CN102313548B - Micro attitude and heading reference system based on 3D stereoscopic packaging technology - Google Patents

Micro attitude and heading reference system based on 3D stereoscopic packaging technology Download PDF

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CN102313548B
CN102313548B CN 201110299117 CN201110299117A CN102313548B CN 102313548 B CN102313548 B CN 102313548B CN 201110299117 CN201110299117 CN 201110299117 CN 201110299117 A CN201110299117 A CN 201110299117A CN 102313548 B CN102313548 B CN 102313548B
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circuit board
printed circuit
board part
plane
reference system
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CN102313548A (en
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王皓冰
朱巍
雷家波
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Weihai Zhonghong Weiyu Technology Co.,Ltd.
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WUXI SHENXING TECHNOLOGY Co Ltd
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Abstract

The invention discloses a micro attitude and heading reference system based on 3D stereoscopic packaging technology. The system provided by the invention comprises a 3D integrated pedestal which is positioned in a core and is shaped as a hexahedron; the external surface of the 3D integrated pedestal is tightly covered with multilayer rigid-flexible PCB; one side of the multilayer rigid-flexible PCB is equipped with a microprocessor, and other five sides are respectively provided with three single-shaft gyroscopes, a triaxial accelerometer and a triaxial magnetic sensor; one side of the 3D integrated pedestal is equipped with a main device slot, and the microprocessor is embedded inside the main device slot; set screws are mounted at four corners of each surface of the 3D integrated pedestal and are also fixedly connected with corresponding positions of the multilayer rigid-flexible PCB; the 3D integrated pedestal is moulded at one step, and each shaft of the sensor is respectively parallel to each other and mutually orthogonal; various sensors are installed by the adoption of multilayer printed circuit boards so as to minimize the volume of the whole pedestal; the microprocessor is introduced to reach independent operational and data processing functions.

Description

A kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology
Technical field
The technical field of inertial sensor system, particularly a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology in the present invention relates to electronic navigation and controlling.
Background technology
The attitude heading reference system, AHRS write a Chinese character in simplified form in English, and it mainly is comprised of three-axis gyroscope, three axis accelerometer, three axle geomagnetic sensors and microprocessor.According to the requirement of inertial navigation principle, three sensitive axes X of accelerometer A, Y A, Z A, gyrostatic three sensitive axes X G, Y G, Z G, three sensitive axes X of earth magnetism Magnetic Sensor M, Y M, Z MX, Y, each axle of Z in front must be parallel mutually for it, and the X that intersects simultaneously, Y, each axle of Z each other also must quadratures.Putting before this, little processing is calculated all sensing datas, and system can directly export rigid body; After the angle of pitch that is written into attitude heading reference system carrier, roll angle and course angle, and then derive speed, position and the movement locus of appended carrier.
For the X, the Y that guarantee senser element, Z axis parallel, condition that each other must quadrature respectively, generally need specific device install and fix accelerometer, gyroscope and geomagnetic sensor; In the prior art, the fixed form of attitude heading reference system normally adopts processing or welding manner and forms the framework of an orthohormbic structure, and degree of will speed up meter, gyroscope and geomagnetic sensor are fixed on its outside surface again.
In certain attitude heading reference system existing product, be that the printed circuit board (PCB) that is welded with accelerometer, gyroscope and geomagnetic sensor is welded on the reference for installation plate of system by the right angle looper, make accelerometer, gyroscope and geomagnetic sensor and the accelerometer on the motherboard, gyroscope and geomagnetic sensor on the daughter board keep being parallel to each other or quadrature.This mode is the design that present attitude heading reference system more often uses, but because right angle looper itself just has angular error, in welding, introduced again new alignment error, so overall accuracy is relatively poor, can't guarantee accurately the orthogonality between X, Y, three sensitive axes of Z.
The patent No. is the Chinese patent application patent " a kind of small-sized Inertial Measurement Unit " (notification number is CN1821717A) of CN200610011562.1 for another example; Adopt the miniature MEMS inertia device, cooperate necessary components and parts to consist of x to, y to, z to three blocks of inertia device plates, carry out the signal conversion by signal processing circuit board, all circuit boards are installed on "T"-shaped hollow; Micro accelerometer on three inertia device plates distributes different, and the phase mutual edge distance reduces at utmost in the space, and the signal processing circuit reasonable installation can not increase the volume of micro inertial measurement unit; The metal construction frame comprises main metal frame and auxiliary metal frame two parts, and auxiliary metal frame is connected in the midline of main metal frame, two orthogonal one-tenth T-shapes of metal frame.The some printed circuit board that are welded with accelerometer, gyroscope and geomagnetic sensor are fixed on the structural framing according to orthogonal direction.This method can reach higher precision with the framework of machining, but three installed surfaces are only provided, when the used device of system too much surpasses hollow auxiliary metal frame front-back areal extent of T-shape, need to increase the quantity of answering printed circuit board, and with the bolt attaching nut these newly-increased circuit boards are serially connected, installation procedure is many, and it is larger to introduce alignment error.And adopt some printed circuit board, can only be also aspect the electrical connection that realizes between plate and the plate mode by soldered wires realize a small amount of being connected.When the electrical connection between some printed circuit board surpassed some, this method then can't solve.
The patent No. is the Chinese patent application patent " a kind of implicit type structure mini inertia measurement unit " (notification number is CN101038173A) of CN200710063635.6 for another example; According to the requirement of certain verticality, flatness and smooth finish, adopt synthesize ceramic materials processing one square pedestal.Utilization has the characteristics of the synthesize ceramic material surface electrodepositable circuit of certain smooth finish, according to accelerometer, gyrostatic encapsulation, circuit theory diagrams and installation requirement, electroplates circuit and attach pad at base-plates surface.Degree of will speed up meter and gyroscope are welded to respectively on three orthogonal of the pedestal, spatially realize mutually orthogonal.But because the square pedestal adopts the mode of electroplating surface circuit, so device can only be welded on its outside surface, available limited space, and as increasing the quantity of device, then be bound to increase the volume of square pedestal, limited the development of function vector variation and lightness.In a kind of implicit type structure mini inertia measurement unit, do not introduce microprocessor, therefore can not carry out independently data processing, can't directly export the athletic posture of carrier.And use the synthesize ceramic material, cost is higher.
In sum, the Miniature posture heading reference system mainly has following seven shortcomings owing to the structural design reason of self in the above-mentioned prior art:
1, metal framework is overweight, greatly increases the weight of Miniature posture heading reference system, is unfavorable for that it is to the development of lightness.
2, Miniature posture heading reference system volume is excessive, is unfavorable for breaking through the restriction in carrier inside space, is unfavorable for that it is to the development of miniaturization.
3, guarantee orthohormbic structure between accelerometer, gyroscope and the geomagnetic sensor sensitive axes with welded structure, error is larger.
4, installation procedure is more, and it is larger to introduce alignment error, and processing cost is higher.
5, the Miniature posture heading reference system does not comprise microprocessor, does not possess the operation independent function.
6, adopt the single face mounting technology, available limited space is unfavorable for the expansion of device.
7, adopt the mode of polylith printed circuit board combination, be unsuitable for highdensity electrical connection.
Miniature posture heading reference system under the therefore present technology can't be taken into account the demand that volume is little, lightweight, precision is high, cost is low and extensibility is strong.
Summary of the invention
Technical matters to be solved by this invention is the present situation for prior art, a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology that a kind of compact conformation is provided, component volume is little, measuring accuracy is high, Member Reliability Analysis is good and has the operation independent ability.
The present invention solves the problems of the technologies described above the technical scheme that adopts: a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology include the integrated pedestal of the three dimensions that is positioned at kernel, and the integrated pedestal of this three dimensions is hexahedron; The integrated pedestal outside surface of three dimensions tightly is covered with the hard and soft board of multilayer; Be furnished with microprocessor in the hard and soft board one side of multilayer, other five are fitted with respectively three single axis gyroscopes, a three axis accelerometer and a magnetic sensor; The integrated pedestal of three dimensions simultaneously is shaped with the main device groove, and microprocessor is embedded in this main device groove; Four jiaos every places of the integrated pedestal of three dimensions all are inserted with dog screw, and dog screw also interts close-fitting with the hard and soft board of multilayer corresponding position; The integrated pedestal of one-time formed three dimensions, can utilize skiving to be worked into accurate flatness and verticality, directly provide three pairs of in twos mutually perpendicular installed surfaces, corresponding matching and to satisfy X, Y, the Z axis of senser element parallel respectively, installation requirement that each other must quadrature.
Adopts measure also comprises:
Its hexahedron of the hard and soft board of above-mentioned multilayer is respectively: the first printed circuit board part, the second printed circuit board part, the 3rd printed circuit board part, the 4th printed circuit board part, the 5th printed circuit board part, the 6th printed circuit board part.
Above-mentioned the first printed circuit board part, the 3rd printed circuit board part, the 5th printed circuit board part, the 6th printed circuit board part are successively from a left side and the right side is arranged in juxtaposition in line, and the joint adhesion has ligament.
Above-mentioned the second printed circuit board part, the 3rd printed circuit board part, the 4th printed circuit board part are arranged in juxtaposition successively from bottom to top in line, and the joint adhesion has ligament.
Above-mentioned microprocessor is assigned on the first printed circuit board part; Each panel centre position of the second printed circuit board part, the 3rd printed circuit board part, the 4th printed circuit board part, the 5th printed circuit board part, the 6th printed circuit board part all is shaped with a circuit board mounting hole, all is fitted with six projections on each inside surface and according to the passive device of display arrangement centered by the circuit board mounting hole.
Four jiaos of places of above-mentioned the first printed circuit board part, the second printed circuit board part, the 3rd printed circuit board part, the 4th printed circuit board part, the 5th printed circuit board part, each panel of the 6th printed circuit board part all are shaped with pilot hole, and pilot hole and the corresponding inserting of described dog screw.
Above-mentioned gyroscope is three, is installed on respectively the second printed circuit board part, the 3rd printed circuit board part, the 5th printed circuit board part middle part; Magnetic sensor is one, and is installed on the middle part of the 4th printed circuit board part; 3-axis acceleration is counted one, and is installed on the middle part of the 6th printed circuit board part, makes the z of three axis accelerometer mutually vertical with mounting plane to sensitive axes.
The integrated pedestal of above-mentioned three dimensions adopts titanium alloy material to make, or adopts resin material to make, or adopts aluminum alloy materials to make.
Its six face of the integrated pedestal of above-mentioned three dimensions is respectively: frontal plane, back plane, left plane, right plane, upper plane and lower plane, and respectively with the first printed circuit board of the hard and soft board of multilayer part, the second printed circuit board part, the 3rd printed circuit board part, the 4th printed circuit board part, the 5th printed circuit board part, the one by one pairing of the 6th printed circuit board part.
Above-mentioned main device groove is formulated on the left plane, all is shaped with the glue-filling slot of an indent on the corner location on left plane; Frontal plane, back plane, right plane, upper plane and lower plane centre position all are shaped with the bumping square body, be shaped with the three-back-shaped auxiliary device mounting groove of indent around the bumping square body, be assigned in passive device and corresponding three-back-shaped auxiliary device mounting groove scarf on the hard and soft board of multilayer.
The center of each bumping square body is shaped with the pedestal mounting hole on above-mentioned frontal plane, back plane, right plane, upper plane and the lower plane, and the circuit board mounting hole on each pedestal mounting hole and the hard and soft board of multilayer aligns one by one.
Compared with prior art, the present invention includes the integrated pedestal of the three dimensions that is positioned at kernel, and the integrated pedestal of this three dimensions is hexahedron; The integrated pedestal outside surface of three dimensions tightly is covered with the hard and soft board of multilayer; Be furnished with microprocessor in the hard and soft board one side of multilayer, other five are fitted with respectively three single axis gyroscopes, a three axis accelerometer and a magnetic sensor; The integrated pedestal of three dimensions simultaneously is shaped with the main device groove, and microprocessor is embedded in this main device groove; Four jiaos every places of the integrated pedestal of three dimensions all are inserted with dog screw, and dog screw also interts close-fitting with the hard and soft board of multilayer corresponding position.The advantage of the embodiment of the invention is: the integrated pedestal of one-time formed three dimensions, it can utilize skiving to be worked into accurate flatness and verticality, three pairs of in twos mutually perpendicular installed surfaces directly are provided, X, the Y, the Z axis that have satisfied senser element are parallel respectively, the installation requirement of necessary quadrature has reduced the nonopiate error that produces in installation process each other; Adopt bilayer or multilayer board that various senser elements are installed, reduced the volume of whole pedestal, be convenient in the situation that does not increase carrier bulk the function of the quantity of senser element and attitude heading reference system in the expanding system; Degree of will speed up meter, gyroscope, geomagnetic sensor and microprocessor carry out structure-integrated design, share the hard and soft board of multilayer of one six cross structure, electrical connection between each face realizes by layer flexible P.e.c. plate portion, the electric interconnections of total Reliability Enhancement, the most amounts of realization effectively reduce the alignment error that produces in the splicing fitting printed circuit board process; Introduce microprocessor, reached independently computing and data processing function, directly exported the angle of pitch, roll angle and the course angle of carrier.
Description of drawings
Fig. 1 is the expansion synoptic diagram of six panels of the hard and soft board of multilayer in the embodiment of the invention;
Three-dimensional axle when Fig. 2 is the hard and soft board six faceplate parts turnover of embodiment of the invention multilayer is surveyed synoptic diagram;
Fig. 3 is the planar development synoptic diagram of the inboard equipped passive device of hard and soft board six panels of embodiment of the invention multilayer, microprocessor;
Fig. 4 is the left front schematic top plan view of the integrated pedestal of embodiment of the invention three dimensions;
Fig. 5 is the right back elevational schematic view of the integrated pedestal of embodiment of the invention three dimensions;
Fig. 6 is the schematic three dimensional views of the integrated pedestal of the hard and soft board of embodiment of the invention multilayer and three dimensions pairing when being half coated state;
Fig. 7 is the left front schematic top plan view after the hard and soft board of embodiment of the invention multilayer and the integrated pedestal of three dimensions coat fully;
Fig. 8 is the right back elevational schematic view after the hard and soft board of embodiment of the invention multilayer and the integrated pedestal of three dimensions coat fully.
Embodiment
Embodiment is described in further detail the present invention below in conjunction with accompanying drawing.
To shown in Figure 8, figure grade is described as follows: hard and soft board 101, the first printed circuit board parts 102 of multilayer such as Fig. 1, the second printed circuit board part 103, the three printed circuit board parts 104, the four printed circuit board parts 105, the 5th printed circuit board part 106, the six printed circuit board parts 107, ligament 108, pilot hole 109, circuit board mounting hole 110, passive device 201, microprocessor 301, the integrated pedestal 401 of three dimensions, left plane 402, frontal plane 403, lower plane 404, back plane 405, right plane 406, upper plane 407, dog screw 409, pedestal mounting hole 410, glue-filling slot 411, main device groove 412, three-back-shaped auxiliary device mounting groove 413, single axis gyroscope 701, three axis accelerometer 702, magnetic sensor 703.
The embodiment of the invention, a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology includes the integrated pedestal 401 of the three dimensions that is positioned at kernel, and the integrated pedestal 401 of this three dimensions is hexahedron; Integrated pedestal 401 outside surfaces of three dimensions tightly are covered with the hard and soft board 101 of multilayer; Be furnished with microprocessor 301 in hard and soft board 101 one sides of multilayer, other five are fitted with respectively three single axis gyroscopes 701, a three axis accelerometer 702 and a magnetic sensor 703; Integrated pedestal 401 one sides of three dimensions are shaped with main device groove 412, and microprocessor 301 is embedded in this main device groove 412; The integrated pedestal of three dimensions 401 four jiaos every places all are inserted with dog screw 409, and dog screw 409 also interts close-fitting with the hard and soft board of multilayer 101 corresponding positions.
Hard and soft board 101 its hexahedrons of multilayer are respectively: the first printed circuit board part 102, the second printed circuit board part 103, the 3rd printed circuit board part 104, the 4th printed circuit board part 105, the 5th printed circuit board part 106, the 6th printed circuit board part 107.The first printed circuit board part 102, the 3rd printed circuit board part 104, the 5th printed circuit board part 106, the 6th printed circuit board part 107 are successively from a left side and the right side is arranged in juxtaposition in line, and the joint adhesion has ligament 108.The second printed circuit board part 103, the 3rd printed circuit board part 104, the 4th printed circuit board part 105 are arranged in juxtaposition successively from bottom to top in line, and the joint adhesion has ligament 108.Microprocessor 301 is assigned on the first printed circuit board part 102; Each panel centre position of the second printed circuit board part 103, the 3rd printed circuit board part 104, the 4th printed circuit board part 105, the 5th printed circuit board part 106, the 6th printed circuit board part 107 all is shaped with a circuit board mounting hole 110, all is fitted with six projections on each inside surface and according to the passive device 201 of display arrangement centered by the circuit board mounting hole 110.Four jiaos of places of the first printed circuit board part 102, the second printed circuit board part 103, the 3rd printed circuit board part 104, the 4th printed circuit board part 105, the 5th printed circuit board part 106, the 6th printed circuit board part 107 each panel all are shaped with pilot hole 109, and pilot hole 109 and dog screw 409 corresponding insertings.Gyroscope 701 is three, is installed on respectively the second printed circuit board part 103, the 3rd printed circuit board part 104, the 5th printed circuit board part 106 middle parts; Described magnetic sensor 703 is one, and is installed on the middle part of the 4th printed circuit board part 105; Described three axis accelerometer 702 is one, and is installed on the middle part of the 6th printed circuit board part 107, makes the z of three axis accelerometer 702 mutually vertical with mounting plane to sensitive axes.
The integrated pedestal 401 of three dimensions adopts titanium alloy material to make, or adopts resin material to make, or adopts aluminum alloy materials to make; Integrated pedestal 401 its six faces of three dimensions are respectively: frontal plane 403, back plane 405, left plane 402, right plane 406, upper plane 407 and lower plane 404, and match one by one with the first printed circuit board part 102, the second printed circuit board part 103, the 3rd printed circuit board part 104, the 4th printed circuit board part 105, the 5th printed circuit board part 106, the 6th printed circuit board part 107 of the hard and soft board 101 of multilayer respectively.Main device groove 412 is formulated on the left plane 402, all is shaped with the glue-filling slot 411 of an indent on the corner location on left plane 402; Described frontal plane 403, back plane 405, right plane 406, upper plane 407 and lower plane 404 centre positions all are shaped with the bumping square body, be shaped with the three-back-shaped auxiliary device mounting groove 413 of indent around the bumping square body, be assigned in passive device 201 and corresponding three-back-shaped auxiliary device mounting groove 413 scarves on the hard and soft board 101 of multilayer.
The center of each bumping square body is shaped with pedestal mounting hole 410 on frontal plane 403, back plane 405, right plane 406, upper plane 407 and the lower plane 404, and the circuit board mounting hole 110 on each pedestal mounting hole 410 and the hard and soft board 101 of multilayer aligns one by one.
The assembling process of the embodiment of the invention and the formation of final structure mainly may further comprise the steps:
The first step: according to the size of selecting electronic devices and components, circuit theory diagrams and installation requirement, the hard and soft board 101 of multilayer of one or six cross structure is provided, as shown in Figure 1, the hard and soft board 101 of the multilayer of described six cross structure, it is the treatment circuit plate of miniature electronic components and parts of the present invention, comprise 6 printed circuit board parts: the first printed circuit board part 102, the second printed circuit board part 103, the 3rd printed circuit board part 104, the 4th printed circuit board part 105, the 5th printed circuit board part 106, the 6th printed circuit board part 107,5 flexible printed circuit board part ligaments 108,24 pilot holes 109 and 5 pedestal mounting holes 110, wherein printed circuit board part 102 is used for installing microprocessor 301 and some passive devices 201, in the Miniature posture heading reference system of 3-D solid structure, microprocessor 301 there is not accurate positioning requirements, so above-mentioned printed circuit board part 102 not be used in and bores circuit board mounting hole 110 on the printed circuit board (PCB), all the other printed circuit board parts 103,104,105,106,107 are used for installing accelerometer, gyroscope, geomagnetic sensor senser element and some passive devices, need to accurately locate, so all will bore circuit board mounting hole 110 at printed circuit board (PCB).Simultaneously, as shown in Figure 2, the hard and soft board 101 of the multilayer of six cross structure can turn down along flexible printed circuit board part ligament 108.
Second step: according to the size of the hard and soft board 101 of multilayer of the size of selecting electronic devices and components and six s' cross structure, the integrated pedestal 401 of three dimensions that provides an employing special material such as titanium alloy, resin, aluminium alloy etc. to process, extremely shown in Figure 5 such as Fig. 4, stipulate each coordinate system axially as shown at right, regulation X-axis forward for left, X-axis negative sense for right, Y-axis forward be front, Y-axis negative sense for after, the Z axis forward is that upper, Z axis negative sense is for lower.The integrated pedestal 401 of three dimensions is to form according to certain verticality, flatness, smooth finish and components and parts dimensioned.It comprises 6 respectively with described printed circuit board part 102,103,104,105,106,107 corresponding faces: frontal plane 403, back plane 405, left plane 402, right plane 406, upper plane 407, lower plane 404.Its left plane 402 is corresponding with described printed circuit board 102, it is made of 4 dog screw 409,4 glue-filling slots 411 and polygon main device grooves 412 corresponding with described pilot hole 109, and the size of main device groove 412 must be greater than the size of selected microprocessor 301; The corresponding relation of all the other five faces is: frontal plane 403 corresponding printed circuit board parts 103, lower plane 404 corresponding printed circuit board parts 104, back plane 405 corresponding printed circuit board parts 405, right plane 406 corresponding printed circuit board parts 106, upper plane 407 corresponding printed circuit board parts 107; The structure of these 5 faces is identical, comprises respectively pedestal mounting hole 410 and 1 three-back-shaped auxiliary device mounting groove 413 that 409,1 of 4 dog screws corresponding with described pilot hole 109 and described circuit board mounting hole 110 are corresponding.
The 3rd step: as shown in Figure 3, the microprocessor 301 that a kind of Miniature posture heading reference system of 3-D solid structure is required is installed in the inboard middle body of printed circuit board part 102 of the hard and soft board 101 of multilayer of six cross structure; Some passive devices 201 are installed in all the other 5 printed circuit board parts 103,104,105,106,107 inboard, in designing printed circuit board, should be noted that, the position of passive device on printed circuit board part 103,104,105,106,107 inboards must be at described with it 5 faces of the corresponding integrated pedestal 401 in MEMS device three-dimensional space, and the auxiliary device mounting groove 413 on frontal plane 403, lower plane 404, back plane 405, right plane 406, upper plane 407 is consistent.
The 4th step: as shown in Figure 6, the hard and soft board 101 of the multilayer of described six cross structure is docked with the integrated pedestal 401 in described MEMS device three-dimensional space, make described printed circuit board part 102 corresponding left planes 402, printed circuit board part 103 corresponding frontal planes 403, printed circuit board part 104 corresponding lower planes 404, printed circuit board part 105 corresponding back planes 405, printed circuit board part 106 corresponding right planes 406, printed circuit board part 107 corresponding upper planes 407; In glue-filling slot 411, pour into glue, the hard and soft board 101 of the multilayer of six cross structures is turned down along flexible printed circuit board part ligament 108, make circuit board mounting hole 110 and pedestal mounting hole 410, and pilot hole 109 aim at dog screw 409, then apply certain pressure, dog screw 409 is inserted pilot holes 109, thereby make the hard and soft board 101 of multilayer of six cross structure be close to the integrated pedestal 401 in MEMS device three-dimensional space and dock.Use screw connecting circuit board mounting hole 110 and pedestal mounting hole 410.
The 5th step: shown in Fig. 7 to 8, the gyroscope 701 of three single shafts is installed in respectively the printed circuit board part 103 of the hard and soft board 101 of multilayer of six cross structure, the outside central authorities of printed circuit board part 104 and printed circuit board part 106, the sensitive axes that makes three single axis gyroscopes 701 is all perpendicular to the mounting plane of device, because the frontal plane 403 of the integrated pedestal of three dimensions, lower plane 404 is vertical in twos with right plane 406, and printed circuit board part 103, three faces of printed circuit board part 104 and printed circuit board part 106 and this are corresponding one by one, and realize accurately location by pilot hole 109 and dog screw 409, realize being close to by screw series circuit plate mounting hole 110 and pedestal mounting hole 410, therefore the sensitive axes of three single axis gyroscopes 701 is vertical and meet at the same point in space in twos.The outside that a three axis accelerometer 702 is installed in printed circuit board part 107 is central, makes the z of three axis accelerometer 702 mutually vertical with mounting plane to sensitive axes.The outside that a magnetic sensor 703 is installed in printed circuit board part 105 is central, makes the z of Magnetic Sensor 703 mutually vertical with mounting plane to sensitive axes.Some passive devices are installed in the outside of printed circuit board part 102.
The design concept of the embodiment of the invention is as described below:
Use the integrated pedestal 401 of three dimensions of precise injection molding or machining formation required size, integrated pedestal 401 each the surperficial verticality of strict guarantee three dimensions, flatness and smooth finish.The integrated pedestal 401 of three dimensions has satisfied the installation requirement of device to greatest extent for accelerometer, gyroscope, geomagnetic sensor provide three pairs of in twos orthogonal surfaces, has farthest reduced the nonopiate error that produces in installation process.The material of the selected integrated pedestal of three dimensions has good thermal conductivity, the thermal stress that the various piece of the integrated pedestal of assurance three dimensions is received when temperature variation evenly distributes, and has reduced greatly inhomogeneous by the thermal stress distribution of base material when temperature variation and nonopiate error that produce.Circuit theory diagrams and installation requirement according to required electronic devices and components, senser element and microprocessor are installed in respectively on the hard and soft board of six cross-types, partly turn down along flexible printed circuit board, make six faces of printed circuit board (PCB) be close to six surfaces of square pedestal fully, use at last pin to be connected square pedestal and hard and soft board with screw, realize accurately fixed installation.Electric interconnection between each face is realized by the flexible PCB of multilayer.And three couple that accelerometer, gyroscope and earth magnetism Magnetic Sensor just have been separately fixed at the integrated pedestal of three dimensions satisfies attitude heading reference system (AHRS) to the structural requirement of device on space distribution in twos on the mutually perpendicular installed surface.According to required components and parts size, determine the size of pedestal and hard and soft board, optimize parameters, in guaranteed performance, reduce to greatest extent its size, reduce its weight.
The advantage of the embodiment of the invention is: the integrated pedestal of one-time formed three dimensions, it can utilize skiving to be worked into accurate flatness and verticality, three pairs of in twos mutually perpendicular installed surfaces directly are provided, X, the Y, the Z axis that have satisfied senser element are parallel respectively, the installation requirement of necessary quadrature has reduced the nonopiate error that produces in installation process each other; Adopt bilayer or multilayer board that various senser elements are installed, reduced the volume of whole pedestal, be convenient in the situation that does not increase carrier bulk the function of the quantity of senser element and attitude heading reference system in the expanding system; Degree of will speed up meter, gyroscope, geomagnetic sensor and microprocessor carry out structure-integrated design, share the hard and soft board of multilayer of one six cross structure, electrical connection between each face realizes by layer flexible P.e.c. plate portion, the electric interconnections of total Reliability Enhancement, the most amounts of realization effectively reduce the alignment error that produces in the splicing fitting printed circuit board process; Introduce microprocessor, reached independently computing and data processing function, directly exported the angle of pitch, roll angle and the course angle of carrier.
Most preferred embodiment of the present invention is illustrated, and various variations or the remodeling made by those of ordinary skills can not depart from the scope of the present invention.

Claims (10)

1. the Miniature posture heading reference system based on the 3 D stereo encapsulation technology includes the integrated pedestal of the three dimensions that is positioned at kernel (401), and the integrated pedestal of this three dimensions (401) is hexahedron; The integrated pedestal of described three dimensions (401) outside surface tightly is covered with the hard and soft board of multilayer (101); It is characterized in that: be furnished with microprocessor (301) in the hard and soft board of described multilayer (101) one side, other five are fitted with respectively three single axis gyroscopes (701), a three axis accelerometer (702) and a magnetic sensor (703); The integrated pedestal of described three dimensions (401) one side is shaped with main device groove (412), and microprocessor (301) is embedded in this main device groove (412); Four jiaos every places of the integrated pedestal of described three dimensions (401) all are inserted with dog screw (409), and dog screw (409) also interts close-fitting with the hard and soft board of multilayer (101) corresponding position; The integrated pedestal of one-time formed three dimensions, can utilize skiving to be worked into accurate flatness and verticality, directly provide three pairs of in twos mutually perpendicular installed surfaces, corresponding matching and to satisfy X, Y, the Z axis of senser element parallel respectively, installation requirement that each other must quadrature.
2. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 1, it is characterized in that: its hexahedron of the hard and soft board of described multilayer (101) is respectively: the first printed circuit board part (102), the second printed circuit board part (103), the 3rd printed circuit board part (104), the 4th printed circuit board part (105), the 5th printed circuit board part (106), the 6th printed circuit board part (107).
3. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 2, it is characterized in that: described the first printed circuit board part (102), the 3rd printed circuit board part (104), the 5th printed circuit board part (106), the 6th printed circuit board part (107) are successively from a left side and the right side is arranged in juxtaposition in line, and the joint adhesion has ligament (108).
4. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 2, it is characterized in that: described the second printed circuit board part (103), the 3rd printed circuit board part (104), the 4th printed circuit board part (105) are arranged in juxtaposition successively from bottom to top in line, and the joint adhesion has ligament (108).
5. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 2 is characterized in that: described microprocessor (301) is assigned on the first printed circuit board part (102); Each panel centre position of described the second printed circuit board part (103), the 3rd printed circuit board part (104), the 4th printed circuit board part (105), the 5th printed circuit board part (106), the 6th printed circuit board part (107) all is shaped with a circuit board mounting hole (110), all is fitted with six projections on each inside surface and according to the passive device (201) of display arrangement centered by the circuit board mounting hole (110).
6. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 5, it is characterized in that: the first printed circuit board part (102), the second printed circuit board part (103), the 3rd printed circuit board part (104), the 4th printed circuit board part (105), the 5th printed circuit board part (106), four jiaos of places of the 6th printed circuit board part (107) each panel all are shaped with pilot hole (109), and pilot hole (109) and the corresponding inserting of described dog screw (409).
7. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 6, it is characterized in that: described gyroscope (701) is three, is installed on respectively the second printed circuit board part (103), the 3rd printed circuit board part (104), the 5th printed circuit board part (106) middle part; Described magnetic sensor (703) is one, and is installed on the middle part of the 4th printed circuit board part (105); Described three axis accelerometer (702) is one, and is installed on the middle part of the 6th printed circuit board part (107), makes the z of three axis accelerometer (702) mutually vertical with mounting plane to sensitive axes.
8. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 7, it is characterized in that: the integrated pedestal of described three dimensions (401) adopts titanium alloy material to make, or adopt resin material to make, or adopt aluminum alloy materials to make;
Its six face of the integrated pedestal of described three dimensions (401) is respectively: frontal plane (403), back plane (405), left plane (402), right plane (406), upper plane (407) and lower plane (404), and respectively with the first printed circuit board of the hard and soft board of multilayer (101) part (102), the second printed circuit board part (103), the 3rd printed circuit board part (104), the 4th printed circuit board part (105), the 5th printed circuit board part (106), the 6th printed circuit board part (107) is matched one by one.
9. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 8, it is characterized in that: described main device groove (412) is formulated on the left plane (402), all is shaped with the glue-filling slot (411) of an indent on the corner location of left plane (402); Described frontal plane (403), back plane (405), right plane (406), upper plane (407) and lower plane (404) centre position all are shaped with the bumping square body, be shaped with the three-back-shaped auxiliary device mounting groove (413) of indent around the bumping square body, be assigned in passive device (201) and corresponding three-back-shaped auxiliary device mounting groove (413) scarf on the hard and soft board of multilayer (101).
10. a kind of Miniature posture heading reference system based on the 3 D stereo encapsulation technology according to claim 9, it is characterized in that: the center of upper each the bumping square body of described frontal plane (403), back plane (405), right plane (406), upper plane (407) and lower plane (404) is shaped with pedestal mounting hole (410), and the circuit board mounting hole (110) on each pedestal mounting hole (410) and the hard and soft board of multilayer (101) aligns one by one.
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Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103454607B (en) * 2012-05-29 2016-02-17 上海汽车集团股份有限公司 The bearing calibration of magnetic field sensor signal and the Vehicular navigation system based on the method
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CN104181329A (en) * 2014-09-04 2014-12-03 中国兵器工业集团第二一四研究所苏州研发中心 Miniature three-axis vibration sensor assembled three-dimensionally through flexible circuit board
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CN105674983A (en) * 2014-11-20 2016-06-15 北京自动化控制设备研究所 Basic modular structure for modular inertial navigation system
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CN105486295A (en) * 2015-11-26 2016-04-13 北京青云航空仪表有限公司 Vibration damper for gyro
CN105800544B (en) * 2016-05-16 2017-04-12 安徽北方芯动联科微系统技术有限公司 Multi-axis MEMS sensor module and vertical assembling method thereof
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CN107863338A (en) * 2017-11-08 2018-03-30 奥肯思(北京)科技有限公司 A kind of boxlike three-dimensional systematic encapsulation
CN108692723A (en) * 2018-04-02 2018-10-23 中国兵器工业集团第二四研究所苏州研发中心 A kind of micro-inertia measuring modular construction of anti high overload
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CN112577483A (en) * 2019-09-29 2021-03-30 北京信息科技大学 Attitude measuring device for parachute landing terminal sensitive device
CN111486818A (en) * 2020-04-24 2020-08-04 青岛智腾科技有限公司 Three-dimensional tilt angle sensor
CN113514063A (en) * 2021-06-21 2021-10-19 北京自动化控制设备研究所 MEMS micro inertial navigation structure
CN114152247B (en) * 2021-12-29 2023-04-28 中国电子科技集团公司第二十六研究所 Small-volume high-precision MEMS inertial measurement unit
DE202022100279U1 (en) * 2022-01-19 2023-04-21 WAGO Verwaltungsgesellschaft mit beschränkter Haftung PCB assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1224147A (en) * 1998-08-07 1999-07-28 清华大学 Method for three dimension position measurement using miniature inertia measurement combination
CN101290227A (en) * 2008-06-17 2008-10-22 北京航空航天大学 Three axis optical fibre gyroscope inertia measurement unit integral structure
CN101349564A (en) * 2008-06-13 2009-01-21 北京航空航天大学 Inertial measurement apparatus
CN101726295A (en) * 2008-10-24 2010-06-09 中国科学院自动化研究所 Unscented Kalman filter-based method for tracking inertial pose according to acceleration compensation
CN102121829A (en) * 2010-08-09 2011-07-13 汪滔 Miniature inertia measurement system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025104A (en) * 1988-06-23 1990-01-10 Fanuc Ltd Arithmetic processing unit
JPH095104A (en) * 1995-06-23 1997-01-10 Nippon Telegr & Teleph Corp <Ntt> Method and apparatus for measurement of three-dimensional attitude angle of moving body
US7093370B2 (en) * 2002-08-01 2006-08-22 The Charles Stark Draper Laboratory, Inc. Multi-gimbaled borehole navigation system
CN101922938B (en) * 2010-07-14 2012-06-06 北京航空航天大学 High-precision laser gyroscope inertia measurement system for POS

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1224147A (en) * 1998-08-07 1999-07-28 清华大学 Method for three dimension position measurement using miniature inertia measurement combination
CN101349564A (en) * 2008-06-13 2009-01-21 北京航空航天大学 Inertial measurement apparatus
CN101290227A (en) * 2008-06-17 2008-10-22 北京航空航天大学 Three axis optical fibre gyroscope inertia measurement unit integral structure
CN101726295A (en) * 2008-10-24 2010-06-09 中国科学院自动化研究所 Unscented Kalman filter-based method for tracking inertial pose according to acceleration compensation
CN102121829A (en) * 2010-08-09 2011-07-13 汪滔 Miniature inertia measurement system

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