CN106128761A - A kind of high-temperature resistant metal thin film - Google Patents
A kind of high-temperature resistant metal thin film Download PDFInfo
- Publication number
- CN106128761A CN106128761A CN201610707495.0A CN201610707495A CN106128761A CN 106128761 A CN106128761 A CN 106128761A CN 201610707495 A CN201610707495 A CN 201610707495A CN 106128761 A CN106128761 A CN 106128761A
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- China
- Prior art keywords
- heat
- radiation belt
- isolation strip
- basement membrane
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 67
- 239000002184 metal Substances 0.000 title claims abstract description 67
- 239000010409 thin film Substances 0.000 title claims abstract description 32
- 238000002955 isolation Methods 0.000 claims abstract description 52
- 210000002469 basement membrane Anatomy 0.000 claims abstract description 37
- 239000010408 film Substances 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 229920002799 BoPET Polymers 0.000 claims description 14
- 239000005041 Mylar™ Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229920001651 Cyanoacrylate Polymers 0.000 claims description 9
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 claims description 9
- 239000004115 Sodium Silicate Substances 0.000 claims description 9
- 239000004568 cement Substances 0.000 claims description 9
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 2
- NLCKLZIHJQEMCU-UHFFFAOYSA-N cyano prop-2-enoate Chemical group C=CC(=O)OC#N NLCKLZIHJQEMCU-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 238000001354 calcination Methods 0.000 abstract description 2
- 239000003990 capacitor Substances 0.000 description 12
- 230000015556 catabolic process Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011104 metalized film Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 125000004494 ethyl ester group Chemical group 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 210000004379 membrane Anatomy 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- ORVGYTXFUWTWDM-UHFFFAOYSA-N silicic acid;sodium Chemical compound [Na].O[Si](O)(O)O ORVGYTXFUWTWDM-UHFFFAOYSA-N 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of high-temperature resistant metal thin film, including basement membrane, the upper surface of basement membrane is provided with metal level, the lower surface of basement membrane is provided with heat dissipation film, and metal level includes multiple metal area, being provided with isolation area between adjacent metal area, isolation area includes vertical isolation strip and horizontal isolation strip, being additionally provided with microfuze between adjacent metal area, the inner side of heat dissipation film is provided with heat-radiation belt, and heat-radiation belt includes vertical heat-radiation belt and horizontal heat-radiation belt.The self-healing ability of described high-temperature resistant metal thin film is high, good heat dissipation effect, and resistance to elevated temperatures is strong, prevents from locally calcination or punch-through, safety and high life, meets actual operation requirements, and implementation result is good.
Description
Technical field
The present invention relates to a kind of high-temperature resistant metal thin film, belong to capacitor technology field.
Background technology
Along with the development and progress of electronic science and technology, the energy problem of 21 century is more and more noticeable, the whole world each
Industry all energy-conservation on a grand scale, illuminating industry is exactly a part therein, and according to incompletely statistics, electric consumption on lighting amount is very big,
Thus energy-saving potential is huge, this provides business opportunity and challenge to the components and parts supplier of illuminating industry.Power capacitor industry is exactly it
In a beneficiary, particularly disabled, along with compact type energy-saving lamp, electronic ballasting at electric filament lamp, inductance type ballast
In the case of device and forth generation lighting source or green light source LED fast development, research and development long-life, high power electronic product are to shine
The new development trend of bright industry.This series products is mainly used in electric ballast and the LED of illumination market, market demand
Bigger, risk is little, and rate of return on investment is big.
It is susceptible to multilayer dielectricity Continuous Breakdown during common metal thin film spontaneous recovery and causes the phenomenon of extensive burn, its electricity
Do not have big electric current inside container, produce high temperature；Further, common metal thin film does not has special radiator structure, commonly
Its poor thermal conductivity of the base material of metallized film i.e. plastic sheeting, causes common metal thin film radiating effect limited, utilizes common
The capacitor body that metallized film is wound into easy accumulation heat in the capacitor, adds capacitor body compact structure, interior
Portion's heat distributes difficulty.The capacitor that common metal thin film is made ambient temperature higher than about 80 DEG C time, metallized film
Occurring breakdown probability exponentially to rise, service life declines.
Summary of the invention
The present invention is directed to the deficiency that prior art exists, it is provided that a kind of high-temperature resistant metal thin film, concrete technical scheme
As follows:
A kind of high-temperature resistant metal thin film, including basement membrane, the upper surface of described basement membrane is provided with metal level, and the lower surface of basement membrane sets
Being equipped with heat dissipation film, described metal level includes multiple metal area, and metal area is in the upper surface array distribution of basement membrane, adjacent metal area
Between be provided with isolation area, isolation area includes vertical isolation strip and horizontal isolation strip, and described vertical isolation strip is parallel with the axis of basement membrane, horizontal stroke
Isolation strip is mutually perpendicular to vertical isolation strip, is additionally provided with microfuze, between adjacent metal area between adjacent metal area
It is electrically connected by microfuze；The inner side of described heat dissipation film is provided with heat-radiation belt, and heat-radiation belt includes vertical heat-radiation belt and horizontal dissipates
The torrid zone, described vertical heat-radiation belt is arranged on the underface of vertical isolation strip and vertical heat-radiation belt is parallel to each other with vertical isolation strip, described horizontal dissipates
The torrid zone is arranged on the underface of horizontal isolation strip and horizontal heat-radiation belt is parallel to each other with horizontal isolation strip.
As the improvement of technique scheme, the width of described vertical isolation strip is a, and the width of described horizontal isolation strip is b, institute
The width stating vertical heat-radiation belt is c, c ＞ a；The width of described horizontal heat-radiation belt is d, d ＞ b.
As the improvement of technique scheme, the width of described heat dissipation film is equal to the width of basement membrane, described horizontal heat-radiation belt
Length is less than the width of heat dissipation film.
As the improvement of technique scheme, described heat dissipation film is mylar, described heat-radiation belt by black lead wash at polyester
The inner side of thin film is made through spraying and drying, and the inner side of heat dissipation film is also coated with Instant cement, passes through between heat dissipation film and basement membrane
Instant cement is fixing to be connected.
As the improvement of technique scheme, described black lead wash is made up of graphite powder, sodium silicate, cyanoacrylate, stone
The quality of graphite powder in ink slurry: the quality of sodium silicate: quality=100:(12 ~ 15 of cyanoacrylate): (50 ~ 60)；Black lead wash
Drying temperature inside mylar is 85 ~ 90 DEG C.
High-temperature resistant metal thin film of the present invention is by arranging heat dissipation film, and arranges relative with isolation area on heat dissipation film
The heat-radiation belt answered, it is to avoid metal area occurs Continuous Breakdown to cause the phenomenon of extensive burn, utilizes this high-temperature resistant metal thin film
The capacitor made is it can be avoided that its internal high temperature that produces, and the operation in hot environment of this capacitor, even if the overwhelming majority is miniature
Electric fuse is all fused by high temperature, does not also have overheated blast；The self-healing ability of described high-temperature resistant metal thin film is high, dissipates
Thermal effect is good, and resistance to elevated temperatures is strong, prevents from locally calcination or punch-through, safety and high life, meets reality
Using requirement, implementation result is good.
Accompanying drawing explanation
Fig. 1 is high-temperature resistant metal membrane structure schematic diagram of the present invention；
Fig. 2 is metal-layer structure schematic diagram of the present invention；
Fig. 3 is heat-dissipation film structure schematic diagram of the present invention.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right
The present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, and
It is not used in the restriction present invention.
As shown in Fig. 1 ~ 3, described high-temperature resistant metal thin film, including basement membrane 10, the upper surface of described basement membrane 10 is provided with
Metal level 20, the lower surface of basement membrane 10 is provided with heat dissipation film 30, and described metal level 20 includes multiple metal area 21, and metal area 21 exists
The upper surface array distribution of basement membrane 10, is provided with isolation area 22 between adjacent metal area 21, logical between adjacent metal area 21
Crossing isolation area 22 to disconnect, isolation area 22 includes vertical isolation strip 221 and horizontal isolation strip 222, described vertical isolation strip 221 and basement membrane 10
Axis is parallel, and horizontal isolation strip 222 is mutually perpendicular to vertical isolation strip 221, is additionally provided with mini-insurance between adjacent metal area 21
Silk 23, is electrically connected by microfuze 23 between adjacent metal area 21；The inner side of described heat dissipation film 30 is provided with heat radiation
Band 31, heat-radiation belt 31 includes vertical heat-radiation belt 311 and horizontal heat-radiation belt 312, and described vertical heat-radiation belt 311 is arranged on vertical isolation strip 221
Underface and vertical heat-radiation belt 311 are parallel to each other with vertical isolation strip 221, and described horizontal heat-radiation belt 312 is just being arranged on horizontal isolation strip 222
Lower section and horizontal heat-radiation belt 312 are parallel to each other with horizontal isolation strip 222.
Basement membrane 10 can use the one in poly-ethyl ester, polypropylene, polystyrene to make, and metal area 21 can be incited somebody to action by copper evaporation process
Aluminum or zinc are plated in the upper surface of basement membrane 10.In use, electric current is entered described high-temperature resistant metal thin film by microfuze 23
Entering the metal area 21 at breakdown point place, current value reaches the moment of certain numerical value, and the metal area 21 produced energy that generates heat makes micro-
Type electric fuse 23 fuses immediately, makes the metal area 21 at breakdown point place totally keep apart with described high-temperature resistant metal thin film,
Prevent the big entrance breakdown point that shoves in time.Metal area 21 is owing to being aluminum or zinc is made, and the radiating effect of metal area 21 is excellent
Good, the poor radiation of basement membrane 10, and there is tomography in the upper surface heat radiation that the existence of isolation area 22 makes basement membrane 10 so that isolation area
Heat is easily accumulated on 22；Owing to vertical heat-radiation belt 311 is relative in the position of basement membrane 10 with vertical isolation strip 221 in the position of basement membrane 10
Should, horizontal heat-radiation belt 312 is corresponding in the position of basement membrane 10 with horizontal isolation strip 222 in the position of basement membrane 10, i.e. heat-radiation belt 31 and every
Corresponding from district 22, heat-radiation belt 31 heat conductivity is high, and the structure of heat-radiation belt 31 meets most advanced and sophisticated heat effect principle, can be rapidly
Heat on isolation area 22 is outwardly distributed, it is to avoid metal area 21 occurs the Continuous Breakdown to cause the phenomenon of extensive burn,
The capacitor internal using described high-temperature resistant metal thin film to make does not haves big electric current, it is to avoid capacitor internal produces height
Temperature.The capacitor operation in high temperature environments made even with described high-temperature resistant metal thin film, most of microfuzes
23 are all fused by high temperature, also can only cause the dramatic decrease of capacity until capacitor open-circuit lost efficacy, without there is overheated generation
Blast, thus improve safety and the resistance to elevated temperatures of described high-temperature resistant metal thin film.
For improving the radiating effect of heat dissipation film 30, the width of described vertical isolation strip 221 is a, the width of described horizontal isolation strip 222
Degree is b, and the width of described vertical heat-radiation belt 311 is c, c ＞ a；The width of described horizontal heat-radiation belt 312 is d, d ＞ b so that heat dissipation film
The area of dissipation of the heat-radiation belt 31 in 30 is more than the area of isolation area 22 so that the heat on isolation area 22 can be dissipated further
The torrid zone 31 disperses, and the radiating effect of heat-radiation belt 31 improves further.
The width of described heat dissipation film 30 is less than heat dissipation film 30 equal to the width of basement membrane 10, the length of described horizontal heat-radiation belt 312
Width so that on the one hand heat-radiation belt 31 can be enclosed between heat dissipation film 30 and basement membrane 10 completely, is to ensure that heat dissipation film 30 He
There are enough bond strengths between basement membrane 10, are on the other hand to avoid heat-radiation belt 31 subsequent design to produce impact, such as when dissipating
When the torrid zone 31 has electric conductivity, heat-radiation belt 31 must be covered by heat dissipation film 30 completely, it is to avoid punctures.
Described heat dissipation film 30 can be selected for mylar, and mylar has good mechanical performance, rigidity, hardness and toughness
Height, puncture-resistant, rub resistance, high temperature resistant and low temperature, chemical proofing, oil resistivity, air-tightness are good；Mylar changes further
The resistance to elevated temperatures of kind described high-temperature resistant metal thin film, the performance of mylar is better than poly-ethyl ester, polypropylene, polystyrene,
Heat dissipation film 30 uses oriented pet film body, is equivalent to basement membrane 10 and is thickened, and described high-temperature resistant metal thin film punctures
Probability declines, and described high-temperature resistant metal thin film improves service life；When described high-temperature resistant metal thin film is in hot environment
Time, mylar is not susceptible to softening transform, is difficult to breakdown between adjacent metal area 21.Described heat-radiation belt 31 is by black lead wash
Making through spraying and drying in the inner side of mylar, the inner side of heat dissipation film 30 is also coated with Instant cement, heat dissipation film 30 and base
Connect by Instant cement is fixing between film 10.The course of processing of heat dissipation film 30 is as follows: by graphite powder, sodium silicate, alpha-cyanoacrylate
Ester is according to mass ratio 100:(12 ~ 15): the ratio mix homogeneously of (50 ~ 60) makes black lead wash, such as scheme one: graphite powder
100Kg, sodium silicate 12Kg, cyanoacrylate 50Kg；Scheme two: graphite powder 100Kg, sodium silicate 13Kg, cyanoacrylate
56Kg；Scheme three: graphite powder 100Kg, sodium silicate 15Kg, cyanoacrylate 60Kg；The black lead wash of mix homogeneously is sprayed on
The inner side of mylar, continues in spraying process to lead to hot blast in the outside of mylar, and the temperature of hot blast is 85 ~ 90 DEG C, by stone
Ink slurry is dried, and the black lead wash after drying i.e. defines heat-radiation belt 31, then coats one layer of Instant cement on the inner side of mylar,
Utilize Instant cement that the inner side of mylar is fixed on the lower surface of basement membrane 10.Graphite powder has excellent heat conductivility, silicic acid
Sodium can promote that graphite powder is bondd by cyanoacrylate, cyanoacrylate specifically quick cementitiousness, temperature is increased to 85 ~
When 90 DEG C, cyanoacrylate coordinates sodium silicate rapidly graphite powder bonding can be formed heat-radiation belt 31.
The heat conductivity of described heat-radiation belt 31 is 80 ~ 90w/ (m k), and the radiating effect of heat-radiation belt 31 is excellent, can rapidly and
Time the heat on isolation area 22 is outwards distributed；The processing technology of heat-radiation belt 31 is simple, and the structure of described heat-radiation belt 31
Also there is cost-effective effect, it is simple to use Instant cement to fix heat dissipation film 30 and basement membrane 10, it is ensured that heat dissipation film 30 and basement membrane 10
Between have enough bond areas.Described high-temperature resistant metal thin film carries out high temperature durability experiment, normal under 150 DEG C of environment
Working time is not less than 1000h, remains to normal working hours 120h under 180 DEG C of environment.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Any amendment, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (5)
1. a high-temperature resistant metal thin film, including basement membrane (10), it is characterised in that: the upper surface of described basement membrane (10) is provided with
Metal level (20), the lower surface of basement membrane (10) is provided with heat dissipation film (30), and described metal level (20) includes multiple metal area (21),
Metal area (21) is provided with isolation area (22) between the upper surface array distribution of basement membrane (10), adjacent metal area (21), every
Including vertical isolation strip (221) and horizontal isolation strip (222) from district (22), described vertical isolation strip (221) is flat with the axis of basement membrane (10)
OK, horizontal isolation strip (222) are mutually perpendicular to vertical isolation strip (221), are additionally provided with mini-insurance between adjacent metal area (21)
Silk (23), is electrically connected by microfuze (23) between adjacent metal area (21)；The inner side of described heat dissipation film (30) sets
Being equipped with heat-radiation belt (31), heat-radiation belt (31) includes vertical heat-radiation belt (311) and horizontal heat-radiation belt (312), and described vertical heat-radiation belt (311) sets
Put underface and vertical heat-radiation belt (311) in vertical isolation strip (221) to be parallel to each other with vertical isolation strip (221), described horizontal heat-radiation belt
(312) underface and the horizontal heat-radiation belt (312) that are arranged on horizontal isolation strip (222) are parallel to each other with horizontal isolation strip (222).
A kind of high-temperature resistant metal thin film the most according to claim 1, it is characterised in that: described vertical isolation strip (221)
Width is a, and the width of described horizontal isolation strip (222) is b, and the width of described vertical heat-radiation belt (311) is c, c ＞ a；Described horizontal heat radiation
The width of band (312) is d, d ＞ b.
A kind of high-temperature resistant metal thin film the most according to claim 2, it is characterised in that: the width of described heat dissipation film (30)
Equal to the width of basement membrane (10), the length of described horizontal heat-radiation belt (312) is less than the width of heat dissipation film (30).
A kind of high-temperature resistant metal thin film the most according to claim 3, it is characterised in that: described heat dissipation film (30) is polyester
Thin film, described heat-radiation belt (31) is made up through spraying and drying in the inner side of mylar of black lead wash, heat dissipation film (30) interior
Side is also coated with Instant cement, connects by Instant cement is fixing between heat dissipation film (30) and basement membrane (10).
A kind of high-temperature resistant metal thin film the most according to claim 4, it is characterised in that: described black lead wash by graphite powder,
Sodium silicate, cyanoacrylate form, the quality of graphite powder in black lead wash: the quality of sodium silicate: the quality of cyanoacrylate=
100:(12 ~ 15): (50 ~ 60)；Black lead wash drying temperature inside mylar is 85 ~ 90 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610707495.0A CN106128761B (en) | 2016-08-24 | 2016-08-24 | A kind of high-temperature resistant metal film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610707495.0A CN106128761B (en) | 2016-08-24 | 2016-08-24 | A kind of high-temperature resistant metal film |
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| Publication Number | Publication Date |
|---|---|
| CN106128761A true CN106128761A (en) | 2016-11-16 |
| CN106128761B CN106128761B (en) | 2018-02-06 |
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| CN201610707495.0A Active CN106128761B (en) | 2016-08-24 | 2016-08-24 | A kind of high-temperature resistant metal film |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202221706U (en) * | 2011-09-16 | 2012-05-16 | 扬州日精电子有限公司 | Heat radiation type metallized film capacitor |
| CN202363255U (en) * | 2011-11-10 | 2012-08-01 | 安徽省宁国市海伟电子有限公司 | Low heat radiation metallization film possessing multiple protection functions |
| JP2015227444A (en) * | 2014-05-09 | 2015-12-17 | Dic株式会社 | Adhesive tape and production method thereof, and heat radiation film |
| CN205959777U (en) * | 2016-08-24 | 2017-02-15 | 铜陵市铜创电子科技有限公司 | High temperature resistant metallized film |
-
2016
- 2016-08-24 CN CN201610707495.0A patent/CN106128761B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202221706U (en) * | 2011-09-16 | 2012-05-16 | 扬州日精电子有限公司 | Heat radiation type metallized film capacitor |
| CN202363255U (en) * | 2011-11-10 | 2012-08-01 | 安徽省宁国市海伟电子有限公司 | Low heat radiation metallization film possessing multiple protection functions |
| JP2015227444A (en) * | 2014-05-09 | 2015-12-17 | Dic株式会社 | Adhesive tape and production method thereof, and heat radiation film |
| CN205959777U (en) * | 2016-08-24 | 2017-02-15 | 铜陵市铜创电子科技有限公司 | High temperature resistant metallized film |
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| Publication number | Publication date |
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| CN106128761B (en) | 2018-02-06 |
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Effective date of registration: 20190717 Address after: 244000 No.2 Building of Standardized Factory Building of Tongling Demonstration Park for Undertaking Industrial Transfer in Anhui Province Patentee after: TONGLING HONGSHENG BAICHENG NEW ENERGY TECHNOLOGY Co.,Ltd. Address before: Room 501, Guantang Community, No. 879, Middle Section of Shicheng Avenue, Tongling City, Anhui Province Patentee before: TONGLING TONGCHUANG ELECTRONIC TECHNOLOGY CO.,LTD. |
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Address after: 244000 unit 1, building C3, Hangzhou Road (standardized plant), East Park, Tongling Economic and Technological Development Zone, Anhui Province Patentee after: Tongling Hongsheng Baicheng New Energy Technology Co.,Ltd. Address before: Building 2 of 244000 Standardization Plant in Tongling City, Anhui Province to Undertake Industrial Transfer Demonstration Park Patentee before: TONGLING HONGSHENG BAICHENG NEW ENERGY TECHNOLOGY Co.,Ltd. |