CN106085282A - 一种用于纸质物品黏接的胶黏剂 - Google Patents
一种用于纸质物品黏接的胶黏剂 Download PDFInfo
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- CN106085282A CN106085282A CN201610587672.6A CN201610587672A CN106085282A CN 106085282 A CN106085282 A CN 106085282A CN 201610587672 A CN201610587672 A CN 201610587672A CN 106085282 A CN106085282 A CN 106085282A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J103/00—Adhesives based on starch, amylose or amylopectin or on their derivatives or degradation products
- C09J103/02—Starch; Degradation products thereof, e.g. dextrin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
- C08K2003/3072—Iron sulfates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Abstract
本申请公开了一种用于纸质物品黏接的胶黏剂,包括玉米淀粉1800‑2500份,硫酸铁3‑15份,氢氧化钠100‑300份,氯酸钠50‑200份,硫代硫酸钠3‑12份,硼砂50‑230份,磷酸二丁酯6‑20份,亚硫酸钠30‑60份。由此,胶黏剂成本低,工艺流程简单,耐水性好,粘合强度高便于储存。
Description
技术领域
本发明涉及胶黏剂,尤其涉及一种用于纸质物品黏接的胶黏剂。
背景技术
淀粉是一种廉价的可再生的天然高分子材料,无毒,易生物降解,近年来受到广泛重视,如何从深度和广度开发应用淀粉资源,已成为国内外学者普遍关注的课题。淀粉以其来源广泛,价格低廉,再生性强,减少环境污染等优点受到人们重视。一直以来在纺织、造纸、医药、食品、包装纸箱、瓦楞纸板等行业大量应用,所以针对改性后的淀粉胶黏剂各方面性能要求也日益增高:像高强快干性、高黏性、耐水性、稳定性、环保型等满足各行业的需要。
发明内容
本发明的目的提供一种用于纸质物品黏接的胶黏剂,解决上述现有技术问题中的一个或者多个。
根据本发明的一个方面,提供一种用于纸质物品黏接的胶黏剂,包括玉米淀粉1800-2500份,硫酸铁3-15份,氢氧化钠100-300份,氯酸钠50-200份,硫代硫酸钠3-12份,硼砂50-230份,磷酸二丁酯6-20份,亚硫酸钠30-60份。
生产时,先向反应锅内加入按质量份数占总物料60%的水,再加入淀粉并搅拌均匀,成为淀粉液,再将剩余物料全部加入反应锅内,继续搅拌,将温度加热到90℃,即得成品。
本发明的胶黏剂成本低,工艺流程简单,耐水性好,粘合强度高,便于储存。
具体实施方式
实施例1:包括玉米淀粉1800-2500份,硫酸铁3-15份,氢氧化钠100-300份,氯酸钠50-200份,硫代硫酸钠3-12份,硼砂50-230份,磷酸二丁酯6-20份,亚硫酸钠30-60份。
实施例2:包括玉米淀粉1800-2500份,硫酸铁3-15份,氢氧化钠100-300份,氯酸钠50-200份,硫代硫酸钠3-12份,硼砂50-230份,磷酸二丁酯6-20份,亚硫酸钠30-60份。
实施例3:包括玉米淀粉1800-2500份,硫酸铁3-15份,氢氧化钠100-300份,氯酸钠50-200份,硫代硫酸钠3-12份,硼砂50-230份,磷酸二丁酯6-20份,亚硫酸钠30-60份。
生产时,先向反应锅内加入按质量份数占总物料60%的水,再加入淀粉并搅拌均匀,成为淀粉液,再将剩余物料全部加入反应锅内,继续搅拌,将温度加热到90℃,即得成品。
综上所述,本发明的胶黏剂成本低,工艺流程简单,耐水性好,粘合强度高,便于储存。
以上所述仅是本发明的一种实施方式,应当指出,对于本领域普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干相似的变形和改进,这些也应视为本发明的保护范围之内。
Claims (1)
1.一种用于纸质物品黏接的胶黏剂,其特征在于:包括玉米淀粉1800-2500份,硫酸铁3-15份,氢氧化钠100-300份,氯酸钠50-200份,硫代硫酸钠3-12份,硼砂50-230份,磷酸二丁酯6-20份,亚硫酸钠30-60份。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103275645A (zh) * | 2013-05-24 | 2013-09-04 | 南通市东方包装有限公司 | 一种瓦楞纸板生产用粘合剂 |
CN103555223A (zh) * | 2013-10-09 | 2014-02-05 | 张家港市敬业包装有限公司 | 一种糊化淀粉粘合剂及其制备方法 |
CN104927702A (zh) * | 2015-06-09 | 2015-09-23 | 天津元华友汇包装有限公司 | 一种瓦楞纸板生产用粘合剂 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103275645A (zh) * | 2013-05-24 | 2013-09-04 | 南通市东方包装有限公司 | 一种瓦楞纸板生产用粘合剂 |
CN103555223A (zh) * | 2013-10-09 | 2014-02-05 | 张家港市敬业包装有限公司 | 一种糊化淀粉粘合剂及其制备方法 |
CN104927702A (zh) * | 2015-06-09 | 2015-09-23 | 天津元华友汇包装有限公司 | 一种瓦楞纸板生产用粘合剂 |
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