CN106029942B - 通过脉冲激光沉积来沉积材料的设备以及利用该设备沉积材料的方法 - Google Patents

通过脉冲激光沉积来沉积材料的设备以及利用该设备沉积材料的方法 Download PDF

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Publication number
CN106029942B
CN106029942B CN201580009380.8A CN201580009380A CN106029942B CN 106029942 B CN106029942 B CN 106029942B CN 201580009380 A CN201580009380 A CN 201580009380A CN 106029942 B CN106029942 B CN 106029942B
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substrate
target
laser
incoming position
equipment
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Chinese (zh)
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CN106029942A (zh
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J·M·德克斯
J·A·扬森斯
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Lam Research Corp
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SOLMATES BV
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201580009380.8A 2014-02-21 2015-02-18 通过脉冲激光沉积来沉积材料的设备以及利用该设备沉积材料的方法 Active CN106029942B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14156256.1A EP2910664B1 (en) 2014-02-21 2014-02-21 Device for depositing a material by pulsed laser deposition and a method for depositing a material with the device
EP14156256.1 2014-02-21
PCT/EP2015/053356 WO2015124589A1 (en) 2014-02-21 2015-02-18 Device for depositing a material by pulsed laser deposition and a method for depositing a material with the device

Publications (2)

Publication Number Publication Date
CN106029942A CN106029942A (zh) 2016-10-12
CN106029942B true CN106029942B (zh) 2019-05-28

Family

ID=50159093

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580009380.8A Active CN106029942B (zh) 2014-02-21 2015-02-18 通过脉冲激光沉积来沉积材料的设备以及利用该设备沉积材料的方法

Country Status (6)

Country Link
EP (1) EP2910664B1 (https=)
JP (1) JP6674898B2 (https=)
KR (1) KR102321884B1 (https=)
CN (1) CN106029942B (https=)
TW (1) TWI696717B (https=)
WO (1) WO2015124589A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105803404A (zh) * 2016-03-25 2016-07-27 武汉华星光电技术有限公司 薄膜沉积组件及薄膜沉积装置
EP3540090A1 (en) * 2018-03-12 2019-09-18 Solmates B.V. Method for pulsed laser deposition
WO2019185187A1 (en) * 2018-03-28 2019-10-03 Applied Materials, Inc. Method for vacuum processing of a substrate, and apparatus for vacuum processing of a substrate
EP3916122A1 (en) 2020-05-28 2021-12-01 Solmates B.V. Method for controlling stress in a substrate during laser deposition
CN117626192A (zh) * 2022-08-10 2024-03-01 中国科学院上海硅酸盐研究所 一种薄膜沉积装置和薄膜沉积方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084300A (en) * 1989-05-02 1992-01-28 Forschungszentrum Julich Gmbh Apparatus for the ablation of material from a target and coating method and apparatus
CN1158911A (zh) * 1995-10-09 1997-09-10 社团法人高等技术研究院研究组合 大面积金钢石薄膜的制造装置及制造方法
CN1461355A (zh) * 2000-09-20 2003-12-10 Agt第一股份有限公司 通过激光烧蚀沉积薄膜
CN101128616A (zh) * 2005-02-23 2008-02-20 比克顿有限公司 脉冲激光沉积方法
EP2159300A1 (en) * 2008-08-25 2010-03-03 Solmates B.V. Method for depositing a material

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100222580B1 (ko) * 1995-12-28 1999-10-01 김덕중 대면적 다이아몬드 박막의 고속증착 제조장치 및 그 제조방법
US6090207A (en) * 1998-04-02 2000-07-18 Neocera, Inc. Translational target assembly for thin film deposition system
US7879410B2 (en) * 2004-06-09 2011-02-01 Imra America, Inc. Method of fabricating an electrochemical device using ultrafast pulsed laser deposition
CN104167464A (zh) * 2006-02-23 2014-11-26 皮克迪昂有限公司 太阳能电池以及用于生产太阳能电池的设备和方法
KR101219225B1 (ko) * 2010-07-15 2013-01-18 국립대학법인 울산과학기술대학교 산학협력단 펄스 레이저 증착장치
TWI433948B (zh) * 2012-01-31 2014-04-11 Univ Nat Chi Nan A radio frequency plasma assisted pulsed laser deposition system and a method for preparing a thin film from its system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084300A (en) * 1989-05-02 1992-01-28 Forschungszentrum Julich Gmbh Apparatus for the ablation of material from a target and coating method and apparatus
CN1158911A (zh) * 1995-10-09 1997-09-10 社团法人高等技术研究院研究组合 大面积金钢石薄膜的制造装置及制造方法
CN1461355A (zh) * 2000-09-20 2003-12-10 Agt第一股份有限公司 通过激光烧蚀沉积薄膜
CN101128616A (zh) * 2005-02-23 2008-02-20 比克顿有限公司 脉冲激光沉积方法
EP2159300A1 (en) * 2008-08-25 2010-03-03 Solmates B.V. Method for depositing a material

Also Published As

Publication number Publication date
JP2017512252A (ja) 2017-05-18
WO2015124589A1 (en) 2015-08-27
EP2910664A1 (en) 2015-08-26
KR20160124103A (ko) 2016-10-26
TW201533254A (zh) 2015-09-01
JP6674898B2 (ja) 2020-04-01
KR102321884B1 (ko) 2021-11-04
TWI696717B (zh) 2020-06-21
CN106029942A (zh) 2016-10-12
EP2910664B1 (en) 2019-04-03

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Effective date of registration: 20221228

Address after: California, USA

Patentee after: LAM RESEARCH Corp.

Address before: Enschede

Patentee before: SOLMATES B.V.