CN106029317A - Brittle substrate cleavage method and brittle substrate cleavage device - Google Patents
Brittle substrate cleavage method and brittle substrate cleavage device Download PDFInfo
- Publication number
- CN106029317A CN106029317A CN201580009533.9A CN201580009533A CN106029317A CN 106029317 A CN106029317 A CN 106029317A CN 201580009533 A CN201580009533 A CN 201580009533A CN 106029317 A CN106029317 A CN 106029317A
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- China
- Prior art keywords
- brittle substrate
- full
- cracks
- cut
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
Abstract
The present invention is a brittle substrate (W) cleavage device (20) for cleaving a brittle substrate (W) along an intended cleavage line (L). The cleavage device is equipped with: a processing pedestal (3) on which the brittle substrate (W) is placed; a leading end fissure-forming unit (21) for forming a leading end fissure (41) as an initial fissure on the intended cleavage line (L) of the brittle substrate (W) at the leading end in the direction of movement when moving the brittle substrate (W); an end fissure-forming unit (22) for forming an end fissure (42) as an initial fissure on the intended cleavage line (L) of the brittle substrate (W) at the back end in the direction of movement when moving the brittle substrate (W); a laser irradiation unit (23) for irradiating laser light (C) on the brittle substrate (W); a refrigerant-spraying unit (24) for spraying a refrigerant (R) on the brittle substrate (W); and a movement means (25) for moving the brittle substrate (W) in a previously set direction with respect to the laser irradiation unit (23) and the refrigerant-spraying unit (24).
Description
Technical field
The present invention relates to the cutting-off method of a kind of brittle substrate and the shearing device of brittle substrate.
The Japanese Patent Application 2014-120915 that this case was filed an application in Japan according on June 11st, 2014
And CLAIM OF PRIORITY, and it is hereby incorporated its content.
Background technology
In the past, as the shearing device of the brittle substrate cutting off glass plate etc., it has been suggested that one possesses
Laser irradiating part and the device in refrigerant injection portion, this laser irradiating part is that laser is irradiated in fragile material
Substrate also carries out locality heating, this refrigerant injection portion then in order to by refrigerant injection to via laser
The brittle substrate heated.It is however generally that, this kind of shearing device is only along fragile material base
Cut-out on plate both alignments and form line of cut (scribe line), by along this line of cut for fragility
Material substrate turns off and processes as rear step, and is finally carrying out the full cutting of brittle substrate
(full cut)。
For this kind of shearing device, it has been suggested that one not only forms line of cut, also carries out fragile material base
The cutting-off method of the full cutting of plate, this cutting-off method applies court along cut-out both alignments of brittle substrate
The distortional stress of thickness direction effect, and along cut off both alignment operation local heat source and carry out fragile material
The full cutting (with reference to patent documentation 1) of substrate.
[prior art literature]
[patent documentation]
[patent documentation 1] Japanese Unexamined Patent Publication 2009-107301 publication
Summary of the invention
[problem that invention to be solved]
But, in the technology of patent documentation 1, have to be likely difficult to constitute and answer in order to concrete applying deformation
The device of power, it is furthermore also possible to be difficult to decision can along cut off both alignment and the most entirely cut
The condition of applying of distortional stress.Accordingly, it is desirable to provide a kind of device constitutes more simple, Er Qieke
The technology that brittle substrate is cut the most entirely.
The present invention grinds wound person in view of described situation, and its purpose is providing cutting of a kind of brittle substrate
Disconnected method and the shearing device of brittle substrate, it can be by more easy method to fragile material base
Plate cuts the most entirely.
[solving the means of problem]
The present inventor carries out, in order to reach described purpose, the result studied intensively, it is thus achieved that following opinion:
For the very thin brittle substrate that such as thickness is below 300 μm, by suitably selecting heating, cold
But condition, and be allowed to suitably produce because of laser and the heat caused by Temperature Distribution of the moving direction of cooling
Stress, can cut entirely until cutting off in the way of both alignments.But, even if the most understanding with this
Mode properly selects heating, cooling, the most inherently produces at cutting terminal part and cuts off remnants.Therefore,
The present inventor continues to the result of research the cutting off remaining of cutting terminal part, the most extremely to eliminate
Complete the present invention.
The cutting-off method that first aspect is a kind of brittle substrate of the present invention, cuts along cutting off both alignments
Disconnected brittle substrate, the cutting-off method of this brittle substrate possesses: in the cut-out of brittle substrate
Both the leading section shape of moving direction when making brittle substrate move relative to laser illumination source on alignment
Top is become to chap, and the step of the rearward end formation terminal be full of cracks at moving direction；One side makes fragility material
Material substrate moves relative to laser illumination source, and laser is irradiated in from laser illumination source and cuts off both alignments by one side
Above carry out the step of heat treated；And from refrigerant injection source by refrigerant injection to via laser to crisp
Property material substrate carried out the position of heat treated, cut with described cut-out both alignment to carry out cooling process
The step of disconnected brittle substrate.
Second aspect such as first aspect of the present invention, wherein, described brittle substrate has at circumference
Non-product property region, and in the inner side in non-product property region, there is product property region；Begin being formed
In the step of end be full of cracks and terminal be full of cracks, the be full of cracks of such top and terminal be full of cracks are both formed in non-goods product
Matter region.
3rd aspect such as first aspect of the present invention, wherein, is so that the cut-out of brittle substrate is set
The thermograde in line direction is more than the mode of the thermograde of the thickness direction of brittle substrate, to fragility
Material substrate carries out heat treated and cooling processes.
The shearing device that 4th aspect is a kind of brittle substrate of the present invention, it is along cutting off both alignments
Cutting off brittle substrate, the shearing device of this brittle substrate possesses: machine table, configures fragility material
Material substrate；Crack formation portion, top, it makes fragile material on cut-out both alignments of brittle substrate
Formation top, the leading section be full of cracks of moving direction when substrate moves；Terminal crack formation portion, it is in fragility
The rearward end of moving direction when making brittle substrate move on the cut-out of material substrate both alignments is formed
Terminal chaps；Laser irradiating part, is irradiated in laser on brittle substrate；Refrigerant injection portion, will
Refrigerant injection is on brittle substrate；And mobile means, make brittle substrate shine relative to laser
Penetrate portion and refrigerant injection portion to move towards direction set in advance.
5th aspect the such as the 4th aspect of the present invention, wherein, mobile means is so that laser irradiating part and cooling
The mode that agent ejection section moves relative to described brittle substrate is constituted；Crack formation portion, top and terminal
Crack formation portion is configured to be displaced on the mobile route identical with laser irradiating part.
[effect of invention]
According to the cutting-off method of the brittle substrate of the present invention, due to the cut-out at brittle substrate both
Formation top, the leading section be full of cracks of moving direction when making brittle substrate move on alignment is as initial
Be full of cracks, and in the rearward end formation terminal initial be full of cracks of be full of cracks conduct of moving direction, the most especially cutting
Cut terminal part can also terminal be full of cracks entirely cut for starting point.Therefore, by simply adding terminal be full of cracks
The simple and easy method of formation, can eliminate that the cut-out at cutting terminal part is remaining and to carry out cutting off both alignments complete
The full cutting in region.
According to the shearing device of the brittle substrate of the present invention, owing to possessing cutting at brittle substrate
The rearward end of moving direction when making brittle substrate move on disconnected both alignments forms terminal be full of cracks conduct
The terminal crack formation portion of initial be full of cracks, the most especially can also terminal chap as starting point at cutting terminal part
And entirely cut.Therefore, by simply possessing the easy method in terminal crack formation portion, can disappear
Carry out cutting off the region-wide full cutting of both alignments except the cut-out remnants at cutting terminal part.
Accompanying drawing explanation
Fig. 1 is the Handling device that display possesses the shearing device of the brittle substrate having present embodiment
The schematic configuration top view of one example.
Fig. 2 is the side view of the schematic configuration of display shearing device.
Fig. 3 is the top view of the major part of display brittle substrate.
Fig. 4 A is the explanatory diagram of the mechanism cut off as beginning that initially chaps with brittle substrate.
Fig. 4 B is the explanatory diagram of the mechanism cut off as beginning that initially chaps with brittle substrate.
Fig. 5 A is for the beginning, very thin brittle substrate to be cut (cut-out) entirely with initial be full of cracks
The explanatory diagram of mechanism.
Fig. 5 B is for the beginning, very thin brittle substrate to be cut (cut-out) entirely with initial be full of cracks
The explanatory diagram of mechanism.
Fig. 5 C is for the beginning, very thin brittle substrate to be cut (cut-out) entirely with initial be full of cracks
The explanatory diagram of mechanism.
Wherein, description of reference numerals is as follows:
1 Handling device
3 transport path (machine table)
The shearing device of 20 brittle substrates
20a movable platen
21 crack formation portion, tops
22 terminal crack formation portions
23 laser irradiating parts (laser illumination source)
24 refrigerant injection portions (refrigerant injection source)
25 travel mechanisms (mobile means)
29 heating regions
31 cooled regions
41 top be full of cracks
42 terminal be full of cracks
L cuts off both alignments
W brittle substrate.
Detailed description of the invention
Describe the shearing device of the brittle substrate of the present invention referring to the drawings in detail.It addition,
In following accompanying drawing, in order to make each component be cognizable size, it is the ratio suitably changing each component
Chi.
Fig. 1 is the example that display possesses the Handling device of the shearing device of the brittle substrate having the present invention
The top view of schematic configuration, in Fig. 1, symbol 1 is Handling device, and 20 is the cut-out of brittle substrate
Device (hereinafter referred to as shearing device).
Handling device 1 is to carry the fragility being such as made up of by the very thin glass below 300 μm thickness
The device of material substrate W.It addition, normally due to the central part of brittle substrate W becomes goods product
Matter region, the most generally to avoid directly holding this kind of product property region.Therefore, at this kind of fragility material
In material substrate W, it is however generally that, become the circumference being referred to as " ear " in the outside in product property region,
The namely non-product property region of the both side ends of the width of width about 5mm to 10mm,
Just become the region directly held.
Handling device 1 will not the most directly hold the product property region of brittle substrate W, and
It is that the both side ends only directly holding and becoming non-product property region is carried, and is filled by cut-out
Put 20 brittle substrate W is cut (cut-out) entirely to become the device of desired size.It is,
Roll out roller (roll) 2 as it is shown in figure 1, Handling device 1 possesses and sent from rolling out roller 2 in order to carry
The transport path 3 of brittle substrate W, and possess again a pair fix holding members 4, a pair first
Movable holding members 5, shearing device 20 and a pair second movable holding members 7.
Roll out roller 2 to possess: the roll shaft 2a of winding brittle substrate W；And be linked to this roll shaft 2a and
The driving source 8 of the motor etc. of rotation in order to make.The rotation speed controlling roll shaft 2a it is provided with in driving source 8
The control portion (not shown) of degree, and control portion is formed as carrying out off and on rolling out fragile material from rolling out roller 2
Substrate W.It addition, for brittle substrate W, for use as previously mentioned thickness be 300 μm with
Under very thin glass.
In the downstream rolling out roller 2, it is configured with height adjustment cylinder (roller) 9.Height adjustment cylinder 9 is
Carrying is from the carrying cylinder rolling out the brittle substrate W that roller 2 rolls out.The upper end of height adjustment cylinder 9
Be configured to compared with transport path 3 is above slightly higher.Consisting of this kind, height adjustment cylinder 9 will be from rolling out
The brittle substrate W that roller 2 is rolled out is carried on (the carrying face) above of transport path 3.
What transport path 3 was configured at height adjustment cylinder 9 sends side, such as along brittle substrate W
Carrying direction and the handling unit 10 of multiple elongated plate-like that is arranged.Handling unit 10 is in this example
In be especially desirable the product property region of central part of the most directly fixing brittle substrate W, and with right
It is preferred for being carried by cordless in product property region, is therefore to have employed by ejection air
Floating type.
On the handling unit 10 of floating type, it is provided with multiple air squit hole (not shown), and at sky
Gas blowout portals to connect through pipe arrangement air supply source, therefrom from the sky of air squit hole ejection given amount
Gas.Additionally, spray air in this way and form air layer in handling unit 10, brittle substrate
I.e. by this air layer, the above more top of court's relatively handling unit 10 (transport path 3) floats W.It addition,
About the shape of air squit hole not particularly restricted, in addition to general circular port, it is possible to for thin gap-like
Elongated hole.
Additionally, be heated or cooled by laser irradiating part 23 described later or refrigerant injection portion 24
Machining area or this machining area near zone in, can be formed the most several respectively with air squit hole
Suction socket (not shown).In such suction socket, first connect through pipe arrangement (not shown) and have as negative pressure source
Vacuum pump (not shown), and aspirated by this vacuum pump, brittle substrate W is pulled to suction socket
Side.But, the suction force that suction socket is formed, it is set as making fragile material base than by air squit hole
The strength that plate W floats is the most weak.Thus, by spraying from the air of air squit hole and passing through suction socket
Suction mutually obtain balance, the gap quilt between brittle substrate W's and transport path 3 is above
Remain certain intervals set in advance, therefore, be with high accuracy held in transport path 3.
As it is shown in figure 1, in the both sides of transport path 3, the carrying direction along transport path 3 is joined respectively
It is equipped with the first folder rail (clamp rail) 11 and the second folder rail 12.Upstream side at the first folder rail 11 (rolls out roller
2 sides) it is provided with fixing holding members 4, and it is provided with first movably admittedly relatively fixing holding members 4 further downstream
Hold component 5.
Fixing holding members 4 is mounted to be fixed on the state of the first folder rail 11 through installation component (not shown).
It is, fixing holding members 4 be fixed to will not be along the length direction (transport road of the first folder rail 11
The carrying direction in footpath 3) mobile.This fixing holding members 4 fills for the general clamping with lower plate and upper plate
Put (clamp), and such upper plate is formed as with lower plate to pass through cylinder (air cylinder) close to separating, thus
And removably hold brittle substrate W.It addition, under the position of fixing brittle substrate W is
Plate, the leading section of upper plate, fixing holding members 4 directly holds whereby and only becomes non-product property region
Both side ends, without directly hold brittle substrate W product property region.
First movable holding members 5 also for having the general clamping device of lower plate and upper plate, and such under
Plate is identically formed with fixing holding members 4 as can therefrom may be used close to separating by cylinder with upper plate
Releasably fixing brittle substrate W.It addition, the first movable holding members 5 also with fixing holding members
4 similarly, and only directly fixing becomes the both side ends in non-product property region, crisp without directly fixing
The product property region of property material substrate W.
Additionally, a pair first movable holding members 5 are all installed into and can reciprocate at the first folder rail 11.
It is, a pair first movable holding members 5 can be along the length direction (transport path of the first folder rail 11
The carrying direction of 3) reciprocate.Here, the first folder rail 11 is for such as possessing ball screw mechanism or line
Property motor (linear motor) mechanism, and the most with high accuracy control the first movable holding members 5
Translational speed or displacement.
It is provided with a pair second movable holding members 7 in the second folder rail 12.Second movable holding members 7 is also
For the clamping device to be constituted with first movable holding members 5 the same manner, and pacify in a movable manner
It is loaded on the second folder rail 12.It is, a pair second movable holding members 7 can be along the second folder rail 12
Length direction (the carrying direction of transport path 3) reciprocates.It addition, the second movable holding members 7 is also
Only directly fixing becomes non-product property in the same manner as fixing holding members 4 or the first movable holding members 5
The both side ends in region, without directly holding the product property region of brittle substrate W.Additionally,
Second folder rail 12 also possess in the same manner as the first folder rail 11 have ball screw mechanism or a linear motor mechanism and
Constitute, and the most with high accuracy control translational speed or the displacement of the second movable holding members 7.
Additionally, in Handling device 1, be provided with fixing framework 13 in roller 2 side that rolls out of transport path 3,
Shearing device 20 it is provided with the most in a movable manner at this fixing framework 13.Shearing device 20 such as front institute
State an embodiment of the shearing device of the brittle substrate for the present invention, and movable shown in Fig. 1
Possess below plate 20a and have main member of formation.It addition, movable platen 20a sets in a movable manner
In fixing framework 13, therefrom can be towards the direction orthogonal with the carrying direction of transport path 3, namely court
The width of brittle substrate W moves.
This shearing device 20 as shown in Fig. 2 shows the side view of schematic configuration, using transport path 3 as
The machine table of the present invention, namely configures the machine table of brittle substrate W, and possesses and have top to chap
Forming portion 21, terminal crack formation portion 22, laser irradiating part 23, refrigerant injection portion 24 and make to swash
Illumination part 23 and refrigerant injection portion 24 are carried out relative to the brittle substrate W in transport path 3
The travel mechanism 25 (mobile means) of movement.
Travel mechanism 25 possesses as shown in Figure 1 and has: movable platen 20a；Holding this in a movable manner can
Pair of guide rails (guide rail) 13a of the fixing framework 13 of dynamic plate 20a；And in order to make movable platen 20a one
Driving source 20b to the motor etc. advanced on guide rail 13a.For guide rail 13a, for such as using rolling
Lunella coronata bar.Constituting according to this kind, movable platen 20a is i.e. rotated by the source 20b of driving by guide rail 13a, by
This and can move towards both forward and reverse directions.It addition, for travel mechanism 25, be not limited to use this kind of rolling
The mechanism of Lunella coronata bar, it is possible to use the mechanism such as employing linear motor.
Crack formation portion, top 21 is in the present embodiment for configuring in fig. 2 with shown in arrow P
The rear of moving direction of movable platen 20a, the rear of moving direction during namely cut-out action.Cause
This, crack formation portion, top 21 is disposed on the leading section of the moving direction of brittle substrate W.This
Outward, terminal crack formation portion 22 is disposed on the front of moving direction of movable platen 20a.Therefore, terminal
Crack formation portion 22 is disposed on the rearward end of the moving direction of brittle substrate W.
As shown the top view of the major part of the brittle substrate W in transport path 3 (machine table)
Shown in Fig. 3, crack formation portion, top 21 is making on cut-out both alignment L of brittle substrate W
The leading section of moving direction when brittle substrate W moves, is with arrow in the present embodiment in Fig. 2
The front end of the head moving direction relative to movable platen 20a shown in symbol P, forms top and chaps 41 conducts
Initial be full of cracks.
Crack formation portion, top 21 possesses in the present embodiment: diamond cutter (diamond
cutter)21a；And travel mechanism 21b, by can make this diamond cutter 21a lifting and in the horizontal direction
The cylinders of movement etc. are constituted.
Constituting according to this kind, crack formation portion, top 21 is passed through travel mechanism by diamond cutter 21a
21b moves with definitive orbit, the most as shown in Figure 3 at the fragile material stopped in transport path 3
Leading section on the cut-out of substrate W both alignment L, forms top be full of cracks 41.About top be full of cracks 41
The degree of depth, and be not particularly limited, it is set to about several μm extremely tens of μm.Additionally, about top be full of cracks 41
Length, described later of the section ratio of the be full of cracks owing to being formed by this kind of diamond cutter 21a
According to laser irradiate section the most coarse, be therefore set to about 2 to 3mm or its below.Therefore, this
Plant top be full of cracks 41 will not be formed to Fig. 3 with the goods of the brittle substrate W shown in 2 refining lines
Quality region and the inner side of the virtual boundary line K in non-product property region, namely will not be formed to goods
Quality region, and the non-goods product being referred to as " ear " in the outside becoming product property region can be formed at
Matter region.
Terminal crack formation portion 22 is as shown in Figure 3 on cut-out both alignment L of brittle substrate W
The rearward end of moving direction when making brittle substrate W move, in the present embodiment as in Fig. 2 with
The rearward end of the moving direction relative to movable platen 20a shown in arrow P, forms terminal be full of cracks 42
As initial be full of cracks.This terminal crack formation portion 22 also possesses in the same manner as crack formation portion, top 21 and has
Diamond cutter 22a and this diamond cutter 22a lifting can be made and move in the horizontal direction
Cylinders etc. are constituted.
Constituting according to this kind, terminal crack formation portion 22 is passed through travel mechanism by diamond cutter 22a
22b moves with definitive orbit, the most as shown in Figure 3 at the fragile material stopped in transport path 3
Rearward end on the cut-out of substrate W both alignment L, forms terminal be full of cracks 42.About terminal be full of cracks 42
The degree of depth, is set to about several μm extremely tens of μm in the same manner as top be full of cracks 41.
Additionally, about the length of terminal be full of cracks 42, be set to 2 to 3mm in the same manner as top be full of cracks 41
Left and right or its below.But, about this terminal be full of cracks 42, will not be formed to fragile material as shown in Figure 3
End edge on the cut-out of substrate W both alignment L, and also may be formed at relatively end edge slightly forward.But,
It is preferred that terminal be full of cracks 42 is also identically formed in non-product property region with top be full of cracks 41, therefore,
Chap the ora terminalis of 41 sides at the top of terminal be full of cracks 42, is set as the position from virtual boundary line K, more leans on
The such as lateral margin of brittle substrate W plays the more lateral, position of 5mm.As long as being formed in this way, logical
Cross the most coarse section that diamond cutter 22a is formed, product property district will not be formed at
Territory and be only formed at non-product property region, thus without undermining be made up of product property region final
The quality of goods.
As in figure 2 it is shown, below movable platen 20a, be equipped with laser irradiating part 23 (laser illumination source).
Laser irradiating part 23 is the width side with the movement along with movable platen 20a towards brittle substrate W
Mode to the top of the brittle substrate W crossed in transport path 3 configures, and possesses and have laser to shake
Swing device (not shown) and in order to guide the optical system equipment of the laser c vibrated from laser oscillator (not
Diagram).
For laser oscillator, the carbon dioxide of the output such as with 100W to hundreds of W is used to swash
Optical generator is preferred.It is also possible, however, to use other output areas or the laser generation of other oscillating mechanisms
Device.Optical system equipment is made up of reflecting mirror (mirror) or lens (lens) etc., in order to will be from laser generation
The laser c that device is vibrated guides to region set in advance (heating region) and is allowed to optically focused.
It is, laser irradiating part 23 is for the brittle substrate W being immobilizated in transport path 3,
From oblique upper, laser c is irradiated in the both alignment L of the cut-out shown in Fig. 3, and by brittle substrate W
It is locally heated by.Here, as shown in Figure 2 by between laser irradiating part 23 and brittle substrate W
The space supplying laser c to pass through is set to laser and passes through region 28, and as shown in Figure 3 by brittle substrate W
On accept laser c irradiate region be set to heating region 29.Heating region 29 is in the present embodiment
For being set in along cutting off the generally rectangular region that both alignment L-shaped become more elongated.It is,
In laser irradiating part 23, it is to form elongated generally rectangular heating region 29 in mode described in mat
Mode constitutes laser oscillator or optical system equipment.
Additionally, as in figure 2 it is shown, below movable platen 20a, be relatively laser irradiating part 23 is more past can
The moving direction rear of dynamic plate 20a, the mode separating both set a distances relative to laser irradiating part 23 is configured with
Refrigerant injection portion 24.This refrigerant injection portion 24 (refrigerant injection source) possesses and has: relative to transport road
Footpath 3 is towards the injection nozzle 24a of configuration below vertical direction；Liquid-feeding pump 24b；And store the groove of coolant
24c.Under this kind is constituted, refrigerant injection portion 24 from injection nozzle 24a towards brittle substrate W
Injection has the coolant R of mobility.
Here, the coolant R that supplies between refrigerant injection portion 24 and brittle substrate W is passed through
Space is set as that coolant passes through region 30, and as shown in Figure 3 by the acceptance on brittle substrate W
The region of coolant R injection is set to cooled region 31.Cooled region 31 is to set in the present embodiment
In the region being formed at the small circular cut off on both alignment L, and formed in the way of separated by a distance and be arranged in
Relatively heating region 29 is more toward the moving direction rear of movable platen 20a.From injection nozzle 24a sprayed cold
But agent R, is to be formed at heating region 29 urgency of brittle substrate W by laser irradiating part 23
Hurriedly cool down, and in water, be mixed into the gas of air etc. and formed.
If being intended to by possessing the Handling device 1 one side carrying fragility having the shearing device 20 with this kind of composition
Material substrate W one side is cut off, and first, will send (rolling out) fragile material from the roller 2 that rolls out shown in Fig. 1
Substrate W, and the leading section of brittle substrate W is held with the first movable holding members 5.Additionally,
If making the first movable holding members 5 move, and brittle substrate W being carried to commitment positions, just stopping
Stop the movement of the first movable holding members 5 and stop the traveling of brittle substrate W.
If stopping the traveling of brittle substrate W in this way, just held by fixing holding members 4
The both side ends rolling out roller 2 side of brittle substrate W.Additionally, except by fixing holding members 4
Beyond fixing brittle substrate W, separately hold fragile material base also by the second movable holding members 7
The leading section of plate W.It is, hold the first movable holding members by the second movable holding members 7
5 more front, the positions held.
It follows that in order to brittle substrate W being cut off towards width by shearing device 20, first
First, the crack formation portion, top 21 cut-out both alignment L at brittle substrate W are passed through as shown in Figure 3
On the leading section of moving direction (direction contrary with arrow P), form top be full of cracks 41.Additionally,
Meanwhile or front and back, set in the cut-out of brittle substrate W by terminal crack formation portion 22
The rearward end of the moving direction on line L, forms terminal be full of cracks 42.If forming top be full of cracks in this way
41, terminal be full of cracks 42, just before the movement of movable platen 20a described later, not disturb this movable platen 20a
Mode, make crack formation portion, top 21, terminal by each travel mechanism 21b, travel mechanism 22b
Crack formation portion 22 backs out from transport path 3.
It follows that one side makes laser irradiating part 23, refrigerant injection portion 24 action, one side pass through respectively
Travel mechanism 25 shown in Fig. 2 makes movable platen 20a move (advance) towards arrow P direction, and makes to swash
Light arrives the leading section of the brittle substrate W being formed with top be full of cracks 41 by the lower section in region 28.
Then, heating region 29 (with reference to Fig. 3) is i.e. formed on brittle substrate W, and brittle substrate
The leading section of W accepts the irradiation of laser c and is heat treatment.Now, due to brittle substrate W
Leading section do not arrive coolant by region 30, therefore do not accept cooling and process, thus only carry out
The initial manufacture of heat treated.
It follows that process the mid-term as the initial manufacture that continues, make laser irradiating part 23, cooling respectively
Under the state of agent ejection section 24 action, movable platen 20a is made to move (advance) further by travel mechanism 25,
And the lower section passing a coolant through region 30 arrives the leading section being formed with top be full of cracks 41, and make to swash
Light arrives side after a while, relatively leading section by the lower section in region 28.Though it addition, showing as convenience initially adding
Work, processing in mid-term, but during moving to processing in mid-term from such initial manufacture, do not make movable platen 20a stop
Only, it is allowed to move with certain speed by travel mechanism 25.Therefore, by the irradiation of laser c
The heating region 29 heated or the cooled region 31 cooled down by coolant R, be at fragile material base
(change) is continuously moved with certain speed on plate W.It is, such heating region 29 or cooling zone
Territory 31, towards the direction identical with the moving direction of movable platen 20a, continuously moves (change) with certain speed.
When in this way coolant R is sprayed cool down in the leading section of brittle substrate W time,
Previous heated position is i.e. cooled down rapidly.Then, on brittle substrate W because heating,
Cooling effect and produce tensile stress, and top be full of cracks 41 indentations bottom produce stress concentrate, therefore,
When set stress effect, cutting line i.e. chaps 41 as starting point along cutting off both alignment L with top
Gradually it is in progress.Now, owing to brittle substrate W is very thin glass plate, therefore by suitably selecting
The heating condition of laser irradiating part 23, the cooling condition in refrigerant injection portion 24, can be formed for fragility
Material substrate W has carried out the cutting line of full cutting and and non-formation line is as cutting line.
Additionally, as the final processing of the processing in this kind of mid-term that continues, make respectively laser irradiating part 23,
Under the state of refrigerant injection portion 24 action, movable platen 20a is made to move further by travel mechanism 25
(advance), makes laser pass through the lower section in region 28, coolant sequentially arrives shape by the lower section in region 30
Become to have the rearward end of brittle substrate W of terminal be full of cracks 42 and passing through of making.It addition, from such
Processing in mid-term moves to the period of final processing, does not the most make movable platen 20a stop, and by travel mechanism 25
Move with certain speed.Therefore, heating region 29 or cooled region 31 on brittle substrate W with
Certain speed continuously moves.
In this way along cut off both alignment L carry out continuously the heat treated by laser irradiating part 23,
Processed by the cooling in refrigerant injection portion 24, i.e. can cut off both alignment L and carry out brittle substrate
The full cutting (cut-out) of W.
Here, the brittle substrate of glass plate etc. with the mechanism cut off as beginning that initially chaps, one
As be thought as follows.
Fig. 4 A, Fig. 4 B are the figure of the section of display brittle substrate W, in such figure, symbol t
For showing the thickness of brittle substrate W, and symbol A is to show to be formed at brittle substrate W's
Initial be full of cracks above.
In order to cut off this kind of brittle substrate W, initially chap when laser is exposed to as shown in Figure 4 A
When A heats, the most heated near initial be full of cracks A, and in the skin section of brittle substrate W
Form heating region 29.It follows that work as the initial Testudinis of brittle substrate W by refrigerant injection
When splitting cooling near A, the most cooled near initial be full of cracks A, and as shown in Figure 4 B at fragile material base
The skin section of plate W forms cooled region 31.Now, previously passed heating and the heating region 29 that formed,
Can be because of conduction of heat towards the thickness direction diffusion of brittle substrate W.
When shown in this kind of Fig. 4 B, though heating region 29 can stretch because of thermal expansion, but add
The impact that the surrounding of thermal region 29 is the most heated, therefore can act as suppression at heating region
The thermal expansion of 29, and therefrom as shown in arrow in Fig. 4 B, compression stress is at heating region 29
Generation effect.
On the other hand, though cooled region 31 can reduce because of thermal contraction, but cooled region 31 is around
And it is not affected by the impact of bigger cooling, therefore can act as suppressing the thermal contraction at cooled region 31, and
Therefrom as shown in arrow in Fig. 4 B, tensile stress is in cooled region 31 generation effect.So,
When the tensile stress cooled region 31 generation effect in the skin section of brittle substrate W, this stretching
Stress i.e. can act on the A that initially chaps, and can act as cutting off fragility material with initial be full of cracks A as starting point
Material substrate W.Thus, brittle substrate W i.e. can be grown up by initial be full of cracks A, and with in fragility
The surface incision of material substrate W has the mode of dividing line to be cut off.
During additionally, especially thickness is the very thin brittle substrate W of below 300 μm, with initial Testudinis
Split mechanism brittle substrate W being cut (cut-out) entirely for the beginning to be thought as follows.
Fig. 5 A to Fig. 5 C is the above axonometric chart showing very thin brittle substrate W, such
Figure also showing for symbol 41, the above top being formed at brittle substrate W chaps, and symbol L
Then show cut-out both alignments of brittle substrate W.
In order to cut off this kind of brittle substrate W, when one side makes brittle substrate W as shown in Figure 5A
Mobile towards arrow Q direction (direction contrary with the moving direction of the movable platen 20a in Fig. 2), one
Heating that face sequentially carries out being irradiated by laser along the cut-out both alignment L comprising top be full of cracks 41, logical
During the cooling that supercooling agent is sprayed, in the very thin brittle substrate W situation that thickness is below 300 μm
For, after laser irradiates, heat can be rapidly transferred to following.It is, brittle substrate W's
Thickness direction temperature is generally uniform, in contrast, in cut-out both alignment L sides of brittle substrate W
To, the width of Temperature Distribution can thickness direction than brittle substrate W big.In other words, at fragility material
The thickness direction of material substrate W, has the gentle thermograde that rate of change is little, in contrast, in fragility
The cut-out of material substrate W both alignment L directions, then have the rapid thermograde (fragility that rate of change is big
The thermograde in the cut-out of the material substrate W both alignment L directions thickness direction than brittle substrate W
Thermograde big).Therefore, the growth of top be full of cracks 41, compared with the thickness side of brittle substrate W
To Temperature Distribution, be more exposed to cut off the impact of both Temperature Distribution in alignment L direction and carry out.
Under this kind of state, though heating region 29 can stretch because of thermal expansion, but heating region 29
Around, especially in the region in opposite direction with arrow Q, the most heated impact, because of
This can act as suppressing the thermal expansion at heating region 29, therefrom as shown in arrow in Fig. 5 A,
Compression stress is in heating region 29 generation effect.
On the other hand, though cooled region 31 can reduce because of thermal contraction, but cooled region 31 is around
Will not be affected by bigger cooling, therefore acted as suppressing the thermal contraction at cooled region 31, thus
And tensile stress is in cooled region 31 generation effect as shown in arrow in Fig. 5 A.So, stretching is worked as
Stress is when the cooled region 31 generation effect of the skin section of brittle substrate W, and this tensile stress is i.e.
Act on top be full of cracks 41 so that produce cut-out with top be full of cracks 41 for starting point at brittle substrate W.
Therefore, when making brittle substrate W move towards arrow Q direction and set along cutting off
Heating that line L carries out being irradiated by laser continuously, by the cooling of refrigerant injection time, with top Testudinis
The cut-out splitting the 41 brittle substrate W being starting point will be carried out along cutting off both alignment L.
But, when brittle substrate W continues the movement toward arrow Q direction, and such as Fig. 5 B institute
When showing the terminal that heating region 29 arrives brittle substrate W, around heating region 29 the most not
The region of heated impact is less, does not especially have the fragility of side in opposite direction with arrow Q
The region of material substrate W.Therefore, suppression produces hardly in the power of the thermal expansion of heating region 29
Effect, therefore as shown in arrow in Fig. 5 B, heating region 29 can freely thermal expansion.
Similarly, it is not affected by cooling down extreme influence in cooled region 31 around cooled region 31
Region is less, and the region of side especially in opposite direction with arrow Q is reduced, and therefore suppresses in cooling zone
The diminished strength of the thermal contraction in territory 31, therefore in Fig. 5 B, as shown in arrow, cooled region 31 can warm
Shrink.
Therefore, the especially tensile stress at cooled region 31 can relax, and therefore with top be full of cracks 41 is being
Starting point and the cutting line that carries out does not has sufficient tensile stress effect, hence along the cut-out of this cutting line
Both the carrying out of alignment L i.e. stopped.It is, with the carrying out of the top be full of cracks 41 cutting line S as starting point
Cut-out both alignment L terminal parts at brittle substrate W stop.Therefore, it is only to form top be full of cracks
41 and along cut off both alignment L and carry out the cooling of the heating of laser irradiation, refrigerant injection continuously,
Cut-out remnants are the most inherently produced at cutting terminal part.As a result, in order to cut off this brittle substrate W's
Cut off nubbin and entirely cut, it is necessary to identical turn off process with known.
Therefore, in the present embodiment, as shown in Figure 5 C in the terminal part formation of brittle substrate W
Terminal be full of cracks 42.Form terminal be full of cracks 42 in this way, should cutting off the stretching produced on both alignment L
Power i.e. acts on the terminal be full of cracks 42 shown in Fig. 5 C, thus i.e. can be with terminal Testudinis at brittle substrate W
Split 42 and produce cut-out for starting point.
Therefore, when making brittle substrate W move towards arrow Q direction and set along cutting off
When line L carries out the cooling of the heating of laser irradiation, refrigerant injection continuously, cutting off both alignment L's
Terminal part, the cut-out with the terminal be full of cracks 42 brittle substrate W as starting point will be set along cutting off
Line L is carried out, and can connect the 41 cutting line S as starting point that chap with top being previously formed.Therefore,
By forming terminal be full of cracks 42 in this way, can make cut off both on alignment L with top be full of cracks 41 for
The cutting line S of point continues mutually with the cut-out with the terminal be full of cracks 42 brittle substrate W as starting point, and
Brittle substrate W is made entirely to cut with a continuous print cutting line.
If cutting off brittle substrate W in this way, just make the movable platen 20a of shearing device 20 towards with
Direction in opposite direction for arrow P is moved, and reverts to initial position.Additionally, it is movably solid to release first
Holding component 5 for the fixing of the brittle substrate W after cutting off and makes the first movable holding members 5 toward solid
Determine holding members 4 side shifting, and hold the follow-up fragile material base held by fixing holding members 4
The leading section of plate W.On the other hand, about the brittle substrate W after cutting off, by make second can
Dynamic holding members 7 moves toward carrying downstream, direction, and makes it advance further in transport path 3 and (remove
Fortune).
Hereinafter, by this kind of step repeatedly, with shearing device 20 by from rolling out the fragility material that roller 2 is rolled out
Material substrate W cuts the most entirely, and can be made desired size.
For the shearing device 20 of present embodiment, there is cutting at brittle substrate W owing to possessing
The rearward end of moving direction when making brittle substrate W move on disconnected both alignment L, forms terminal
Be full of cracks 42 is as the terminal crack formation portion 22 of initial be full of cracks, even if the most especially at brittle substrate
The cutting terminal part of W can also cut for starting point entirely in terminal be full of cracks 42.Therefore, by being only
Possess the easy method in terminal crack formation portion 22, so that it may eliminate the cut-out at cutting terminal part remaining and
Cutting off, both alignment L was region-wide cuts the most entirely.
Additionally, for cut off the method for brittle substrate by this kind of shearing device 20, also due to shape
Become to have terminal be full of cracks 42 to chap as initial, even if therefore can also terminal be full of cracks 42 at cutting terminal part
Entirely cut for starting point.Therefore, by being only the easy method plus formation terminal be full of cracks 42,
Just can eliminate that the cut-out at cutting terminal part is remaining and both alignment L was region-wide cuts entirely cutting off.
Additionally, top be full of cracks 41 and terminal be full of cracks 42 to be both formed in the non-goods of brittle substrate W
Quality region.Therefore, although the section of such top be full of cracks 41 and terminal be full of cracks 42 is the most coarse,
But top be full of cracks 41 and terminal be full of cracks 42 will not be formed at product property region, therefore can prevent from undermining by
The quality of the final goods that product property region is constituted.
It addition, the present invention is not limited to described embodiment, as long as in the purport without departing from the present invention
In the range of, all can make various change.
Such as, in said embodiment, though being configured to respectively by travel mechanism 21b alone, shifting
Motivation structure 22b moves crack formation portion, top 21, terminal crack formation portion 22, but also can be by top Testudinis
Split forming portion 21, the diamond cutter 21a of each in terminal crack formation portion 22, diamond cutter
22a is installed on movable platen 20a or is installed on laser irradiating part 23, the most respectively by movable in order to make
Travel mechanism 25 that plate 20a moves and make respectively crack formation portion, top 21 (diamond cutter 21a),
Terminal crack formation portion 22 (diamond cutter 22a) is mobile.
Now, it is possible to crack formation portion, top 21, terminal crack formation portion 22 be set the most in the lump, and only
The crack formation portion of a wherein side is installed on movable platen 20a or laser irradiating part 23, and by this be full of cracks
Forming portion carries out the formation of top be full of cracks 41 and the formation of terminal be full of cracks 42 in the lump.
Additionally, in said embodiment, though make by making movable platen 20a move laser irradiating part 23,
Refrigerant injection portion 24 moves relative to brittle substrate W, but is such as intended to large-scale fragile material
When substrate W is divided into multi-disc etc. under situation, it is possible to first by laser irradiating part 23, refrigerant injection portion 24
Give fixed configurations, and make brittle substrate W relative to such laser irradiating part 23, coolant spray
Penetrate portion 24 to move.
Additionally, in said embodiment, though employ the diamond cutting belonging to break bar (cutter wheel)
Cutter 21a or diamond cutter 22a as crack formation portion, top 21, terminal crack formation portion 22,
But the present invention is not limited to this, other also can be such as by employing the grinding (ablation) of short-pulse laser
It is processed to form top be full of cracks 41 or terminal be full of cracks 42.When using this kind of short-pulse laser, owing to passing through
Cordless forms top be full of cracks 41 or terminal be full of cracks 42, therefore can suppress shattered crack (micro crack)
Generation.
[industrial applicability]
The shearing device of the brittle substrate of the foundation present invention and cutting-off method, especially at cutting terminal part
Can also terminal be full of cracks entirely cut for starting point.Therefore, by simply adding the formation of terminal be full of cracks
Simple and easy method, so that it may it is region-wide entirely that elimination carries out cutting off both alignments in the cut-out remnants of cutting terminal part
Cutting.
Claims (5)
1. a cutting-off method for brittle substrate, is along cutting off both alignment cut-out brittle substrates,
The cutting-off method of this brittle substrate includes:
The brittle substrate that makes on cut-out both alignments of brittle substrate moves relative to laser illumination source
Formation top, the leading section be full of cracks of moving direction time dynamic, and in the rearward end formation terminal of moving direction
The step of be full of cracks；
One side makes described brittle substrate move relative to laser illumination source, and one side will from laser illumination source
Laser is irradiated in and carries out the step of heat treated on described cut-out both alignments；And
From refrigerant injection source, brittle substrate was carried out at heating by refrigerant injection to via laser
The position of reason, cuts off the step of described brittle substrate to carry out cooling process with described cut-out both alignment
Suddenly.
2. the cutting-off method of brittle substrate as claimed in claim 1, wherein, described fragile material
Substrate has non-product property region at circumference, and has goods product in the inner side in non-product property region
Matter region；
In the step forming the be full of cracks of described top and the be full of cracks of described terminal, by the be full of cracks of such top and terminal
Be full of cracks is both formed in non-product property region.
3. the cutting-off method of brittle substrate as claimed in claim 1, wherein, is so that described crisp
Property material substrate the thermograde in cut-out both alignment directions more than the thickness direction of described brittle substrate
The mode of thermograde, described brittle substrate is carried out described heat treated and described cooling processes.
4. a shearing device for brittle substrate, is along cutting off both alignment cut-out brittle substrates,
The shearing device of this brittle substrate includes:
Machine table, configures brittle substrate；
Crack formation portion, top, it makes fragile material on cut-out both alignments of described brittle substrate
Formation top, the leading section be full of cracks of moving direction when substrate moves；
Terminal crack formation portion, it makes fragile material on cut-out both alignments of described brittle substrate
The rearward end of moving direction when substrate moves forms terminal be full of cracks；
Laser irradiating part, is irradiated in laser on described brittle substrate；
Refrigerant injection portion, by refrigerant injection on described brittle substrate；And
Mobile means, makes described brittle substrate spray relative to described laser irradiating part and described coolant
Portion of penetrating moves towards direction set in advance.
5. the shearing device of brittle substrate as claimed in claim 4, wherein, described mobile means
So that the side that described laser irradiating part and described refrigerant injection portion move relative to described brittle substrate
Formula is constituted；
Crack formation portion, described top and described terminal crack formation portion are configured to be displaced into be shone with described laser
On the mobile route that portion of penetrating is identical.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2014120915 | 2014-06-11 | ||
| JP2014-120915 | 2014-06-11 | ||
| PCT/JP2015/065073 WO2015190281A1 (en) | 2014-06-11 | 2015-05-26 | Brittle substrate cleavage method and brittle substrate cleavage device |
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| CN106029317A true CN106029317A (en) | 2016-10-12 |
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| JP (1) | JP6269830B2 (en) |
| KR (1) | KR101836025B1 (en) |
| CN (1) | CN106029317A (en) |
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| WO (1) | WO2015190281A1 (en) |
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| WO2017206054A1 (en) * | 2016-05-31 | 2017-12-07 | Faurecia (China) Holding Co., Ltd. | Release agent supply device for cold knife weakening and a cold knife system comprising such a device |
| JP2019025792A (en) * | 2017-07-31 | 2019-02-21 | 三星ダイヤモンド工業株式会社 | Break device |
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- 2015-05-26 CN CN201580009533.9A patent/CN106029317A/en active Pending
- 2015-05-26 KR KR1020167025812A patent/KR101836025B1/en active IP Right Grant
- 2015-05-26 JP JP2016527730A patent/JP6269830B2/en active Active
- 2015-05-26 WO PCT/JP2015/065073 patent/WO2015190281A1/en active Application Filing
- 2015-05-28 TW TW104117135A patent/TWI607976B/en active
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| Publication number | Publication date |
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| JPWO2015190281A1 (en) | 2017-04-20 |
| KR20160124198A (en) | 2016-10-26 |
| TW201602028A (en) | 2016-01-16 |
| KR101836025B1 (en) | 2018-03-07 |
| JP6269830B2 (en) | 2018-01-31 |
| WO2015190281A1 (en) | 2015-12-17 |
| TWI607976B (en) | 2017-12-11 |
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