CN106102310A - Circuit board and assembly thereof - Google Patents
Circuit board and assembly thereof Download PDFInfo
- Publication number
- CN106102310A CN106102310A CN201610612699.6A CN201610612699A CN106102310A CN 106102310 A CN106102310 A CN 106102310A CN 201610612699 A CN201610612699 A CN 201610612699A CN 106102310 A CN106102310 A CN 106102310A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- cabling
- dielectric layer
- trough
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to electronic technology field, disclose a kind of circuit board and assembly thereof.The circuit board that the present invention provides includes: multiple dielectric layers that stacking is arranged, at least one of which dielectric layer has at least one trough；At least one cylinder cabling, is arranged at described trough；Present invention also offers a kind of circuit board assemblies；Present invention achieves big electric current to pass through from cylinder cabling, thus be conducive to the flexible arrangement of other cablings and electronic devices and components, there is provided space for putting other components and parts more or other cablings more of arranging on circuit boards, improve the stability of the electronic equipment applying it.
Description
Technical field
The present invention relates to electronic technology field, particularly to a kind of circuit board and assembly thereof.
Background technology
The electronic product such as mobile phone, panel computer is higher to the stability requirement of power supply, and to power supply provide voltage and electricity
Stream size also has certain requirement.Such as, central processing unit etc. process chip employing low-voltage, big electric current drives；That is,
Big electric current cabling is needed to be connected to the power end of central processing unit.
In prior art, in order to meet the performance requirement of central processing unit, it usually needs spread big copper on a printed circuit board
Face is connected to central processing unit as big electric current cabling；Big copper face can take the large area of printed circuit board surface, for needing
For putting the printed circuit board (PCB) of more and more electronic component (to realize more and more functions of electronic product), spread big copper face
It is unfavorable for arranging flexibly and the exploitation of electronic product function of electronic component.
Furthermore, it is desirable to the components and parts of large driven current density, such as central processing unit, the printed substrate region at its place generally belongs to
In telltale hole close quarters, (multiple signal pins of central processing unit transmit signal by multiple signal lead respectively；Multiple letters
Number cabling is positioned at the different substrate floor surface of printed substrate, therefore substrate layer offers multiple telltale hole to connect each pin and each
Signal lead), typically no spare area is for spreading big copper face.For to spread big copper face at telltale hole close quarters, current
Solution is, each telltale hole is adjusted and passes through for big electric current cabling to the biggest spacing, sometimes also need to multiple substrate layer common
Coordinate and could realize；Not only design difficulty is big, and is likely to be due to arrange too closely, big electric current cabling can to other cablings and
Electronic component produces interference, the stability of broken ring electronic product.
Summary of the invention
It is an object of the invention to provide a kind of circuit board and assembly thereof, it is achieved that big electric current passes through from cylinder cabling,
Thus be conducive to the flexible arrangement of other cablings and electronic devices and components, for putting other components and parts more or row on circuit boards
Cloth other cablings more provide space, improve the stability of the electronic equipment applying it.
For solving above-mentioned technical problem, embodiments of the present invention provide a kind of circuit board, including: stacking arranges many
Individual dielectric layer, at least one of which dielectric layer has at least one trough；At least one cylinder cabling, is arranged at described trough.
Embodiments of the present invention additionally provide a kind of circuit board assemblies, including: at least two electronic components and above-mentioned
Circuit board；Described two electronic components are respectively arranged in described circuit board, and are connected to the two ends of described cylinder cabling.
In terms of existing technologies, stacking arranges the medium with trough to embodiment of the present invention in the circuit board
Layer, and at least one cylinder cabling is arranged at trough, thus realize big electric current and pass through from cylinder cabling, i.e. without spreading big copper
Face achieves that away that (existing cabling is all provided in dielectric layer surface to big electric current, the biggest owing to walking cross-sectional area, the electricity passed through
Flow the biggest, so to spread big copper face if walking big electric current), thus be conducive to the flexible row of other cablings and electronic devices and components
Cloth, provides space for putting other components and parts more or other cablings more of arranging on circuit boards；Further, it is possible to reduce right
Other cablings and the interference of electronic component, reduce circuit board heating, thus improve the electronic equipment of application circuit board
Stability；And present invention reduces the emulation difficulty of circuit board.
It addition, the described dielectric layer offering trough has multiple telltale hole；Described circuit board also includes multiple surface
Cabling and at least one welded ball array encapsulation；The encapsulation of described welded ball array is arranged at Jie being layered in outer layer in the plurality of dielectric layer
The surface of matter layer；Described cylinder cabling is connected to a pin of described welded ball array encapsulation；The plurality of surface cabling is arranged
In the surface of wherein one or more dielectric layers of the plurality of dielectric layer, and it is connected to institute by the plurality of telltale hole respectively
State multiple pins of welded ball array encapsulation；Provide and a kind of be applied to the specific design of circuit board during telltale hole close quarters, full
The foot application demand of actual design, it is ensured that the feasibility of the present invention.
It addition, welded ball array encapsulation is matched with central processing unit.That is, cylinder cabling can be applicable to central processing unit, with full
Foot needs the performance of the central processing unit of big drives, has expanded the application scenarios of the present invention.
It addition, trough runs through described dielectric layer.I.e. cylinder cabling runs through described dielectric layer (cylinder cabling is arranged at cabling
Groove), realize cylinder cabling further by bigger electric current.
It addition, at least one damaged surface of cylinder cabling protrudes from the surface of described dielectric layer, and described damaged surface
The height on the surface protruding from described dielectric layer equals to or less than the thickness of described surface cabling；Damaged surface is made to protrude from Jie
The thickness that the part of matter layer is tried one's best with surface cabling is maintained at same level.It is easy to make.
It addition, the number offering the described dielectric layer of trough is multiple, and the trough on each dielectric layer interconnects mutually
Logical；It is easy to the cylinder cabling being arranged at each dielectric layer trough from the trough cabling being interconnected, it is provided that circuit board is not
Concrete set-up mode with the cylinder cabling of dielectric layer.
It addition, two electronic components are respectively voltage source and encapsulation chip；Provide the electricity being connected to cylinder cabling two ends
Sub-element, has expanded the application scenarios of the present invention.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that in the circuit board according to the first embodiment, trough does not runs through dielectric layer；
Fig. 2 is the schematic diagram that in the circuit board according to the first embodiment, trough runs through dielectric layer；
Fig. 3 is the schematic diagram that in the circuit board according to the second embodiment, the trough of different medium layer is interconnected.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with the accompanying drawing each reality to the present invention
The mode of executing is explained in detail.But, it will be understood by those skilled in the art that in each embodiment of the present invention,
In order to make reader be more fully understood that, the application proposes many ins and outs.But, even if there is no these ins and outs and base
Many variations and amendment in following embodiment, it is also possible to realize the application each claim technical side required for protection
Case.
First embodiment of the present invention relates to a kind of circuit board, including: multiple dielectric layers that stacking is arranged, at least one post
Body cabling, multiple surfaces cabling and at least one welded ball array encapsulation (BGA, Ball Grid Array).
In present embodiment, trough 3 is arranged in multiple dielectric layer and is layered in the dielectric layer of outer layer.As it is shown in figure 1,
The dielectric layer 1 being layered in outer layer in multiple dielectric layers has upper surface 11 and lower surface 12, and dielectric layer 1 has at least one cabling
Groove 3, exemplarily only draws a trough, is so not limited to this in Fig. 1.Cylinder cabling 4 is arranged at trough 3, cylinder cabling 4
Damaged surface protrude from the upper surface 11 of dielectric layer 1, and the surface of cylinder cabling 4 protrudes from the height of dielectric layer 1 upper surface 11
Degree is equal to or less than the thickness of surface cabling；It is also preferred that the left the part that the surface of cylinder cabling 4 protrudes from dielectric layer 1 is walked with surface
Line is maintained at same level, in order to the making of circuit board.Wherein, surface cabling refer to be arranged at each dielectric layer surface and for
The wire of signal transmission.
In present embodiment, the two ends of cylinder cabling 4 can be connected to power pin and electronic component, cylinder cabling
4 are used for supplying electricity to electronic component, and the type of the electronic component that cylinder cabling 4 specifically connects is not made any limit by present embodiment
System.
In present embodiment, can as desired by size of current determine the sectional area needed for cylinder cabling 4；Pass through
Electric current the biggest, the sectional area required for cylinder cabling 4 is the biggest, and the sectional area of cylinder cabling 4 is not made any by present embodiment
Limit.
Further, as in figure 2 it is shown, the trough 3 being arranged at the dielectric layer 1 being layered in outer layer in multiple dielectric layer also may be used
Run through dielectric layer 1 (cylinder cabling 4 is arranged at trough 3) being designed as running through dielectric layer 1, i.e. cylinder cabling 4, realize further
Cylinder cabling 4 is by bigger electric current.
In present embodiment, the damaged surface of cylinder cabling 4 can also be to flush or recessed relative to the surface of dielectric layer 1
Fall into, be so not intended to be limited in any, specifically can arrange according to the needs of actual design.
It should be noted that to being arranged at the trough of dielectric layer 1, being arranged at the cylinder of trough 3 in present embodiment
The number of cabling 4 is not intended to be limited in any, and can be one, it is also possible to for multiple；Can the most specifically arrange.
In terms of existing technologies, trough 3 is arranged at Jie being layered in outer layer in multiple dielectric layer to present embodiment
In matter layer 1, and cylinder cabling 4 is arranged at trough 3, so that big electric current can pass through from cylinder cabling 4, i.e. without
Spread big copper face and achieve that away that (existing cabling is all provided in dielectric layer surface to big electric current, the biggest owing to walking cross-sectional area, logical
The electric current crossed is the biggest, so to spread big copper face if walking big electric current), thus be conducive to other cablings and the spirit of electronic devices and components
Live and arrange, provide space for putting other components and parts more or other cablings more of arranging on circuit boards；Further, it is possible to subtract
Few to other cablings and the interference of electronic component, reduce the heating of circuit board, thus improve the electronic equipment of application circuit board
Stability；And present invention reduces the emulation difficulty of circuit board.
It is also preferred that the left when arranging cylinder cabling 4 as above at the telltale hole close quarters of circuit board, the present invention is carried
The technique effect that comes (that is, be conducive to the flexible arrangement of other cablings and electronic devices and components, for put on circuit boards more other
Components and parts or other cablings more of arranging provide space) will be more significant, wherein, the telltale hole close quarters of circuit board is concrete
It is described as follows:
The telltale hole close quarters of circuit board i.e. refers to the region on circuit board with welded ball array encapsulation.Specifically,
Welded ball array encapsulation is arranged at the surface of the dielectric layer 1 being layered in outer layer in multiple dielectric layer, and multiple surfaces cabling can be arranged
In the surface of wherein one or more dielectric layers of multiple dielectric layers, each dielectric layer has multiple telltale hole.Multiple surfaces cabling
It is connected to multiple pins of welded ball array encapsulation respectively by multiple telltale holes, thus each pin signal of welded ball array encapsulation is led
Cause each electronic devices and components of circuit board.Wherein, cylinder cabling 4 is connected to a pin of welded ball array encapsulation.The present invention carries
Supply a kind of cylinder cabling to be applied to the specific design of circuit board during telltale hole close quarters, met the application of actual design
Demand, it is ensured that the feasibility of the present invention.
Wherein, welded ball array encapsulation is matched with central processing unit, i.e. cylinder cabling 4 can be applicable to central processing unit, with full
Foot needs the performance of the central processing unit of big drives, has expanded the application scenarios of the present invention；So it is not intended to be limited in any, also may be used
To be matched with other components and parts using low-voltage and high-current driving design.
It addition, in present embodiment, layout can be drawn on demand by needing the dielectric layer 1 arranging trough 3, go out the end
Derive together with other dielectric layers during sheet data, then use the methods such as groove milling to be milled out by the trough 3 of dielectric layer 1, then at it
In cylinder cabling 4 is set, obtain described circuit board together with the dielectric layer made with other normal etches；So present embodiment is to electricity
The manufacture method of road plate is not intended to be limited in any.
Second embodiment of the invention relates to a kind of circuit board, and the second embodiment and the first embodiment are roughly the same,
Being in place of the main distinction: in first embodiment of the present invention, trough is only arranged at outside being layered in multiple dielectric layer
In the dielectric layer of layer, and in second embodiment of the present invention, trough can be arranged at multiple dielectric layers that stacking is arranged
In.
In present embodiment, when multiple dielectric layers that stacking is arranged offer trough, one end of each trough can phase
Intercommunicated, i.e. one end of each trough is mutually run through, one end of the cylinder cabling of each trough is connected with each other.Example, such as figure
Shown in 3, for comprising the top view of the circuit board of the multilayer dielectricity layer that stacking is arranged；Wherein, such as ground floor is to third layer medium
Cylinder cabling 41,42 and 43 it is respectively arranged with in Ceng, and, one end of cylinder cabling 41,42 and 43 is interconnected, thus
It is commonly connected to the corresponding pin of welded ball array encapsulation.Wherein, each cylinder cabling can mutually stagger in space, i.e. does not exists
In same perpendicular.The invention provides the concrete set-up mode of the cylinder cabling of the different medium layer of circuit board, this enforcement
The number of dielectric layer is not intended to be limited in any by mode.
Substantially, each trough of multiple dielectric layers that stacking is arranged can also be generally aligned in the same plane interior and be interconnected,
So this is not intended to be limited in any by present embodiment.
During it should be noted that cylinder cabling is arranged on the trough of the dielectric layer being laminated in surface, prominent height can
With the thickness higher than surface cabling, but, when cylinder cabling is arranged on the trough of the dielectric layer being laminated in centre, prominent
Highly practically equal to or (that is, prominent height is high equal to or less than the interval of two dielectric layers less than the thickness of surface cabling
Degree).
It is noted that each element involved in present embodiment is logic element, in actual applications, one
Individual logical block can be a physical location, it is also possible to be a part for a physical location, it is also possible to multiple physics lists
The combination of unit realizes.Additionally, for the innovative part highlighting the present invention, will be with solution institute of the present invention in present embodiment
The unit that the technical problem relation of proposition is the closest introduces, but this is not intended that in present embodiment the list that there is not other
Unit.
Third embodiment of the invention relates to a kind of circuit board assemblies, including: at least two electronic components and first are in fact
Execute the circuit board described in mode or the second embodiment.
In present embodiment, two electronic components are respectively arranged in circuit board, and are connected to the two ends of cylinder cabling.
In present embodiment, two electronic components are respectively voltage source and encapsulation chip.Wherein, encapsulation chip is centre
Reason device, so can also need the components and parts of large driven current density for other.
It will be understood by those skilled in the art that the respective embodiments described above are to realize the specific embodiment of the present invention,
And in actual applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (9)
1. a circuit board, it is characterised in that including:
Multiple dielectric layers that stacking is arranged, at least one of which dielectric layer has at least one trough；
At least one cylinder cabling, is arranged at described trough.
Circuit board the most according to claim 1, it is characterised in that the described dielectric layer offering trough has multiple letter
Number hole；
Described circuit board also includes multiple surfaces cabling and at least one welded ball array encapsulation；
The encapsulation of described welded ball array is arranged at the surface of the dielectric layer being layered in outer layer in the plurality of dielectric layer；Described cylinder is walked
Line is connected to a pin of described welded ball array encapsulation；
The plurality of surface cabling is arranged at the surface of wherein one or more dielectric layers of the plurality of dielectric layer, and leads to respectively
Cross the plurality of telltale hole and be connected to multiple pins of described welded ball array encapsulation.
Circuit board the most according to claim 2, it is characterised in that the encapsulation of described welded ball array is matched with central processing unit.
Circuit board the most according to claim 1, it is characterised in that described trough runs through described dielectric layer.
Circuit board the most according to claim 1, it is characterised in that at least one damaged surface of described cylinder cabling highlights
In the surface of described dielectric layer, and described damaged surface protrudes from the height on surface of described dielectric layer equal to or less than described table
The thickness of face cabling.
Circuit board the most according to claim 1, it is characterised in that offer the number of described dielectric layer of trough for many
Individual, and the trough on each dielectric layer is interconnected.
7. a circuit board assemblies, it is characterised in that including: any one at least two electronic components and claim 1 to 6
Circuit board described in Xiang；
Described two electronic components are respectively arranged in described circuit board, and are connected to the two ends of described cylinder cabling.
Circuit board assemblies the most according to claim 7, it is characterised in that described two electronic components be respectively voltage source with
Encapsulation chip.
Circuit board assemblies the most according to claim 8, it is characterised in that described encapsulation chip is central processing unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610612699.6A CN106102310A (en) | 2016-07-29 | 2016-07-29 | Circuit board and assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610612699.6A CN106102310A (en) | 2016-07-29 | 2016-07-29 | Circuit board and assembly thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106102310A true CN106102310A (en) | 2016-11-09 |
Family
ID=57479969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610612699.6A Pending CN106102310A (en) | 2016-07-29 | 2016-07-29 | Circuit board and assembly thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106102310A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709963A (en) * | 2021-07-23 | 2021-11-26 | 苏州浪潮智能科技有限公司 | PCB and manufacturing method and equipment thereof |
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|---|---|---|---|---|
| CN1468048A (en) * | 2002-05-30 | 2004-01-14 | ��ʽ�����װ | Enhancement of current-carrying capacity of a multilayer circuit board |
| JP2007165642A (en) * | 2005-12-14 | 2007-06-28 | Mitsubishi Electric Corp | Component mounting substrate |
| CN103813646A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN103813650A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| US20150116968A1 (en) * | 2013-10-28 | 2015-04-30 | Renesas Electronics Corporation | Semiconductor integrated circuit device |
-
2016
- 2016-07-29 CN CN201610612699.6A patent/CN106102310A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1468048A (en) * | 2002-05-30 | 2004-01-14 | ��ʽ�����װ | Enhancement of current-carrying capacity of a multilayer circuit board |
| JP2007165642A (en) * | 2005-12-14 | 2007-06-28 | Mitsubishi Electric Corp | Component mounting substrate |
| CN103813646A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| CN103813650A (en) * | 2012-11-15 | 2014-05-21 | 深南电路有限公司 | Circuit board capable of bearing large currents and processing method thereof |
| US20150116968A1 (en) * | 2013-10-28 | 2015-04-30 | Renesas Electronics Corporation | Semiconductor integrated circuit device |
Non-Patent Citations (1)
| Title |
|---|
| 丁明军: "《PCB制图与制版实训》", 31 March 2015 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113709963A (en) * | 2021-07-23 | 2021-11-26 | 苏州浪潮智能科技有限公司 | PCB and manufacturing method and equipment thereof |
| CN113709963B (en) * | 2021-07-23 | 2023-02-28 | 苏州浪潮智能科技有限公司 | PCB and manufacturing method and equipment thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161109 |
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| RJ01 | Rejection of invention patent application after publication |