CN106065314A - Bi-component high thermal conductive silicon ketone glue and preparation method thereof and use - Google Patents
Bi-component high thermal conductive silicon ketone glue and preparation method thereof and use Download PDFInfo
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- CN106065314A CN106065314A CN201610407246.XA CN201610407246A CN106065314A CN 106065314 A CN106065314 A CN 106065314A CN 201610407246 A CN201610407246 A CN 201610407246A CN 106065314 A CN106065314 A CN 106065314A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Abstract
A kind of bi-component high thermal conductive silicon ketone glue and preparation method thereof and use, belong to technical field of electronic materials.The a that will weigh by weight, w dialkyl polydimethylsiloxane 80 95 parts, diluent 8 12 parts, graphite powder 48 58 parts, fire-retardant filler 35 45 parts, 20 30 parts of input blenders of filler stir, discharging fill, obtain component A；The diluent 10 15 parts that will weigh by weight, catalyst 3.5 5.5 parts, cross-linking agent 69 parts and coupling agent 3.5 4.5 parts put in planetary mixer and stir, and obtain component B.Using method: component A and component B in mass ratio 56: 1 are used in mixed way and are finished in 0.6 0.7h.It is easy to storage and transport；Meet industrialization production requirements；The excellent encapsulation requirement to LED can be met；High construction efficiency；Environmental protection；Strong to environmental suitability；Technique is simple, meets industrial amplification production requirement.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to a kind of bi-component high thermal conductive silicon ketone glue, and also relate to
Its preparation method and using method.
Background technology
LED is referred to as forth generation lighting source or green light source, has the features such as energy-saving and environmental protection, life-span length and volume are little,
Be widely used in various instruction, show, decorate, the field such as backlight, general lighting and urban landscape.According to using function not
With, the information that can be divided into shows, signal lights, Vehicular lamp, liquid crystal screen backlight and the big class of general illumination five.
Traditional commonly used epoxy resin embedding adhesive of the encapsulation to LED (i.e. packaging plastic, as follows) or organosilicon embedding
LED chip is encapsulated by glue etc. with support.The typical document of epoxy resin encapsulating (abbreviation epoxy pouring sealant) is open such as
CN1227320C, CN1247729C, CN1939999A, CN102925110B and CN102634312A, etc..This epoxy sealing
Glue has been usually added into after a certain proportion of defoamer, firming agent, accelerator, diluent and filler are sufficiently stirred for deaeration and has made, system
Casting glue after one-tenth causes the depot of product and the suitability the most less due to the reason employing light curing agent or thermal curing agents
Preferable；Especially need the auxiliary equipment increasing many necessity (such as hot setting device and UV during the use of such casting glue
Lamp etc.), it is unfavorable for industrialization production line balance demand.Additionally, with epoxy resin for base material casting glue storage requirement the most extremely
Harshness, needs to store in the environment of airtight, lucifuge, low temperature.And for the casting glue with epoxy resin as base material in preparation
During employ substantial amounts of benzene-type products and use as diluent so that the most all there are the contraction feelings of vast scale in product
Condition, serious directly results in the encapsulating face fracture that fluid sealant is formed, thus loses encapsulation function, and in the curing process, embedding
Accelerator in glue, diluent, catalyst volatilize quite serious, and the gas volatilized has certain poisonous and harmful substance, both
Affect working environment and undermine again the health of online assignment personnel.
The technical information of silicone casting glue can be seen in, the most such as in disclosed Chinese patent literature
" bi-component silicone pouring sealant for LED light mouth display device and preparation method thereof " that CN101544881B recommends, this patent
The raw materials by weight portion meter of component A as follows: α-alpha, omega-dihydroxy polydimethyl siloxane 100 parts, organic silica-based glue 10-35
Part, filler 0-50 part and plasticizer 10-30 part；The raw materials by weight portion meter of component B is as follows: cross-linking agent 5-10 part, coupling agent
0.3-3 part, titanate esters complex 0.1-0.5 part, N, N-diethylhydroxylamine 0.1-0.5 part, dibutyl tin dilaurate 0.01-0.1 part and
Plasticizer 2-10 part.Known, along with the continuous expansion of LED development class, powerful product emerges in an endless stream, and LED was using
Because being concentrated use in factors such as grade in journey, cause the phenomenon such as local pyrexia, sparking the most fairly common.Then use due to this patent
The plasticizer made a gesture of measuring greatly, although and the plasticizer made a gesture of measuring greatly can promote the thixotropic property of casting glue, but also bring along filling simultaneously
The heat conductivility of sealing declines, and makes the casting glue prepared heat conductivility after a procedure be difficult to well be ensured；Again owing to filling out
The one in calcium carbonate, carborundum, silica flour, aluminium sesquioxide, silica flour and white carbon black selected by material, and the ratio of filler is at 0-50
Between Fen, decrease the application of filler to promote embedding effect, then make the casting glue prepared in fire resistance, heat conductivity
Can decline, be unfavorable for the safety after products application and ageing-resistant performance；The primary solidification time is 4-6 hour, although solving should
By problem, but also imply that this product is unfavorable for industrialization pile line operation demand simultaneously.
Summary of the invention
The task of the present invention is to provide one to contribute to storing at normal temperatures and transporting and use in reduction logistics link
Cost, be conducive to abandoning hot setting or the solidification of UV lamp and use and meet wanting of on the streamline of industrialized production application
Ask, be of value to significantly reduce thermal weight loss and shrinkage factor and use ensure electronic product application require and have be easy to embody excellence
Heat conductivility and using avoid product after a procedure overload heating occurs and causes the bi-component of the serious heating of sparking or local
High thermal conductive silicon ketone glue.
Another task of the present invention is to provide the preparation method of a kind of bi-component high thermal conductive silicon ketone glue, the letter of the method technique
Practice, technical factor is the harshest, without relying on complicated equipment and can make the described technology of the one pack system high thermal conductive silicon ketone glue obtained
Effect is embodied comprehensively.
Another task of the present invention is to provide the using method of a kind of bi-component high thermal conductive silicon ketone glue, and the method can be convenient
Two components are used in mixed way by ground by rational mass ratio.
The task of the present invention is performed by, and a kind of bi-component high thermal conductive silicon ketone glue, including component A and component B, institute
Component A stated is made up of the raw material of following proportioning by weight:
Described component B is made up of the raw material of following proportioning by weight:
Diluent 10-15 part；
Catalyst 3.5-5.5 part；
Cross-linking agent 6-9 part；
Coupling agent 3.5-4.5 part.
In a specific embodiment of the present invention, described α, the viscosity of alpha, omega-dihydroxy polydimethyl siloxane is
12000-15000m·pas。
In another specific embodiment of the present invention, described diluent is that density is at 0.963g/cm3And viscosity exists
350-500m pas dimethicone, vinyl silicone oil or methyl vinyl silicon oil；Described graphite powder is particle diameter ＜ 1.2mm
And bulk density is at 1.74-1.76g/cm3Polycrystalline graphite powder；
In another specific embodiment of the present invention, described fire-retardant filler is reactive hydrogen magnesium oxide and/or activity
Aluminium hydroxide；Described filler is the activated Calcium carbonate processed through resinic acid.
In another specific embodiment of the present invention, described catalyst is dibutyl tin acetate or dibutyl two
Tin octoate.
Also having in a specific embodiment in the present invention, described cross-linking agent is MTMS, methyl
Three isobutyl ketone oximino silanes or vinyl three isobutyl ketone oximino silane；Described coupling agent be hexamethyl disiloxane and/or γ-
[2,3-epoxy the third oxygen] propyl trimethoxy silicane.
Another task of the present invention is performed by, the preparation method of a kind of bi-component high thermal conductive silicon ketone glue, including
Following steps:
A) component A is prepared, the α that will weigh by weight, alpha, omega-dihydroxy polydimethyl siloxane 80-95 part, diluent
8-12 part, graphite powder 48-58 part, fire-retardant filler 35-45 part, filler 20-30 part put into dispersion stirring in blender, control stirring
Time vacuum, control whipping temp, control mixing time and control mixing speed, discharging fill, obtain component A；
B) component B is prepared, the diluent 10-15 part that will weigh by weight, catalyst 3.5-5.5 part, cross-linking agent 6-9
Part and coupling agent 3.5-4.5 part put in planetary mixer and then stirring, the temperature controlling and then stirring, control and then stir
Time and control and then the speed of stirring, discharging fill, obtain component B.
In more and in a specific embodiment of the present invention, step A) described in blender be the stirring of high speed double-planet
Machine；Described vacuum when controlling stirring is to be 0.08-0.095MPa by vacuum degree control；Described control whipping temp is
Temperature is controlled as 115-125 DEG C；Described control mixing time is to control the time for 80-100min；Described control is stirred
Mixing speed is to be 450-550rpm by speed controlling.
The present invention's and then in a specific embodiment, step B) described in control whipping temp be by so that stir
The temperature mixed controls as 35-45 DEG C；Described control mixing time be by so that time of stirring control as 35-55min；Described
Control mixing speed be by so that stirring speed controlling be 250-300rpm.
The another task of the present invention is performed by, and the using method of a kind of bi-component high thermal conductive silicon ketone glue, it is
Component A and component B in mass ratio 5-6: 1 are used in mixed way and are finished in 0.6-0.7h.
One of technical scheme that the present invention provides, owing to storage at normal temperature can reach more than 10-12 month, quite convenient for storage
With transport and saved significantly on the cost in logistics link；Two, owing to having abandoned firming agent in prior art, solidification
Accelerator etc., thus without in use relying on the facility of hot setting or UV lamp etc, it is satisfied industrialized production
Streamline on application requirement；Three, owing to adhesive strength 1.7-2.0MPa, thermal weight loss only 0.3-0.5%, thermal conductivity values reach
6.5-7W/m k, reach V without Yellowing and fire resistance1Or V2Level, thus the excellent encapsulation to LED can be met and want
Ask；Four, owing to having good thixotroping and cold curing characteristic, thus facilitated and efficiently row construction；Five, due to
Distribute without toxic and harmful after solidification and solidification, thus there is green environmental protection and ensured that online operating personnel's is strong
Health；Six, owing to having preferable high-low temperature resistant and antioxygenic property, thus strong to environmental suitability；Seven, it is provided that preparation
Method technique simple and without harsh technical factor and without by complicated equipment, thus industrial amplification production can be met
Requirement.
Detailed description of the invention
Embodiment 1:
A) component A is prepared, the α that viscosity is 12000m pas that will weigh by weight, alpha, omega-dihydroxy polydimethyl
Siloxanes (being called for short 107 glue) 95 parts, density are 0.963g/cm3And viscosity 350m pas dimethicone 10 parts,
Particle diameter ＜ 1.2 and bulk density are at 1.75g/cm358 parts of polycrystalline graphite powder, reactive hydrogen magnesium oxide 45 parts and through resin
The activated Calcium carbonate of acid treatment 25 parts puts in high speed double planetary mixer and stirs, and vacuum when controlling stirring is
0.09MPa, controlling whipping temp is 120 DEG C, and control mixing time is 100min and controls mixing speed is 550rpm, and discharging is also
Fill, obtains component A；
B) component B is prepared, by the density that weighs by weight at 0.963g/cm3And viscosity is the two of 350m pas
Methyl-silicone oil 15 parts, dibutyl tin acetate 3.5 parts, MTMS 9 parts and hexamethyl disiloxane 4.5 parts input
In planetary mixer and then stirring, and control and then the temperature of stirring is 35 DEG C, control and then time of stirring is 55min
And the speed of control and then stirring is 300rpm, discharging fill, obtain component B.
Embodiment 2:
A) component A is prepared, the α that viscosity is 15000m pas that will weigh by weight, alpha, omega-dihydroxy polydimethyl
Siloxanes (being called for short 107 glue) 90 parts, density are 0.963g/cm3And viscosity 500m pas dimethicone 11 parts,
Particle diameter ＜ 1.2 and bulk density are at 1.74g/cm350 parts of polycrystalline graphite powder, reactive hydrogen magnesium oxide 35 parts and through resin
The activated Calcium carbonate of acid treatment 30 parts puts in high speed double planetary mixer and stirs, and vacuum when controlling stirring is
0.08MPa, controlling whipping temp is 125 DEG C, and control mixing time is 80min and controls mixing speed is 450rpm, and discharging is also
Fill, obtains component A；
B) component B is prepared, by the density that weighs by weight at 0.963g/cm3And viscosity is the two of 350m pas
Methyl-silicone oil 10 parts, dibutyl tin acetate 5.5 parts, MTMS 6 parts and hexamethyl disiloxane 4 parts are put into
In planetary mixer and then stirring, and control and then the temperature of stirring is 45 DEG C, control so that time of stirring be 50min with
And the speed of control and then stirring is 250rpm, discharging fill, obtain component B.
Embodiment 3:
A) component A is prepared, the α that viscosity is 14000m pas that will weigh by weight, alpha, omega-dihydroxy polydimethyl
Siloxanes (being called for short 107 glue) 80 parts, density are 0.963g/cm3And viscosity 400m pas dimethicone 12 parts,
Particle diameter ＜ 1.2 and bulk density are at 1.745g/cm348 parts of polycrystalline graphite powder, active aluminium hydroxide 40 parts and through tree
The activated Calcium carbonate 20 parts that fat acid processes puts in high speed double planetary mixer and stirs, and vacuum when controlling stirring is
0.095MPa, controlling whipping temp is 115 DEG C, and control mixing time is 90min and controls mixing speed is 500rpm, and discharging is also
Fill, obtains component A；
B) component B is prepared, by the density that weighs by weight at 0.963g/cm3And viscosity is the two of 350m pas
Methyl-silicone oil 13 parts, dibutyl tin acetate 4 parts, methyl three isobutyl ketone oximino silane 8 parts and γ-[2,3-epoxy the third oxygen] propyl group
Trimethoxy silane 3.5 parts is put in planetary mixer and then stirring, and the temperature of control and then stirring is 40 DEG C, controls
And then the speed that the time is 45min and control and then stirring of stirring is 290rpm, discharging fill, obtain component B.
Embodiment 4:
A) component A is prepared, the α that viscosity is 13000m pas that will weigh by weight, alpha, omega-dihydroxy polydimethyl
Siloxanes (being called for short 107 glue) 85 parts, density are 0.963g/cm3And viscosity is vinyl silicone oil 8 part, of 450m pas
Footpath ＜ 1.2 and bulk density are at 1.76g/cm352 parts of polycrystalline graphite powder, active aluminium hydroxide 38 parts and through resinic acid
The activated Calcium carbonate 26 parts processed puts in high speed double planetary mixer and stirs, and vacuum when controlling stirring is
0.085MPa, controlling whipping temp is 118 DEG C, and control mixing time is 95min and controls mixing speed is 460rpm, and discharging is also
Fill, obtains component A；
B) component B is prepared, by the density that weighs by weight at 0.963g/cm3And viscosity is in the second of 350m pas
Thiazolinyl silicone oil 12 parts, dibutyl tin dioctoate 4.5 parts, methyl three isobutyl ketone oximino silane 7 parts and γ-[2,3-epoxy the third oxygen] third
Base trimethoxy silane 4 parts is put in planetary mixer and then stirring, and the temperature of control and then stirring is 38 DEG C, controls
And then the speed that the time is 40min and control and then stirring of stirring is 280rpm, discharging fill, obtain component B.
Embodiment 5:
A) component A is prepared, the α that viscosity is 13500m pas that will weigh by weight, alpha, omega-dihydroxy polydimethyl
Siloxanes (being called for short 107 glue) 88 parts, density are 0.963g/cm3And viscosity is at the methyl vinyl silicon oil 9 of 380m pas
Part, particle diameter ＜ 1.2 and bulk density are at 1.755g/cm355 parts of polycrystalline graphite powder, reactive hydrogen magnesium oxide and activity hydrogen-oxygen
Change aluminum each 21 parts and stirring in the activated Calcium carbonate 28 parts input high speed double planetary mixer that resinic acid processes, and control
Vacuum during stirring is 0.086MPa, and controlling whipping temp is 122 DEG C, controls mixing time and is 85min and controls stirring speed
Degree is 520rpm, and discharging fill obtain component A；
B) component B is prepared, by the density that weighs by weight at 0.963g/cm3And viscosity is in the first of 350m pas
Base vinyl silicone oil 11 parts, dibutyl tin dioctoate 5 parts, vinyl three isobutyl ketone oximino silane 8 parts, hexamethyl disiloxane
2.2 parts and γ-[2,3-epoxy the third oxygen] propyl trimethoxy silicane 2.2 parts is put in planetary mixer and then stirring, and
And control and then the temperature of stirring is 42 DEG C, control and then the speed that time is 35min and control and then stirring that stirs is
260rpm, discharging fill, obtain component B.
Make use-case 1:
To be used in mixed way by component A of embodiment 1 and component B in mass ratio 6: 1 and be used complete in 0.6h.
Make use-case 2:
To be used in mixed way by component A of embodiment 1 and component B in mass ratio 5: 1 and be used complete in 0.5h.
Make use-case 3:
To be used in mixed way by component A of embodiment 1 and component B in mass ratio 5.2: 1 and be used complete in 0.7h.
Make use-case 4:
To be used in mixed way by component A of embodiment 1 and component B in mass ratio 5.4: 1 and be used complete in 0.6h.
Make use-case 5:
To be used in mixed way by component A of embodiment 1 and component B in mass ratio 5.7: 1 and be used complete in 0.7h.
The bi-component high thermal conductive silicon ketone glue obtained by above-described embodiment 1 to 5 has following technical specification after tested:
Claims (10)
1. a bi-component high thermal conductive silicon ketone glue, it is characterised in that include component A and component B, described component A is pressed weight by following
The raw material composition of amount number proportioning:
Described component B is made up of the raw material of following proportioning by weight:
Diluent 10-15 part；
Catalyst 3.5-5.5 part；
Cross-linking agent 6-9 part；
Coupling agent 3.5-4.5 part.
Bi-component high thermal conductive silicon ketone glue the most according to claim 1, it is characterised in that described α, alpha, omega-dihydroxy polydimethyl
The viscosity of siloxanes is 12000-15000m pas.
Bi-component high thermal conductive silicon ketone glue the most according to claim 1, it is characterised in that described diluent is that density exists
0.963g/cm3And viscosity is at 350-500m pas dimethicone, vinyl silicone oil or methyl vinyl silicon oil；Described
Graphite powder is particle diameter ＜ 1.2mm and bulk density is at 1.74-1.76g/cm3Polycrystalline graphite powder.
Bi-component high thermal conductive silicon ketone glue the most according to claim 1, it is characterised in that described fire-retardant filler is reactive hydrogen
Magnesium oxide and/or active aluminium hydroxide；Described filler is the activated Calcium carbonate processed through resinic acid.
Bi-component high thermal conductive silicon ketone glue the most according to claim 1, it is characterised in that described catalyst is dibutyl two
Tin acetate or dibutyl tin dioctoate.
Bi-component high thermal conductive silicon ketone glue the most according to claim 1, it is characterised in that described cross-linking agent is methyl trimethoxy
TMOS, methyl three isobutyl ketone oximino silane or vinyl three isobutyl ketone oximino silane；Described coupling agent is hexamethyl two
Siloxanes and/or γ-[2,3-epoxy the third oxygen] propyl trimethoxy silicane.
7. the preparation method of a bi-component high thermal conductive silicon ketone glue as claimed in claim 1, it is characterised in that include following step
Rapid:
A) component A is prepared, the α that will weigh by weight, alpha, omega-dihydroxy polydimethyl siloxane 80-95 part, diluent 8-
12 parts, graphite powder 48-58 part, fire-retardant filler 35-45 part, filler 20-30 part put into dispersion stirring in blender, when controlling stirring
Vacuum, control whipping temp, control mixing time and control mixing speed, discharging fill, obtain component A；
B) prepare component B, the diluent 10-15 part that will weigh by weight, catalyst 3.5-5.5 part, cross-linking agent 6-9 part and
Coupling agent 3.5-4.5 part puts in planetary mixer and then stirring, the temperature controlling and then stirring, the time controlling and then stirring
With the speed controlled and then stir, discharging fill, obtain component B.
The preparation method of bi-component high thermal conductive silicon ketone glue the most according to claim 7, it is characterised in that step A) described in
Blender be high speed double planetary mixer；Described vacuum when controlling stirring is to be 0.08-by vacuum degree control
0.095MPa；Described control whipping temp is to control temperature for 115-125 DEG C；Described control mixing time is by the time
Control as 80-100min；Described control mixing speed is to be 450-550rpm by speed controlling.
The preparation method of bi-component high thermal conductive silicon ketone glue the most according to claim 7, it is characterised in that step B) described in
Control whipping temp be by so that the temperature of stirring control as 35-45 DEG C；Described control mixing time be by so that stirring
Time control as 35-55min；Described control mixing speed be by so that stirring speed controlling be 250-300rpm.
10. the using method of a bi-component high thermal conductive silicon ketone glue as claimed in claim 1, it is characterised in that it is by component
A and component B in mass ratio 5-6: 1 are used in mixed way and are finished in 0.6-0.7h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610407246.XA CN106065314A (en) | 2016-06-12 | 2016-06-12 | Bi-component high thermal conductive silicon ketone glue and preparation method thereof and use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610407246.XA CN106065314A (en) | 2016-06-12 | 2016-06-12 | Bi-component high thermal conductive silicon ketone glue and preparation method thereof and use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106065314A true CN106065314A (en) | 2016-11-02 |
Family
ID=57420390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610407246.XA Pending CN106065314A (en) | 2016-06-12 | 2016-06-12 | Bi-component high thermal conductive silicon ketone glue and preparation method thereof and use |
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| CN (1) | CN106065314A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107586532A (en) * | 2017-10-19 | 2018-01-16 | 江苏江永新材料科技有限公司 | A kind of 703 room temperature curing lamp adhesives |
| CN112759609A (en) * | 2020-12-30 | 2021-05-07 | 硅宝(深圳)研发中心有限公司 | Double-component dehydrogenation type bonding heat-conducting potting adhesive and catalyst and preparation method thereof |
| CN115386293A (en) * | 2022-09-22 | 2022-11-25 | 杭州赛维动力科技有限公司 | Sprayable silicone adhesive for power equipment and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516926A (en) * | 2011-12-20 | 2012-06-27 | 江苏明昊新材料科技有限公司 | Pouring sealant for electronic components of automobile control system and preparation method thereof |
-
2016
- 2016-06-12 CN CN201610407246.XA patent/CN106065314A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516926A (en) * | 2011-12-20 | 2012-06-27 | 江苏明昊新材料科技有限公司 | Pouring sealant for electronic components of automobile control system and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107586532A (en) * | 2017-10-19 | 2018-01-16 | 江苏江永新材料科技有限公司 | A kind of 703 room temperature curing lamp adhesives |
| CN112759609A (en) * | 2020-12-30 | 2021-05-07 | 硅宝(深圳)研发中心有限公司 | Double-component dehydrogenation type bonding heat-conducting potting adhesive and catalyst and preparation method thereof |
| CN115386293A (en) * | 2022-09-22 | 2022-11-25 | 杭州赛维动力科技有限公司 | Sprayable silicone adhesive for power equipment and preparation method thereof |
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