CN106047250A - 一种led显示屏用纳米金刚石改性的复合环氧灌封胶 - Google Patents

一种led显示屏用纳米金刚石改性的复合环氧灌封胶 Download PDF

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CN106047250A
CN106047250A CN201610402063.9A CN201610402063A CN106047250A CN 106047250 A CN106047250 A CN 106047250A CN 201610402063 A CN201610402063 A CN 201610402063A CN 106047250 A CN106047250 A CN 106047250A
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肖宪书
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Bengbu Gaohua Resolution Technology Co Ltd
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Abstract

本发明公开了一种LED显示屏用纳米金刚石改性的复合环氧灌封胶，这种灌封胶在制备过程中将纳米金刚石先经过硅烷偶联剂表面偶联处理，再与聚氨酯预聚体混合反应，得到的复合纳米金刚石填料兼具无机物和有机物的性能，具有良好的分散性和结合性，与环氧树脂复配效果优良，改善了纳米分散分散性差的问题，极大地提高了材料的导热性能和力学性能，加入的氧化钇能与导热填料一起提高环氧树脂胶的热传导能力，从而将LED产生的热量快速的转移出去，以这种复合环氧树脂胶封装的LED芯片使用寿命更长，耐磨耐腐，在LED显示屏封装方面显示出良好的应用前景。

Description

一种LED显示屏用纳米金刚石改性的复合环氧灌封胶
技术领域
本发明涉及LED灌封胶技术领域，尤其涉及一种LED显示屏用纳米金刚石改性的复合环氧灌封胶。
背景技术
LED显示屏是将发光二极管通过组装，构成点阵模块，从而实现大面积的显示功能，在日常生活中得到广泛的应用。目前LED显示屏逐步向更高亮度、更长寿命、更好的发光均匀性和稳定性方面发展，这无疑要求芯片集成化、高功率化，随着芯片技术的日益成熟，芯片的性能能基本满足使用需求，与此相应的封装技术的要求也越来越高。众所周知，封装效果直接影响到LED芯片的使用性能和寿命，市场的发展对封装技术提出了更高要求。
灌封胶常用于电子元件导热、粘接、密封、灌封以及涂覆保护等等，主要起到防潮、防尘、防腐、防震以及提高模块的稳定性等功效。目前应用较多的为环氧树脂类灌封胶，环氧类灌封胶在应用时最大的缺陷就是导热性差、粘度大，降低了器件的使用寿命。为了适用市场需要，很有必要对传统的环氧树脂灌封胶进行改性处理，以期获得令人满意的封装效果。《LED用环氧树脂灌封胶的研究》一文以双酚A环氧树脂作为主体材料，用聚氨酯作为增韧剂，使用低粘度的混合胺类固化剂和环氧活性稀释剂，制备得到了黏度小、透光性好、力学性能佳的产品，然而这类改性环氧类灌封胶导热效果差，不够环保；《ZnO在Al2O3/导热环氧树脂灌封胶中的应用研究》一文利用导热无机填料对环氧树脂进行改性处理，在一定程度上提升了环氧树脂的导热性，然而其力学性能却有下降趋势，粘度变大。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种LED显示屏用纳米金刚石改性的复合环氧灌封胶。
本发明是通过以下技术方案实现的：
一种LED显示屏用纳米金刚石改性的复合环氧灌封胶，其特征在于，该封装胶由以下重量份的原料制得：双酚A环氧树脂30-60、含硅聚氨酯预聚体改性纳米金刚石5-10、氧化钇0.01-0.02、稀释剂CYH-277 5-15、固化剂20-80、抗氧剂0.1-0.5、紫外光稳定剂0.01-0.05、紫外光吸收剂0.01-0.05。
所述的含硅聚氨酯预聚体改性纳米金刚石由以下原料制备得到：聚醚多元醇10-20、二苯基甲烷二异氰酸酯5-10、二乙醇胺适量、纳米金刚石30-40、硅烷偶联剂2-3、二丁基二月桂酸锡0.1-0.2。
制备方法为：
（1）将聚醚多元醇投入反应容器中，在氮气氛围下加热脱除水分，随后加入二苯基甲烷二异氰酸酯，在80-90℃条件下混合反应6-8h。
（2）将纳米金刚石与硅烷偶联剂混合研磨分散1-1.5h，随后将其投入步骤（1）反应容器中，降低体系温度至60-70℃，加入二丁基二月桂酸锡，混合研磨反应2-3h后滴加二乙醇胺，继续研磨反应1-1.5h后降温出料，即得所述的含硅聚氨酯预聚体改性纳米金刚石。
所述的固化剂为甲基六氢苯酐、甲基四氢苯酐中的一种。
该灌封胶的使用方法为：先将双酚A环氧树脂、含硅聚氨酯预聚体改性纳米金刚石、氧化钇、稀释剂、抗氧剂、紫外光稳定剂、紫外光吸收剂混合搅拌均匀，随后再加入固化剂，边加边搅拌，添加完毕后混合物料加热至60-80℃，所得胶液经真空脱泡处理后注入待封装的LED模具中，自然预固化2-3h后取出预封装的LED，置于真空干燥箱中，加热至120-130℃，恒温固化3-4h后即得灌封好的LED。
本发明将纳米金刚石先经过硅烷偶联剂表面偶联处理，再与聚氨酯预聚体混合反应，得到的复合纳米金刚石填料兼具无机物和有机物的性能，具有良好的分散性和结合性，与环氧树脂复配效果优良，改善了纳米分散分散性差的问题，极大地提高了材料的导热性能和力学性能，加入的氧化钇能与导热填料一起提高环氧树脂胶的热传导能力，从而将LED产生的热量快速的转移出去，以这种复合环氧树脂胶封装的LED芯片使用寿命更长，耐磨耐腐，在LED显示屏封装方面显示出良好的应用前景。
具体实施方式
该实施例的灌封胶由以下重量份的原料制得：双酚A环氧树脂50、含硅聚氨酯预聚体改性纳米金刚石8、氧化钇0.01、稀释剂CYH-277 12、甲基六氢苯酐60、抗氧剂0.2、紫外光稳定剂0.02、紫外光吸收剂0.03。
其中含硅聚氨酯预聚体改性纳米金刚石由以下原料制备得到：聚醚多元醇15、二苯基甲烷二异氰酸酯8、二乙醇胺适量、纳米金刚石35、硅烷偶联剂2、二丁基二月桂酸锡0.1。
制备方法为：
（1）将聚醚多元醇投入反应容器中，在氮气氛围下加热脱除水分，随后加入二苯基甲烷二异氰酸酯，在80-90℃条件下混合反应7.5h。
（2）将纳米金刚石与硅烷偶联剂混合研磨分散1.2h，随后将其投入步骤（1）反应容器中，降低体系温度至60-70℃，加入二丁基二月桂酸锡，混合研磨反应2.5h后滴加二乙醇胺，继续研磨反应1.5h后降温出料，即得所述的含硅聚氨酯预聚体改性纳米金刚石。
该灌封胶的使用方法为：先将双酚A环氧树脂、含硅聚氨酯预聚体改性纳米金刚石、氧化钇、稀释剂、抗氧剂、紫外光稳定剂、紫外光吸收剂混合搅拌均匀，随后再加入固化剂，边加边搅拌，添加完毕后混合物料加热至60-80℃，所得胶液经真空脱泡处理后注入待封装的LED模具中，自然预固化2.5h后取出预封装的LED，置于真空干燥箱中，加热至125℃，恒温固化3.5h后即得灌封好的LED。
该灌封胶的性能测试结果如下：
检测项目 检测结果
热导率（W.m-1.k-1） 0.85
断裂伸长率(%) 40.8
拉伸强度(MPa) 18.5
热膨胀系数 0.42
吸水率 0.08

Claims (4)

1.一种LED显示屏用纳米金刚石改性的复合环氧灌封胶，其特征在于，该封装胶由以下重量份的原料制得：双酚A环氧树脂30-60、含硅聚氨酯预聚体改性纳米金刚石5-10、氧化钇0.01-0.02、稀释剂CYH-277 5-15、固化剂20-80、抗氧剂0.1-0.5、紫外光稳定剂0.01-0.05、紫外光吸收剂0.01-0.05。
2.如权利要求1所述的一种LED显示屏用纳米金刚石改性的复合环氧灌封胶，其特征在于，所述的含硅聚氨酯预聚体改性纳米金刚石由以下原料制备得到：聚醚多元醇10-20、二苯基甲烷二异氰酸酯5-10、二乙醇胺适量、纳米金刚石30-40、硅烷偶联剂2-3、二丁基二月桂酸锡0.1-0.2；
制备方法为：
（1）将聚醚多元醇投入反应容器中，在氮气氛围下加热脱除水分，随后加入二苯基甲烷二异氰酸酯，在80-90℃条件下混合反应6-8h；
（2）将纳米金刚石与硅烷偶联剂混合研磨分散1-1.5h，随后将其投入步骤（1）反应容器中，降低体系温度至60-70℃，加入二丁基二月桂酸锡，混合研磨反应2-3h后滴加二乙醇胺，继续研磨反应1-1.5h后降温出料，即得所述的含硅聚氨酯预聚体改性纳米金刚石。
3.如权利要求1所述的一种LED显示屏用纳米金刚石改性的复合环氧灌封胶，其特征在于，所述的固化剂为甲基六氢苯酐、甲基四氢苯酐中的一种。
4.如权利要求1所述的一种LED显示屏用纳米金刚石改性的复合环氧灌封胶的使用方法为：先将双酚A环氧树脂、含硅聚氨酯预聚体改性纳米金刚石、氧化钇、稀释剂、抗氧剂、紫外光稳定剂、紫外光吸收剂混合搅拌均匀，随后再加入固化剂，边加边搅拌，添加完毕后混合物料加热至60-80℃，所得胶液经真空脱泡处理后注入待封装的LED模具中，自然预固化2-3h后取出预封装的LED，置于真空干燥箱中，加热至120-130℃，恒温固化3-4h后即得灌封好的LED。
CN201610402063.9A 2016-06-08 2016-06-08 一种led显示屏用纳米金刚石改性的复合环氧灌封胶 Pending CN106047250A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109096959A (zh) * 2018-07-26 2018-12-28 合肥嘉仕诚能源科技有限公司 一种光伏组件专用封装材料及其制备方法
CN111675897A (zh) * 2020-07-22 2020-09-18 福建美庆热传科技有限公司 一种相变高导热材料及其制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101250390A (zh) * 2008-03-27 2008-08-27 上海纳晶科技有限公司 一种纳米导热透明灌封胶复合材料及其制备方法
CN101580686A (zh) * 2009-05-07 2009-11-18 中国工程物理研究院化工材料研究所 一种低密度高抗冲击性环氧树脂灌封胶及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101250390A (zh) * 2008-03-27 2008-08-27 上海纳晶科技有限公司 一种纳米导热透明灌封胶复合材料及其制备方法
CN101580686A (zh) * 2009-05-07 2009-11-18 中国工程物理研究院化工材料研究所 一种低密度高抗冲击性环氧树脂灌封胶及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109096959A (zh) * 2018-07-26 2018-12-28 合肥嘉仕诚能源科技有限公司 一种光伏组件专用封装材料及其制备方法
CN111675897A (zh) * 2020-07-22 2020-09-18 福建美庆热传科技有限公司 一种相变高导热材料及其制备方法

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Application publication date: 20161026