CN106052680A - Navigation module of low-stress inertial sensor - Google Patents
Navigation module of low-stress inertial sensor Download PDFInfo
- Publication number
- CN106052680A CN106052680A CN201610492825.9A CN201610492825A CN106052680A CN 106052680 A CN106052680 A CN 106052680A CN 201610492825 A CN201610492825 A CN 201610492825A CN 106052680 A CN106052680 A CN 106052680A
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- Prior art keywords
- circuit structure
- inertial sensor
- navigation module
- flexible
- low stress
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- 125000006850 spacer group Chemical group 0.000 claims description 20
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000009434 installation Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 3
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- 230000001133 acceleration Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
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- 230000008901 benefit Effects 0.000 description 1
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- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
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- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Gyroscopes (AREA)
Abstract
The invention provides a navigation module of a low-stress inertial sensor. The navigation module comprises a lower part circuit structure, an upper part circuit structure and a protecting structure, wherein the protecting structure is used for accommodating the upper part circuit structure and the lower part circuit structure and is of a hard structure, the upper part circuit structure and the lower part circuit structure are electrically connected through a flexible electric connecting structure, and each of the upper part circuit structure and the lower part circuit structure comprises at least one circuit board. According to the navigation module, a rigid connection manner is replaced with a flexible connection manner, so that the stress is not transferred to the circuit boards where the inertial sensor is distributed; by utilizing a multi-layer structure, the navigation module is small in occupied area and applicable to portable equipment; the circuit boards are protected by virtue of the protecting structure, so that the external disturbance is prevented; and the integral structure is simple and is easy to mount.
Description
Technical field
The present invention relates to a kind of navigation module, particularly relate to a kind of low stress inertial sensor navigation module, belong to inertia
Navigation field.
Background technology
In inertial navigation field, need to mount on printed circuit board (PCB) various inertial sensors, then by this printing electricity
Road plate is installed to matched structure, carries out data acquisition and transmission.In prior art, typically by the side of removably connecting
Formula, is fixed on the printed circuit board (PCB) at inertial sensor place on installation carrier.But this structure is by following shortcoming:
(1) for some the sensitiveest inertial sensors, owing to inertial sensor mounts on printed circuit board (PCB), a side
, can there is the stress of interaction in face, on the other hand, printed circuit board (PCB) is installed to structure between printed circuit board (PCB) and sensor
On, structure also can produce stress to printed circuit board (PCB), all can be transmitted on inertial sensor by stress, and this can be to inertia sensing
Device brings the biggest impact, makes inertial sensor penalty, and particularly with wide variety of MEMS sensor, it is by stress
Impact is relatively big, even if there being small STRESS VARIATION, the reading of MEMS sensor also can move by beating heart, has a strong impact on certainty of measurement；
(2) in some specific areas, for being applied to the inertial navigation unit of portable set, to circuit volume requirement
Higher, therefore the layout of circuit part need to carry out well-designed, needs the gyroscope in inertial navigation measuring unit, acceleration
The chip layout such as meter are in wherein, owing to, in inertial navigation structure, needing arranging electronic device more so that the circuit board that volume is excessive
The demand of actual application cannot be met；
(3) owing to inertial sensor place circuit board not installed protection structure, when by the situation such as external force or vibration,
The damage of inertial sensor can be caused.
For this situation, stress can be reduced from the form of inertial sensor and with the consideration that coordinates of structure.Soft
Property circuit structure be a kind of pliability circuit structure, there is the features such as high reliability, lightweight, thickness is thin, bending property is good.Flexible
Circuit structure can meet the smaller and design needs of more high-density installation, it helps reduces assembling procedure and strengthens reliable
Property.Flex circuit can be substantially reduced the volume and weight of electronic product, is suitable for electronic product to high density, miniaturization, height
The needs of reliable direction development.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of low stress inertial sensor navigation module, solves in prior art used
Property sensor affected by force is relatively big and the problem that affects inertial sensor.
For solving above-mentioned technical problem, the technical solution used in the present invention is: a kind of low stress inertial sensor navigation mould
Group, including lower circuit structure with for arranging the upper circuit structure of inertial sensor, also includes accommodating described upper circuit
The protection structure of structure and lower circuit structure, protection structure is hard structure, described upper circuit structure and lower circuit knot
Being electrically connected by flexible electrical attachment structure between structure, lower circuit structure and upper circuit structure all include at least one block of electricity
Road plate.
For the inertial navigation unit of portable set, higher, therefore by single unit system to the volume requirement of navigation module
It is divided into upper circuit structure and lower circuit structure can be greatly reduced volume.Owing to inertial sensor counter stress is the most sensitive,
Therefore upper circuit structure it is arranged in.The change of lower circuit structure counter stress is insensitive, therefore to fixed form without special
Requirement.By flexibly connecting between upper circuit structure and lower circuit structure, it is rigidly connected flexibly connecting replacement, can be big
The big minimizing stress impact on the inertial sensor in upper circuit structure.Setting has the protection structure of hard structure can be very
Good protection inertial sensor is free from the influence of the external environment.Even if between printed circuit board (PCB) and sensor or printed circuit board (PCB) and
The structure installed produces the stress interacted, owing to using flexible electrical attachment structure, and also will not be by Stress Transfer to used
Property sensor, does not interferes with the performance of inertial sensor.Simultaneously as protection structure is hard structure, its rigidity is stronger, it is possible to
So that whole circuit structure is played a protective role, it is to avoid stress or the impact of impact.The circuit structure of the present invention uses lamination knot
Structure designs, it is possible to reduce printed circuit board (PCB) makes the performance of inertial sensor by stress due to deformation, external contact and pressure
Impact.
Further, described flexible electrical attachment structure is flexible PCB, between described protection structure and upper circuit structure
Connect for single-point.Owing to flexible PCB is flexible printed circuit, it is lightweight, thickness is thin, bending property is good, therefore, upper
Between portion's circuit structure and lower circuit structure, flexible PCB is set, the Stress Transfer by lower circuit structure can be avoided to arrive
Upper circuit structure, decreasing upper circuit structure is affected by stress.If only with owing to flexible PCB is by upper circuit
Structure and lower circuit structure are attached, it is impossible to ensure under stress influence, the stability of upper circuit structure, therefore, on
Portion's circuit structure is by being connected with protection structure single-point, it is ensured that the stability of upper circuit structure, and single-point is connected as
The mode that stress is minimum, therefore protection structure will not produce impact to the inertial sensor in the circuit of upper strata.
Further, described upper circuit structure, flexible electrical attachment structure, lower circuit structure are structure as a whole.Can lead to
Crossing global design and processing, be processed as one structure by upper circuit structure, flexible electrical attachment structure, lower circuit structure,
During installation, first fixing lower circuit structure, bending upper circuit structure, flexible electrical attachment structure, lower circuit structure are formed
Integrative-structure, then upper circuit structure and protection structure single-point are connected, mounting means is simple, it is simple to operation.
Further, flexible electrical attachment structure is flexible cable, also sets between upper circuit structure and lower circuit structure
It is equipped with flexible spacer structure.If be attached by flexible cable between upper circuit structure and lower circuit structure, then need
Flexible spacer structure is set between upper circuit structure and lower circuit structure, to ensure that upper circuit structure can be well
Fixing, and upper circuit structure and lower circuit structure are for flexibly connecting, and also flexible spacer structure also reduces top electricity
Inertial sensor in line structure is affected by stress.
Further, described flexible cable is bonding line.
Further, described flexible spacer structure is pad or flexible rings.
Further, the material of described flexible spacer structure is foam or silica gel.
Further, described upper circuit structure is flex circuit.Upper circuit structure uses flex circuit,
Will be arranged in flex circuit by inertial sensor, can further avoid the Stress Transfer of generation to inertia sensing
Device, and affect its performance.
Further, single-point connection is carried out by demountable structure between described protection structure and upper circuit structure.Profit
Protection structure and upper circuit structure can be attached by the mode of removably connecting such as threaded.
Further, described protection structure is aluminium alloy structure.Aluminum alloy materials is hard structure, can be to inertia sensing
Device is protected, and the lighter in weight of aluminium alloy, the weight that will not make navigation module is excessive.
The present invention has the advantage that as follows with good effect:
(1) it is rigidly connected flexibly connecting replacement, will not be by Stress Transfer to the circuit structure arranging inertial sensor；
(2) multiple structure is used to take small volume, it is adaptable to portable set；
(3) circuit board is protected by protection structure, is possible to prevent external interference.
(4) overall structure is simple, it is easy to install.
Accompanying drawing explanation
Fig. 1 is the first embodiment of the present invention and the sectional view of the second embodiment；
Fig. 2 is the third embodiment of the present invention and the sectional view of the 4th embodiment；
Fig. 3 is the third embodiment of the present invention and the B-B sectional view of the 4th embodiment.
In figure, 1, upper circuit structure, 2, lower circuit structure, 3, protection structure, 4, flexible spacer structure, 5, flexible
Pcb board, 6, flexible cable, 7, carrier, the 8, first screw connection structure, the 9, second screw connection structure are installed
Detailed description of the invention
The invention will be further described below in conjunction with the accompanying drawings.
Generally, the low stress inertial sensor navigation module of the present invention only needs two pieces of circuit boards, i.e. uses respectively
Two pieces of printed circuit boards below and above form laminated construction and can realize.If practical situation having setting more than 2 pieces
The demand of circuit board, such as, need the components and parts arranged more, then to may be used without more polylith circuit board and realize.
Embodiment 1:
The present embodiment 1 is the low stress inertial sensor navigation module utilizing flexible PCB to be attached.
As it is shown in figure 1, a kind of low stress inertial sensor navigation module, including upper circuit structure 1, lower circuit structure
2, protection structure 3.Lower circuit structure 2 and upper circuit structure 1 are monolithic hard circuit board.Lower circuit structure 2 is installed
On the installation carrier 7 of required installation, available demountable structure is installed.Between protection structure 3 and upper circuit structure 1 it is
Single-point connects.
Upper circuit structure 1, lower circuit structure 2, flexible electrical attachment structure constitute soft or hard pcb board.Upper circuit structure
1, flexible electrical attachment structure, lower circuit structure 2 can be separately formed, it is possible to be processed as one structure.Can by global design and
Processing, be processed as one structure by upper circuit structure 1, flexible electrical attachment structure, lower circuit structure 2, when mounted, first solid
Fix portion's circuit structure 2, the integrative-structure that bending upper circuit structure 1, flexible electrical attachment structure, lower circuit structure 2 are formed
Afterwards, then upper circuit structure 1 and protection structure 3 single-point being connected, mounting means is simple, it is simple to operation.
The printed circuit board (PCB) that upper circuit structure 1 mounts for inertial sensor, for data acquisition and processing (DAP).Inertia sensing
Device includes gyroscope, accelerometer, uses MEMS sensor, such as mems accelerometer and MEMS gyroscope in the present embodiment.Under
Portion's circuit structure 2 is arranged power module, communication module etc., for functions such as data transmission, power supplies.Due to upper circuit structure
1 counter stress change is more sensitive, and the change of lower circuit structure 2 counter stress is insensitive, therefore fixing lower circuit structure 2
Lower circuit structure 2, without particular/special requirement, can be fixed on installation carrier 7 by mode.
Being electrically connected by flexible electrical attachment structure between upper circuit structure 1 and lower circuit structure 2, flexibility is electrically connected
Access node structure is flexible PCB 5.According to actual requirement of engineering, flexible PCB 5 can be by upper circuit structure 1 and lower circuit structure
Sidepiece, middle part or other positions of 2 connect, and flexible PCB 5 can connect upper circuit structure 1 and the one of lower circuit structure 2
Side, it is possible to by being all attached of upper circuit structure 1 and lower circuit structure 2.
Protection structure 3 is for accommodating described upper circuit structure 1 and lower circuit structure 2, and protection structure 3 uses rigidity
Stronger hard structure, can use aluminium alloy structure or hard plastic structure.Protection structure 3 can use removable with installing carrier 7
Unload connected mode, utilize the second screw connection structure 9 to be attached.
The effect of protection structure 3 is: (1) is used for fixing upper circuit structure 1, upper circuit structure 1 and protection structure 3 it
Between stress can be used minimum single-point connect, carry out single-point by demountable structure between protection structure 3 and upper circuit structure 1
Connect, as utilized the first screw connection structure 8 to carry out single-point connection；(2) it is used for being protected from any applied external force to inertia
Sensor and the impact of whole navigation module.
Embodiment 2:
The present embodiment 2 is the low stress inertial sensor navigation module utilizing flexible PCB to be attached.
The present embodiment 2 is similar to Example 1, and difference is: in the present embodiment, and upper circuit structure 1 is tied for flexible circuit
Structure.
As it is shown in figure 1, the connection between upper circuit structure 1 and lower circuit structure 2 also flexibly connects, i.e. by soft
Property electric connection structure be electrically connected, upper circuit structure 1, lower circuit structure 2 and flexible electrical attachment structure form one
Entirety also constitutes soft or hard pcb board.Upper circuit structure 1 is set to flex circuit, and inertial sensor is arranged in
Portion's circuit structure 1, and combine flexible electrical attachment structure, the stress impact on inertial sensor can be reduced further.
Embodiment 3:
The present embodiment 3 is the low stress inertial sensor navigation mould utilizing flexible cable and flexible spacer structure to be attached
Group.
As Figure 2-3, a kind of low stress inertial sensor navigation module, including upper circuit structure 1, lower circuit knot
Structure 2, protection structure 3.Lower circuit structure 2 and upper circuit structure 1 are monolithic hard circuit board.Lower circuit structure 2 is pacified
Being contained on the installation carrier 7 of required installation, available demountable structure is installed.
The printed circuit board (PCB) that upper circuit structure 1 mounts for inertial sensor, for data acquisition and processing (DAP).Inertia sensing
Device includes gyroscope, accelerometer, uses MEMS sensor, such as mems accelerometer and MEMS gyroscope in the present embodiment.Under
Power module, communication module etc. is arranged, for functions such as data transmission, power supplies above portion's circuit structure 2.Owing to upper circuit is tied
The change of structure 1 counter stress is more sensitive, and the change of lower circuit structure 2 counter stress is insensitive, therefore consolidating lower circuit structure 2
Determining mode without particular/special requirement, lower floor's mounting structure can be fixed on installation carrier 7.
Being electrically connected by flexible electrical attachment structure between upper circuit structure 1 and lower circuit structure 2, flexibility is electrically connected
Access node structure is flexible cable 6, and flexible cable 6 can use bonding line.Connect needs according to circuit, many flexible cables 6 can be set,
Realize the electrical connection of upper circuit structure 1 and lower circuit structure 2.Also set between upper circuit structure 1 and lower circuit structure 2
It is equipped with flexible spacer structure 4.Flexible spacer structure can use the form of stickup and the upper circuit structure 1 being positioned at above it and
The lower circuit structure 2 being positioned under is fixed.Flexible spacer structure 4 uses pad or flexible rings, and pad is back
Font, is fixed on upper circuit structure 1 in this pad.The material of flexible spacer structure 4 is foam or silica gel.Upper circuit
Structure 1 and lower circuit structure 2 are for flexibly connecting, and flexible spacer structure 4 also reduces inertia in upper circuit structure 1 and passes
Sensor is affected by stress.
Owing to lower circuit structure 2 is arranged above with flexible spacer structure 4, and flexible spacer structure 4 is above for upper strata electricity
Line structure 1, therefore without upper circuit structure being connected with protection structure 3, upper strata circuit structure 1 can possess good steady
It is qualitative,.
Protection structure 3 is used for accommodating described upper circuit structure 1 and lower circuit structure 2, and protection structure 3 uses rigidity relatively
Strong hard structure, can use aluminium alloy structure or hard plastic structure.Protection structure 3 can use detachably with installing carrier 7
Connected mode, utilizes the second screw connection structure 9 to be attached.Protection structure 3 is used for being protected from any applied external force pair
Inertial sensor and the impact of whole navigation module.
Embodiment 4:
The present embodiment 4 is the low stress inertial sensor navigation mould utilizing flexible cable and flexible spacer structure to be attached
Group.
The present embodiment 4 is similar to Example 3, and difference is: in the present embodiment, and upper circuit structure 1 is tied for flexible circuit
Structure.
As Figure 2-3, flexible spacer structure 4, and top are set between upper circuit structure 1 and lower circuit structure 2
Circuit structure 1 is flex circuit.Upper circuit structure 1 and the flexible spacer structure 4 with flex circuit all can subtract
The impact of few stress, it is to avoid the performance of inertial sensor is affected.
The above, be only presently preferred embodiments of the present invention, is not the restriction that the present invention makees other form, appoints
What those skilled in the art changed possibly also with the technology contents of the disclosure above or be modified as equivalent variations etc.
Effect embodiment.But every without departing from technical solution of the present invention content, the technical spirit of the foundation present invention is to above example institute
Any simple modification, equivalent variations and the remodeling made, still falls within the protection domain of technical solution of the present invention.
Claims (10)
1. low stress inertial sensor navigation module, it is characterised in that: include that lower circuit structure (2) and being used for is arranged used
The upper circuit structure (1) of property sensor, also includes accommodating described upper circuit structure (1) and the guarantor of lower circuit structure (2)
Protection structure (3), protection structure (3) is hard structure, passes through between described upper circuit structure (1) and lower circuit structure (2)
Flexible electrical attachment structure is electrically connected, and lower circuit structure (2) and upper circuit structure (1) all include at least one piece of circuit
Plate.
Low stress inertial sensor the most according to claim 1 navigation module, it is characterised in that: described flexible electrical connects knot
Structure is flexible PCB (5), connects for single-point between described protection structure (3) and upper circuit structure (1).
Low stress inertial sensor the most according to claim 2 navigation module, it is characterised in that: described upper circuit structure
(1), flexible electrical attachment structure, lower circuit structure (2) are structure as a whole.
Low stress inertial sensor the most according to claim 1 navigation module, it is characterised in that: described flexible electrical connects knot
Structure is flexible cable (6), is additionally provided with flexible spacer structure between described upper circuit structure (1) and lower circuit structure (2)
(4)。
Low stress inertial sensor the most according to claim 4 navigation module, it is characterised in that: described flexible cable (6)
For bonding line.
Low stress inertial sensor the most according to claim 4 navigation module, it is characterised in that: described flexible spacer structure
(4) it is pad or flexible rings.
Low stress inertial sensor the most according to claim 4 navigation module, it is characterised in that: described flexible spacer structure
(4) material is foam or silica gel.
8. according to the low stress inertial sensor navigation module according to any one of claim 1-7, it is characterised in that: on described
Portion's circuit structure (1) is flex circuit.
Low stress inertial sensor the most according to claim 2 navigation module, it is characterised in that: described protection structure (3)
And carry out single-point connection by demountable structure between upper circuit structure (1).
Low stress inertial sensor the most according to claim 1 navigation module, it is characterised in that: described protection structure (3)
For aluminium alloy structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610492825.9A CN106052680A (en) | 2016-06-29 | 2016-06-29 | Navigation module of low-stress inertial sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610492825.9A CN106052680A (en) | 2016-06-29 | 2016-06-29 | Navigation module of low-stress inertial sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106052680A true CN106052680A (en) | 2016-10-26 |
Family
ID=57166039
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610492825.9A Pending CN106052680A (en) | 2016-06-29 | 2016-06-29 | Navigation module of low-stress inertial sensor |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102313548A (en) * | 2011-09-29 | 2012-01-11 | 王皓冰 | Micro attitude and heading reference system based on 3D stereoscopic packaging technology |
| CN102980584A (en) * | 2011-09-02 | 2013-03-20 | 深圳市大疆创新科技有限公司 | Inertia measuring module of unmanned aircraft |
| CN205014987U (en) * | 2015-06-05 | 2016-02-03 | 深圳市道通智能航空技术有限公司 | Inertial measurement device |
| CN105352503A (en) * | 2015-11-30 | 2016-02-24 | 上海拓攻机器人有限公司 | Inertial measuring device for unmanned aerial vehicle |
| CN205748394U (en) * | 2016-06-29 | 2016-11-30 | 湖南格纳微信息科技有限公司 | A kind of low stress inertial sensor navigation module |
-
2016
- 2016-06-29 CN CN201610492825.9A patent/CN106052680A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980584A (en) * | 2011-09-02 | 2013-03-20 | 深圳市大疆创新科技有限公司 | Inertia measuring module of unmanned aircraft |
| CN102313548A (en) * | 2011-09-29 | 2012-01-11 | 王皓冰 | Micro attitude and heading reference system based on 3D stereoscopic packaging technology |
| CN205014987U (en) * | 2015-06-05 | 2016-02-03 | 深圳市道通智能航空技术有限公司 | Inertial measurement device |
| CN105352503A (en) * | 2015-11-30 | 2016-02-24 | 上海拓攻机器人有限公司 | Inertial measuring device for unmanned aerial vehicle |
| CN205748394U (en) * | 2016-06-29 | 2016-11-30 | 湖南格纳微信息科技有限公司 | A kind of low stress inertial sensor navigation module |
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Address after: 410205 No. 5, 4th Floor, Building F4, Yuyuan, Lugu, 27 Wenxuan Road, Changsha High-tech Development Zone, Hunan Province Applicant after: HUNAN GLONAVIN INFORMATION TECHNOLOGY CO.,LTD. Address before: 410205 Room 1610, 16th Floor, Headquarters Building, Zhongdian Software Park, 39 Jianshan Road, Changsha High-tech Development Zone, Hunan Province Applicant before: HUNAN GLONAVIN INFORMATION TECHNOLOGY CO.,LTD. |
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Address after: 410205 1705, building 1b, Hunan military civilian integration science and Technology Innovation Industrial Park, No. 699, Qingshan Road, Changsha high tech Development Zone, Changsha, Hunan Applicant after: Hunan yunjiangna micro Information Technology Co.,Ltd. Address before: 410205 No. 5, 4th Floor, Building F4, Yuyuan, Lugu, 27 Wenxuan Road, Changsha High-tech Development Zone, Hunan Province Applicant before: HUNAN GLONAVIN INFORMATION TECHNOLOGY CO.,LTD. |
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Application publication date: 20161026 |