CN106115348A - Conductive tape attaching device and conductive tape attaching method - Google Patents
Conductive tape attaching device and conductive tape attaching method Download PDFInfo
- Publication number
- CN106115348A CN106115348A CN201610479813.2A CN201610479813A CN106115348A CN 106115348 A CN106115348 A CN 106115348A CN 201610479813 A CN201610479813 A CN 201610479813A CN 106115348 A CN106115348 A CN 106115348A
- Authority
- CN
- China
- Prior art keywords
- conductive tape
- drive mechanism
- auxiliary briquetting
- pressure head
- briquetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/0006—Article or web delivery apparatus incorporating cutting or line-perforating devices
- B65H35/002—Hand-held or table apparatus
- B65H35/0026—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape
- B65H35/0033—Hand-held or table apparatus for delivering pressure-sensitive adhesive tape and affixing it to a surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/02—Advancing webs by friction roller
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a kind of conductive tape attaching device, solve conductive tape in prior art and attach the big and wasting problem of length tolerance.This conductive tape attaching device includes: pressure head and pressure head drive mechanism, and conductive tape is pressed on screen surface to realize attaching under the driving of pressure head drive mechanism by pressure head；First guide wheel group and the second guide wheel group, be separately positioned on the both sides of pressure head, for screen body direction conveying conductive tape；First auxiliary briquetting and the first drive mechanism, the first auxiliary briquetting is arranged between the first guide wheel group and pressure head, and conductive tape is pressed to shield surface under the driving of the first drive mechanism by the first auxiliary briquetting；And the second auxiliary briquetting and the second drive mechanism, the second auxiliary briquetting is arranged between the second guide wheel group and pressure head, and conductive tape is pressed to shield surface under the driving of the second drive mechanism by the second auxiliary briquetting；Wherein parallel with screen surface in the bottom surface of the first auxiliary briquetting and the second auxiliary briquetting.
Description
Technical field
The present invention relates to display preparing technical field, be specifically related to a kind of conductive tape attaching device and conductive tape patch
Subsidiary formula method.
Background technology
In the preparation process of display, need to realize integrated core by conductive tape (such as, anisotropic conductive adhesive tape)
Electrode between sheet with display screen body is connected.Concrete process for being first attached to display screen surface by conductive tape, by stripping
The adhesion layer of conductive tape is made to stay screen surface, the most again by integrated chip attachment on adhesion layer surface from process.Such as Fig. 1 a
Shown in Fig. 1 b, existing conductive tape attaching device includes guide wheel group and the pressure head of both sides, and conductive tape typically uses winding
Formula.Under pressure head during pressure, by the transmission of both sides guide wheel group, conductive tape is pressed on screen surface, then warp by pressure head
The first pressing fixed time of overvoltage keeps process (needing during this to control the temperature of pressing, time and pressure and other parameters), so that leading
The adhesion layer of electricity adhesive tape adheres to screen surface.
But during realizing conductive tape attaching, there are the following problems: between the distance screen body of guide wheel group bottom
There is certain distance, thus conductive tape also has certain distance in distance screen surface during attaching.So pressure head under press
During can cause the stretcher strain (as shown in Figure 1 b) of conductive tape, thus it is long to cause conductive tape to there is bigger attaching
Degree tolerance, this can cause the use of conductive tape to waste, increase the use cost of conductive tape.
Although prior art can be come by introducing extra guide wheel and stripping litter device between guide wheel group and screen body
Reduce the distance between conductive tape and screen body during pressure head is pressed down, but owing to this extra guide wheel need to possess certain depth
Guided wheel slot is to realize the guiding to conductive tape, and this glass litter device itself also needs to occupy certain volume, this mode
Still conductive tape off screen surface during attaching cannot be enable enough near, thus it is long to yet suffer from bigger attaching
Degree tolerance.
Summary of the invention
In view of this, the invention provides a kind of conductive tape attaching device and conductive tape attaching method, solve existing
There is the problem that the attaching length tolerance of conductive tape in technology causes conductive tape to waste greatly.
A kind of conductive tape attaching device that the present invention provides includes:
Pressure head and pressure head drive mechanism, conductive tape is pressed under the driving of described pressure head drive mechanism by described pressure head
Screen surface is to realize attaching；
First guide wheel group and the second guide wheel group, be separately positioned on the both sides of described pressure head, for defeated to described screen body direction
Send conductive tape；
First auxiliary briquetting and the first drive mechanism, described first auxiliary briquetting is arranged on described first guide wheel group and described
Between pressure head, described conductive tape is pressed to shield body surface under the driving of described first drive mechanism by described first auxiliary briquetting
Face；And
Second auxiliary briquetting and the second drive mechanism, described second auxiliary briquetting is arranged on described second guide wheel group and described
Between pressure head, described conductive tape is pressed to shield body surface under the driving of described second drive mechanism by described second auxiliary briquetting
Face；
Parallel with screen surface in the bottom surface of wherein said first auxiliary briquetting and the second auxiliary briquetting.
Further, described first auxiliary briquetting farther includes: the first chamfering and the first side, wherein said first auxiliary
First chamfering described in the underrun of pressing aid block is connected with described first side, and described first side and the first chamfering are led described
Electricity adhesive tape guides the bottom surface of described first auxiliary briquetting；And/or
Described second auxiliary briquetting farther includes: the second chamfering and the second side, wherein said second auxiliary briquetting
Second chamfering described in underrun is connected with described second side, and described conductive tape is led by described second side and the second chamfering
Bottom surface to described second auxiliary briquetting.
Further, described first side and/or described first chamfering and/or described second side and/or the second chamfering
Surface be provided with direction recess.
Further, described pressure head drive mechanism and/or described first drive mechanism and/or described second drive mechanism are adopted
Realize driving function with leading screw motor.
Further, described conductive tape attaching device farther includes: cutter sweep, for cutting attached described
The adhesion layer of conductive tape.
Further, described cutter sweep includes two cutting tools, and it is right to be respectively used to realize from the both sides of described pressure head
The cutting of the adhesion layer of the described conductive tape attached.
The present invention also provides for a kind of conductive tape attaching method, uses foregoing conductive tape attaching device, wherein
Described method includes:
By described first drive mechanism and described second drive mechanism so that described first assists briquetting and described second
Conductive tape is pressed to shield above body by auxiliary briquetting；
By described pressure head drive mechanism so that described conductive tape is pressed on screen surface by described pressure head；And
Rise described pressure head by described pressure head drive mechanism, then driven by described first drive mechanism and described second
Motivation structure rises described first auxiliary briquetting and described second auxiliary briquetting.
Further, by described first drive mechanism and described second drive mechanism rise described first auxiliary briquetting and
Described second auxiliary briquetting includes:
First pass through described first drive mechanism and rise described first auxiliary briquetting, then risen by described second drive mechanism
Described second auxiliary briquetting；Or
First pass through described second drive mechanism and rise described second auxiliary briquetting, then risen by described first drive mechanism
Described first auxiliary briquetting.
Further, by described first drive mechanism and described second drive mechanism so that described first auxiliary briquetting and
Conductive tape is pressed to shield above body and includes by described second auxiliary briquetting:
Described conductive tape after being pressed down by described first auxiliary briquetting and described second auxiliary briquetting and described screen body surface
Face is parallel.
Further, described conductive tape attaching device farther includes: cutter sweep；Wherein said method is wrapped further
Include:
Before rising described pressure head by described pressure head drive mechanism, cut described conducting resinl by described cutter sweep
The adhesion layer of band is so that the adhesion layer of conductive tape after Qie Ge matches with integrated chip size to be mounted.
A kind of conductive tape attaching device that the present invention provides and conductive tape attaching method, by pressure head and both sides
Introduce the first auxiliary briquetting and the second auxiliary briquetting between guide wheel group respectively, the first auxiliary pressure can be first passed through before pressing under pressure head
Conductive tape is pressed to shield above body by block and the second auxiliary briquetting；And due to the first auxiliary briquetting and the end of the second auxiliary briquetting
Paralleling with screen surface in face, therefore conductive tape can be pressed to distance screen body surface by the first auxiliary briquetting and the second auxiliary briquetting
The position that face is the nearest.The excessive tensile that can't cause conductive tape after so pressure head is pressed down deforms, thus substantially reduces
The attaching length tolerance of conductive tape, reduces the use cost of conductive tape.
Accompanying drawing explanation
Fig. 1 a show the structural representation of a kind of conductive tape attaching device that prior art provides.
Fig. 1 b show the attaching principle schematic of a kind of conductive tape attaching device that prior art provides.
Fig. 2 show the structural representation of a kind of conductive tape attaching device that the present invention provides.
Fig. 3 show the schematic flow sheet of a kind of conductive tape attaching method that the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under not making creative work premise
Execute example, broadly fall into the scope of protection of the invention.
Fig. 2 show the structural representation of a kind of conductive tape attaching device of the present invention.As in figure 2 it is shown, this conducting resinl
Band adhering device includes: pressure head 1, pressure head drive mechanism, first guide wheel group the 21, second guide wheel group 22, first assist briquetting 31, the
One drive mechanism, the second auxiliary briquetting 32 and the second drive mechanism.Wherein, pressure head drive mechanism, the first drive mechanism and second
Drive mechanism is not it is shown in fig. 2, it is to be understood that pressure head drive mechanism, the first drive mechanism and the second drive mechanism can be
Using such as leading screw motor to realize driving the mechanical mechanism of function, the present invention is to pressure head drive mechanism, the first drive mechanism
Do not limit with the specific implementation of the second drive mechanism.
Specifically, conductive tape 4 is pressed on screen surface to realize patch under the driving of pressure head drive mechanism by pressure head 1
Attached.Owing to pressure head 1 also needs to be controlled the temperature of pressing, therefore in pressure head 1 during the pressing holding to conductive tape 4
Portion also should possess heating unit.First guide wheel group 21 and the second guide wheel group 22 are separately positioned on the both sides of pressure head 1, for screen body
Direction conveying conductive tape 4.As in figure 2 it is shown, each guide wheel group may each comprise three guide wheels of upper, middle and lower, and three guide wheels are vertically
The position in direction offsets one from another, to ensure the tension force in conductive tape 4 transmitting procedure.It is to be understood that, each guide wheel group is led
The quantity of wheel and arrange position and can adjust according to actual needs, this is not limited by the present invention.
First auxiliary briquetting 31 is arranged between the first guide wheel group 21 and pressure head 1, and the first auxiliary briquetting 31 drives first
Press to conductive tape 4 under the driving of mechanism shield surface.Second auxiliary briquetting 32 be arranged on the second guide wheel group 22 and pressure head 1 it
Between, conductive tape 4 is pressed to shield surface under the driving of the second drive mechanism by the second auxiliary briquetting 32.First auxiliary briquetting 31
Parallel with screen surface with the bottom surface of the second auxiliary briquetting 32.So can first pass through the first auxiliary pressure before 1 time pressure of pressure head
Conductive tape 4 is pressed to shield above body by block 31 and the second auxiliary briquetting 32.Due to the first auxiliary briquetting 31 and the second auxiliary pressure
Paralleling with screen surface in the bottom surface of block 32, therefore conductive tape 4 can be assisted briquetting 32 times by the first auxiliary briquetting 31 and second
It is depressed into the position that distance screen surface is the nearest.So the excessive tensile of conductive tape 4 can't be caused to become after 1 time pressure of pressure head
Shape, thus substantially reduce the attaching length tolerance of conductive tape 4, reduce the use cost of conductive tape 4.
Through overtesting, use the conductive tape attaching device that the embodiment of the present invention is provided, after mounting integrated chip, lead
The length accuracy of the prolongation that integrated chip left and right edges compared by electricity adhesive tape 4 can be controlled in about 0.2mm, and industry is adopted at present
The length accuracy attaching the prolongation that mode conductive tape 4 compares integrated chip left and right edges by tradition only can be controlled in
About 0.5mm, therefore the attachment of every integrated chip can save the use of conductive tape 4 of 0.6mm, with COGACF (Chip On
Glass Anisotropic Conductive Film, the anisotropic conductive film that glass surface chip bonding is used) be
Example, the price of 0.6mm is about 0.009 yuan.
In the present invention, pressed through for 32 times by the first auxiliary briquetting 31 and the second auxiliary briquetting to reduce conductive tape 4
Tensile stress in journey, reduces the attaching length tolerance thus brought, and the first auxiliary briquetting 31 comprises the steps that the first chamfering 312 He
First side 311, wherein underrun first chamfering 312 of the first auxiliary briquetting 31 is connected with the first side 311, the first side
311 and first chamfering 312 conductive tape 4 is guided the bottom surface of the first auxiliary briquetting 31.Correspondingly, the second auxiliary briquetting 32 can wrap
Include: the second chamfering 322 and the second side 321, wherein the second auxiliary underrun second chamfering 322 of briquetting 32 and the second side
321 connect, and conductive tape 4 is guided the bottom surface of the second auxiliary briquetting 32 by the second side 321 and the second chamfering 322.So conduction
Adhesive tape 4 be directed to first auxiliary briquetting 31/ second auxiliary briquetting 32 bottom surface during will through a chamfering, thus
Avoid conductive tape 4 and produce the bending that angle is excessive, fall when by this first auxiliary briquetting 31/ second auxiliary 32 times pressure of briquetting
Low tensile stress, can reduce the attaching length tolerance of conductive tape 4 further.
So that conductive tape 4 is to guide the first auxiliary briquetting 31/ second from the first side 321, side 311/ second auxiliary
Position will not be occurred during the bottom surface of pressing aid block 32 to deviate, first the 311, first chamfering the 312, second side 321, side and
The surface of the second chamfering 322 can be provided with direction recess.The so conductive tape 4 position in transmitting procedure can be limited in this and leads
In groove, improve the position precision that conductive tape 4 attaches.
In the present invention, conductive tape 4 also needs to carry out cutting according to integrated chip to be mounted after having attached, because of
This this conductive tape attaching device also can farther include: cutter sweep, for the adhesion of the conductive tape 4 that cutting has attached
Layer.Such as, this cutter sweep can include two cutting tools, is respectively used to realize the conduction attached from the both sides of pressure head 1
The cutting of the adhesion layer of adhesive tape 4.Ensure as a example by should be appreciated that on integrated chip, all of pin can realize being electrically connected with screen body
Connecing, the size of the adhesion layer of the conductive tape 4 after cutting should be larger than integrated chip to be mounted.At its of the present invention
In his embodiment, this cutter sweep also can use other way of realization, and the present invention is same to the concrete form of this cutter sweep
Do not limit.
Fig. 3 show the schematic flow sheet of a kind of conductive tape attaching method that the present invention provides.The method uses this
The conductive tape attaching device that bright embodiment is provided completes the attaching process of conductive tape.As it is shown on figure 3, the method includes:
Step 301: by the first drive mechanism and the second drive mechanism so that the first auxiliary briquetting 31 and the second auxiliary are pressed
Conductive tape 4 is pressed to shield above body by block 32.Due to the first auxiliary briquetting 31 and the second auxiliary briquetting 32 bottom surface all with shield
Surface is parallel, the most also needs to control so that by the conductive tape 4 after the first auxiliary briquetting 31 and second 32 times pressures of auxiliary briquetting
Parallel with screen surface.So conductive tape 4 just can be compressed to a distance screen surface very before 1 time pressure of pressure head
Near position.
Step 302: by pressure head drive mechanism so that conductive tape 4 is pressed on screen surface by pressure head 1.Due to conducting resinl
The nearest position, a distance screen surface has been pressed to by the first auxiliary briquetting 31 and the second auxiliary briquetting 32 with 4, because of
And the excessive tensile that the process that pressure head is pressed for 1 time can't cause conductive tape 4 deforms, thus improve the attaching of conductive tape 4
Length accuracy, reduces the use cost of conductive tape 4.
Step 303: rise pressure head 1 by pressure head drive mechanism, then by the first drive mechanism and the second drive mechanism
Rise the first auxiliary briquetting 31 and the second auxiliary briquetting 32.In the present invention, the rising of briquetting is assisted to realize in order to be able to utilization right
The stripping of conductive tape 4 adhesion layer, makes adhesion layer stay screen surface, can first pass through the first drive mechanism and rise the first auxiliary pressure
Block 31, then rise the second auxiliary briquetting 32 by the second drive mechanism.During such first auxiliary briquetting 31 rises, second
Auxiliary briquetting 32 is still in the state pressed down, thus the conductive tape 4 attached can be realized peeling effect so that attached
The adhesion layer of conductive tape 4 is stripped and stays screen surface.In like manner, it is possible to first pass through the second drive mechanism and rise the second auxiliary
Briquetting 32, then rise the first auxiliary briquetting 31 by the first drive mechanism, this peeling effect can be realized equally.
In the present invention, in order to after conductive tape 4 has attached according to integrated chip size to be mounted to conduction
The adhesion layer of adhesive tape 4 carries out cutting, and this conductive tape attaching device farther includes: cutter sweep.Now the method can enter one
Step includes: risen before pressure head 1 by pressure head drive mechanism, by the adhesion layer of cutter sweep cutting conductive tape 4 so that
The adhesion layer of the conductive tape 4 after cutting matches with integrated chip size to be mounted.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Within god and principle, any amendment of being made, equivalent etc., should be included within the scope of the present invention.
Claims (10)
1. a conductive tape attaching device, it is characterised in that including:
Pressure head and pressure head drive mechanism, conductive tape is pressed on screen body under the driving of described pressure head drive mechanism by described pressure head
Surface is to realize attaching；
First guide wheel group and the second guide wheel group, be separately positioned on the both sides of described pressure head, leads for the conveying to described screen body direction
Electricity adhesive tape；
First auxiliary briquetting and the first drive mechanism, described first auxiliary briquetting is arranged on described first guide wheel group and described pressure head
Between, described conductive tape is pressed to shield surface under the driving of described first drive mechanism by described first auxiliary briquetting；With
And
Second auxiliary briquetting and the second drive mechanism, described second auxiliary briquetting is arranged on described second guide wheel group and described pressure head
Between, described conductive tape is pressed to shield surface under the driving of described second drive mechanism by described second auxiliary briquetting；
Parallel with screen surface in the bottom surface of wherein said first auxiliary briquetting and the second auxiliary briquetting.
Conductive tape attaching device the most according to claim 1, it is characterised in that described first auxiliary briquetting wraps further
Include: the first chamfering and the first side, the first chamfering and described first side described in the underrun of wherein said first auxiliary briquetting
Face connects, and described conductive tape is guided the bottom surface of described first auxiliary briquetting by described first side and the first chamfering；And/or
Described second auxiliary briquetting farther includes: the second chamfering and the second side, the bottom surface of wherein said second auxiliary briquetting
Being connected with described second side by described second chamfering, described conductive tape is guided institute by described second side and the second chamfering
State the bottom surface of the second auxiliary briquetting.
Conductive tape attaching device the most according to claim 2, it is characterised in that described first side and/or described
The surface of one chamfering and/or described second side and/or the second chamfering is provided with direction recess.
4. according to described conductive tape attaching device arbitrary in claims 1 to 3, it is characterised in that described pressure head drives machine
Structure and/or described first drive mechanism and/or described second drive mechanism use leading screw motor to realize driving function.
5. according to described conductive tape attaching device arbitrary in claims 1 to 3, it is characterised in that farther include: cutting
Device, for the adhesion layer of the described conductive tape that cutting has attached.
Conductive tape attaching device the most according to claim 5, it is characterised in that described cutter sweep includes two cuttings
Cutter, is respectively used to realize the cutting of the adhesion layer to the described conductive tape attached from the both sides of described pressure head.
7. a conductive tape attaching method, it is characterised in that use conductive tape attaching device as claimed in claim 1,
The method comprise the steps that
By described first drive mechanism and described second drive mechanism so that described first auxiliary briquetting and described second assists
Conductive tape is pressed to shield above body by briquetting；
By described pressure head drive mechanism so that described conductive tape is pressed on screen surface by described pressure head；And
Rise described pressure head by described pressure head drive mechanism, then drive machine by described first drive mechanism and described second
Structure rises described first auxiliary briquetting and described second auxiliary briquetting.
Conductive tape attaching method the most according to claim 7, it is characterised in that by described first drive mechanism and institute
State the second described first auxiliary briquetting of drive mechanism rising and described second auxiliary briquetting include:
First pass through described first drive mechanism and rise described first auxiliary briquetting, then rise described by described second drive mechanism
Second auxiliary briquetting；Or
First pass through described second drive mechanism and rise described second auxiliary briquetting, then rise described by described first drive mechanism
First auxiliary briquetting.
Conductive tape attaching method the most according to claim 7, it is characterised in that by described first drive mechanism and institute
State the second drive mechanism so that conductive tape is pressed to shield above body by described first auxiliary briquetting and described second auxiliary briquetting
Including:
Described conductive tape after being pressed down by described first auxiliary briquetting and described second auxiliary briquetting and described screen surface phase
Parallel.
Conductive tape attaching method the most according to claim 7, it is characterised in that described conductive tape attaching device enters
One step includes: cutter sweep；Wherein said method farther includes:
Before rising described pressure head by described pressure head drive mechanism, cut described conductive tape by described cutter sweep
Adhesion layer is so that the adhesion layer of conductive tape after Qie Ge matches with integrated chip size to be mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610479813.2A CN106115348A (en) | 2016-06-27 | 2016-06-27 | Conductive tape attaching device and conductive tape attaching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610479813.2A CN106115348A (en) | 2016-06-27 | 2016-06-27 | Conductive tape attaching device and conductive tape attaching method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106115348A true CN106115348A (en) | 2016-11-16 |
Family
ID=57265699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610479813.2A Pending CN106115348A (en) | 2016-06-27 | 2016-06-27 | Conductive tape attaching device and conductive tape attaching method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106115348A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932929A (en) * | 2017-03-30 | 2017-07-07 | 京东方科技集团股份有限公司 | A kind of shading rubber belt pastes system |
| CN110271197A (en) * | 2019-07-04 | 2019-09-24 | 珠海灵科自动化科技有限公司 | Glue film hot-press arrangement and glue film hot press |
| CN110849737A (en) * | 2019-10-14 | 2020-02-28 | 北京航空航天大学 | Electric auxiliary single-pull test temperature control device and use method thereof |
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|---|---|---|---|---|
| JPS6469463A (en) * | 1987-09-10 | 1989-03-15 | Fujitsu Ltd | Sticking device for double-side adhesive tape |
| JPH10871A (en) * | 1996-06-14 | 1998-01-06 | Sakurai Kk | Binding tool using tape |
| US20060011284A1 (en) * | 2004-07-16 | 2006-01-19 | Minoru Ametani | Film peeling method and film peeling device |
| KR20070084688A (en) * | 2006-02-21 | 2007-08-27 | 삼성전자주식회사 | Anisotropic conductive film attaching apparatus |
| CN101035729A (en) * | 2004-09-30 | 2007-09-12 | 芝浦机械电子装置股份有限公司 | Adhesion film adhibition device and adhesion film tape feeding mechanism |
-
2016
- 2016-06-27 CN CN201610479813.2A patent/CN106115348A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6469463A (en) * | 1987-09-10 | 1989-03-15 | Fujitsu Ltd | Sticking device for double-side adhesive tape |
| JPH10871A (en) * | 1996-06-14 | 1998-01-06 | Sakurai Kk | Binding tool using tape |
| US20060011284A1 (en) * | 2004-07-16 | 2006-01-19 | Minoru Ametani | Film peeling method and film peeling device |
| CN101035729A (en) * | 2004-09-30 | 2007-09-12 | 芝浦机械电子装置股份有限公司 | Adhesion film adhibition device and adhesion film tape feeding mechanism |
| KR20070084688A (en) * | 2006-02-21 | 2007-08-27 | 삼성전자주식회사 | Anisotropic conductive film attaching apparatus |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932929A (en) * | 2017-03-30 | 2017-07-07 | 京东方科技集团股份有限公司 | A kind of shading rubber belt pastes system |
| CN106932929B (en) * | 2017-03-30 | 2019-10-29 | 京东方科技集团股份有限公司 | A kind of shading rubber belt pastes system |
| CN110271197A (en) * | 2019-07-04 | 2019-09-24 | 珠海灵科自动化科技有限公司 | Glue film hot-press arrangement and glue film hot press |
| CN110849737A (en) * | 2019-10-14 | 2020-02-28 | 北京航空航天大学 | Electric auxiliary single-pull test temperature control device and use method thereof |
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Application publication date: 20161116 |
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| RJ01 | Rejection of invention patent application after publication |