CN106028628A - Circuit board and mobile terminal with same - Google Patents
Circuit board and mobile terminal with same Download PDFInfo
- Publication number
- CN106028628A CN106028628A CN201610607536.9A CN201610607536A CN106028628A CN 106028628 A CN106028628 A CN 106028628A CN 201610607536 A CN201610607536 A CN 201610607536A CN 106028628 A CN106028628 A CN 106028628A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipating
- dissipating layer
- pad
- mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board and a mobile terminal with the same. The circuit board comprises a motherboard, at least one electrical component, and a heat radiation layer. The motherboard is provided with at least one pad. The at least one electrical component is welded with the corresponding pad. The heat radiation layer is laid at at least a part of the surface of the motherboard and is provided with an avoidance gap, and the at least one pad is in the avoidance gap. According to the circuit board of the invention, the circuit board has good heat radiation ability, the stable working environment of the circuit board can be ensured, the service life of the electrical component is prolonged, thus the stability and reliability of the working operation of the mobile terminal are ensured, and the quality of the mobile terminal is ensured.
Description
Technical field
The present invention relates to technical field of electronic equipment, especially relate to a kind of circuit board and there is the movement of described circuit board
Terminal.
Background technology
The mobile terminals such as such as mobile phone, it is bigger that it fills the caloric value operationally of the electric elements in adapter circuit soon,
The heat dissipation path of electric elements is mainly transmitted on circuit board by the pin of electric elements, but circuit board self
Heat-sinking capability is limited, the stability run during impact adaptation work, particularly works under continuous high temperature state, it will
Have influence on the service life of electric elements, thus have influence on use quality and the reliability of adapter.
Summary of the invention
It is contemplated that at least solve one of technical problem present in prior art.To this end, the present invention proposes a kind of electricity
Road plate, the heat-sinking capability of described circuit board is good.
The present invention also proposes a kind of mobile terminal with described circuit board.
The circuit board of embodiment according to a first aspect of the present invention, including: mainboard, described mainboard is provided with at least one pad；
At least one electric elements, at least one described electric elements and corresponding described pad solder；And heat dissipating layer, described heat radiation
Layer is laid at least part of surface of described mainboard, and described heat dissipating layer is provided with dodges breach, at least one described pad position
Dodge in breach in described.
Circuit board according to embodiments of the present invention, by laying heat dissipating layer at least part of surface of mainboard, and makes at least one
What individual pad was positioned on heat dissipating layer dodges breach, and so, the heat produced during circuit board work can quickly be transmitted to heat radiation
On layer, heat dissipating layer is the heat Quick diffusing of circuit board so that circuit board works operation under steady, good temperature environment,
Guarantee that working environment is stable, extend the service life of electric elements, thus ensure stability that mobile terminal work runs and can
By property, it is ensured that the quality of mobile terminal.
It addition, circuit board according to embodiments of the present invention also has a following additional technical characteristic:
According to some embodiments of the present invention, described in dodge between inner side wall and the pad in this dodges breach
Short distance is D1, and described D1 meets: 0.3mm≤D1≤0.5mm.
According to some embodiments of the present invention, described heat dissipating layer is laid on the upper surface of described mainboard, outside described heat dissipating layer
Beeline between the outer contour of periphery and described upper surface is D2, and described D2 meets: 0.2mm≤D2≤0.3mm.
According to some embodiments of the present invention, the thickness of described heat dissipating layer is H, and described H meets: 40 μm≤H≤50 μm.
According to some embodiments of the present invention, the thickness of described heat dissipating layer is H, and described H meets: 30 μm≤H ＜ 40 μm.
According to some embodiments of the present invention, described in dodge breach and be formed as polygon, circular or oval.
According to some embodiments of the present invention, described heat dissipating layer is graphite linings or copper foil layer.
The mobile terminal of embodiment according to a second aspect of the present invention, including the circuit described in embodiment according to a first aspect of the present invention
Plate.
Mobile terminal according to embodiments of the present invention, utilizes circuit board as above, stable performance, reliability height, quality
Good.
The additional aspect of the present invention and advantage will part be given in the following description, and part will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Accompanying drawing explanation
Fig. 1 is the explosive view of circuit board according to embodiments of the present invention；
Fig. 2 is the axonometric chart of circuit board according to embodiments of the present invention.
Reference:
Circuit board 1,
Mainboard 100, pad 110,
Electric elements 200,
Heat dissipating layer 300, dodges breach 301.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below by ginseng
The embodiment examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention, it is to be understood that term " length ", " width ", " thickness ", " on ",
Orientation or the position of the instruction such as D score, "front", "rear", "left", "right", " interior ", " outward " are closed
System for based on orientation shown in the drawings or position relationship, be for only for ease of the description present invention and simplifying describe rather than
Instruction or the device of hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore
It is not considered as limiting the invention.Additionally, term " first ", " second " are only used for describing purpose, and not
It is understood that as instruction or implies relative importance or the implicit quantity indicating indicated technical characteristic.Thus, limit
Have " first ", the feature of " second " can express or implicitly include one or more this feature.At this
In the description of invention, except as otherwise noted, " multiple " are meant that two or more.
Describe the circuit board 1 of embodiment according to a first aspect of the present invention below with reference to Fig. 1 and Fig. 2, this circuit board 1 is suitable to
The mobile terminals such as such as mobile phone, have the advantage that heat-sinking capability is good.
As depicted in figs. 1 and 2, circuit board 1 according to embodiments of the present invention, including mainboard 100, at least one electrical equipment unit
Part 200 and heat dissipating layer 300.
Specifically, mainboard 100 is provided with at least one pad 110, i.e. mainboard 100 is provided with one or more pad
110.At least one described electric elements 200 welds with corresponding pad 110, in other words, and electric elements 200 and phase
The pad 110 answered welds, or, multiple electric elements 200 weld with corresponding pad 110 respectively.Heat dissipating layer 300 spreads
Being located at least part of surface of mainboard 100, such as, heat dissipating layer 300 is only laid on the part surface of mainboard 100, again
As, heat dissipating layer 300 is laid on the whole surface of mainboard 100.Wherein, heat dissipating layer 300 is provided with dodges breach 301,
At least one pad 110 is positioned at dodges breach 301, so, when heat dissipating layer 300 and mainboard 100 are fitted, and electric elements
200 can expose from dodging breach 301, it is to avoid heat dissipating layer 300 is short-circuited with electric elements 200.
Circuit board 1 according to embodiments of the present invention, by laying heat dissipating layer 300 at least part of surface of mainboard 100, and
Make what at least one pad 110 was positioned on heat dissipating layer 300 to dodge breach 301, so, produce when circuit board 1 works
Heat can quickly be transmitted on heat dissipating layer 300, the heat Quick diffusing of 300 circuit boards 1 of heat dissipating layer so that circuit board
1 works operation under steady, good temperature environment, it is ensured that working environment is stable, extends the use longevity of electric elements 200
Life, thus ensure stability and the reliability of mobile terminal work operation, it is ensured that the quality of mobile terminal.
According to some embodiments of the present invention, the pad 110 dodged breach 301 medial wall be positioned at this and dodge breach 301
Between beeline be that D1, D1 meet: 0.3mm≤D1≤0.5mm, such that it is able to avoid heat dissipating layer 300 and mainboard 100
It is pressed onto the heat dissipating layer 300 that electric elements 200 cause after laminating to be short-circuited with electric elements 200.
According to some embodiments of the present invention, as depicted in figs. 1 and 2, heat dissipating layer 300 is laid on the upper surface of mainboard 100
On, the beeline between outer peripheral edge and the outer contour of upper surface of heat dissipating layer 300 is that D2, D2 meet: 0.2mm≤D2
≤ 0.3mm, so, it is ensured that the safe spacing of laminating tolerance.
In some embodiments of the invention, heat dissipating layer 300 is graphite linings, and the thickness of heat dissipating layer 300 is that H, H meet: 40
μm≤H≤50 μm, thus good heat dissipation effect.In some specific embodiments of the present invention, heat dissipating layer 300 is copper foil layer,
The thickness of heat dissipating layer 300 is that H, H meet: 30 μm≤H ＜ 40 μm, thus good heat dissipation effect.Preferably, breach is dodged
301 are formed as polygon, circular or oval, consequently facilitating machine-shaping, conveniently dodge electric elements 200.
Below with reference to the accompanying drawings describing the circuit board 1 of a specific embodiment according to the present invention in detail, this circuit board 1 is suitable to
The mobile terminals such as such as mobile phone fill adapter circuit soon.It is worth being understood by, simply exemplary illustration described below,
And be not considered as limiting the invention.
As depicted in figs. 1 and 2, circuit board 1 according to embodiments of the present invention, including mainboard 100, electric elements 200 and
Heat dissipating layer 300.
Specifically, the rectangular slab that mainboard 100 orients in left-right direction for length, width orients along the longitudinal direction, and main
Plate 100 is provided with multiple pad 110.At least one electric elements 200 welds with corresponding pad 110, i.e. at least one
Electric elements 200 are connected on mainboard 100 by pad 110.Heat dissipating layer 300 is for rectangle and is laid on the upper of mainboard 100
On surface, the beeline between each edge and the corresponding sides edge of mainboard 100 of heat dissipating layer 300 is that D2, D2 meet: 0.2mm
≤D2≤0.3mm.What heat dissipating layer 300 was provided with rectangle dodges breach 301, and multiple pads 110 are positioned at dodges breach 301,
And dodge the beeline between breach 301 medial wall and the pad in this dodges breach 301 110 be D1, D1 meet:
0.3mm≤D1≤0.5mm,
Circuit board 1 according to embodiments of the present invention, by making heat dissipating layer 300 fit tightly with the upper surface of mainboard 100, and dissipates
Thermosphere 300 dodges electric elements 200, and so, the heat produced when circuit board 1 works can quickly be transmitted to heat dissipating layer 300
On, the heat Quick diffusing of 300 circuit boards 1 of heat dissipating layer, thus the heat-sinking capability of intensifier circuit plate 1 so that circuit board
1 works operation under steady, good temperature environment, it is ensured that stablizing of adaptive working environment, extends electric elements 200
Service life, and then ensure stability and the reliability of mobile terminal work operation, it is ensured that the quality of mobile terminal.
Other compositions of circuit board 1 according to embodiments of the present invention and operation are the most all
Known, it is not detailed herein.
The mobile terminal of embodiment according to a second aspect of the present invention, including the circuit described in embodiment according to a first aspect of the present invention
Plate 1.
Mobile terminal according to embodiments of the present invention, utilizes circuit board 1 as above, stable performance, reliability height, quality
Good.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " install ",
" be connected ", " connection " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect,
Or be integrally connected；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible in by
Between medium be indirectly connected to, can be the connection of two element internals.For the ordinary skill in the art, may be used
Above-mentioned term concrete meaning in the present invention is understood with concrete condition.
In the description of this specification, reference term " embodiment ", " some embodiments ", " specific embodiment ",
It is concrete that the description of " alternative embodiment ", " example " or " some examples " etc. means to combine this embodiment or example describes
Feature, structure, material or feature are contained at least one embodiment or the example of the present invention.In this manual, right
The schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.And, the specific features of description, structure,
Material or feature can combine in any one or more embodiments or example in an appropriate manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
These embodiments can be carried out multiple change in the case of the principle of the disengaging present invention and objective, revise, replace and become
Type, the scope of the present invention is limited by claim and equivalent thereof.
Claims (8)
1. a circuit board, it is characterised in that including:
Mainboard, described mainboard is provided with at least one pad；
At least one electric elements, at least one described electric elements and corresponding described pad solder；With
Heat dissipating layer, described heat dissipating layer is laid at least part of surface of described mainboard, and described heat dissipating layer is provided with dodges breach, at least one described pad be positioned at described in dodge breach.
Circuit board the most according to claim 1, it is characterised in that described in dodge the beeline between inner side wall and the pad in this dodges breach be D1, described D1 meets: 0.3mm≤D1≤0.5mm.
Circuit board the most according to claim 1, it is characterized in that, described heat dissipating layer is laid on the upper surface of described mainboard, and the beeline between outer peripheral edge and the outer contour of described upper surface of described heat dissipating layer is D2, and described D2 meets: 0.2mm≤D2≤0.3mm.
Circuit board the most according to claim 1, it is characterised in that the thickness of described heat dissipating layer is H, described H meets: 40 μm≤H≤50 μm.
Circuit board the most according to claim 1, it is characterised in that the thickness of described heat dissipating layer is H, described H meets: 30 μm≤H ＜ 40 μm.
Circuit board the most according to claim 1, it is characterised in that described in dodge breach and be formed as polygon, circular or oval.
7. according to the circuit board according to any one of claim 1-6, it is characterised in that described heat dissipating layer is graphite linings or copper foil layer.
8. a mobile terminal, it is characterised in that include according to the circuit board according to any one of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610607536.9A CN106028628A (en) | 2016-07-28 | 2016-07-28 | Circuit board and mobile terminal with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610607536.9A CN106028628A (en) | 2016-07-28 | 2016-07-28 | Circuit board and mobile terminal with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106028628A true CN106028628A (en) | 2016-10-12 |
Family
ID=57114820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610607536.9A Pending CN106028628A (en) | 2016-07-28 | 2016-07-28 | Circuit board and mobile terminal with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106028628A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106507651A (en) * | 2016-12-30 | 2017-03-15 | 深圳天珑无线科技有限公司 | Electronic equipment |
| CN107846775A (en) * | 2017-12-22 | 2018-03-27 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of high heat conduction and its production method |
| CN107949160A (en) * | 2017-12-22 | 2018-04-20 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method |
| CN114576739A (en) * | 2022-03-02 | 2022-06-03 | 宁波奥克斯电气股份有限公司 | Automatically controlled subassembly, automatically controlled box subassembly and air conditioner of air condensing units |
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| CN201479454U (en) * | 2009-04-16 | 2010-05-19 | 惠州国展电子有限公司 | Circuit board with metal covering film of insulated rubber film attached to element surface thereof |
| CN103200764A (en) * | 2012-01-05 | 2013-07-10 | 佳能元件股份有限公司 | Flexible printed circuit, illumination apparatus, capsule endoscope and vehicle lighting apparatus |
| CN203537660U (en) * | 2013-10-10 | 2014-04-09 | 上海斐讯数据通信技术有限公司 | Printed circuit board |
| CN104023466A (en) * | 2014-06-04 | 2014-09-03 | 汕头超声印制板（二厂）有限公司 | Efficiently radiating circuit board and manufacturing method thereof |
| CN104113979A (en) * | 2014-02-13 | 2014-10-22 | 美的集团股份有限公司 | Aluminum-based circuit board and preparation method thereof, and full packaging electronic component |
| CN204046919U (en) * | 2014-08-12 | 2014-12-24 | 温州扬升电路板有限公司 | A kind of wiring board strengthening dispelling the heat |
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Patent Citations (6)
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|---|---|---|---|---|
| CN201479454U (en) * | 2009-04-16 | 2010-05-19 | 惠州国展电子有限公司 | Circuit board with metal covering film of insulated rubber film attached to element surface thereof |
| CN103200764A (en) * | 2012-01-05 | 2013-07-10 | 佳能元件股份有限公司 | Flexible printed circuit, illumination apparatus, capsule endoscope and vehicle lighting apparatus |
| CN203537660U (en) * | 2013-10-10 | 2014-04-09 | 上海斐讯数据通信技术有限公司 | Printed circuit board |
| CN104113979A (en) * | 2014-02-13 | 2014-10-22 | 美的集团股份有限公司 | Aluminum-based circuit board and preparation method thereof, and full packaging electronic component |
| CN104023466A (en) * | 2014-06-04 | 2014-09-03 | 汕头超声印制板（二厂）有限公司 | Efficiently radiating circuit board and manufacturing method thereof |
| CN204046919U (en) * | 2014-08-12 | 2014-12-24 | 温州扬升电路板有限公司 | A kind of wiring board strengthening dispelling the heat |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106507651A (en) * | 2016-12-30 | 2017-03-15 | 深圳天珑无线科技有限公司 | Electronic equipment |
| CN107846775A (en) * | 2017-12-22 | 2018-03-27 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of high heat conduction and its production method |
| CN107949160A (en) * | 2017-12-22 | 2018-04-20 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method |
| CN114576739A (en) * | 2022-03-02 | 2022-06-03 | 宁波奥克斯电气股份有限公司 | Automatically controlled subassembly, automatically controlled box subassembly and air conditioner of air condensing units |
| CN114576739B (en) * | 2022-03-02 | 2023-09-01 | 宁波奥克斯电气股份有限公司 | Electric control assembly, electric control box assembly of air conditioner outdoor unit and air conditioner |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |
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| RJ01 | Rejection of invention patent application after publication |