CN106129269A - A kind of preparation method of flexible display substrates - Google Patents
A kind of preparation method of flexible display substrates Download PDFInfo
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- CN106129269A CN106129269A CN201610474848.7A CN201610474848A CN106129269A CN 106129269 A CN106129269 A CN 106129269A CN 201610474848 A CN201610474848 A CN 201610474848A CN 106129269 A CN106129269 A CN 106129269A
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- flexible display
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- bearing basement
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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Abstract
The present invention discloses the preparation method of a kind of flexible display substrates, relate to flexible display substrates technical field, the device on damage flexible display substrates and the problem such as the radius of curvature of flexible display substrates is bigger during for solving to peel off flexible display substrates with rigidity bearing basement and invent.Described preparation method includes: form bump maps pattern layer in rigidity bearing basement；Preparing flexible display substrates in the rigidity bearing basement being formed with described bump maps pattern layer, described flexible display substrates contains display device, and described display device avoided by the pattern in described bump maps pattern layer；Described flexible display substrates and described rigidity bearing basement are peeled off and obtained described flexible display substrates.The method that the present invention provides is for the preparation of flexible display substrates.
Description
Technical field
The present invention relates to flexible display substrates technical field, particularly relate to the preparation method of a kind of flexible display substrates.
Background technology
Flexible display has the advantages such as frivolous, flexible, shows have huge potential advantages in market in future.Soft
Property display in display base plate used be usually flexible display substrates.
The general manufacture method of flexible display substrates is: first prepares flexible display substrates in bearing basement, then exists
Thin film transistor (TFT) and other device is prepared on flexible display substrates.Such as flexible OLED (Organic Light Emitting Diode) display base
Plate, it usually needs make thin film transistor (TFT) and Organic Light Emitting Diode.Flexible display substrates uses laser by it after having prepared
Peeling off with bearing basement, in stripping process, laser often damages thin film transistor (TFT), causes TFT Vth (film crystal pipe threshold
Voltage) drift, component failure so that flexible display display is abnormal, even cannot normally work.
Further, the flexible display substrates thickness prepared according to said method is the biggest so that flexible display substrates
Radius of curvature is the biggest, flexible poor.
Summary of the invention
It is an object of the invention to provide the preparation method of a kind of flexible display substrates, be used for preparing device and be not easy to damage
Bad, that radius of curvature is uniform and less flexible display substrates, to improve performance and the yield of flexible display substrates.
To achieve these goals, the present invention provides following technical scheme:
A kind of preparation method of flexible display substrates, including:
Rigidity bearing basement is formed bump maps pattern layer；
The rigidity bearing basement being formed with described bump maps pattern layer is prepared flexible display substrates, described Flexible Displays base
Plate contains display device, and described display device avoided by the pattern in described bump maps pattern layer；
Described flexible display substrates and described rigidity bearing basement are peeled off and obtained described flexible display substrates.
In the preparation method of the flexible display substrates described in technique scheme, described formation in rigidity bearing basement
The step of bump maps pattern layer specifically can have two ways, and one way in which is to make protruding patterned layer, another way
For making the patterned layer of depression.
The step making protruding patterned layer includes: deposited picture layer film in described rigidity bearing basement；Use structure
Figure technique forms the patterned layer of projection on described patterned layer thin film.Wherein, the material that described patterned layer thin film is used is deposited
Including metal material, alloy material, composite or insulant.Further, by described flexible display substrates and described rigidity
After bearing basement is peeled away, described method also includes: remove remained on described flexible display substrates after having peeled off described
Patterned layer material.
The step of the patterned layer making depression includes: directly carry out patterning processes in described rigidity bearing basement, is formed
The patterned layer of depression.
In above-mentioned each technical scheme, after forming described bump maps pattern layer, in rigidity bearing basement, preparation flexibility is aobvious
Show that substrate specifically includes:
The rigidity bearing basement being formed with described bump maps pattern layer is formed flexible substrate；
Described flexible substrate is prepared display element layer.
Specifically, described bump maps pattern layer can be made up of the area of the pattern of multiple mutual separations, described relief pattern
Pattern in Ceng is distributed in described area of the pattern, and the horizontal and vertical size range of each described area of the pattern is 1um-
Size range in 300um, short transverse is 1um-300um, the spacing distance scope between the area of the pattern that each two is adjacent
For 1um-3um.
The flat shape of described area of the pattern is the various shapes such as rectangle, trapezoidal, triangle or circle.
Additionally, the making of mask plate for convenience, can be connected with each other between the area of the pattern of the plurality of mutual separation
Form latticed area of the pattern.
In the preparation method of the flexible display substrates that the present invention provides, owing to being formed with bump maps in rigidity bearing basement
Pattern layer, and in rigidity bearing basement after making flexible display substrates, the pattern in described bump maps pattern layer is avoided described
Display device on flexible display substrates, therefore will form stress at the pattern of patterned layer and concentrate when peeling off, stress collection
The stress at middle place is relatively big, and the place comprising display device on remaining place such as flexible display substrates not having stress to concentrate
Stress is less, is not easy to damage the device on flexible display substrates during stripping.Further, because this bump maps pattern layer makes flexible aobvious
Show substrate thickness disunity, so the least in the local radius of curvature that flexible base board thickness is less, therefore by this bump maps
Pattern layer can make the last subregional thickness of flexible display substrates reduce, so that the radius of curvature of this subregion reduces,
The flexible display substrates with less radius of curvature can be obtained to a certain extent.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the present invention, this
Bright schematic description and description is used for explaining the present invention, is not intended that inappropriate limitation of the present invention.In the accompanying drawings:
The flow chart of the preparation method of the flexible display substrates that Fig. 1 provides for the embodiment of the present invention；
Fig. 2 a is the schematic diagram one forming bump maps pattern layer after step 1 shown in Fig. 1；
Fig. 2 b is Fig. 2 a profile along line A-A；
Fig. 3 is the schematic diagram two forming bump maps pattern layer after step 1 shown in Fig. 1；
The flexible display substrates that the method that Fig. 4 provides for utilizing Fig. 1 prepares.
Reference:
The patterned layer that 201-rigidity bearing basement 202-is protruding
The patterned layer 204-flexible substrate of 203-depression
205-cushion 206-grid
207-gate insulation layer 208-active layer
209-source electrode 210-drains
211-passivation layer 212-pixel electrode
Detailed description of the invention
For ease of understanding, below in conjunction with Figure of description, the preparation to the flexible display substrates that the embodiment of the present invention provides
Method is described in detail.
Referring to Fig. 1, the preparation method of the flexible display substrates that the embodiment of the present invention provides includes:
Step 1, in rigidity bearing basement formed bump maps pattern layer；
Step 2, in the rigidity bearing basement being formed with described bump maps pattern layer, prepare flexible display substrates, described flexibility
Display base plate contains display device, and described display device avoided by the pattern in described bump maps pattern layer；
Step 3, described flexible display substrates and described rigidity bearing basement are peeled off and obtained described Flexible Displays
Substrate.
In the preparation method of above-mentioned flexible display substrates, owing to being formed with bump maps pattern layer in rigidity bearing basement,
And after making flexible display substrates in rigidity bearing basement, the pattern in described bump maps pattern layer is avoided described flexibility and is shown
Show the display device on substrate, therefore will form stress when peeling off at the pattern of patterned layer and concentrate, stress raiser
Stress is relatively big, and the local stress comprising display device on remaining place such as flexible display substrates not having stress to concentrate is relatively
Little, it is not easy during stripping to damage the device on flexible display substrates.Further, because this bump maps pattern layer makes flexible display substrates
Thickness disunity, so the least in the local radius of curvature that flexible base board thickness is less, therefore can by this bump maps pattern layer
So that the last subregional thickness of flexible display substrates reduces, so that the radius of curvature of this subregion reduces, Ke Yi
Obtain the flexible display substrates with less radius of curvature to a certain extent.
In the preparation method of the flexible display substrates shown in Fig. 1, described step 1, formed in rigidity bearing basement recessed
Convex pattern layer specifically can have two ways, and one way in which is to make protruding patterned layer, and another way is recessed for making
The patterned layer fallen into.
Making protruding pattern and do not damage rigidity bearing basement, rigidity bearing basement can be reused, and at one piece just
Property bearing basement on can prepare different raised designs according to the difference of flexible display substrates, such as in first use make
The raised design of standby a kind of form, prepares another form of raised design in upper once use, uses motility high.And make
The pattern making to cave in then need not deposit thin film pattern-making layer again in rigidity bearing basement separately, saves making of material
With, and saving the processing steps such as deposition, technique is simple.
Fig. 2 a and 2b is the schematic diagram of the protruding patterned layer prepared after above-mentioned steps 1.Make protruding pattern
The step of layer includes:
Deposited picture layer film in rigidity bearing basement 201；
Patterning processes is used to form the patterned layer 202 of projection on described patterned layer thin film.
Further, after being peeled away with described rigidity bearing basement by described flexible display substrates, protruding pattern is made
The method of layer also includes: remove the described patterned layer material remained on described flexible display substrates after having peeled off.
Wherein, deposit the material that described patterned layer thin film used and include metal material, alloy material, composite or absolutely
Edge material.PVD (physical vapour deposition (PVD)) method can be used, with gold such as Cr, Ti, Mo, W, Al, Cu when deposited picture layer film
Belong to material or alloy material and other composite carries out thin film deposition as target.Or, it is possible to use CVD (chemistry
Vapour deposition) method, utilize the one or more of which insulant such as SiOx, SiNx, SiONx, AlOx to carry out thin film deposition.?
During deposited picture layer film, the selection of material does not limits, and can use suitable material, choosing according to material price, acquisition pattern etc.
Select more flexible and convenient.
Afterwards, using patterning processes to form the patterned layer of projection, described patterning processes includes that thin film deposition, mask plate expose
Light, etch, the operation such as stripping.
Finally, the cleanout fluid adapted with protruding patterned layer can be used to remove described Flexible Displays base after stripping completes
The described patterned layer material of residual on plate.Or, it would however also be possible to employ physical method is removed.Protruding patterned layer material is removed it
After, rigidity bearing basement can be reused.
Specifically, above-mentioned prepared protruding patterned layer 202 can be made up of the area of the pattern of multiple mutual separations, institute
Stating the pattern in bump maps pattern layer to be distributed in described area of the pattern, the shape of this area of the pattern can be such as Fig. 2 a and 2b institute
The projection shape (its flat shape projecting formation on the plane graph of Fig. 2 a is rectangle) shown, the horizontal stroke of each described area of the pattern
Be 1um-300um to longitudinal size range, as in Fig. 2 b the lateral dimension L1 of area of the pattern may range from 1um-
300um, the size range in short transverse is 1um-300um, the spacing distance L2's between the area of the pattern that each two is adjacent
Scope is 1um-3um.By being configured obtaining different patterned layer shapes, pattern to the size of area of the pattern and interval
The shape of layer affects the distribution that stress is concentrated, and usual stress concentration distribution must be the most uniform, and when carrying out strip operation, flexibility shows
Show that the device on substrate is less susceptible to damage, by controlling the shape of patterned layer so that stripping process is more smooth.
The flat shape of described area of the pattern does not limits, for example, the various shape such as rectangle, trapezoidal, triangle or circle.Figure
Case region can select to make various shape, and correspondingly the making to mask plate requires to reduce, can be cost-effective.
Additionally, the making of mask plate for convenience, can be connected with each other between the area of the pattern of the plurality of mutual separation
Form latticed area of the pattern.
Fig. 3 is the schematic diagram of the patterned layer of the depression prepared after above-mentioned steps 1.Make the step of the patterned layer of depression
Suddenly include: in described rigidity bearing basement, directly carry out patterning processes, form the patterned layer 203 of depression.It should be noted that
The patterned layer 203 of the depression making formation also includes the area of the pattern mutually separated, and the shape of this area of the pattern can be such as
Round pool shape shown in Fig. 3, the horizontal and vertical size range of each described area of the pattern is 1um-300um, in Fig. 3
The lateral dimension L3 of area of the pattern may range from 1um-300um, and the size range in short transverse is 1um-300um, often
Spacing distance L4 between two adjacent area of the pattern is in the range of 1um-3um.Further, in order to avoid Flexible Displays further
Substrate damage and make the thickness of flexible display substrates uniform, can aobvious by described area of the pattern and described flexible display substrates
Show the corresponding setting in region.Additionally, the making of mask plate for convenience, permissible between the area of the pattern of the plurality of mutual separation
It is interconnected to form latticed area of the pattern.
In the various embodiments described above, formed described bump maps pattern layer (include projection patterned layer and the patterned layer of depression) it
After, rigidity bearing basement prepares flexible display substrates and specifically includes:
The rigidity bearing basement being formed with described bump maps pattern layer is formed flexible substrate；
Described flexible substrate is prepared display element layer.
The preparation method of the flexible display substrates of 4 pairs of embodiment of the present invention offers is integrally situated between below in conjunction with the accompanying drawings
Continue:
S1, cleaning rigidity bearing basement 201, form bump maps pattern layer, and this bump maps pattern layer can be protruding patterned layer
202 or depression patterned layer 203.
First rigidity bearing basement is carried out, deionized water during cleaning, can be used.Rigidity bearing basement can be
Glass substrate etc..
The method making bump maps pattern layer in rigidity bearing basement is referred to description above.
S2, making flexible substrate 204.
By spin coating or paste technique and prepare flexible substrate, the material of flexible substrate comprises the steps that polyimides (PI), poly-
Ethylene glycol terephthalate (PET), PEN (PEN) etc..The thickness range of flexible substrate can be 1-
300um, the present embodiment thickness is preferably 200um.
S3, making cushion 205.
Using chemical gaseous phase deposition (CVD) deposition techniques cushion, cushion can use SiOx, SiNx, SiONx, AlOx
Making etc. one or more insulant therein, the present embodiment cushion uses SiOx.Cushion can be one or more layers
Structure, thickness is 1-800nm, and the present embodiment preferred thickness is 300nm.
S4, making metal gates 206.
Prepare grid conducting layer on the buffer layer, grid conducting layer can use the metal materials such as Cr, Ti, Mo, W, Al, Cu,
Alloy material and other conductive material make.Above-mentioned grid conducting layer can be one or more layers structure, and thickness is 1-1000nm,
The present embodiment preferred thickness is 300nm.
S5, making gate insulator 207.
Use chemical gaseous phase deposition (CVD) deposition techniques gate insulator, gate insulator can use SiOx, SiNx,
One or more insulant therein such as SiONx, AlOx make, and the present embodiment gate insulator uses SiOx.Gate insulator
Layer can be one or more layers structure, and thickness is 1-800nm, and the present embodiment preferred thickness is 300nm.
S6, making active layer 208.
Using magnetron sputtering technique deposited oxide indium gallium zinc (IGZO) active layer, active layer material also includes: ITZO,
The oxide semiconductor materials such as HIZO, ATZIO, ATZO, ZTO, GTO, IGTO, active layer can be one or more layers structure, thick
Degree is 1-500nm, and the present embodiment preferred thickness is 50nm.
S7, making source electrode 209 and drain electrode 210.
Using magnetron sputtering technique sedimentary origin, leakage conductance electric layer, source, leakage conductance electric layer can use the gold such as Cr, Ti, Mo, W, Al, Cu
Belong to material, alloy material and other conductive material to make.Above-mentioned source, drain electrode conductive layer can be one or more layers structures,
Thickness is 1-1000nm, and the present embodiment is preferably 400nm.
S8, making passivation layer 211.
Using chemical gaseous phase deposition (CVD) deposition techniques passivation layer, passivation layer can use SiOx, SiNx, SiONx, AlOx
Making etc. one or more insulant therein, form via by patterning processes, the present embodiment passivation layer uses SiOx.Blunt
Changing layer can be one or more layers structure, and thickness is 1-800nm, and the present embodiment is preferably 300nm.
S9, making pixel electrode 212.
Using magnetron sputtering technique pixel deposition electrode, material includes: ITO, IZO etc., and thickness is 1-300nm；Embodiment
Preferred thickness is 40nm.
It is the formation of complete flexible tft array by above-mentioned steps, to realize display function, can select as required
Make planarization layer, pixel defines layer and carries out EL evaporation, encapsulation etc..
S10, flexible display substrates use laser it to be cut separation with rigidity bearing basement after having prepared.
This embodiment describes flexible substrate and display unit as a example by the patterned layer forming projection in rigidity bearing basement
The manufacture method of part layer, also can directly form the patterned layer of depression in rigidity bearing basement, then uses same procedure to prepare
Flexible display substrates.
The flexible display substrates prepared by said method, is included on mobile phone, flat board, display, TV, billboard etc.
Application, but be not limited to this.
In the description of above-mentioned embodiment, specific features, structure, material or feature can be at any one or many
Individual embodiment or example combine in an appropriate manner.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art, in the technical scope that the invention discloses, can readily occur in change or replace, should contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (9)
1. the preparation method of a flexible display substrates, it is characterised in that including:
Rigidity bearing basement is formed bump maps pattern layer；
Preparing flexible display substrates in the rigidity bearing basement being formed with described bump maps pattern layer, described flexible display substrates contains
Display device, the pattern in described bump maps pattern layer is had to avoid described display device；
Described flexible display substrates and described rigidity bearing basement are peeled off and obtained described flexible display substrates.
The preparation method of flexible display substrates the most according to claim 1, it is characterised in that described in rigidity bearing basement
The step of upper formation bump maps pattern layer specifically includes:
Deposited picture layer film in described rigidity bearing basement；
Patterning processes is used to form the patterned layer of projection on described patterned layer thin film.
The preparation method of flexible display substrates the most according to claim 2, it is characterised in that: deposit described patterned layer thin film
The material used includes metal material, alloy material, composite or insulant.
The preparation method of flexible display substrates the most according to claim 2, it is characterised in that by described Flexible Displays base
After plate and described rigidity bearing basement are peeled away, described method also includes:
Remove the described patterned layer material remained on described flexible display substrates after having peeled off.
The preparation method of flexible display substrates the most according to claim 1, it is characterised in that described in rigidity bearing basement
The step of upper formation bump maps pattern layer specifically includes:
In described rigidity bearing basement, directly carry out patterning processes, form the patterned layer of depression.
6. according to the preparation method of the flexible display substrates described in any one of claim 2-5, it is characterised in that described in formation
Have and prepare flexible display substrates in the rigidity bearing basement of described relief pattern layer and specifically include:
The rigidity bearing basement being formed with described bump maps pattern layer is formed flexible substrate；
Described flexible substrate is prepared display element layer.
7. according to the preparation method of the flexible display substrates described in any one of claim 2-5, it is characterised in that: described bump maps
Pattern layer is made up of the area of the pattern of multiple mutual separations, and the pattern in described bump maps pattern layer is distributed in described area of the pattern,
The horizontal and vertical size range of each described area of the pattern is the size range in 1um-300um, short transverse
1um-300um, the spacing distance scope between the area of the pattern that each two is adjacent is 1um-3um.
The preparation method of flexible display substrates the most according to claim 7, it is characterised in that: the plane of described area of the pattern
It is shaped as rectangle, trapezoidal, triangle or circle.
The preparation method of flexible display substrates the most according to claim 7, it is characterised in that: the plurality of mutual separation
Latticed area of the pattern it is interconnected to form between area of the pattern.
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| CN112968144A (en) * | 2021-03-09 | 2021-06-15 | 华中科技大学 | PI flexible substrate stripping method based on silk-screen substrate layer, flexible substrate and OLED |
| CN112968144B (en) * | 2021-03-09 | 2022-05-20 | 华中科技大学 | PI flexible substrate stripping method based on silk-screen substrate layer, flexible substrate and OLED |
| CN113437234A (en) * | 2021-06-09 | 2021-09-24 | Tcl华星光电技术有限公司 | Method for peeling flexible substrate, flexible substrate and display panel |
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