CN106090662B

CN106090662B - LED lamp with safety protection structure and manufacturing method thereof

Info

Publication number: CN106090662B
Application number: CN201610512468.8A
Authority: CN
Inventors: 何忠亮
Original assignee: Individual
Current assignee: Individual
Priority date: 2016-06-30
Filing date: 2016-06-30
Publication date: 2023-01-17
Anticipated expiration: 2036-06-30
Also published as: CN106090662A

Abstract

The invention discloses an LED lamp with a safety protection structure and a manufacturing method thereof. The LED lamp is provided with a metal substrate, a circuit layer and a bonding layer for connecting the metal substrate and the circuit layer, wherein the bonding layer is made of a material which generates a cross-linking reaction under the action of working heat of the LED lamp, so that the rigidity of a metal-based circuit board formed by the metal substrate, the circuit layer and the bonding layer is increased, and the metal-based circuit board is easy to break under the action of external force. Therefore, on the premise of ensuring that the light emitting efficiency is not influenced, the LED lamp can also ensure that the metal-based circuit board is broken and fails under the influence of external forces such as collision and falling, and the power supply is cut off, so that the LED lamp cannot continuously generate heat, and the hidden danger of fire is avoided.

Description

LED lamp with safety protection structure and manufacturing method thereof

Technical Field

The invention relates to the field of LED application, in particular to an LED lamp with a safety protection structure and a manufacturing method thereof.

Background

The LED is used as a fourth generation light source and has the advantages of low energy consumption and long service life. With the gradual maturity of the technology, the requirements on the lighting effect, the heat dissipation, the safety performance and the like of the LED lamp module have reached a new stage.

In a conventional LED light source, a light emitting assembly generates heat during use, and therefore a lampshade is usually used for protection and isolation to avoid contact with other objects. However, if the power supply system fails to automatically cut off the power supply when the light bulb is accidentally dropped, the light emitting component of the light bulb continuously emits light and generates heat, and other objects in contact with the light emitting component are likely to be ignited, so that a fire disaster occurs.

The existing safety standards of the LED standardize the circuit, installation, operation and the like of the LED, but no technology for improving the structure of the LED so as to enable the LED to meet the safety requirements exists.

Disclosure of Invention

The invention improves the traditional LED lamp source, improves the safety design on the premise of ensuring that the light-emitting efficiency is not influenced, ensures that the LED lamp cannot continuously generate heat because the light-emitting component is broken and fails under the influence of external force after the bulb falls off, and avoids the hidden danger of fire.

The LED lamp with the safety protection structure comprises a light-emitting component, wherein the light-emitting component comprises a metal-based circuit board and LED lamp beads, the metal-based circuit board comprises a metal substrate, and a bonding layer and a circuit layer which are sequentially arranged on a first surface of the metal substrate, and the LED lamp beads are welded on the circuit layer;

the tie coat comprises the heat conduction insulating material who has heat reactivity, heat conduction insulating material is in the crosslinking reaction takes place under the effect that LED lamp work generated heat, makes metal-based circuit board with the holistic rigidity that LED lamp pearl constitutes increases.

Preferably, the metal substrate is provided as a high reflectance surface with respect to a second surface of the first surface.

Preferably, the high-reflectance face includes mirror silver, mirror aluminum, mirror film, or the like.

Preferably, a solder mask layer is further arranged on the circuit layer, and the solder mask layer has high reflectivity.

Preferably, the metal-based circuit board comprises a vent groove.

Preferably, the direction of the force leakage groove is parallel to the welding direction of the LED lamp bead.

Preferably, the material of the metal substrate is aluminum.

Preferably, the adhesive layer material comprises epoxy resin or acrylic resin based glue.

Preferably, the metal-based circuit board is bent into a ring shape, a spiral shape, a mobius ring shape or other multi-segment zigzag shape.

Preferably, the metal-based wiring board is bent in a spiral shape.

Preferably, the metal-based circuit board bent into a spiral shape satisfies:

D＝N·(L1+L2+2πR)；

SinΘ＝N·(L1+L2)/D；

wherein, L1 is the width of the metal-based circuit board, L2 is the winding distance, D is the length of the metal-based circuit board, R is the winding radius, N is the number of winding turns, the inclination angle of theta winding is provided, and pi is the circumferential rate.

Preferably, the LED lamp is also provided with a lamp shell and a lamp holder, and the lamp shell is positioned at the periphery of the light emitting component; the lamp holder is positioned at the tail end of the LED lamp; the lamp housing is made of a transparent and high temperature resistant material: glass or resin or other material.

Preferably, a driving power supply is arranged in the lamp holder.

Preferably, the LED lamp beads are a plurality of LED lamp beads which are mutually spaced.

Preferably, the body of the metal substrate comprises a heat dissipation structure, wherein the width of the heat dissipation structure is determined according to the power of the LED lamp.

The invention also provides a manufacturing method of the LED lamp with the safety protection structure, which is characterized by comprising the following steps of:

step 1: preparing a metal substrate; manufacturing a required circuit pattern on the copper-clad plate to form a circuit layer;

step 2: bonding the circuit layer and the metal substrate together by using a bonding material to obtain a metal-based circuit board, wherein the bonding material has heat reactivity and generates a crosslinking reaction under the action of heat;

and step 3: coating a solder resist material on the circuit surface of the obtained metal-based circuit board, exposing a bonding pad to be welded, and welding the required LED lamp beads on the circuit layer;

and 4, step 4: bending the obtained welded metal-based circuit board with the element into a preset shape;

and 5: and the metal-based circuit board bent into a preset shape is placed into the lamp shell after being connected with a driving power supply, and the assembly is completed.

Preferably, the step 1 further comprises: a relief groove is formed in a metal substrate.

Preferably, the direction of the force release groove is parallel to the welding direction of the LED lamp beads.

Preferably, the bending direction is consistent with the orientation of the force leakage groove on the circuit layer.

Preferably, the circuit layer is made of a polyimide copper clad laminate; the bonding layer material comprises epoxy resin or acrylic resin glue.

Drawings

The invention is described in further detail below with reference to the following figures and detailed description:

fig. 1 is a schematic view of the overall structure of an LED lamp having a protective structure according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the internal structure of an LED lamp with a protective structure according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a metal-based wiring board structure according to an embodiment of the invention;

FIG. 4 is a schematic view of a vent groove structure of a metal-based circuit board according to an embodiment of the invention;

fig. 5 is a schematic view of the structure of the layers of the metal-based wiring board according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of an LED lamp structure with a single annular metal-based wiring board according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of an LED lamp structure with a spiral metal-based wiring board according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of the internal structure of an LED lamp with a spiral metal-based wiring board according to an embodiment of the present invention;

fig. 9 is a schematic diagram of a metal-based wiring board structure having a mobius loop in accordance with an embodiment of the present invention.

Detailed Description

As shown in fig. 1 and 2, the LED bulb meeting the safety standard disclosed in the present invention comprises: the lamp comprises a light-emitting component, a lamp shell and a lamp holder; the lamp shell is positioned at the periphery of the light-emitting component; the lamp holder is located below the LED bulb. Light emitting component includes metal-based circuit board and LED lamp pearl, the metal-based circuit board includes metal substrate and the adhesive material layer and the circuit layer that set gradually on metal substrate's first face, the welding of LED lamp pearl is in on the circuit layer. The tie coat comprises the heat conduction insulating material who has the heat reactivity, the cross-linking reaction takes place under the effect that heat was used to LED to heat conduction insulating material, makes metal-based circuit board with the holistic rigidity that LED lamp pearl constitutes increases. Due to the increase of rigidity, under the conditions that the LED lamp is collided by a large external force, falls off and the like, the LED lamp breaks and fails due to external force impact, so that the LED lamp cannot continuously generate heat, and hidden dangers such as fire disasters are avoided.

In one embodiment, a high-reflection material is used on the surface of the other side of the metal-based circuit board. The high-reflection material comprises mirror silver, mirror aluminum, mirror film and the like.

Optionally, a driving power supply is built in the lamp holder. In order to improve the light-emitting uniformity, fluorescent glue can also be covered on the LED lamp beads.

In one embodiment, a solder resist material is coated on the circuit surface of the obtained metal-based circuit board, the solder pads to be soldered of the solder resist material are exposed to prevent the solder from flowing, and the solder resist material can be further made of a material with high reflectivity, such as white ink, to improve the light extraction rate.

The use of thermally conductive and insulating materials with thermal reactivity brings about the following advantageous technical effects: before the LED lamp is used, the heat-conducting insulating material is not changed in properties, the whole light-emitting assembly is flexible, the processing difficulty in the production process is reduced, the yield is improved, and the light-emitting assembly cannot be damaged due to large external force collision in the production, storage and transportation processes. After the LED lamp is used, the LED lamp generates heat in the using process, so that the heat-conducting insulating material generates a cross-linking reaction under the action of the heat generated by the LED lamp, the rigidity of the whole substrate and the LED lamp bead is increased, the substrate does not have flexibility and becomes brittle and is easy to break, and the LED lamp cannot continuously generate heat because the substrate is broken and fails due to external force impact under the conditions that the LED lamp is collided and falls by larger external force and the like, so that hidden dangers such as fire disasters are avoided.

The metal-based circuit board is made of a bend-resistant metal, including aluminum. The material of the bonding layer can be epoxy resin or acrylic resin glue.

As shown in fig. 3 and 4, the circuit layer of the metal-based circuit board includes a relief groove. In the structure shown in fig. 3, the light emitting assembly including the metal-based circuit board and the LED lamp beads is in a strip shape as a whole, wherein the metal substrate has the same shape as the metal-based circuit board, the circuit layer is composed of discontinuous metal conductive sheets, electrodes are provided on the metal conductive sheets, and the LED lamp beads and the electrodes on the metal conductive sheets are connected with the metal conductive sheets to form a series circuit. A vent slot is formed between the conductive metal sheets (e.g., as shown in fig. 3 and 4) or on the conductive metal sheets (not shown).

The use of a wiring layer with relief grooves brings the following beneficial technical effects: during production and installation, the metal substrate needs to be bent. The stress relief groove can buffer the stress borne by the circuit layer and the welded element, so that greater bending freedom degree is brought, and the circuit or welding point fracture caused by bending of the metal substrate is avoided. After the LED lamp is used, the heat-conducting insulating material generates a cross-linking reaction under the action of heat generated by the LED lamp, so that the rigidity of the whole substrate and the LED lamp bead is increased, the substrate is not flexible any more and becomes brittle and is easy to break, and under the conditions that the LED lamp is collided by large external force, falls and the like, because the metal stress relief grooves are mutually discontinuous, when the LED lamp is collided or falls, the LED lamp bead is more easily broken by the external force, so that a circuit is disconnected, and the LED lamp bead is prevented from continuously generating heat and possibly causing fire.

The stress relief grooves are arranged through stress analysis according to the bending shape of the metal-based circuit board, and the bending shape of the metal substrate is combined to achieve the optimal stress buffering effect. In an embodiment corresponding to fig. 4, for example, an included angle is formed between the orientation of the force release groove and the outer edge of the strip-shaped metal-based circuit board, and the included angle is parallel to the connecting line direction of two adjacent bonding pads, so that the included angle is parallel to the welding direction of the LED lamp beads, and therefore, even if the metal substrate is bent after the LED lamp beads are welded, the welding spots can be effectively prevented from falling off in the bending process after the welding.

In addition, a plurality of LED lamp pearls very easily set up on the metal-based circuit board of buckling at an interval, produce the visual effect that twinkles like starlight easily when luminous, better, a plurality of LED lamp pearls can be different colours. Preferably, the LED lamp is power-adjustable, each LED lamp bead is in a twinkling effect when the low power is low, and each LED lamp bead is equivalent to an independent light source under the high power.

In addition, the metal-based circuit board may be slightly wider, for example, the body of the metal-based circuit board further includes a heat dissipation structure, wherein the width of the heat dissipation structure is determined according to the power of the LED lamp. For example, the LEDs may be mounted or disposed to occupy only a portion of the width of the metal-based circuit board, the remaining width may be designed or mounted with scattering structures, and the heat dissipation structures may be planar or may be other shapes or fins having a higher surface area.

As shown in fig. 5 to 9, the bent shape of the metal-based wiring board may be a single loop shape, a single loop spiral shape, a multiple-segment bent shape, or a mobius loop shape.

In one embodiment, the metal-based circuit board is bent into a multi-ring spiral bent shape, and the metal-based circuit board width L1, the winding distance L2, the metal-based circuit board length D, the winding radius R, and the number of winding turns N have the following relationship:

D＝N·(L1+L2+2πR)。

if the multi-ring spiral is expanded, and the model of the multi-ring spiral is equivalent to the expansion of a cylindrical surface, the inclination angle theta of the winding can satisfy the following conditions:

SinΘ＝N·(L1+L2)/D。

different bending structures can be obtained by adjusting parameters such as L1, L2, D and N, the stress on the metal-based circuit board in different bending structures is different, and the structural parameters of the product can be obtained by selecting a proper stress range.

For example, when the metal-based circuit board width L1=3.5mm, the winding pitch L2=3.5mm, the metal-based circuit board length D =120mm, the winding radius R =4.3426mm, pi =3.14159, and the number of winding turns N =3.5, sin Θ =0.20417, and Θ =11.78 °.

In general, the diameter of the bending loop of the metal-based wiring board is proportional to the voltage inputted from the outside.

In stress simulation, the LED lamp with the parameter structure shows moderate structural stress, which ensures that the flexible metal substrate cannot be broken due to bending in the production and installation processes. When the LED safety protection device is used, the metal substrate with the enhanced rigidity is heated by the LED, and can be broken under the impact of proper external force under the stress, so that the safety protection purpose is achieved.

According to the actual product test result, the metal-based circuit board meeting the size design can be broken under the condition that the LED lamp falls from the preset height.

In one embodiment, the metal-based circuit board is bent into a Mobius ring shape, so that the stress of each point of the circuit board bearing the light bar is uniform, and the damage to the metal-based circuit board caused by bending in the production and manufacturing process is reduced. Meanwhile, a certain stress is applied to the metal-based circuit board by using the Mobius ring structure, so that the metal substrate with the rigidity strengthened by heating the LED is ensured to be broken under the impact of proper external force, and the purpose of safety protection is achieved.

In the above embodiment, the multi-ring spiral metal-based circuit board and the mobius annular metal-based circuit board further have different light distribution effects, the multi-ring spiral structure can achieve better light distribution in the direction perpendicular to the spiral axial direction, and the mobius annular structure can achieve light distribution in a larger range by matching with the high-reflectivity layer on the back of the metal-based circuit board.

In one embodiment, the metal-based circuit board is bent into a single ring, the single ring structure has a good light distribution range, the assembly is simple, and the fracture threshold caused by external force collision is easy to regulate and control.

In one embodiment, the metal-based circuit board is bent into a single-spiral structure, is close to a single-ring structure in the aspect of stress test, and has different light distribution effects.

In one embodiment, the LED lamp has the following manufacturing process:

step 1: preparing a metal substrate; and manufacturing a required circuit pattern on the copper-clad plate to form a circuit layer.

Step 2: and bonding the circuit layer and the metal substrate together by using a bonding material.

And step 3: and welding the required LED lamp beads on the circuit layer.

And 4, step 4: and bending the obtained welded metal-based circuit board with the element around a shaft.

And 5: and connecting the bent metal-based circuit board with a driving power supply, and then placing the metal-based circuit board into the lamp shell to complete assembly.

The step 1 also comprises a step of forming a force relief groove. The orientation of the force release groove is parallel to the welding direction of the LED, so that the welding point is prevented from falling off in the bending process after welding.

In the step 4, the direction of the line layer stress relief groove is consistent with the bending direction of the metal substrate, so that the line is prevented from being broken in the bending process.

In the above process, the temperature and heating time are strictly controlled to avoid the occurrence of complete cross-linking reaction of the bonding material and reduce the bending resistance. In the product testing process, a micro-current test with small heat productivity and/or a section-by-section test of a plurality of lamp beads are used, so that the cross-linking reaction caused by heat generated in the testing process is avoided.

The above description is only a preferred embodiment of the present invention and should not be taken as limiting the invention, and any modification, equivalent replacement and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED lamp with a safety protection structure, comprising:

the LED lamp comprises a light-emitting component, a metal-based circuit board and LED lamp beads, wherein the metal-based circuit board comprises a metal substrate, and a bonding layer and a circuit layer which are sequentially arranged on a first surface of the metal substrate;

the metal-based circuit board comprises a force relief groove;

the bonding layer is made of a heat-conducting insulating material with heat reactivity, and the heat-conducting insulating material is subjected to a cross-linking reaction under the action of the heat generated by the LED lamp, so that the rigidity of the whole body formed by the metal-based circuit board and the LED lamp beads is increased; the rigidity is increased, under the conditions that the LED lamp is collided and falls by a large external force, the metal stress relief grooves are mutually discontinuous, when the LED lamp is collided or falls, the LED lamp is more easily broken by the external force, so that a circuit is disconnected, and the LED lamp cannot continue to generate heat due to the failure of breakage caused by external force impact, so that the possibility of fire disaster caused by continuous heating of the LED lamp bead is avoided;

the second surface of the metal substrate, which is opposite to the first surface, is a high-reflectivity surface;

a solder mask is further arranged on the circuit layer, and the solder mask has high reflectivity;

the metal-based circuit board is bent into a ring shape, a spiral shape, a Mobius ring shape or other multi-section zigzag shape;

the bending direction is consistent with the direction of the force release groove on the circuit layer;

the setting of earial drainage groove sets up through stress analysis according to the shape of buckling of metal-based circuit board, combines metal substrate's shape of buckling to reach the optimal stress buffering effect: the orientation of the force release groove is parallel to the welding direction of the LED lamp beads, so that even if the metal substrate is bent after the LED lamp beads are welded, the welding spots can be effectively prevented from falling off in the bending process after welding.

2. The LED lamp of claim 1, wherein the high-reflectivity surface comprises any of: mirror silver, mirror aluminum, mirror film.

3. The LED lamp of claim 1, wherein the metal substrate is aluminum.

4. The LED lamp of claim 1, wherein the bonding layer material comprises an epoxy or acrylic based glue.

5. The LED lamp of claim 1, wherein the metal-based wiring board is bent into a spiral shape.

6. The LED lamp of claim 5, wherein the metal-based circuit board that is bent into a spiral shape satisfies:

D= N·（L1+L2+2πR）；

SinΘ=N·（L1+L2）/D；

wherein, L1 is the width of the metal-based circuit board, L2 is the winding distance, D is the length of the metal-based circuit board, R is the winding radius, N is the number of winding turns, theta is the inclination angle of the winding, and pi is the circumferential rate.

7. The LED lamp of claim 1 further comprising a lamp housing and a lamp base, said lamp housing being located around the periphery of the light emitting assembly; the lamp holder is positioned at the tail end of the LED lamp; the lamp housing is made of a transparent, high temperature resistant material: glass or resin.

8. The LED lamp of claim 7, wherein a driving power supply is disposed within the socket.

9. The LED lamp of claim 1, wherein the LED beads are covered with fluorescent glue.

10. The LED lamp of claim 1, wherein the LED bead is a plurality of LED beads spaced apart from each other.

11. The LED lamp of claim 1, wherein the body of the metal substrate comprises a heat dissipating structure, wherein the width of the heat dissipating structure is determined by the power of the LED lamp.

12. The method for manufacturing the LED lamp with the safety protection structure as claimed in claim 1, wherein the method comprises the following steps:

step 2: bonding the circuit layer and the metal substrate together by using a bonding material to obtain a metal-based circuit board, wherein the bonding material has thermal reactivity and generates a crosslinking reaction under the action of heat;

13. The method of claim 12, wherein: the step 1 further comprises: a vent groove is formed in a metal substrate.

14. The method of claim 13, wherein: the direction of the force release groove is parallel to the welding direction of the LED lamp beads.

15. The method of claim 13, wherein: in the step 4, the bending direction is consistent with the direction of the force release groove on the circuit layer.

16. The method of claim 12, wherein: the bonding layer material comprises epoxy resin or acrylic resin glue.