CN106061125A - 一种柔性电路板的电镀设备 - Google Patents
一种柔性电路板的电镀设备 Download PDFInfo
- Publication number
- CN106061125A CN106061125A CN201610454200.3A CN201610454200A CN106061125A CN 106061125 A CN106061125 A CN 106061125A CN 201610454200 A CN201610454200 A CN 201610454200A CN 106061125 A CN106061125 A CN 106061125A
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- electroplating device
- panel
- casing
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Telephone Exchanges (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610454200.3A CN106061125A (zh) | 2016-06-20 | 2016-06-20 | 一种柔性电路板的电镀设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610454200.3A CN106061125A (zh) | 2016-06-20 | 2016-06-20 | 一种柔性电路板的电镀设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106061125A true CN106061125A (zh) | 2016-10-26 |
Family
ID=57168788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610454200.3A Pending CN106061125A (zh) | 2016-06-20 | 2016-06-20 | 一种柔性电路板的电镀设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106061125A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112165785A (zh) * | 2020-11-02 | 2021-01-01 | 深圳市明锐信息科技有限公司 | 一种线路板生产用电镀装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578155A (en) * | 1985-03-19 | 1986-03-25 | Halliwell Michael J | Laser induced deposition on polymeric substrates |
JPH02109392A (ja) * | 1988-10-18 | 1990-04-23 | Mitsubishi Electric Corp | 回路パターンの形成方法 |
US20110095410A1 (en) * | 2009-10-28 | 2011-04-28 | Fairchild Semiconductor Corporation | Wafer level semiconductor device connector |
CN102817051A (zh) * | 2012-09-14 | 2012-12-12 | 中国科学院半导体研究所 | 一种激光脉冲电镀系统 |
CN102925938A (zh) * | 2012-09-14 | 2013-02-13 | 中国科学院半导体研究所 | 一种对激光镀层进行处理的系统 |
-
2016
- 2016-06-20 CN CN201610454200.3A patent/CN106061125A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578155A (en) * | 1985-03-19 | 1986-03-25 | Halliwell Michael J | Laser induced deposition on polymeric substrates |
JPH02109392A (ja) * | 1988-10-18 | 1990-04-23 | Mitsubishi Electric Corp | 回路パターンの形成方法 |
US20110095410A1 (en) * | 2009-10-28 | 2011-04-28 | Fairchild Semiconductor Corporation | Wafer level semiconductor device connector |
CN102817051A (zh) * | 2012-09-14 | 2012-12-12 | 中国科学院半导体研究所 | 一种激光脉冲电镀系统 |
CN102925938A (zh) * | 2012-09-14 | 2013-02-13 | 中国科学院半导体研究所 | 一种对激光镀层进行处理的系统 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112165785A (zh) * | 2020-11-02 | 2021-01-01 | 深圳市明锐信息科技有限公司 | 一种线路板生产用电镀装置 |
CN112165785B (zh) * | 2020-11-02 | 2021-09-24 | 台山市图今智控技术有限公司 | 一种线路板生产用电镀装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Liu Qinghua Inventor before: He Rongte |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180115 Address after: 435000 Hubei city of Huangshi Province Economic and Technological Development Zone Jinshan Street Jinhong Road No. 1 Applicant after: Huangshi Electronic Technology Co., Ltd. Address before: 517000 Guangdong Province, Heyuan city high tech Development Zone, No. eight Fumin Industrial Park A District B building Applicant before: Riverhead Xi Pu Electronics Co., Ltd. |
|
AD01 | Patent right deemed abandoned | ||
AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20190507 |