CN106131228A

CN106131228A - Smart city network node communication system

Info

Publication number: CN106131228A
Application number: CN201610799395.5A
Authority: CN
Inventors: 蒋闯
Original assignee: Individual
Current assignee: Shanghai Fujin Information Technology Co ltd
Priority date: 2016-08-31
Filing date: 2016-08-31
Publication date: 2016-11-16
Anticipated expiration: 2036-08-31
Also published as: CN106131228B

Abstract

Present invention is disclosed a kind of smart city network node communication system, if including dry contact, at least one node is that host node, at least one node are for from node；Each node all includes that power supply and electric power management circuit, MCU, GPRS module are or/and BDS module, network communication bus, shaking sensor, ultra-low power consumption wireless data module；When shaking sensor electric circuit inspection to state changes, host node MCU encodes by GPRS module alarm or/and BDS module is sent to the big data platform of far-end, and MCU is per hour automatically to battery voltage detection, and assesses dump energy；Arriving when the periodic awakening time, system has first checked whether short-message instruction, first processes if had, and next is actively connected to teledata platform, as data platform has instruction to perform instruction, the most just submits periodic report.The smart city network node communication system that the present invention proposes, can realize each network node low-power consumption communication.

Description

Smart city network node communication system

Technical field

The invention belongs to technology of Internet of things field, relate to a kind of network node communication system, particularly relate to a kind of wisdom city City's network node communication system.

Background technology

In order to develop smart city and underground Intelligent pipe net technology, bring convenient management to city, need to city portion Administration's network sensor.Due to some sensor applied environment limit and signal transmission problem, need solve power consumption and The problem that signal penetrates.But, current equipment cannot realize said process well.

In view of this, nowadays in the urgent need to designing a kind of new network node communication modes, in order to overcome existing communication side The drawbacks described above that formula exists.

Summary of the invention

The technical problem to be solved is: provide a kind of smart city network node communication system, can realize each Individual network node low-power consumption communication.

For solving above-mentioned technical problem, the present invention adopts the following technical scheme that

A kind of smart city network node communication system, if described network node communication system includes dry contact, at least one Node is that host node, at least one node are for from node；

Each node all include power supply and electric power management circuit, MCU, GPRS module or/and BDS module, network communication bus, Shaking sensor, ultra-low power consumption wireless data module, a holonomic system of composition, whole system is enclosed in plastic containers；

When shaking sensor electric circuit inspection to state changes when, host node MCU passes through GPRS alarm coding Module is or/and BDS module is sent to the big data platform of far-end, and MCU is per hour automatically to battery voltage detection, and assesses residue electricity Amount, if electricity is sufficient, that is sending period distances wakeup time transmission current electric quantity, otherwise timely turn-on data communication module Inform that big data platform needs to change；

Arriving when the periodic awakening time, system has first checked whether short-message instruction, first processes if had, the most actively It is connected to teledata platform, as data platform has instruction to perform instruction, the most just submits periodic report；

If node is with sensor network, node is automatically collected the sensing data of current time and is actively returned report； Reading sensing data can be provided reference time benchmark and acquisition set of time to reach the side of plesiochronous collection by high in the clouds Formula gathers；

When needing alarm from node, from node M CU by ultra-low power consumption wireless module and host node super low-power consumption module Exchange data, host node be responsible for from node and teledata platform by self super low-power consumption module and GPRS module or/ Data Bridge is set up with BDS module；

Directly data are initiated to host node, host node by teledata platform when teledata platform needs to set up communication Waken up up by super low-power consumption data module and set up data cube computation exchange data from node or be controlled；When also needing to bridge from node The when of connecing other sensors, data turn receipts from network communication Bus repeater again；Products application passes in remote meter reading, remote alarms Sensor, remote environment sensor and the monitoring of city manhole cover；

Power supply and electric power management circuit comprise battery, manostat LDO and controllable on and off switch；Wherein, battery BAT3 is system groundwork power supply, for solaode, the 39th electric capacity C39, the 40th electric capacity C40, the 38th electricity The power circuit holding C38 and the 6th chip U6 composition provides continual power supply to MCU；

The positive pole VCC of battery BAT3 connect the input port of the 6th chip U6, the positive pole of the 39th electric capacity C39, the 4th The positive pole of ten electric capacity C40, the input port of the 6th chip U6 connects the positive pole of the 38th electric capacity C38, the 39th electric capacity C39 Negative pole, the negative pole of the 40th electric capacity C40, the negative pole of the 38th electric capacity C38, the minus earth of battery BAT3；

By the 43rd electric capacity C43, the 44th electric capacity C44, the 45th electric capacity C45, the 49th electric capacity C49, 42 electric capacity C42, the 48th electric capacity C48, the 46th electric capacity C46, the 47th electric capacity C47, the 37th resistance R37, the 36th resistance R36, the 38th resistance R38, the second diode D2, the first inductance L1 and the 7th chip U7 composition Controlled DCDC provides the power supply that can turn off to data communication module, and control signal passes through the 37th resistance from the GPS_S of MCU R37 is given to the 3rd foot EN of the 7th chip U7 and controls port；

The positive pole of battery BAT3 connect the positive pole of the 43rd electric capacity C43, the positive pole of the 44th electric capacity C44, the 40th The positive pole of five electric capacity C45, the VIN port of the 7th chip U7, the EN port of the 7th chip U7 is connected by the 37th resistance The SS port ground connection of MCU, the 7th chip U7；7th port of the 7th chip U7 connects first end of the 42nd electric capacity C42, the The SW port of seven chip U7 connect second end of the 42nd electric capacity C42, the negative pole of the second diode D2, the of the first inductance L1 One end；The GS port of the 7th chip U7, the plus earth of the second diode D2；Second end of the first inductance L1 connects the 48th First end of electric capacity C48, first end of the 36th resistance R36, the positive pole of the 46th electric capacity C46, the 47th electric capacity C47 Positive pole；The FB port of the 7th chip U7 connect second end of the 48th electric capacity C48, second end of the 36th resistance R36, First end of the 38th resistance R38, the second end ground connection of the 38th resistance R38；

Described MCU includes the first chip U1, the first low-and high-frequency crystal oscillator OSC1, the second low-and high-frequency crystal oscillator OSC2, down Monitor Unit Chip U2, boosting battery BAT1, some resistance, some electric capacity；Main offer serial ports ISP synchronous serial interface and AD sampling, and Battery voltage detection, burn out detection, mechanical movement detection action control ability；Wherein, the 17th resistance R17, the 21st electricity Resistance R21, the 22nd resistance R22, the 23rd resistance R23, the circuit of the second metal-oxide-semiconductor M2 composition are used for gathering the electricity of main battery Pressure situation, is used for assessing dump energy；Gather and turn off the second metal-oxide-semiconductor M2 after terminating and avoid the extra static current of lcd of circuit；Pass through P1 mouth is used for debugging and filling program；

Described data communication module includes SIM circuit, communicating circuit；SIM circuit include the 3rd chip U3, the 20th Electric capacity C20, the 16th electric capacity C16, the 21st electric capacity C21, the 23rd electric capacity C23, the 24th electric capacity C24, the 20th Five electric capacity C25, the 26th electric capacity C26, the 22nd electric capacity C22；

Communicating circuit include fifth chip U5, the first diode D1, the first LED LED1, the 33rd electric capacity C33, 32 electric capacity C32, the 31st electric capacity C31, the 35th electric capacity C35, the 34th electric capacity C34, the 37th electric capacity C37, the 36th electric capacity C36, the 41st electric capacity C41, the 29th electric capacity R29, the 30th electric capacity R30, the 31st electricity Hold R31, the 32nd electric capacity R32, the 33rd electric capacity R33 and antenna ANT1BT-ANT；Main responsible MCU and the number in high in the clouds According to communication, open the when of necessary, the complete closedown of communication；

The negative pole of the first diode D1 connect first end of the 33rd electric capacity C33, the first of the 32nd electric capacity C32 End, first end of the 31st electric capacity C31, the positive pole of the 35th electric capacity C35, the positive pole of the 34th electric capacity C34, the 5th core Sheet U5, second end of the 33rd electric capacity C33, second end of the 32nd electric capacity C32, second end of the 31st electric capacity C31, The negative pole of the 35th electric capacity C35, the minus earth of the 34th electric capacity C34；

Described network communication bus includes fourth chip U4, the 15th resistance R15, the 16th resistance R16, the 18th resistance R18, the 20th resistance R20, the 19th resistance R19, the 24th resistance R24, the 28th resistance R28, the 27th electric capacity C27, the 29th electric capacity C29, the 28th electric capacity C28, the 30th electric capacity C30, the 3rd metal-oxide-semiconductor M3 and network transformer B2；The main conversion providing data signal mode, it is achieved low-power consumption high isolation, improves reliability and the IPI grade of product；Second Ten resistance R20 serve as terminal unit resistance, and the 18th resistance R18, the 19th resistance R19 are terminal resistances that can arrange, Determined that bringing onto load resistance is still without load resistance by configuration；

Shaking sensor includes the 51st moving back even electric capacity C51, the 52nd moving back even electric capacity C52, the 43rd resistance R43, the 42nd resistance R42 and sensor U1, Main Function is when product perceives big vibrations and product upset Wake up MCU up by interruption in time, allow MCU process warning signal notice high in the clouds；Shaking sensor uses semiconductor acceleration inclination angle Sensor；

Ultra-low power consumption wireless data module includes the tenth chip U10, the 9th chip U9, the 11st chip U11 and the 9th Electric capacity C9, the 50th electric capacity C50, the 53rd electric capacity C53, the 54th electric capacity C54, the 55th electric capacity C55, the 56th Electric capacity C56, the 57th electric capacity C57, the 58th electric capacity C58, the 59th electric capacity C59, the 60th electric capacity C60, the 60th One electric capacity C61, the 62nd electric capacity C62, the 63rd electric capacity C63, the 64th electric capacity C64, the 65th electric capacity C65, 66 electric capacity C66, the 67th electric capacity C67, the 68th electric capacity C68, the 69th electric capacity C69, the 70th electric capacity C70, 71st electric capacity C71, the 72nd electric capacity C72, the 73rd electric capacity C73, the 74th electric capacity C74, the 75th electric capacity C75, the 76th electric capacity C76, the 77th electric capacity C77, the 78th electric capacity C78, the 79th electric capacity C79, the 80th electricity Hold C80, the 81st electric capacity C81, the 82nd electric capacity C82, the 83rd electric capacity C83, the 84th electric capacity C84, the 80th Five electric capacity C85, the 86th electric capacity C86, the 87th electric capacity C87, the 88th electric capacity C88, the 89th electric capacity C89, the Two inductance L2, the 3rd inductance L3, the 4th inductance L4, the 5th inductance L5, the 6th inductance L6, the 7th inductance L7, the 8th inductance L8, Nine inductance L9, the tenth inductance L10, the 11st inductance L11, the 12nd inductance L12, the 13rd inductance L13, the 14th inductance L14, 15th inductance L15, the 3rd low-and high-frequency crystal oscillator OSC3, the second resistance R2, the 3rd resistance R3, the 39th resistance R39, the 40th Resistance R40；

Tenth chip U10 connects first end of the 4th inductance L4, first end of the 3rd inductance L3, the second of the 4th inductance L4 End ground connection, second end of the 3rd inductance L3 connects first end of the 54th electric capacity C54, first end of the 50th electric capacity C50；The The second end ground connection of 54 electric capacity C54, second end of the 50th electric capacity C50 passes through the second resistance R2, the 53rd electric capacity C53 Connect the 9th chip U9；

Tenth chip U10 connects first end of the 8th inductance L8, first end of the 64th electric capacity C64, the 60th electric capacity First end of C60, the 8th inductance L8 second end connect first end of the tenth inductance L10, the first of the 65th electric capacity C65 End, first end of the 66th electric capacity C66, the second end ground connection of the 64th electric capacity C64, second end of the 60th electric capacity C60 Connect first end of the 5th inductance L5；Second end of the 5th inductance L5 connects first end of the 61st electric capacity C61, the 6th inductance First end of L6, first end of the 57th electric capacity C57；The second end ground connection of the 61st electric capacity C61, the of the 6th inductance L6 Two ends, second end of the 57th electric capacity C57, first end of the 58th electric capacity C58, first end of the 7th inductance L7 connect the First end of 62 electric capacity C62, the second end ground connection of the 62nd electric capacity C62；9th chip U9 connects the 58th electric capacity Second end of C58, second end of the 7th inductance L7, first end of the 63rd electric capacity C63, the second of the 63rd electric capacity C63 End ground connection；

Tenth chip U10 connects first end of the 9th inductance L9, and second end of the 9th inductance L9 connects the 75th electric capacity First end of C75, first end of the 70th electric capacity C70, the second end ground connection of the 75th electric capacity C75；70th electric capacity C70's Second end connects first end of the 11st inductance L11；Second end of the 11st inductance L11 connects the of the 71st electric capacity C71 One end, first end of the 12nd inductance L12, first end of the 67th electric capacity C67, second termination of the 71st electric capacity C71 Ground；Second end of the 12nd inductance L12, second end of the 67th electric capacity C67, first end of the 13rd inductance L13, the 60th First end of eight electric capacity C68 connects first end of the 72nd electric capacity C72, the second end ground connection of the 72nd electric capacity C72；Tenth One chip U11 connects second end of the 13rd inductance L13, second end of the 68th electric capacity C68, the 78th electric capacity C78 First end, the second end ground connection of the 78th electric capacity C78；

Tenth chip U10 connects first end of the tenth inductance L10, second end of the 8th inductance L8, the 65th electric capacity C65 The first end, first end of the 66th electric capacity C66；Second end of the 65th electric capacity C65, the of the 66th electric capacity C66 Two end ground connection；

Tenth chip U10 connects first end of the 15th inductance L15, first end of the 84th electric capacity C84, the 15th electricity Second end of sense L15 connects first end of the 85th electric capacity C85, first end of the 80th electric capacity C80；84th electric capacity Second end of C84, the second end ground connection of the 85th electric capacity C85；Second end of the 80th electric capacity C80 is sequentially connected in series the 39th Resistance R39, the 81st electric capacity C81 connect the 11st chip U11；

Tenth chip U10 connects first pin of the 3rd low-and high-frequency crystal oscillator OSC3, first end of the 78th electric capacity C78, Second pin of the 3rd low-and high-frequency crystal oscillator OSC3 connects first end of the 79th electric capacity C79, the 3rd low-and high-frequency crystal oscillator OSC3's Three-prong, second end of the 78th electric capacity C78, the second end ground connection of the 79th electric capacity C79；

9th chip U9 connects first end of the second inductance L2, first end of the 55th electric capacity C55, the second inductance L2's Second end connects first end of the 56th electric capacity C56, second end of the 55th electric capacity C55, the of the 56th electric capacity C56 Two end ground connection；

11st chip U11 connection first end of the 14th inductance L14, first end of the 82nd electric capacity C82, the 14th Second end of inductance L14 connects first end of the 83rd electric capacity C83, second end of the 82nd electric capacity C82, the 83rd electricity Hold the second end ground connection of C83.

Each node all include power supply and electric power management circuit, MCU, GPRS module or/and BDS module, network communication bus, Shaking sensor, ultra-low power consumption wireless data module；

When shaking sensor electric circuit inspection to state changes when, host node MCU passes through GPRS alarm coding Module is or/and BDS module is sent to the big data platform of far-end, and MCU, and commented automatically to battery voltage detection at interval of the time of setting Estimating dump energy, if electricity is sufficient, that is sending period distances wakeup time transmission current electric quantity, otherwise timely turn-on data Communication module informs that big data platform needs to change；

Arriving when the periodic awakening time, system has first checked whether short-message instruction, first processes if had, the most actively It is connected to teledata platform, as data platform has instruction to perform instruction, the most just submits periodic report.

As a preferred embodiment of the present invention, if node is with sensor network, node collects current time automatically Sensing data actively return report；Read sensing data and can be provided reference time benchmark and the time of acquisition by high in the clouds Arrange and reach the mode of plesiochronous collection and gather；

Directly data are initiated to host node, host node by teledata platform when teledata platform needs to set up communication Waken up up by super low-power consumption data module and set up data cube computation exchange data from node or be controlled；When also needing to bridge from node The when of connecing other sensors, data turn receipts from network communication Bus repeater again；Products application passes in remote meter reading, remote alarms Sensor, remote environment sensor and the monitoring of city manhole cover.

Battery, manostat LDO and controlled is comprised as a preferred embodiment of the present invention, power supply and electric power management circuit The on and off switch of system；Wherein, battery BAT3 is system groundwork power supply, for solaode, and the 39th electric capacity C39, The power circuit that 40 electric capacity C40, the 38th electric capacity C38 and the 6th chip U6 are constituted provides continual power supply to MCU；

The positive pole of battery BAT3 connect the positive pole of the 43rd electric capacity C43, the positive pole of the 44th electric capacity C44, the 40th The positive pole of five electric capacity C45, the VIN port of the 7th chip U7, the EN port of the 7th chip U7 is connected by the 37th resistance The SS port ground connection of MCU, the 7th chip U7；7th port of the 7th chip U7 connects first end of the 42nd electric capacity C42, the The SW port of seven chip U7 connect second end of the 42nd electric capacity C42, the negative pole of the second diode D2, the of the first inductance L1 One end；The GS port of the 7th chip U7, the plus earth of the second diode D2；Second end of the first inductance L1 connects the 48th First end of electric capacity C48, first end of the 36th resistance R36, the positive pole of the 46th electric capacity C46, the 47th electric capacity C47 Positive pole；The FB port of the 7th chip U7 connect second end of the 48th electric capacity C48, second end of the 36th resistance R36, First end of the 38th resistance R38, the second end ground connection of the 38th resistance R38.

As a preferred embodiment of the present invention, described MCU include the first chip U1, the first low-and high-frequency crystal oscillator OSC1, Two low-and high-frequency crystal oscillator OSC2, down Monitor Unit chip U2, boosting battery BAT1, some resistance, some electric capacity；Serial ports is mainly provided ISP synchronous serial interface and AD sampling, and battery voltage detection, burn out detection, mechanical movement detection action control ability；Its In, the 17th resistance R17, the 21st resistance R21, the 22nd resistance R22, the 23rd resistance R23, the second metal-oxide-semiconductor M2 The circuit of composition is used for gathering the voltage condition of main battery, is used for assessing dump energy；Collection turns off the second metal-oxide-semiconductor M2 after terminating Avoid the static current of lcd that circuit is extra；It is used for debugging and filling program by P1 mouth.

As a preferred embodiment of the present invention, described data communication module includes SIM circuit, communicating circuit；SIM Circuit includes the 3rd chip U3, the 20th electric capacity C20, the 16th electric capacity C16, the 21st electric capacity C21, the 23rd electric capacity C23, the 24th electric capacity C24, the 25th electric capacity C25, the 26th electric capacity C26, the 22nd electric capacity C22；

The negative pole of the first diode D1 connect first end of the 33rd electric capacity C33, the first of the 32nd electric capacity C32 End, first end of the 31st electric capacity C31, the positive pole of the 35th electric capacity C35, the positive pole of the 34th electric capacity C34, the 5th core Sheet U5, second end of the 33rd electric capacity C33, second end of the 32nd electric capacity C32, second end of the 31st electric capacity C31, The negative pole of the 35th electric capacity C35, the minus earth of the 34th electric capacity C34.

As a preferred embodiment of the present invention, described network communication bus includes fourth chip U4, the 15th resistance R15, the 16th resistance R16, the 18th resistance R18, the 20th resistance R20, the 19th resistance R19, the 24th resistance R24, 28th resistance R28, the 27th electric capacity C27, the 29th electric capacity C29, the 28th electric capacity C28, the 30th electric capacity C30, the 3rd metal-oxide-semiconductor M3 and network transformer B2；The main conversion that data signal mode is provided, it is achieved low-power consumption high isolation, Improve reliability and the IPI grade of product；20th resistance R20 serves as terminal unit resistance, the 18th resistance R18, the 19th Resistance R19 is a terminal resistance that can arrange, configuration determine that bringing onto load resistance is still without load resistance.

As a preferred embodiment of the present invention, shaking sensor includes the 51st moving back even electric capacity C51, the 52nd moving back Even electric capacity C52, the 43rd resistance R43, the 42nd resistance R42 and sensor U1, Main Function is to perceive at product Wake up MCU up by interruption in time when big vibrations and product upset, allow MCU process warning signal notice high in the clouds；Vibration-sensing Device uses semiconductor acceleration obliquity sensor.

As a preferred embodiment of the present invention, ultra-low power consumption wireless data module includes the tenth chip U10, the 9th chip U9, the 11st chip U11 and the 9th electric capacity C9, the 50th electric capacity C50, the 53rd electric capacity C53, the 54th electric capacity C54, 55th electric capacity C55, the 56th electric capacity C56, the 57th electric capacity C57, the 58th electric capacity C58, the 59th electric capacity C59, the 60th electric capacity C60, the 61st electric capacity C61, the 62nd electric capacity C62, the 63rd electric capacity C63, the 64th electricity Hold C64, the 65th electric capacity C65, the 66th electric capacity C66, the 67th electric capacity C67, the 68th electric capacity C68, the 60th Nine electric capacity C69, the 70th electric capacity C70, the 71st electric capacity C71, the 72nd electric capacity C72, the 73rd electric capacity C73, the 7th 14 electric capacity C74, the 75th electric capacity C75, the 76th electric capacity C76, the 77th electric capacity C77, the 78th electric capacity C78, 79th electric capacity C79, the 80th electric capacity C80, the 81st electric capacity C81, the 82nd electric capacity C82, the 83rd electric capacity C83, the 84th electric capacity C84, the 85th electric capacity C85, the 86th electric capacity C86, the 87th electric capacity C87, the 88th Electric capacity C88, the 89th electric capacity C89, the second inductance L2, the 3rd inductance L3, the 4th inductance L4, the 5th inductance L5, the 6th inductance L6, the 7th inductance L7, the 8th inductance L8, the 9th inductance L9, the tenth inductance L10, the 11st inductance L11, the 12nd inductance L12, 13rd inductance L13, the 14th inductance L14, the 15th inductance L15, the 3rd low-and high-frequency crystal oscillator OSC3, the second resistance R2, the 3rd Resistance R3, the 39th resistance R39, the 40th resistance R40；

The beneficial effects of the present invention is: the smart city network node communication system that the present invention proposes, can be realized each Network node low-power consumption communication.Present device principal and subordinate one, divides main equipment and from equipment when of use, main equipment is responsible for logical Cross GPRS/BDS data module and connect network data platform, carry out data friendship from node by low power consumption data passage and main equipment Change.

Accompanying drawing explanation

Fig. 1 is the composition schematic diagram of smart city of the present invention network node communication system.

Fig. 2 is the circuit diagram of power supply and electric power management circuit.

Fig. 3 is the circuit diagram of MUC part.

Fig. 4 is the circuit diagram of data communication module.

Fig. 5 is the circuit diagram of network communication bus.

Fig. 6 is the circuit diagram of shaking sensor.

Fig. 7 is the circuit diagram of ultra-low power consumption wireless data module.

Detailed description of the invention

Describe the preferred embodiments of the present invention below in conjunction with the accompanying drawings in detail.

Embodiment one

Refer to Fig. 1, present invention is disclosed a kind of smart city network node communication system, described network node communication system If system includes that dry contact, at least one node are that host node, at least one node are for from node.

Each node all includes power supply and electric power management circuit 1, MCU 2, data communication module 3, network communication bus 4, shake Dynamic sensor 5, ultra-low power consumption wireless data module 6, a holonomic system of composition, whole system is enclosed in plastic containers. Data communication module 3 includes GPRS module or/and BDS module.

When shaking sensor electric circuit inspection to state changes when, host node MCU passes through GPRS alarm coding Module is or/and BDS module is sent to the big data platform of far-end, and MCU is per hour automatically to battery voltage detection, and assesses residue electricity Amount, if electricity is sufficient, that is sending period distances wakeup time transmission current electric quantity, otherwise timely turn-on data communication module Inform that big data platform needs to change.

If node is with sensor network, node is automatically collected the sensing data of current time and is actively returned report； Reading sensing data can be provided reference time benchmark and acquisition set of time to reach the side of plesiochronous collection by high in the clouds Formula gathers.

When needing alarm from node, from node M CU by ultra-low power consumption wireless module and host node super low-power consumption module Exchange data, host node be responsible for from node and teledata platform by self super low-power consumption module and GPRS module or/ Data Bridge is set up with BDS module.

Refer to Fig. 2, power supply and electric power management circuit and comprise battery, manostat LDO (including the 6th chip U6) and can The on and off switch (including the 7th chip U7) controlled；Wherein, battery BAT3 is system groundwork power supply, for solaode, The power circuit that 39th electric capacity C39, the 40th electric capacity C40, the 38th electric capacity C38 and the 6th chip U6 are constituted is to MCU Continual power supply is provided.

The positive pole VCC of battery BAT3 connect the input port of the 6th chip U6, the positive pole of the 39th electric capacity C39, the 4th The positive pole of ten electric capacity C40, the input port of the 6th chip U6 connects the positive pole of the 38th electric capacity C38, the 39th electric capacity C39 Negative pole, the negative pole of the 40th electric capacity C40, the negative pole of the 38th electric capacity C38, the minus earth of battery BAT3.

By the 43rd electric capacity C43, the 44th electric capacity C44, the 45th electric capacity C45, the 49th electric capacity C49, 42 electric capacity C42, the 48th electric capacity C48, the 46th electric capacity C46, the 47th electric capacity C47, the 37th resistance R37, the 36th resistance R36, the 38th resistance R38, the second diode D2, the first inductance L1 and the 7th chip U7 composition Controlled DCDC provides the power supply that can turn off to data communication module, and control signal passes through the 37th resistance from the GPS_S of MCU R37 is given to the 3rd foot EN of the 7th chip U7 and controls port.

Refer to Fig. 3, described MCU and include the first chip U1, the first low-and high-frequency crystal oscillator OSC1, the second low-and high-frequency crystal oscillator OSC2, down Monitor Unit chip U2, boosting battery BAT1, some resistance, some electric capacity；Main provide serial ports ISP synchronous serial interface with And AD sampling, and the action control ability such as battery voltage detection, burn out detection, mechanical movement detection；Wherein, the 17th resistance R17, the 21st resistance R21, the 22nd resistance R22, the 23rd resistance R23, the circuit of the second metal-oxide-semiconductor M2 composition are used for Gather the voltage condition of main battery, be used for assessing dump energy；Collection turns off the second metal-oxide-semiconductor M2 after terminating and avoids circuit extra Static current of lcd；It is used for debugging and filling program (as shown in Figure 3) by P1 mouth.

Referring to Fig. 4, described data communication module includes SIM circuit, communicating circuit；SIM circuit includes the 3rd core Sheet U3, the 20th electric capacity C20, the 16th electric capacity C16, the 21st electric capacity C21, the 23rd electric capacity C23, the 24th electric capacity C24, the 25th electric capacity C25, the 26th electric capacity C26, the 22nd electric capacity C22；

Communicating circuit include fifth chip U5, the first diode D1, the first LED LED1, the 33rd electric capacity C33, 32 electric capacity C32, the 31st electric capacity C31, the 35th electric capacity C35, the 34th electric capacity C34, the 37th electric capacity C37, the 36th electric capacity C36, the 41st electric capacity C41, the 29th electric capacity R29, the 30th electric capacity R30, the 31st electricity Hold R31, the 32nd electric capacity R32, the 33rd electric capacity R33 and antenna ANT1 BT-ANT；Main MCU and the high in the clouds of being responsible for Data communication, opens the when of necessary, the complete closedown of communication.

Refer to Fig. 5, described network communication bus include fourth chip U4, the 15th resistance R15, the 16th resistance R16, 18th resistance R18, the 20th resistance R20, the 19th resistance R19, the 24th resistance R24, the 28th resistance R28, 27 electric capacity C27, the 29th electric capacity C29, the 28th electric capacity C28, the 30th electric capacity C30, the 3rd metal-oxide-semiconductor M3 and net Network transformator B2；The main conversion providing data signal mode, it is achieved low-power consumption high isolation, improves reliability and the IPI of product Grade；20th resistance R20 serves as terminal unit resistance, and the 18th resistance R18, the 19th resistance R19 are one and can arrange By configuration, terminal resistance, determines that bringing onto load resistance is still without load resistance.

Refer to Fig. 6, shaking sensor include the 51st move back even electric capacity C51, the 52nd move back even electric capacity C52, the 4th 13 resistance R43, the 42nd resistance R42 and sensor U1, Main Function is to perceive big vibrations and product at product Wake up MCU up by interruption in time during product upset, allow MCU process warning signal notice high in the clouds；Shaking sensor uses quasiconductor to add Speed obliquity sensor.

Referring to Fig. 7, ultra-low power consumption wireless data module includes the tenth chip U10, the 9th chip U9, the 11st chip U11 and the 9th electric capacity C9, the 50th electric capacity C50, the 53rd electric capacity C53, the 54th electric capacity C54, the 55th electric capacity C55, the 56th electric capacity C56, the 57th electric capacity C57, the 58th electric capacity C58, the 59th electric capacity C59, the 60th electricity Hold C60, the 61st electric capacity C61, the 62nd electric capacity C62, the 63rd electric capacity C63, the 64th electric capacity C64, the 60th Five electric capacity C65, the 66th electric capacity C66, the 67th electric capacity C67, the 68th electric capacity C68, the 69th electric capacity C69, 70 electric capacity C70, the 71st electric capacity C71, the 72nd electric capacity C72, the 73rd electric capacity C73, the 74th electric capacity C74, 75th electric capacity C75, the 76th electric capacity C76, the 77th electric capacity C77, the 78th electric capacity C78, the 79th electric capacity C79, the 80th electric capacity C80, the 81st electric capacity C81, the 82nd electric capacity C82, the 83rd electric capacity C83, the 84th electricity Hold C84, the 85th electric capacity C85, the 86th electric capacity C86, the 87th electric capacity C87, the 88th electric capacity C88, the 80th Nine electric capacity C89, the second inductance L2, the 3rd inductance L3, the 4th inductance L4, the 5th inductance L5, the 6th inductance L6, the 7th inductance L7, 8th inductance L8, the 9th inductance L9, the tenth inductance L10, the 11st inductance L11, the 12nd inductance L12, the 13rd inductance L13, 14th inductance L14, the 15th inductance L15, the 3rd low-and high-frequency crystal oscillator OSC3, the second resistance R2, the 3rd resistance R3, the 39th Resistance R39, the 40th resistance R40.

Tenth chip U10 connects first end of the 4th inductance L4, first end of the 3rd inductance L3, the second of the 4th inductance L4 End ground connection, second end of the 3rd inductance L3 connects first end of the 54th electric capacity C54, first end of the 50th electric capacity C50；The The second end ground connection of 54 electric capacity C54, second end of the 50th electric capacity C50 passes through the second resistance R2, the 53rd electric capacity C53 Connect the 9th chip U9.

Tenth chip U10 connects first end of the 8th inductance L8, first end of the 64th electric capacity C64, the 60th electric capacity First end of C60, the 8th inductance L8 second end connect first end of the tenth inductance L10, the first of the 65th electric capacity C65 End, first end of the 66th electric capacity C66, the second end ground connection of the 64th electric capacity C64, second end of the 60th electric capacity C60 Connect first end of the 5th inductance L5；Second end of the 5th inductance L5 connects first end of the 61st electric capacity C61, the 6th inductance First end of L6, first end of the 57th electric capacity C57；The second end ground connection of the 61st electric capacity C61, the of the 6th inductance L6 Two ends, second end of the 57th electric capacity C57, first end of the 58th electric capacity C58, first end of the 7th inductance L7 connect the First end of 62 electric capacity C62, the second end ground connection of the 62nd electric capacity C62；9th chip U9 connects the 58th electric capacity Second end of C58, second end of the 7th inductance L7, first end of the 63rd electric capacity C63, the second of the 63rd electric capacity C63 End ground connection.

Tenth chip U10 connects first end of the 9th inductance L9, and second end of the 9th inductance L9 connects the 75th electric capacity First end of C75, first end of the 70th electric capacity C70, the second end ground connection of the 75th electric capacity C75；70th electric capacity C70's Second end connects first end of the 11st inductance L11；Second end of the 11st inductance L11 connects the of the 71st electric capacity C71 One end, first end of the 12nd inductance L12, first end of the 67th electric capacity C67, second termination of the 71st electric capacity C71 Ground；Second end of the 12nd inductance L12, second end of the 67th electric capacity C67, first end of the 13rd inductance L13, the 60th First end of eight electric capacity C68 connects first end of the 72nd electric capacity C72, the second end ground connection of the 72nd electric capacity C72；Tenth One chip U11 connects second end of the 13rd inductance L13, second end of the 68th electric capacity C68, the 78th electric capacity C78 First end, the second end ground connection of the 78th electric capacity C78.

Tenth chip U10 connects first end of the tenth inductance L10, second end of the 8th inductance L8, the 65th electric capacity C65 The first end, first end of the 66th electric capacity C66；Second end of the 65th electric capacity C65, the of the 66th electric capacity C66 Two end ground connection.

Tenth chip U10 connects first end of the 15th inductance L15, first end of the 84th electric capacity C84, the 15th electricity Second end of sense L15 connects first end of the 85th electric capacity C85, first end of the 80th electric capacity C80；84th electric capacity Second end of C84, the second end ground connection of the 85th electric capacity C85；Second end of the 80th electric capacity C80 is sequentially connected in series the 39th Resistance R39, the 81st electric capacity C81 connect the 11st chip U11.

Tenth chip U10 connects first pin of the 3rd low-and high-frequency crystal oscillator OSC3, first end of the 78th electric capacity C78, Second pin of the 3rd low-and high-frequency crystal oscillator OSC3 connects first end of the 79th electric capacity C79, the 3rd low-and high-frequency crystal oscillator OSC3's Three-prong, second end of the 78th electric capacity C78, the second end ground connection of the 79th electric capacity C79.

Embodiment two

Network communication bus passes through isolating transformer communication；Network communication bus provides the structure of externally local networking, and And the junction sensor on network can exchange data by the data communication module of Intelligent well cover and the biggest data platform.

The structure of shaking sensor, be used for realizing vibrations detection and installation direction carry when changing actively be sent to remote Journey big data platform warning information.Shaking sensor can use semiconductor acceleration obliquity sensor.

Native system includes a photovoltaic cell, it is possible to sharing electric power to battery increases battery life.Ultra-low power consumption wireless module The IC of SX1276 series can be used.

Smart city of the present invention network node communication system can serve as remote meter reading, remote alarms sensor, remote loop The method of the data communications such as border sensor and city manhole cover monitoring.

Embodiment three

As it is shown in figure 1, in the smart city network node communication system of present invention announcement, node divides host node and from joint Point, and principal and subordinate's one, from node by super low-power consumption module and host node exchange data, host node by GPRS/BDS module and The mode of remote switch data.And remotely can pass through the network number from node by host node after communicating from node foundation Ability and the method for the data of sensor in bus is obtained according to bus.

Smart city network node communication system includes 6 funtion parts.It is 1 respectively: power supply and electric power management circuit, 2: Main control MCU, 3:GPRS/BDS data module, 4: network communication bus, 5: shaking sensor, 6: ultra-low power consumption wireless data mould Block, a holonomic system of composition, whole system is enclosed in plastic containers.

When shaking sensor circuit 5 detects that state changes when, host node MCU passes through alarm coding GPRS/BDS module is sent to the big data platform of far-end, and MCU is per hour automatically to battery voltage detection, and assesses dump energy, If electricity is sufficient, that is sending period distances wakeup time transmission current electric quantity, and otherwise turn-on data communication module is accused in time Know that big data platform needs to change.Arriving when the periodic awakening time, system has first checked whether short-message instruction, if had first Processing, next is actively connected to teledata platform, as data platform has instruction to perform instruction, the most just submits periodic report. If node is with sensor network, node is automatically collected the sensing data of current time and is actively returned report.Read sensing The mode that device data can be provided reference time benchmark and acquisition set of time to reach plesiochronous collection by high in the clouds gathers.When When node needs alarm, from node M CU by ultra-low power consumption wireless module and host node super low-power consumption module exchange data, main Node is responsible for setting up data bridge from node and teledata platform by self super low-power consumption module and GPRS/BDS module Connect.Directly initiated data by teledata platform when teledata platform needs to set up communication to pass through to host node, host node Super low-power consumption data module wakes up up to be set up data cube computation exchange data from node or is controlled.When also needing to bridge it from node The when of his sensor, data turn receipts from network communication Bus repeater again.Product can apply to remote meter reading, and remote alarms passes Sensor, remote environment sensor and city manhole cover monitoring etc..

Power supply and electric power management circuit contain battery, LDO and the on and off switch that can control.Wherein battery BAT2 is System groundwork power supply, the power circuit that electric capacity C39 C40 C38 and U6 is constituted provides continual power supply to MCU.By electricity Hold the controlled of C43 C44 C45 C49 C42 C48 C46 C47 resistance R37 R36 R38 diode D2 inductance L1 and U7 composition DCDC provides the electricity that can turn off former to GPRS data module, and control signal is given to the 3 foot EN of U7 from the GPS_S of MCU by R37 Control port.Circuit carries optional BAT3 (solaode), provides longer stand-by time.

MCU is by the U1 and low-and high-frequency crystal oscillator OSC1 OSC2 down Monitor Unit U2 boosting battery BAT1 of Fig. 3 and some other The adnexa compositions such as resistance capacitance, main offer serial ports ISP synchronous serial interface and AD sampling, and the inspection of battery voltage detection, broken string Survey, mechanical movement detects action control ability.Wherein the circuit of R17 R21 R22R23 M2 composition is used for gathering the electricity of main battery Pressure situation, is used for assessing dump energy.Gather and turn off M2 after terminating and avoid the extra static current of lcd of circuit.It is used for adjusting by P1 mouth Examination and the program of filling.

SIM circuit that GPRS data module is made up of C20 C16 C21 C23 C24 C25 C26 C22 U3 and by D1 LED1 C33 C32 C31 C35 C34 C37 C36 C41 R29 R30 R31 R32 R33 and antenna ANT1 BT- ANT and module U5 composition own.Main MCU and the data communication in high in the clouds be responsible for, opens the when of necessary, the complete closedown of communication.

Network communication bus is by chip U4 resistance R15 R16 R18 R20 R19 R24 R28 electric capacity C27 C29 C28 C30 MOS M3 and network transformer B2 composition.The main conversion providing data signal mode, is mainly characterized by low-power consumption high Isolation, can improve reliability and the IPI grade of product.R20 act as terminal unit resistance, and R18 R19 is one and can arrange Terminal resistance, can by configuration determine bringing onto load resistance still without load resistance.

Shaking sensor is formed by moving back even electric capacity C51 C52 resistance R43 R42 and sensor U1, and Main Function is to produce Product wake up MCU up by interruption when perceiving big vibrations and product upset in time, allow MCU process warning signal notice high in the clouds.

Ultra-low power consumption wireless data module, by U1 U9 U11 and C9 C50 C53 C54 C55 C56 C57 C58 C59 C60 C61 C62 C63 C64 C65 C66 C67 C68 C69 C70 C71 C72 C73 C74 C75 C76 C77 C78 C79 C80 C81 C82 C83 C84 C85 C86 C87 C88 C89, L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 R2 R3 R39 R40 forms.

In sum, the smart city network node communication system that the present invention proposes, the low merit of each network node can be realized Consumption communication.Present device principal and subordinate one, divides main equipment and from equipment when of use, main equipment is responsible for by GPRS/BDS number Connect network data platform according to module, carry out data exchange from node by low power consumption data passage and main equipment.

Here description of the invention and application is illustrative, is not wishing to limit the scope of the invention to above-described embodiment In.The deformation of embodiments disclosed herein and change are possible, real for those skilled in the art The various parts with equivalence of replacing executing example are known.It should be appreciated by the person skilled in the art that without departing from the present invention Spirit or essential characteristics in the case of, the present invention can in other forms, structure, layout, ratio, and with other assembly, Material and parts realize.In the case of without departing from scope and spirit of the present invention, embodiments disclosed herein can be entered Other deformation of row and change.

Claims

1. a smart city network node communication system, it is characterised in that described network node communication system includes some joints Point, at least one node is that host node, at least one node are for from node；

Each node all include power supply and electric power management circuit, MCU, data communication module, network communication bus, shaking sensor, Ultra-low power consumption wireless data module, a holonomic system of composition, whole system is enclosed in plastic containers；Data communication module Including GPRS module or/and BDS module；

When shaking sensor electric circuit inspection to state changes when, host node MCU passes through GPRS module alarm coding Or/and BDS module is sent to the big data platform of far-end, MCU is per hour automatically to battery voltage detection, and assesses dump energy, If electricity is sufficient, that send period distances wakeup time send current electric quantity, the most in time open GPRS module or/and BDS module informs that big data platform needs to change；

Arriving when the periodic awakening time, system has first checked whether short-message instruction, first processes if had, and the most actively connects There is instruction to perform instruction to teledata platform, such as data platform, the most just submit periodic report；

If node is with sensor network, node is automatically collected the sensing data of current time and is actively returned report；Read The mode that sensing data can be provided reference time benchmark and acquisition set of time to reach plesiochronous collection by high in the clouds is adopted Collection；

When needing alarm from node, exchanged by ultra-low power consumption wireless module and host node super low-power consumption module from node M CU Data, host node be responsible for from node and teledata platform by self super low-power consumption module and GPRS module or/and BDS Module sets up Data Bridge；

Directly initiated data by teledata platform when teledata platform needs to set up communication to pass through to host node, host node Super low-power consumption data module wakes up up to be set up data cube computation exchange data from node or is controlled；When also needing to bridge it from node The when of his sensor, data turn receipts from network communication Bus repeater again；Products application in remote meter reading, remote alarms sensor, Remote environment sensor and the monitoring of city manhole cover；

Power supply and electric power management circuit comprise battery, manostat LDO and controllable on and off switch；Wherein, battery BAT3 is System groundwork power supply, for solaode, the 39th electric capacity C39, the 40th electric capacity C40, the 38th electric capacity C38 and The power circuit that 6th chip U6 is constituted provides continual power supply to MCU；

The positive pole VCC of battery BAT3 connects the input port of the 6th chip U6, the positive pole of the 39th electric capacity C39, the 40th electricity Holding the positive pole of C40, the input port of the 6th chip U6 connects the positive pole of the 38th electric capacity C38, and the 39th electric capacity C39's is negative Pole, the negative pole of the 40th electric capacity C40, the negative pole of the 38th electric capacity C38, the minus earth of battery BAT3；

By the 43rd electric capacity C43, the 44th electric capacity C44, the 45th electric capacity C45, the 49th electric capacity C49, the 40th Two electric capacity C42, the 48th electric capacity C48, the 46th electric capacity C46, the 47th electric capacity C47, the 37th resistance R37, It is controlled that 36 resistance R36, the 38th resistance R38, the second diode D2, the first inductance L1 and the 7th chip U7 form DCDC provides the power supply that can turn off to data communication module, and control signal passes through the 37th resistance R37 from the GPS_S of MCU The 3rd foot EN being given to the 7th chip U7 controls port；

The positive pole of battery BAT3 connects the positive pole of the 43rd electric capacity C43, the positive pole of the 44th electric capacity C44, the 45th electricity Holding the positive pole of C45, the VIN port of the 7th chip U7, the EN port of the 7th chip U7 connects MCU by the 37th resistance, the The SS port ground connection of seven chip U7；7th port of the 7th chip U7 connects first end of the 42nd electric capacity C42, the 7th chip The SW port of U7 connects second end of the 42nd electric capacity C42, the negative pole of the second diode D2, first end of the first inductance L1； The GS port of the 7th chip U7, the plus earth of the second diode D2；Second end of the first inductance L1 connects the 48th electric capacity First end of C48, first end of the 36th resistance R36, the positive pole of the 46th electric capacity C46, the 47th electric capacity C47 are just Pole；The FB port of the 7th chip U7 connect second end of the 48th electric capacity C48, second end of the 36th resistance R36, the 3rd First end of 18 resistance R38, the second end ground connection of the 38th resistance R38；

Described MCU includes the first chip U1, the first low-and high-frequency crystal oscillator OSC1, the second low-and high-frequency crystal oscillator OSC2, down Monitor Unit chip U2, boosting battery BAT1, some resistance, some electric capacity；Main offer serial ports ISP synchronous serial interface and AD sampling, and battery Voltage detecting, burn out detection, mechanical movement detection action control ability；Wherein, the 17th resistance R17, the 21st resistance R21, the 22nd resistance R22, the 23rd resistance R23, the circuit of the second metal-oxide-semiconductor M2 composition are used for gathering the voltage of main battery Situation, is used for assessing dump energy；Gather and turn off the second metal-oxide-semiconductor M2 after terminating and avoid the extra static current of lcd of circuit；Pass through P1 Mouth is used for debugging and filling program；

Described data communication module includes SIM circuit, communicating circuit；SIM circuit includes the 3rd chip U3, the 20th electric capacity C20, the 16th electric capacity C16, the 21st electric capacity C21, the 23rd electric capacity C23, the 24th electric capacity C24, the 25th electricity Hold C25, the 26th electric capacity C26, the 22nd electric capacity C22；

Communicating circuit include fifth chip U5, the first diode D1, the first LED LED1, the 33rd electric capacity C33, the 30th Two electric capacity C32, the 31st electric capacity C31, the 35th electric capacity C35, the 34th electric capacity C34, the 37th electric capacity C37, 36 electric capacity C36, the 41st electric capacity C41, the 29th electric capacity R29, the 30th electric capacity R30, the 31st electric capacity R31, 32nd electric capacity R32, the 33rd electric capacity R33 and antenna ANT1BT-ANT；The data in the main MCU of being responsible for and high in the clouds are led to News, open the when of necessary, the complete closedown of communication；

The negative pole of the first diode D1 connect first end of the 33rd electric capacity C33, first end of the 32nd electric capacity C32, the First end of 31 electric capacity C31, the positive pole of the 35th electric capacity C35, the positive pole of the 34th electric capacity C34, fifth chip U5, Second end of the 33rd electric capacity C33, second end of the 32nd electric capacity C32, second end of the 31st electric capacity C31, the 3rd The negative pole of 15 electric capacity C35, the minus earth of the 34th electric capacity C34；

Described network communication bus include fourth chip U4, the 15th resistance R15, the 16th resistance R16, the 18th resistance R18, 20th resistance R20, the 19th resistance R19, the 24th resistance R24, the 28th resistance R28, the 27th electric capacity C27, 29th electric capacity C29, the 28th electric capacity C28, the 30th electric capacity C30, the 3rd metal-oxide-semiconductor M3 and network transformer B2；Main The conversion of data signal mode to be provided, it is achieved low-power consumption high isolation, improves reliability and the IPI grade of product；20th electricity Resistance R20 serves as terminal unit resistance, and the 18th resistance R18, the 19th resistance R19 are terminal resistances that can arrange, by joining Put decision bringing onto load resistance still without load resistance；

Shaking sensor include the 51st move back even electric capacity C51, the 52nd move back even electric capacity C52, the 43rd resistance R43, the 42 resistance R42 and sensor U1, Main Function is to lead in time when product perceives big vibrations and product upset Cross interruption and wake up MCU up, allow MCU process warning signal notice high in the clouds；Shaking sensor uses semiconductor acceleration obliquity sensor；

Ultra-low power consumption wireless data module includes the tenth chip U10, the 9th chip U9, the 11st chip U11 and the 9th electric capacity C9, the 50th electric capacity C50, the 53rd electric capacity C53, the 54th electric capacity C54, the 55th electric capacity C55, the 56th electric capacity C56, the 57th electric capacity C57, the 58th electric capacity C58, the 59th electric capacity C59, the 60th electric capacity C60, the 61st electricity Hold C61, the 62nd electric capacity C62, the 63rd electric capacity C63, the 64th electric capacity C64, the 65th electric capacity C65, the 60th Six electric capacity C66, the 67th electric capacity C67, the 68th electric capacity C68, the 69th electric capacity C69, the 70th electric capacity C70, the 7th 11 electric capacity C71, the 72nd electric capacity C72, the 73rd electric capacity C73, the 74th electric capacity C74, the 75th electric capacity C75, 76th electric capacity C76, the 77th electric capacity C77, the 78th electric capacity C78, the 79th electric capacity C79, the 80th electric capacity C80, the 81st electric capacity C81, the 82nd electric capacity C82, the 83rd electric capacity C83, the 84th electric capacity C84, the 85th Electric capacity C85, the 86th electric capacity C86, the 87th electric capacity C87, the 88th electric capacity C88, the 89th electric capacity C89, second Inductance L2, the 3rd inductance L3, the 4th inductance L4, the 5th inductance L5, the 6th inductance L6, the 7th inductance L7, the 8th inductance L8, the 9th Inductance L9, the tenth inductance L10, the 11st inductance L11, the 12nd inductance L12, the 13rd inductance L13, the 14th inductance L14, 15 inductance L15, the 3rd low-and high-frequency crystal oscillator OSC3, the second resistance R2, the 3rd resistance R3, the 39th resistance R39, the 40th electricity Resistance R40；

Tenth chip U10 connects first end of the 4th inductance L4, first end of the 3rd inductance L3, second termination of the 4th inductance L4 Ground, second end of the 3rd inductance L3 connects first end of the 54th electric capacity C54, first end of the 50th electric capacity C50；50th The second end ground connection of four electric capacity C54, second end of the 50th electric capacity C50 is connected by the second resistance R2, the 53rd electric capacity C53 9th chip U9；

Tenth chip U10 connects first end of the 8th inductance L8, first end of the 64th electric capacity C64, the 60th electric capacity C60 First end, the 8th inductance L8 second end connect first end of the tenth inductance L10, first end of the 65th electric capacity C65, the 6th First end of 16 electric capacity C66, the second end ground connection of the 64th electric capacity C64, second end of the 60th electric capacity C60 connects the 5th First end of inductance L5；5th inductance L5 second end connect first end of the 61st electric capacity C61, the first of the 6th inductance L6 End, first end of the 57th electric capacity C57；The second end ground connection of the 61st electric capacity C61, second end of the 6th inductance L6, Second end of 57 electric capacity C57, first end of the 58th electric capacity C58, first end of the 7th inductance L7 connect the 62nd First end of electric capacity C62, the second end ground connection of the 62nd electric capacity C62；9th chip U9 connects the of the 58th electric capacity C58 Two ends, second end of the 7th inductance L7, first end of the 63rd electric capacity C63, the second end ground connection of the 63rd electric capacity C63；

Tenth chip U10 connects first end of the 9th inductance L9, and second end of the 9th inductance L9 connects the 75th electric capacity C75's First end, first end of the 70th electric capacity C70, the second end ground connection of the 75th electric capacity C75；The second of 70th electric capacity C70 End connects first end of the 11st inductance L11；11st inductance L11 second end connect the 71st electric capacity C71 the first end, First end of the 12nd inductance L12, first end of the 67th electric capacity C67, the second end ground connection of the 71st electric capacity C71；The Second end of 12 inductance L12, second end of the 67th electric capacity C67, first end of the 13rd inductance L13, the 68th electricity The first end holding C68 connects first end of the 72nd electric capacity C72, the second end ground connection of the 72nd electric capacity C72；11st core Sheet U11 connect second end of the 13rd inductance L13, second end of the 68th electric capacity C68, the first of the 78th electric capacity C78 End, the second end ground connection of the 78th electric capacity C78；

Tenth chip U10 connect first end of the tenth inductance L10, second end of the 8th inductance L8, the of the 65th electric capacity C65 One end, first end of the 66th electric capacity C66；Second end of the 65th electric capacity C65, second end of the 66th electric capacity C66 Ground connection；

Tenth chip U10 connects first end of the 15th inductance L15, first end of the 84th electric capacity C84, the 15th inductance Second end of L15 connects first end of the 85th electric capacity C85, first end of the 80th electric capacity C80；84th electric capacity C84 The second end, the second end ground connection of the 85th electric capacity C85；Second end of the 80th electric capacity C80 is sequentially connected in series the 39th electricity Resistance R39, the 81st electric capacity C81 connect the 11st chip U11；

Tenth chip U10 connection first pin of the 3rd low-and high-frequency crystal oscillator OSC3, first end of the 78th electric capacity C78, the 3rd Second pin of low-and high-frequency crystal oscillator OSC3 connects first end of the 79th electric capacity C79, the 3rd of the 3rd low-and high-frequency crystal oscillator OSC3 Pin, second end of the 78th electric capacity C78, the second end ground connection of the 79th electric capacity C79；

9th chip U9 connects first end of the second inductance L2, first end of the 55th electric capacity C55, the second of the second inductance L2 End connects first end of the 56th electric capacity C56, second end of the 55th electric capacity C55, second end of the 56th electric capacity C56 Ground connection；

11st chip U11 connects first end of the 14th inductance L14, first end of the 82nd electric capacity C82, the 14th inductance Second end of L14 connects first end of the 83rd electric capacity C83, second end of the 82nd electric capacity C82, the 83rd electric capacity The second end ground connection of C83.

2. a smart city network node communication system, it is characterised in that described network node communication system includes some joints Point, at least one node is that host node, at least one node are for from node；

Each node all include power supply and electric power management circuit, MCU, data communication module, network communication bus, shaking sensor, Ultra-low power consumption wireless data module；Data communication module includes GPRS module or/and BDS module；

When shaking sensor electric circuit inspection to state changes when, host node MCU passes through GPRS module alarm coding Or/and BDS module is sent to the big data platform of far-end, MCU automatically to battery voltage detection, and assesses surplus at interval of the time of setting Remaining electricity, if electricity is sufficient, that is sending period distances wakeup time transmission current electric quantity, otherwise turn-on data communication in time Module informs that big data platform needs to change；

Arriving when the periodic awakening time, system has first checked whether short-message instruction, first processes if had, and the most actively connects There is instruction to perform instruction to teledata platform, such as data platform, the most just submit periodic report.

Smart city the most according to claim 2 network node communication system, it is characterised in that:

Directly initiated data by teledata platform when teledata platform needs to set up communication to pass through to host node, host node Super low-power consumption data module wakes up up to be set up data cube computation exchange data from node or is controlled；When also needing to bridge it from node The when of his sensor, data turn receipts from network communication Bus repeater again；Products application in remote meter reading, remote alarms sensor, Remote environment sensor and the monitoring of city manhole cover.

The positive pole of battery BAT3 connects the positive pole of the 43rd electric capacity C43, the positive pole of the 44th electric capacity C44, the 45th electricity Holding the positive pole of C45, the VIN port of the 7th chip U7, the EN port of the 7th chip U7 connects MCU by the 37th resistance, the The SS port ground connection of seven chip U7；7th port of the 7th chip U7 connects first end of the 42nd electric capacity C42, the 7th chip The SW port of U7 connects second end of the 42nd electric capacity C42, the negative pole of the second diode D2, first end of the first inductance L1； The GS port of the 7th chip U7, the plus earth of the second diode D2；Second end of the first inductance L1 connects the 48th electric capacity First end of C48, first end of the 36th resistance R36, the positive pole of the 46th electric capacity C46, the 47th electric capacity C47 are just Pole；The FB port of the 7th chip U7 connect second end of the 48th electric capacity C48, second end of the 36th resistance R36, the 3rd First end of 18 resistance R38, the second end ground connection of the 38th resistance R38.

Described MCU includes the first chip U1, the first low-and high-frequency crystal oscillator OSC1, the second low-and high-frequency crystal oscillator OSC2, down Monitor Unit chip U2, boosting battery BAT1, some resistance, some electric capacity；Main offer serial ports ISP synchronous serial interface and AD sampling, and battery Voltage detecting, burn out detection, mechanical movement detection action control ability；Wherein, the 17th resistance R17, the 21st resistance R21, the 22nd resistance R22, the 23rd resistance R23, the circuit of the second metal-oxide-semiconductor M2 composition are used for gathering the voltage of main battery Situation, is used for assessing dump energy；Gather and turn off the second metal-oxide-semiconductor M2 after terminating and avoid the extra static current of lcd of circuit；Pass through P1 Mouth is used for debugging and filling program.

The negative pole of the first diode D1 connect first end of the 33rd electric capacity C33, first end of the 32nd electric capacity C32, the First end of 31 electric capacity C31, the positive pole of the 35th electric capacity C35, the positive pole of the 34th electric capacity C34, fifth chip U5, Second end of the 33rd electric capacity C33, second end of the 32nd electric capacity C32, second end of the 31st electric capacity C31, the 3rd The negative pole of 15 electric capacity C35, the minus earth of the 34th electric capacity C34.

Described network communication bus include fourth chip U4, the 15th resistance R15, the 16th resistance R16, the 18th resistance R18, 20th resistance R20, the 19th resistance R19, the 24th resistance R24, the 28th resistance R28, the 27th electric capacity C27, 29th electric capacity C29, the 28th electric capacity C28, the 30th electric capacity C30, the 3rd metal-oxide-semiconductor M3 and network transformer B2；Main The conversion of data signal mode to be provided, it is achieved low-power consumption high isolation, improves reliability and the IPI grade of product；20th electricity Resistance R20 serves as terminal unit resistance, and the 18th resistance R18, the 19th resistance R19 are terminal resistances that can arrange, by joining Put decision bringing onto load resistance still without load resistance.

Shaking sensor include the 51st move back even electric capacity C51, the 52nd move back even electric capacity C52, the 43rd resistance R43, the 42 resistance R42 and sensor U1, Main Function is to lead in time when product perceives big vibrations and product upset Cross interruption and wake up MCU up, allow MCU process warning signal notice high in the clouds；Shaking sensor uses semiconductor acceleration obliquity sensor.