination resistors, and the configuration determines whether the resistors are loaded or unloaded.
As a preferred scheme of the invention, the vibration sensor comprises a fiftieth decoupling capacitor C51, a fiftieth decoupling capacitor C52, a forty-third resistor R43, a forty-second resistor R42 and a sensor U1, and mainly has the function of waking up the MCU in time through interruption when a product senses large vibration and the product turns over, so that the MCU processes an alarm signal to inform the cloud; the vibration sensor uses a semiconductor acceleration inclination sensor.
As a preferred scheme of the invention, the ultra-low power consumption wireless data module comprises a tenth chip U10, a ninth chip U9, an eleventh chip U11, a ninth capacitor C9, a fifty-seventh capacitor C50, a fifty-third capacitor C53, a fifty-fourth capacitor C54, a fifty-fifth capacitor C55, a fifty-sixth capacitor C56, a fifty-seventh capacitor C57, a fifty-eighth capacitor C58, a fifty-ninth capacitor C59, a sixty-capacitor C60, a sixty-first capacitor C61, a sixty-second capacitor C62, a sixty-third capacitor C63, a sixty-fourth capacitor C64, a sixty-fifth capacitor C65, a sixty-sixth capacitor C66, a sixty-seventh capacitor C67, a sixty-eighth capacitor C68, a seventy-ninth capacitor C69, a seventy-fourth capacitor C70, a seventy-first capacitor C71, a seventy-second capacitor C72, a seventy-third capacitor C73, a seventy-fourth capacitor C74, a seventy-fifth capacitor C75, a seventy-sixth capacitor C76, a seventy-seventh capacitor C77, a seventy-eighth capacitor C78, a seventy-eighth capacitor C80, a seventy-eighth capacitor C85, a seventy-eighth capacitor C80 and a seventy-eighth capacitor C80, the second inductor L2, the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, the seventh inductor L7, the eighth inductor L8, the ninth inductor L9, the tenth inductor L10, the eleventh inductor L11, the twelfth inductor L12, the thirteenth inductor L13, the fourteenth inductor L14, the fifteenth inductor L15, the third high-low frequency crystal oscillator OSC3, the second resistor R2, the third resistor R3, the thirty-ninth resistor R39 and the fortieth resistor R40;
The tenth chip U10 is connected with the first end of the fourth inductor L4 and the first end of the third inductor L3, the second end of the fourth inductor L4 is grounded, and the second end of the third inductor L3 is connected with the first end of the fifty-fourth capacitor C54 and the first end of the fifty-fourth capacitor C50; the second end of the fifty-fourth capacitor C54 is grounded, and the second end of the fifty-third capacitor C50 is connected with the ninth chip U9 through a second resistor R2 and a fifty-third capacitor C53;
the tenth chip U10 is connected to the first end of the eighth inductor L8, the first end of the sixty-fourth capacitor C64, and the first end of the sixty-capacitor C60, the second end of the eighth inductor L8 is connected to the first end of the tenth inductor L10, the first end of the sixty-fifth capacitor C65, the first end of the sixty-sixth capacitor C66, the second end of the sixty-fourth capacitor C64 is grounded, and the second end of the sixty-capacitor C60 is connected to the first end of the fifth inductor L5; the second end of the fifth inductor L5 is connected to the first end of the sixty-first capacitor C61, the first end of the sixth inductor L6, and the first end of the fifty-seventh capacitor C57; the second end of the sixty-first capacitor C61 is grounded, the second end of the sixth inductor L6, the second end of the fifty-seventh capacitor C57, the first end of the fifty-eighth capacitor C58 and the first end of the seventh inductor L7 are connected with the first end of the sixty-second capacitor C62, and the second end of the sixty-second capacitor C62 is grounded; the ninth chip U9 is connected with the second end of the fifty-eighth capacitor C58, the second end of the seventh inductor L7, the first end of the sixty-third capacitor C63, and the second end of the sixty-third capacitor C63 is grounded;
The tenth chip U10 is connected with the first end of the ninth inductor L9, the second end of the ninth inductor L9 is connected with the first end of the seventy-fifth capacitor C75 and the first end of the seventy-fifth capacitor C70, and the second end of the seventy-fifth capacitor C75 is grounded; the second end of the seventy capacitor C70 is connected with the first end of the eleventh inductor L11; the second end of the eleventh inductor L11 is connected to the first end of the seventy-first capacitor C71, the first end of the twelfth inductor L12, the first end of the sixty-seventh capacitor C67, and the second end of the seventy-first capacitor C71 is grounded; the second end of the twelfth inductor L12, the second end of the sixty-seventh capacitor C67, the first end of the thirteenth inductor L13, and the first end of the sixty-eighth capacitor C68 are connected to the first end of the seventy-second capacitor C72, and the second end of the seventy-second capacitor C72 is grounded; the eleventh chip U11 is connected to the second end of the thirteenth inductor L13, the second end of the sixty-eighth capacitor C68, the first end of the seventy-eighth capacitor C78, and the second end of the seventy-eighth capacitor C78 is grounded;
the tenth chip U10 is connected to the first end of the tenth inductor L10, the second end of the eighth inductor L8, the first end of the sixty-fifth capacitor C65, and the first end of the sixty-sixth capacitor C66; a second end of the sixty-fifth capacitor C65 and a second end of the sixty-sixth capacitor C66 are grounded;
The tenth chip U10 is connected to the first end of the fifteenth inductor L15 and the first end of the eighty-fourth capacitor C84, and the second end of the fifteenth inductor L15 is connected to the first end of the eighty-fifth capacitor C85 and the first end of the eighty-capacitor C80; a second end of the eighty-fourth capacitor C84 and a second end of the eighty-fifth capacitor C85 are grounded; the second end of the eighty capacitor C80 is sequentially connected with a thirty-ninth resistor R39 and an eighty-first capacitor C81 in series and is connected with an eleventh chip U11;
the tenth chip U10 is connected with the first pin of the third high-low frequency crystal oscillator OSC3 and the first end of the seventy-eighth capacitor C78, the second pin of the third high-low frequency crystal oscillator OSC3 is connected with the first end of the seventy-ninth capacitor C79, and the third pin of the third high-low frequency crystal oscillator OSC3, the second end of the seventy-eighth capacitor C78 and the second end of the seventy-ninth capacitor C79 are grounded;
the ninth chip U9 is connected with the first end of the second inductor L2 and the first end of the fifty-fifth capacitor C55, the second end of the second inductor L2 is connected with the first end of the fifty-sixth capacitor C56, and the second end of the fifty-fifth capacitor C55 and the second end of the fifty-sixth capacitor C56 are grounded;
the eleventh chip U11 is connected to the first end of the fourteenth inductor L14 and the first end of the eighteenth capacitor C82, and the second end of the fourteenth inductor L14 is connected to the first end of the eighteenth capacitor C83, and the second end of the eighteenth capacitor C82 and the second end of the eighteenth capacitor C83 are grounded.
The invention has the beneficial effects that: the intelligent city network node communication system provided by the invention can realize low-power consumption communication of each network node. The device is integrated with master device and slave device, when in use, the master device is responsible for connecting with a network data platform through a GPRS/BDS data module, and the slave node exchanges data with the master device through a low-power-consumption data channel.
Drawings
Fig. 1 is a schematic diagram of the communication system of the smart city network node according to the present invention.
Fig. 2 is a circuit schematic diagram of a power supply and power management circuit.
Fig. 3 is a circuit diagram of the MUC portion.
Fig. 4 is a circuit schematic diagram of the data communication module.
Fig. 5 is a circuit schematic diagram of a network communication bus.
Fig. 6 is a circuit schematic of the vibration sensor.
Fig. 7 is a circuit schematic diagram of an ultra-low power wireless data module.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Example 1
Referring to fig. 1, the present invention discloses a smart city network node communication system, which includes a plurality of nodes, at least one node is a master node, and at least one node is a slave node.
Each node comprises a complete system consisting of a power supply and power supply management circuit 1, an MCU 2, a data communication module 3, a network communication bus 4, a vibration sensor 5 and an ultra-low power consumption wireless data module 6, and the whole system is sealed in a plastic container. The data communication module 3 comprises a GPRS module or/and a BDS module.
When the vibration sensor circuit detects that the state is changed, the main node MCU sends an alarm code to the remote big data platform through the GPRS module or/and the BDS module, the MCU automatically detects the battery voltage every hour and evaluates the residual electric quantity, if the electric quantity is sufficient, the current electric quantity is sent at the wake-up time of a sending period interval, otherwise, the data communication module is started in time to inform the big data platform that the big data platform needs to be replaced.
When the period wake-up time arrives, the system firstly checks whether a short message instruction exists, if so, the system firstly processes the short message instruction, then actively connects to a remote data platform, and if the data platform has an instruction execution instruction, the system submits a period report;
if the node is provided with a sensor network, the node automatically gathers the sensor data at the current moment and actively reports back; the cloud can provide a reference time reference and acquire time setting to acquire the sensor data in a quasi-synchronous acquisition mode.
When the slave node needs to alarm, the slave node MCU exchanges data with the master node ultra-low power consumption module through the ultra-low power consumption wireless module, and the master node is responsible for establishing data bridging between the slave node and the remote data platform through the self ultra-low power consumption module and the GPRS module or/and the BDS module.
When the remote data platform needs to establish communication, the remote data platform directly initiates data to the master node, and the master node wakes up the slave node through the ultra-low power consumption data module to establish data connection for exchanging data or control; when the slave node also needs to bridge other sensors, the data is forwarded and received from the network communication bus; the product is applied to remote meter reading, remote alarm sensors, remote environment sensors and urban manhole cover monitoring.
Referring to fig. 2, the power supply and power management circuit includes a battery, a regulator LDO (including a sixth chip U6), and a controllable power switch (including a seventh chip U7); the battery BAT3 is a main working power supply of the system, and is a power supply circuit formed by a solar battery, a thirty-ninth capacitor C39, a fortieth capacitor C40, a thirty-eighth capacitor C38 and a sixth chip U6 for supplying uninterrupted power to the MCU.
The positive pole VCC of the battery BAT3 is connected with the input port of the sixth chip U6, the positive pole of the thirty-ninth capacitor C39 and the positive pole of the fortieth capacitor C40, the input port of the sixth chip U6 is connected with the positive pole of the thirty-eighth capacitor C38, the negative pole of the thirty-ninth capacitor C39, the negative pole of the fortieth capacitor C40, the negative pole of the thirty-eighth capacitor C38 and the negative pole of the battery BAT3 are grounded.
The controllable DCDC composed of the forty-third capacitor C43, the forty-fourth capacitor C44, the forty-fifth capacitor C45, the forty-ninth capacitor C49, the forty-second capacitor C42, the forty-eighth capacitor C48, the forty-sixth capacitor C46, the forty-seventh capacitor C47, the thirty-seventh resistor R37, the thirty-sixth resistor R36, the thirty-eighth resistor R38, the second diode D2, the first inductor L1 and the seventh chip U7 provides a power supply capable of being turned off for the data communication module, and a control signal is supplied to a third pin EN control port of the seventh chip U7 from the GPS_S of the MCU through the thirty-seventh resistor R37.
The positive electrode of the battery BAT3 is connected with the positive electrode of the forty-third capacitor C43, the positive electrode of the forty-fourth capacitor C44, the positive electrode of the forty-fifth capacitor C45 and the VIN port of the seventh chip U7, the EN port of the seventh chip U7 is connected with the MCU through a thirty-seventh resistor, and the SS port of the seventh chip U7 is grounded; the seventh port of the seventh chip U7 is connected with the first end of the forty-second capacitor C42, and the SW port of the seventh chip U7 is connected with the second end of the forty-second capacitor C42, the cathode of the second diode D2 and the first end of the first inductor L1; the GS port of the seventh chip U7 and the anode of the second diode D2 are grounded; the second end of the first inductor L1 is connected with the first end of a forty-eighth capacitor C48, the first end of a thirty-sixth resistor R36, the positive electrode of the forty-sixth capacitor C46 and the positive electrode of a forty-seventh capacitor C47; the FB port of the seventh chip U7 is connected to the second end of the forty-eighth capacitor C48, the second end of the thirty-sixth resistor R36, the first end of the thirty-eighth resistor R38, and the second end of the thirty-eighth resistor R38 is grounded.
Referring to fig. 3, the MCU includes a first chip U1, a first high-low frequency crystal oscillator OSC1, a second high-low frequency crystal oscillator OSC2, a power-down monitoring chip U2, an auxiliary battery BAT1, a plurality of resistors, and a plurality of capacitors; the system mainly provides synchronous serial port and AD sampling of serial port ISP, and motion control capability of battery voltage detection, disconnection detection, mechanical motion detection and the like; the circuit formed by the seventeenth resistor R17, the twenty first resistor R21, the twenty second resistor R22, the twenty third resistor R23 and the second MOS tube M2 is used for collecting the voltage condition of the main battery and evaluating the residual electric quantity; after the acquisition is finished, the second MOS tube M2 is turned off to avoid extra power consumption current of the circuit; for debugging and programming (as shown in fig. 3) through the P1 port.
Referring to fig. 4, the data communication module includes a SIM card circuit and a communication circuit; the SIM card circuit comprises a third chip U3, a twenty-first capacitor C20, a sixteenth capacitor C16, a twenty-third capacitor C23, a twenty-fourth capacitor C24, a twenty-fifth capacitor C25, a twenty-sixth capacitor C26 and a twenty-second capacitor C22;
the communication circuit comprises a fifth chip U5, a first diode D1, a first LED lamp LED1, a thirty-third capacitor C33, a thirty-second capacitor C32, a thirty-first capacitor C31, a thirty-fifth capacitor C35, a thirty-fourth capacitor C34, a thirty-seventh capacitor C37, a thirty-sixth capacitor C36, a forty-first capacitor C41, a twenty-ninth capacitor R29, a thirty-first capacitor R30, a thirty-second capacitor R31, a thirty-third capacitor R32, and an antenna ANT1 BT-ANT; the communication system is mainly responsible for data communication between the MCU and the cloud, is started when necessary, and is closed after the communication is finished.
The negative electrode of the first diode D1 is connected to the first end of the thirty-third capacitor C33, the first end of the thirty-second capacitor C32, the first end of the thirty-first capacitor C31, the positive electrode of the thirty-fifth capacitor C35, the positive electrode of the thirty-fourth capacitor C34, the fifth chip U5, the second end of the thirty-third capacitor C33, the second end of the thirty-second capacitor C32, the second end of the thirty-first capacitor C31, the negative electrode of the thirty-fifth capacitor C35, and the negative electrode of the thirty-fourth capacitor C34.
Referring to fig. 5, the network communication bus includes a fourth chip U4, a fifteenth resistor R15, a sixteenth resistor R16, an eighteenth resistor R18, a twentieth resistor R20, a nineteenth resistor R19, a twenty fourth resistor R24, a twenty eighth resistor R28, a twenty seventh capacitor C27, a twenty ninth capacitor C29, a twenty eighth capacitor C28, a thirty second capacitor C30, a third MOS transistor M3, and a network transformer B2; the method mainly provides the conversion of the data signal mode, realizes low power consumption and high isolation, and improves the reliability and IPI level of the product; the twentieth resistor R20 serves as a termination device resistor, the eighteenth resistor R18 and the nineteenth resistor R19 are configurable termination resistors, and the configuration determines whether the resistors are loaded or unloaded.
Referring to fig. 6, the vibration sensor includes a fifth eleventh decoupling capacitor C51, a fifty second decoupling capacitor C52, a forty-third resistor R43, a forty-second resistor R42, and a sensor U1, and is mainly used for waking up the MCU by interrupting in time when the product senses a large vibration and the product turns over, so that the MCU processes the alarm signal to notify the cloud; the vibration sensor uses a semiconductor acceleration inclination sensor.
Referring to fig. 7, the ultra-low power wireless data module includes a tenth chip U10, a ninth chip U9, an eleventh chip U11, and a ninth capacitor C9, a fifty-seventh capacitor C50, a fifty-third capacitor C53, a fifty-fourth capacitor C54, a fifty-fifth capacitor C55, a fifty-sixth capacitor C56, a fifty-seventh capacitor C57, a fifty-eighth capacitor C58, a fifty-ninth capacitor C59, a sixty-fourth capacitor C60, a sixty-first capacitor C61, a sixty-second capacitor C62, a sixty-third capacitor C63, a sixty-fourth capacitor C64, a sixty-fifth capacitor C65, a sixty-sixth capacitor C66, a sixty-seventh capacitor C67, a sixty-eighth capacitor C68, a sixty-ninth capacitor C69, a seventy-seventh capacitor C70, a seventy-first capacitor C71, a seventy-second capacitor C72, a seventy-third capacitor C73, a seventy-fourth capacitor C74, a seventy-fifth capacitor C75, a seventy-sixth capacitor C76, a seventy-eighth capacitor C77, a seventy-eighth capacitor C78, a seventy-eighth capacitor C80, a seventy-eighth capacitor C82, a seventy-eighth capacitor C85, the second inductor L2, the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, the seventh inductor L7, the eighth inductor L8, the ninth inductor L9, the tenth inductor L10, the eleventh inductor L11, the twelfth inductor L12, the thirteenth inductor L13, the fourteenth inductor L14, the fifteenth inductor L15, the third high-low frequency crystal oscillator OSC3, the second resistor R2, the third resistor R3, the thirty-ninth resistor R39 and the fortieth resistor R40.
The tenth chip U10 is connected with the first end of the fourth inductor L4 and the first end of the third inductor L3, the second end of the fourth inductor L4 is grounded, and the second end of the third inductor L3 is connected with the first end of the fifty-fourth capacitor C54 and the first end of the fifty-fourth capacitor C50; the second end of the fifty-fourth capacitor C54 is grounded, and the second end of the fifty-third capacitor C50 is connected to the ninth chip U9 through the second resistor R2 and the fifty-third capacitor C53.
The tenth chip U10 is connected to the first end of the eighth inductor L8, the first end of the sixty-fourth capacitor C64, and the first end of the sixty-capacitor C60, the second end of the eighth inductor L8 is connected to the first end of the tenth inductor L10, the first end of the sixty-fifth capacitor C65, the first end of the sixty-sixth capacitor C66, the second end of the sixty-fourth capacitor C64 is grounded, and the second end of the sixty-capacitor C60 is connected to the first end of the fifth inductor L5; the second end of the fifth inductor L5 is connected to the first end of the sixty-first capacitor C61, the first end of the sixth inductor L6, and the first end of the fifty-seventh capacitor C57; the second end of the sixty-first capacitor C61 is grounded, the second end of the sixth inductor L6, the second end of the fifty-seventh capacitor C57, the first end of the fifty-eighth capacitor C58 and the first end of the seventh inductor L7 are connected with the first end of the sixty-second capacitor C62, and the second end of the sixty-second capacitor C62 is grounded; the ninth chip U9 is connected to the second end of the fifty-eighth capacitor C58, the second end of the seventh inductor L7, the first end of the sixty-third capacitor C63, and the second end of the sixty-third capacitor C63 is grounded.
The tenth chip U10 is connected with the first end of the ninth inductor L9, the second end of the ninth inductor L9 is connected with the first end of the seventy-fifth capacitor C75 and the first end of the seventy-fifth capacitor C70, and the second end of the seventy-fifth capacitor C75 is grounded; the second end of the seventy capacitor C70 is connected with the first end of the eleventh inductor L11; the second end of the eleventh inductor L11 is connected to the first end of the seventy-first capacitor C71, the first end of the twelfth inductor L12, the first end of the sixty-seventh capacitor C67, and the second end of the seventy-first capacitor C71 is grounded; the second end of the twelfth inductor L12, the second end of the sixty-seventh capacitor C67, the first end of the thirteenth inductor L13, and the first end of the sixty-eighth capacitor C68 are connected to the first end of the seventy-second capacitor C72, and the second end of the seventy-second capacitor C72 is grounded; the eleventh chip U11 is connected to the second end of the thirteenth inductor L13, the second end of the sixty-eighth capacitor C68, the first end of the seventy-eighth capacitor C78, and the second end of the seventy-eighth capacitor C78 is grounded.
The tenth chip U10 is connected to the first end of the tenth inductor L10, the second end of the eighth inductor L8, the first end of the sixty-fifth capacitor C65, and the first end of the sixty-sixth capacitor C66; the second end of the sixty-fifth capacitor C65 and the second end of the sixty-sixth capacitor C66 are grounded.
The tenth chip U10 is connected to the first end of the fifteenth inductor L15 and the first end of the eighty-fourth capacitor C84, and the second end of the fifteenth inductor L15 is connected to the first end of the eighty-fifth capacitor C85 and the first end of the eighty-capacitor C80; a second end of the eighty-fourth capacitor C84 and a second end of the eighty-fifth capacitor C85 are grounded; the second end of the eighty capacitor C80 is sequentially connected in series with a thirty-ninth resistor R39 and an eighty-first capacitor C81 which are connected with the eleventh chip U11.
The tenth chip U10 is connected to the first pin of the third high-low frequency crystal oscillator OSC3 and the first end of the seventy-eight capacitor C78, the second pin of the third high-low frequency crystal oscillator OSC3 is connected to the first end of the seventy-nine capacitor C79, and the third pin of the third high-low frequency crystal oscillator OSC3, the second end of the seventy-eight capacitor C78 and the second end of the seventy-nine capacitor C79 are grounded.
The ninth chip U9 is connected with the first end of the second inductor L2 and the first end of the fifty-fifth capacitor C55, the second end of the second inductor L2 is connected with the first end of the fifty-sixth capacitor C56, and the second end of the fifty-fifth capacitor C55 and the second end of the fifty-sixth capacitor C56 are grounded;
the eleventh chip U11 is connected to the first end of the fourteenth inductor L14 and the first end of the eighteenth capacitor C82, and the second end of the fourteenth inductor L14 is connected to the first end of the eighteenth capacitor C83, and the second end of the eighteenth capacitor C82 and the second end of the eighteenth capacitor C83 are grounded.
Example two
A communication system of a smart city network node comprises a plurality of nodes, wherein at least one node is a master node and at least one node is a slave node;
each node comprises a power supply and power supply management circuit, an MCU, a GPRS module or/and BDS module, a network communication bus, a vibration sensor and an ultra-low power consumption wireless data module;
when the vibration sensor circuit detects that the state is changed, the main node MCU sends an alarm code to the remote big data platform through the GPRS module or/and the BDS module, the MCU automatically detects the battery voltage every interval set time and evaluates the residual electric quantity, if the electric quantity is sufficient, the current electric quantity is sent at the transmission period interval wake-up time, otherwise, the data communication module is started in time to inform the big data platform that the big data platform needs to be replaced;
when the period wake-up time arrives, the system firstly checks whether a short message instruction exists, and if so, the system firstly processes the short message instruction, then actively connects to a remote data platform, and if the data platform has an instruction execution instruction, the system does not submit a period report.
As a preferable scheme of the invention, if the node is provided with a sensor network, the node automatically gathers the sensor data at the current moment and actively reports back; the read sensor data can be acquired in a manner that the cloud provides a reference time reference and acquires time setting to achieve quasi-synchronous acquisition;
When the slave node needs to alarm, the slave node MCU exchanges data with the master node ultra-low power consumption module through the ultra-low power consumption wireless module, and the master node is responsible for establishing data bridging between the slave node and the remote data platform through the self ultra-low power consumption module and the GPRS module or/and the BDS module;
when the remote data platform needs to establish communication, the remote data platform directly initiates data to the master node, and the master node wakes up the slave node through the ultra-low power consumption data module to establish data connection for exchanging data or control; when the slave node also needs to bridge other sensors, the data is forwarded and received from the network communication bus; the product is applied to remote meter reading, remote alarm sensors, remote environment sensors and urban manhole cover monitoring.
The network communication bus is communicated through an isolation transformer; the network communication bus provides a structure for external local networking, and node sensors on the network can exchange data with a remote big data platform through a data communication module of the intelligent well lid.
The structure of the vibration sensor is used for actively sending alarm information to a remote big data platform when the vibration detection and the installation direction are changed. The vibration sensor may use a semiconductor acceleration inclination sensor.
The system includes a photovoltaic cell capable of sharing power to the battery to increase battery life. The ultra low power wireless module may use SX1276 series of ICs.
The intelligent city network node communication system can be used as a data communication method for remote meter reading, a remote alarm sensor, a remote environment sensor, city manhole cover monitoring and the like.
Example III
As shown in FIG. 1, in the communication system of the smart city network node disclosed by the invention, the nodes are divided into a master node and a slave node, the master node and the slave node are integrated, the slave node exchanges data with the master node through an ultra-low power consumption module, and the master node exchanges data with a remote mode through a GPRS/BDS module. And the remote can acquire the capacity and the method of the data of the sensor on the bus through the network data bus of the slave node after the communication is established between the master node and the slave node.
The smart city network node communication system comprises 6 functional parts. The system comprises a power supply and power supply management circuit 1, a main control MCU 2, a GPRS/BDS data module 3, a network communication bus 4, a vibration sensor 5 and an ultra-low power consumption wireless data module 6, wherein the whole system is sealed in a plastic container.
When the vibration sensor circuit 5 detects that the state is changed, the main node MCU sends an alarm code to the remote big data platform through the GPRS/BDS module, the MCU automatically detects the battery voltage every hour and evaluates the residual electric quantity, if the electric quantity is sufficient, the current electric quantity is sent at the wake-up time of the sending period interval, otherwise, the data communication module is started in time to inform the big data platform that the big data platform needs to be replaced. When the period wake-up time arrives, the system firstly checks whether a short message instruction exists, and if so, the system firstly processes the short message instruction, then actively connects to a remote data platform, and if the data platform has an instruction execution instruction, the system does not submit a period report. If the node is provided with the sensor network, the node automatically gathers the sensor data at the current moment and actively reports back. The cloud can provide a reference time reference and acquire time setting to acquire the sensor data in a quasi-synchronous acquisition mode. When the slave node needs to alarm, the slave node MCU exchanges data with the master node ultra-low power consumption module through the ultra-low power consumption wireless module, and the master node is responsible for establishing data bridging between the slave node and the remote data platform through the self ultra-low power consumption module and the GPRS/BDS module. When the remote data platform needs to establish communication, the remote data platform directly initiates data to the master node, and the master node wakes the slave node to establish data connection through the ultra-low power consumption data module to exchange data or control. When the slave node also needs to bridge other sensors, the data is forwarded and received from the network communication bus. The product can be applied to remote meter reading, remote alarm sensors, remote environment sensors, urban manhole cover monitoring and the like.
The power supply and power management circuit comprises a battery, an LDO and a controllable power switch. Wherein, the battery BAT2 is the main working power supply of the system, and the power supply circuit formed by the capacitors C39C 40C 38 and U6 provides uninterrupted power supply for the MCU. The controllable DCDC composed of the capacitor C43C 44C 45C 49C 42C 48C 46C 47 resistor R37R 36R 38 diode D2 inductor L1 and U7 provides a turn-off power source for the GPRS data module, and a control signal is sent from the GPS_S of the MCU to the 3-pin EN control port of U7 through R37. The circuit is provided with an optional BAT3 (solar cell) which provides a longer standby time.
The MCU is composed of the U1 of FIG. 3, the high-low frequency crystal oscillator OSC1 OSC2 power failure monitoring U2 auxiliary battery BAT1 and other accessories such as a plurality of resistance capacitors and the like, and mainly provides synchronous serial port and AD sampling of serial port ISP, battery voltage detection, disconnection detection and mechanical motion detection action control capability. The circuit formed by R17R 21R 22R 23M 2 is used for collecting the voltage condition of the main battery and evaluating the residual electric quantity. And after the acquisition is finished, the M2 is turned off to avoid extra power consumption current of the circuit. The P1 port is used for debugging and filling programs.
The GPRS data module consists of a SIM card circuit formed by C20C 16C 21C 23C 24C 25C 26C 22U 3, a D1 LED 1C 33C 32C 31C 35C 37C 41R 29R 30R 31R 32R 33, an antenna ANT1 BT-ANT and a module U5. The communication system is mainly responsible for data communication between the MCU and the cloud, is started when necessary, and is closed after the communication is finished.
The network communication bus consists of a chip U4 resistor R15R 16R 18R 20R 24R 28 capacitor C27C 29C 28C 30 MOS M3 and a network transformer B2. The method mainly provides the conversion of the data signal mode, and is mainly characterized by low power consumption and high isolation, and the reliability and IPI level of the product can be improved. R20 acts as a termination device resistor, and R18R 19 is a configurable termination resistor, which may be configured to determine whether the resistor is loaded or unloaded.
The vibration sensor consists of a decoupling capacitor C51C 52 resistor R43R 42 and a sensor U1, and is mainly used for waking up the MCU in time through interruption when a product senses large vibration and the product turns over, so that the MCU processes an alarm signal to inform the cloud.
The ultra-low power consumption wireless data module consists of U1U 9U 11, C9C 50C 53C 54C 55C 56C 57C 58C 59C 60C 61C 62C 63C 64C 65C 66C 67C 68C 69C 70C 71C 72C 73C 74C 75C 76C 77C 79C 80C 81C 82C 83C 84C 85C 86C 87C 88C 89, L2L 3L 4L 5L 6L 7L 8L 9L 10L 11L 12L 13L 14L 15R 2R 3R 39R 40.
In summary, the communication system of the smart city network node provided by the invention can realize low-power consumption communication of each network node. The device is integrated with master device and slave device, when in use, the master device is responsible for connecting with a network data platform through a GPRS/BDS data module, and the slave node exchanges data with the master device through a low-power-consumption data channel.
The description and applications of the present invention herein are illustrative and are not intended to limit the scope of the invention to the embodiments described above. Variations and modifications of the embodiments disclosed herein are possible, and alternatives and equivalents of the various components of the embodiments are known to those of ordinary skill in the art. It will be clear to those skilled in the art that the present invention may be embodied in other forms, structures, arrangements, proportions, and with other assemblies, materials, and components, without departing from the spirit or essential characteristics thereof. Other variations and modifications of the embodiments disclosed herein may be made without departing from the scope and spirit of the invention.

Claims (1)

1. The intelligent city network node communication system is characterized by comprising a plurality of nodes, wherein at least one node is a master node and at least one node is a slave node;
each node comprises a power supply and power supply management circuit, an MCU, a data communication module, a network communication bus, a vibration sensor and an ultra-low power consumption wireless data module, and the whole system is sealed in a plastic container; the data communication module comprises a GPRS module or/and a BDS module;
When the vibration sensor circuit detects that the state is changed, the main node MCU sends an alarm code to the remote big data platform through the GPRS module or/and the BDS module, the MCU automatically detects the battery voltage every hour and evaluates the residual electric quantity, if the electric quantity is sufficient, the current electric quantity is sent at the wake-up time of a sending period interval, otherwise, the GPRS module or/and the BDS module is started in time to inform the big data platform that the big data platform needs to be replaced;
when the period wake-up time arrives, the system firstly checks whether a short message instruction exists, if so, the system firstly processes the short message instruction, then actively connects to a remote data platform, and if the data platform has an instruction execution instruction, the system submits a period report;
if the node is provided with a sensor network, the node automatically gathers the sensor data at the current moment and actively reports back; the read sensor data can be acquired in a manner that the cloud provides a reference time reference and acquires time setting to achieve quasi-synchronous acquisition;
when the slave node needs to alarm, the slave node MCU exchanges data with the master node ultra-low power consumption module through the ultra-low power consumption wireless module, and the master node is responsible for establishing data bridging between the slave node and the remote data platform through the self ultra-low power consumption module and the GPRS module or/and the BDS module;
When the remote data platform needs to establish communication, the remote data platform directly initiates data to the master node, and the master node wakes up the slave node through the ultra-low power consumption data module to establish data connection for exchanging data or control; when the slave node also needs to bridge other sensors, the data is forwarded and received from the network communication bus; the product is applied to remote meter reading, remote alarm sensors, remote environment sensors and urban manhole cover monitoring;
the power supply and power management circuit comprises a battery, a voltage regulator LDO and a controllable power switch; the battery BAT3 is a main working power supply of the system, and is a solar battery, and a power supply circuit formed by a thirty-ninth capacitor C39, a fortieth capacitor C40, a thirty-eighth capacitor C38 and a sixth chip U6 provides uninterrupted power supply for the MCU;
the positive pole VCC of the battery BAT3 is connected with the input port of the sixth chip U6, the positive pole of the thirty-ninth capacitor C39 and the positive pole of the fortieth capacitor C40, the input port of the sixth chip U6 is connected with the positive pole of the thirty-eighth capacitor C38, the negative pole of the thirty-ninth capacitor C39, the negative pole of the fortieth capacitor C40, the negative pole of the thirty-eighth capacitor C38 and the negative pole of the battery BAT3 are grounded;
the controllable DCDC composed of a forty-third capacitor C43, a forty-fourth capacitor C44, a forty-fifth capacitor C45, a forty-ninth capacitor C49, a forty-second capacitor C42, a forty-eighth capacitor C48, a forty-sixth capacitor C46, a forty-seventh capacitor C47, a thirty-seventh resistor R37, a thirty-sixth resistor R36, a thirty-eighth resistor R38, a second diode D2, a first inductor L1 and a seventh chip U7 provides a power supply capable of being turned off for the data communication module, and a control signal is supplied from GPS_S of the MCU to a third pin EN control port of the seventh chip U7 through the thirty-seventh resistor R37;
The positive electrode of the battery BAT3 is connected with the positive electrode of the forty-third capacitor C43, the positive electrode of the forty-fourth capacitor C44, the positive electrode of the forty-fifth capacitor C45 and the VIN port of the seventh chip U7, the EN port of the seventh chip U7 is connected with the MCU through a thirty-seventh resistor, and the SS port of the seventh chip U7 is grounded; the seventh port of the seventh chip U7 is connected with the first end of the forty-second capacitor C42, and the SW port of the seventh chip U7 is connected with the second end of the forty-second capacitor C42, the cathode of the second diode D2 and the first end of the first inductor L1; the GS port of the seventh chip U7 and the anode of the second diode D2 are grounded; the second end of the first inductor L1 is connected with the first end of a forty-eighth capacitor C48, the first end of a thirty-sixth resistor R36, the positive electrode of the forty-sixth capacitor C46 and the positive electrode of a forty-seventh capacitor C47; the FB port of the seventh chip U7 is connected with the second end of the forty-eighth capacitor C48, the second end of the thirty-sixth resistor R36 and the first end of the thirty-eighth resistor R38, and the second end of the thirty-eighth resistor R38 is grounded;
the MCU comprises a first chip U1, a first high-low frequency crystal oscillator OSC1, a second high-low frequency crystal oscillator OSC2, a power-down monitoring chip U2, an auxiliary battery BAT1, a plurality of resistors and a plurality of capacitors; the system mainly provides serial ISP synchronous serial port and AD sampling, battery voltage detection, disconnection detection and mechanical motion detection action control capability; the circuit formed by the seventeenth resistor R17, the twenty first resistor R21, the twenty second resistor R22, the twenty third resistor R23 and the second MOS tube M2 is used for collecting the voltage condition of the main battery and evaluating the residual electric quantity; after the acquisition is finished, the second MOS tube M2 is turned off to avoid extra power consumption current of the circuit; the P1 port is used for debugging and program filling;
The second end of the seventeenth resistor R17 is connected with the drain electrode of the second MOS tube M2, the grid electrode of the second MOS tube M2 is connected with the first end of the twenty-first resistor R21, and the source electrode of the second MOS tube M2 is respectively connected with the first end of the twenty-second resistor R22 and the first end of the twenty-third resistor R23; the second end of the twenty-third resistor R23 is grounded;
the data communication module comprises a SIM card circuit and a communication circuit; the SIM card circuit comprises a third chip U3, a twenty-first capacitor C20, a sixteenth capacitor C16, a twenty-third capacitor C23, a twenty-fourth capacitor C24, a twenty-fifth capacitor C25, a twenty-sixth capacitor C26 and a twenty-second capacitor C22;
the DAT pin of the third chip U3 is respectively connected with the first end of the twentieth capacitor C20 and the first end of the sixteenth capacitor C16; the second end of the twentieth capacitor C20 and the second end of the sixteenth capacitor C16 are grounded respectively;
the CLK pin of the third chip U3 is respectively connected with the first end of the twenty-first capacitor C21 and the first end of the twenty-third capacitor C23; the REST pin of the third chip U3 is respectively connected with the first end of the twenty-fourth capacitor C24 and the first end of the twenty-fifth capacitor C25; the VCC pin of the third chip U3 is respectively connected with the first end of the twenty-sixth capacitor C26 and the first end of the twenty-second capacitor C22;
The second end of the twenty-first capacitor C21, the second end of the twenty-third capacitor C23, the second end of the twenty-fourth capacitor C24, the second end of the twenty-fifth capacitor C25, the second end of the twenty-sixth capacitor C26 and the second end of the twenty-second capacitor C22 are respectively grounded;
the communication circuit comprises a fifth chip U5, a first diode D1, a first LED lamp LED1, a thirty-third capacitor C33, a thirty-second capacitor C32, a thirty-first capacitor C31, a thirty-fifth capacitor C35, a thirty-fourth capacitor C34, a thirty-seventh capacitor C37, a thirty-sixth capacitor C36, a forty-first capacitor C41, a twenty-ninth resistor R29, a thirty-first resistor R30, a thirty-second resistor R31, a thirty-third resistor R32, a thirty-fourth resistor R33, a thirty-fifth resistor R35 and antennas ANT1BT-ANT; the communication system is mainly responsible for data communication between the MCU and the cloud, is started when necessary, and is closed after the communication is finished;
the negative electrode of the first diode D1 is connected with the first end of the thirty-third capacitor C33, the first end of the thirty-second capacitor C32, the first end of the thirty-first capacitor C31, the positive electrode of the thirty-fifth capacitor C35, the positive electrode of the thirty-fourth capacitor C34 and the fifth chip U5, the second end of the thirty-third capacitor C33, the second end of the thirty-second capacitor C32, the second end of the thirty-first capacitor C31, the negative electrode of the thirty-fifth capacitor C35 and the negative electrode of the thirty-fourth capacitor C34 are grounded;
An eighteenth pin of the fifth chip U5 is respectively connected with a second end of the forty-first capacitor C41 and a first end of the thirty-fifth resistor R35; the second end of the thirty-fifth resistor R35 is connected with the anode of the first LED lamp LED1, and the cathode of the first LED lamp LED1 and the first end of the forty-first capacitor C41 are respectively grounded;
the eleventh pin of the fifth chip U5 is connected with the second end of the third fourth resistor R34, and the first end of the third fourth resistor R34 is respectively connected with the positive electrode of the thirty-seventh capacitor C37 and the first end of the thirty-sixth capacitor C36; the negative electrode of the thirty-seventh capacitor C37 and the second end of the thirty-sixth capacitor C36 are respectively grounded;
the thirty-third pin of the fifth chip U5 is connected with the first end of the twenty-ninth resistor R29, the thirty-second pin of the fifth chip U5 is connected with the first end of the thirty-first resistor R30, the thirty-first pin of the fifth chip U5 is connected with the first end of the thirty-first resistor R31, the thirty-second pin of the fifth chip U5 is connected with the first end of the thirty-second resistor R32, and the twenty-ninth pin of the fifth chip U5 is connected with the first end of the thirty-third resistor R33;
the network communication bus comprises a fourth chip U4, a fifteenth resistor R15, a sixteenth resistor R16, an eighteenth resistor R18, a twentieth resistor R20, a nineteenth resistor R19, a twenty-fourth resistor R24, an eighth resistor R28, a seventeenth capacitor C17, a twenty-seventh capacitor C27, a twenty-ninth capacitor C29, a twenty-eighth capacitor C28, a thirty-eighth capacitor C30, a third MOS tube M3 and a network transformer B2; the method mainly provides the conversion of the data signal mode, realizes low power consumption and high isolation, and improves the reliability and IPI level of the product; the twentieth resistor R20 serves as a terminal device resistor, the eighteenth resistor R18 and the nineteenth resistor R19 are configurable terminal resistors, and the configuration determines whether the resistor is loaded or unloaded;
The sixth pin of the fourth chip U4 is connected with the first end of a twenty-seventh capacitor C27, and the second end of the twenty-seventh capacitor C27 is grounded; the seventh pin, the eighth pin and the ninth pin of the fourth chip U4 are respectively connected with the first end of the twenty-ninth capacitor C29, and the second end of the twenty-ninth capacitor C29 is grounded;
the sixteenth pin of the fourth chip U4 is connected with the first end of the sixteenth resistor R16, the second end of the sixteenth resistor R16 is respectively connected with the fifteenth pin of the fourth chip U4 and the second end of the fifteenth resistor R15, and the first end of the fifteenth resistor R15 is grounded;
the eleventh pin of the fourth chip U4 is respectively connected with the first end of the eighteenth resistor R18 and the ninth pin of the network transformer B2; the tenth pin of the fourth chip U4 is respectively connected with the first end of the nineteenth resistor R19 and the eleventh pin of the network transformer B2;
the tenth pin and the fifteenth pin of the network transformer B2 are respectively connected with the second end of the seventeenth capacitor C17, and the first end of the seventeenth capacitor C17 is grounded; the fourteenth pin of the network transformer B2 is connected with the second end of the twentieth resistor R20, and the sixteenth pin of the network transformer B2 is connected with the first end of the twentieth resistor R20;
the second end of the eighteenth resistor R18 is connected with the sixth pin of the third MOS tube M3, and the second end of the nineteenth resistor R19 is connected with the fourth pin of the third MOS tube M3; the fifth pin of the third MOS tube M3 is grounded;
The first pin of the third MOS tube M3 is respectively connected with the second end of the second fourth resistor R24, the first end of the thirty-eighth capacitor C30, the first end of the twenty-eighth resistor R28 and the third pin of the third MOS tube M3;
the second pin of the third MOS tube M3, the second end of the thirty-eighth capacitor C30 and the second end of the twenty-eighth resistor R28 are respectively grounded;
the vibration sensor comprises a fifty-first decoupling capacitor C51, a fifty-second decoupling capacitor C52, a forty-third resistor R43, a forty-second resistor R42 and a sensor U8, and is mainly used for waking up the MCU in time through interruption when a product senses large vibration and the product turns over, so that the MCU processes an alarm signal to inform the cloud; the vibration sensor uses a semiconductor acceleration inclination sensor;
the fourteenth pin Vdd pin of the sensor U8 is connected to the first end of the forty-second resistor R42, the first end of the forty-third resistor R43, the first end of the fifty-first decoupling capacitor C51, and the first end of the fifty-second decoupling capacitor C52, respectively;
the ninth pin INT2 pin of the sensor U8 is connected with the second end of the forty-second resistor R42, and the eleventh pin INT1 of the sensor U8 is connected with the second end of the forty-third resistor R43; the second end of the fifty-first decoupling capacitor C51 and the second end of the fifty-second decoupling capacitor C52 are respectively grounded;
The ultra-low power wireless data module includes a tenth chip U10, a ninth chip U9, an eleventh chip U11, and a ninth capacitor C9, a fifty-seventh capacitor C50, a fifty-third capacitor C53, a fifty-fourth capacitor C54, a seventeenth capacitor C55, a seventeenth capacitor C56, a seventeenth capacitor C57, a fifty-eighth capacitor C58, a fifty-ninth capacitor C59, a sixty-fourth capacitor C60, a sixty-first capacitor C61, a sixty-second capacitor C62, a sixty-third capacitor C63, a sixty-fourth capacitor C64, a sixty-fifth capacitor C65, a sixty-sixth capacitor C66, a sixty-seventh capacitor C67, a sixty-eighth capacitor C68, a sixty-ninth capacitor C69, a seventeenth capacitor C70, a seventy-first capacitor C71, a seventy-second capacitor C72, a seventy-third capacitor C73, a seventy-fourth capacitor C74, a seventy-fifth capacitor C75, a seventy-sixth capacitor C76, a seventy-seventh capacitor C77, a seventy-eighth capacitor C78, a seventy-eighth capacitor C86, a seventy-eighth capacitor C82, the second inductor L2, the third inductor L3, the fourth inductor L4, the fifth inductor L5, the sixth inductor L6, the seventh inductor L7, the eighth inductor L8, the ninth inductor L9, the tenth inductor L10, the eleventh inductor L11, the twelfth inductor L12, the thirteenth inductor L13, the fourteenth inductor L14, the fifteenth inductor L15, the third high-low frequency crystal oscillator OSC3, the second resistor R2, the third resistor R3, the thirty-ninth resistor R39 and the fortieth resistor R40;
The tenth chip U10 is connected with the first end of the fourth inductor L4 and the first end of the third inductor L3, the second end of the fourth inductor L4 is grounded, and the second end of the third inductor L3 is connected with the first end of the fifty-fourth capacitor C54 and the first end of the fifty-fourth capacitor C50; the second end of the fifty-fourth capacitor C54 is grounded, and the second end of the fifty-third capacitor C50 is connected with the ninth chip U9 through a second resistor R2 and a fifty-third capacitor C53;
the tenth chip U10 is connected to the first end of the eighth inductor L8, the first end of the sixty-fourth capacitor C64, and the first end of the sixty-capacitor C60, the second end of the eighth inductor L8 is connected to the first end of the tenth inductor L10, the first end of the sixty-fifth capacitor C65, the first end of the sixty-sixth capacitor C66, the second end of the sixty-fourth capacitor C64 is grounded, and the second end of the sixty-capacitor C60 is connected to the first end of the fifth inductor L5; the second end of the fifth inductor L5 is connected to the first end of the sixty-first capacitor C61, the first end of the sixth inductor L6, and the first end of the fifty-seventh capacitor C57; the second end of the sixty-first capacitor C61 is grounded, the second end of the sixth inductor L6, the second end of the fifty-seventh capacitor C57, the first end of the fifty-eighth capacitor C58 and the first end of the seventh inductor L7 are connected with the first end of the sixty-second capacitor C62, and the second end of the sixty-second capacitor C62 is grounded; the ninth chip U9 is connected with the second end of the fifty-eighth capacitor C58, the second end of the seventh inductor L7, the first end of the sixty-third capacitor C63, and the second end of the sixty-third capacitor C63 is grounded;
The tenth chip U10 is connected with the first end of the ninth inductor L9, the second end of the ninth inductor L9 is connected with the first end of the seventy-fifth capacitor C75 and the first end of the seventy-fifth capacitor C70, and the second end of the seventy-fifth capacitor C75 is grounded; the second end of the seventy capacitor C70 is connected with the first end of the eleventh inductor L11; the second end of the eleventh inductor L11 is connected to the first end of the seventy-first capacitor C71, the first end of the twelfth inductor L12, the first end of the sixty-seventh capacitor C67, and the second end of the seventy-first capacitor C71 is grounded; the second end of the twelfth inductor L12, the second end of the sixty-seventh capacitor C67, the first end of the thirteenth inductor L13, and the first end of the sixty-eighth capacitor C68 are connected to the first end of the seventy-second capacitor C72, and the second end of the seventy-second capacitor C72 is grounded; the eleventh chip U11 is connected to the second end of the thirteenth inductor L13, the second end of the sixty-eighth capacitor C68, the first end of the seventy-eighth capacitor C78, and the second end of the seventy-eighth capacitor C78 is grounded;
the tenth chip U10 is connected to the first end of the tenth inductor L10, the second end of the eighth inductor L8, the first end of the sixty-fifth capacitor C65, and the first end of the sixty-sixth capacitor C66; a second end of the sixty-fifth capacitor C65 and a second end of the sixty-sixth capacitor C66 are grounded;
The tenth chip U10 is connected to the first end of the fifteenth inductor L15 and the first end of the eighty-fourth capacitor C84, and the second end of the fifteenth inductor L15 is connected to the first end of the eighty-fifth capacitor C85 and the first end of the eighty-capacitor C80; a second end of the eighty-fourth capacitor C84 and a second end of the eighty-fifth capacitor C85 are grounded; the second end of the eighty capacitor C80 is sequentially connected with a thirty-ninth resistor R39 and an eighty-first capacitor C81 in series and is connected with an eleventh chip U11;
the tenth chip U10 is connected with the first pin of the third high-low frequency crystal oscillator OSC3 and the first end of the seventy-eighth capacitor C78, the second pin of the third high-low frequency crystal oscillator OSC3 is connected with the first end of the seventy-ninth capacitor C79, and the third pin of the third high-low frequency crystal oscillator OSC3, the second end of the seventy-eighth capacitor C78 and the second end of the seventy-ninth capacitor C79 are grounded;
the ninth chip U9 is connected with the first end of the second inductor L2 and the first end of the fifty-fifth capacitor C55, the second end of the second inductor L2 is connected with the first end of the fifty-sixth capacitor C56, and the second end of the fifty-fifth capacitor C55 and the second end of the fifty-sixth capacitor C56 are grounded;
the eleventh chip U11 is connected to the first end of the fourteenth inductor L14 and the first end of the eighteenth capacitor C82, and the second end of the fourteenth inductor L14 is connected to the first end of the eighteenth capacitor C83, and the second end of the eighteenth capacitor C82 and the second end of the eighteenth capacitor C83 are grounded.
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