CN106025004A - Method for coating protection material on LED chip - Google Patents
Method for coating protection material on LED chip Download PDFInfo
- Publication number
- CN106025004A CN106025004A CN201610496512.0A CN201610496512A CN106025004A CN 106025004 A CN106025004 A CN 106025004A CN 201610496512 A CN201610496512 A CN 201610496512A CN 106025004 A CN106025004 A CN 106025004A
- Authority
- CN
- China
- Prior art keywords
- glue
- chip
- led chip
- protection material
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a method for coating protection material on an LED chip. In filling of packaging glue in the packaging process of the LED, first fluorescent glue is printed on the corresponding position layer by layer by adopting a printing technology rather than use a mould pressing technology for filling of the fluorescent glue. The position of fluorescent powder is relatively fixed in the fluorescent glue due to layer-by-layer printing rather than random distribution, and the distribution of the fluorescent powder in the fluorescent glue is more uniform than that of the existing fluorescent powder in the fluorescent glue so that uniformity of LED light-emitting colors can be enhanced. Besides, when the first fluorescent glue is printed by using the printing technology, the required amount of the fluorescent glue is less than that of the existing packaging technology when the fluorescent glue of the same concentration is used due to the uniform and centralized distribution of the fluorescent powder so that the loss of the fluorescent powder can be reduced and manufacturing cost of the LED can be reduced.
Description
Technical field
The invention belongs to technical field of semiconductor chip encapsulation, be specifically related to the side of a kind of LED chip coating protection material
Method.
Background technology
Need coating protection material after LED chip processing, to reach defencive function, improve its durability degree.Existing encapsulation
Technique at least there is problems in that 1, use fluorescent glue consumption that mould pressing technology fills in flip LED chip surrounding greatly, causes
Fluorescent material loss is big, and the manufacturing cost of LED is high；2, mould pressing technology is used to fill during fluorescent glue, glimmering in fluorescent glue
Light powder position in glue is random distribution, is easily caused fluorescent material skewness in fluorescent glue, and then causes lighting
Time, the problem of the white light color lack of homogeneity that LED is sent.
Summary of the invention
For solving the deficiencies in the prior art, it is an object of the invention to can quickly, the painting of a kind of LED chip of even spread
The method of cloth protection material.
In order to realize above-mentioned target, the present invention adopts the following technical scheme that:
The method of a kind of LED chip coating protection material, is characterized in that, described LED chip is to have the chip board of salient point, and tool
Having the front that one side is LED chip of salient point, its back side is the back side of chip board, and remaining face of described chip board is chip board
Side；Operating procedure is as follows:
(1) by printing fluorescent glue on the back side of LED core sheet, fluorescent glue is solidify to form the first glue-line；
(2) chip board of back up fluorescent glue is cut, do not cut to the first glue-line, LED core sheet is cut into
Independent chip；
(3) independent LED chip front printing fluorescent glue after dicing, solidify to form the second glue-line by fluorescent glue；
(4) cut on first glue-line at the LED chip back side, not cutter LED chip, retain LED chip dorsal edge
First glue-line at place, takes off remaining first glue-line, exposes the back side and the side of independent chip；
(5) it is coated with protection material at the back side of independent LED chip and side and solidifies；
(6) at protection outer material side printing fluorescent glue, the 3rd glue-line is formed；
(7) LED chip being coated with protection material is cut, do not cut the 3rd glue-line；
(8) LED chip is taken out.
Further, described step (1), the chip board of back up fluorescent glue is placed in fixed frame, chip board
Periphery be close to fixed frame.
Further, described fixed frame is metal frame or frame of plastic.
Further, chip board is put into cutting machine and is cut by described step (2).
Further, described step (5), first chip is put into coating machine, protection material coat chip board the back side and
Side, then chip is taken out, to put in solidification equipment, protection material is solidified by setting time, temperature.
Further, the technology that printing fluorescent glue is used is ink-jet printing technology and/or Microcontact printing technology.
The invention have benefit that:, the present invention, in the encapsulation process of LED, when filling packaging plastic, not adopts
Fill fluorescent glue with mould pressing technology, but use printing technology by the first fluorescent glue in layer be printed on corresponding position,
Due to can printing in layer, therefore fluorescent material position in fluorescent glue is also relatively fixed, and and Non-random distribution, its
Distribution in fluorescent glue is also uniform than existing fluorescent material position distribution in fluorescent glue, can improve the equal of LED glow color
Even property；During it addition, use printing technology to print the first fluorescent glue, owing to uniform concentration is compared in the distribution of fluorescent material, therefore make
During with the fluorescent glue of comparable sodium, the consumption of required fluorescent glue is few compared with expense adopted in existing packaging technology, Jin Erke
Reduce the loss of fluorescent material, reduce the manufacturing cost of LED.
Detailed description of the invention
Hereinafter the present invention is made concrete introduction.
The method of a kind of LED chip of present invention coating protection material, wherein, LED chip is to have the chip board of salient point, and
Having the front that one side is LED chip of salient point, its back side is the back side of chip board, and remaining face of chip board is chip board
Side；Operating procedure is as follows:
(1) by printing fluorescent glue on the back side of LED core sheet, fluorescent glue is solidify to form the first glue-line；
(2) chip board of back up fluorescent glue is cut, do not cut to the first glue-line, LED core sheet is cut into
Independent chip；
(3) independent LED chip front printing fluorescent glue after dicing, solidify to form the second glue-line by fluorescent glue；
(4) cut on first glue-line at the LED chip back side, not cutter LED chip, retain LED chip dorsal edge
First glue-line at place, takes off remaining first glue-line, exposes the back side and the side of independent chip；
(5) it is coated with protection material at the back side of independent LED chip and side and solidifies；
(6) at protection outer material side printing fluorescent glue, the 3rd glue-line is formed；
(7) LED chip being coated with protection material is cut, do not cut the 3rd glue-line；
(8) LED chip is taken out.
Further, described step (1), the chip board of back up fluorescent glue is placed in fixed frame, chip board
Periphery be close to fixed frame.
Further, described fixed frame is metal frame or frame of plastic.
Further, chip board is put into cutting machine and is cut by described step (2).
Further, described step (5), first chip is put into coating machine, protection material coat chip board the back side and
Side, then chip is taken out, to put in solidification equipment, protection material is solidified by setting time, temperature.
Further, the technology that printing fluorescent glue is used is ink-jet printing technology and/or Microcontact printing technology.
The ultimate principle of the present invention, principal character and advantage have more than been shown and described.The technical staff of the industry should
Understanding, above-described embodiment limits the present invention the most in any form, and the mode of all employing equivalents or equivalent transformation is obtained
Technical scheme, all falls within protection scope of the present invention.
Claims (6)
1. a method for LED chip coating protection material, is characterized in that, described LED chip is to have the chip board of salient point, and
Having the front that one side is LED chip of salient point, its back side is the back side of chip board, and remaining face of described chip board is chip
The side of plate；Operating procedure is as follows:
(1) by printing fluorescent glue on the back side of LED core sheet, fluorescent glue is solidify to form the first glue-line；
(2) chip board of back up fluorescent glue is cut, do not cut to the first glue-line, LED core sheet is cut into
Independent chip；
(3) independent LED chip front printing fluorescent glue after dicing, solidify to form the second glue-line by fluorescent glue；
(4) cut on first glue-line at the LED chip back side, not cutter LED chip, retain LED chip dorsal edge
First glue-line at place, takes off remaining first glue-line, exposes the back side and the side of independent chip；
(5) it is coated with protection material at the back side of independent LED chip and side and solidifies；
(6) at protection outer material side printing fluorescent glue, the 3rd glue-line is formed；
(7) LED chip being coated with protection material is cut, do not cut the 3rd glue-line；
(8) LED chip is taken out.
The method of a kind of LED chip the most according to claim 1 coating protection material, it is characterised in that described step
(1), being placed in fixed frame by the chip board of back up fluorescent glue, fixed frame is close in the periphery of chip board.
The method of a kind of LED chip the most according to claim 2 coating protection material, it is characterised in that described fixed frame
Frame is metal frame or frame of plastic.
The method of a kind of LED chip the most according to claim 1 coating protection material, it is characterised in that described step (2)
Chip board is put into cutting machine cut.
The method of a kind of LED chip the most according to claim 1 coating protection material, it is characterised in that described step
(5), chip first being put into coating machine, protection material is coated the back side and the side of chip board, then is taken out by chip, puts into solidification
In device, protection material is solidified by setting time, temperature.
The method of a kind of LED chip the most according to claim 1 coating protection material, it is characterised in that printing fluorescent glue
The technology used is ink-jet printing technology and/or Microcontact printing technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610496512.0A CN106025004A (en) | 2016-06-30 | 2016-06-30 | Method for coating protection material on LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610496512.0A CN106025004A (en) | 2016-06-30 | 2016-06-30 | Method for coating protection material on LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106025004A true CN106025004A (en) | 2016-10-12 |
Family
ID=57104701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610496512.0A Pending CN106025004A (en) | 2016-06-30 | 2016-06-30 | Method for coating protection material on LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106025004A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070246734A1 (en) * | 2006-04-10 | 2007-10-25 | Samsung Electro-Mechanics Co., Ltd. | Multilayered white light emitting diode using quantum dots and method of fabricating the same |
| CN102738370A (en) * | 2012-07-04 | 2012-10-17 | 深圳市聚飞光电股份有限公司 | Led packaging method |
| CN103367344A (en) * | 2012-04-11 | 2013-10-23 | 光宝电子(广州)有限公司 | Connecting plate sheet material, light emitting diode encapsulation product and light emitting diode light bar |
| CN103972369A (en) * | 2014-05-26 | 2014-08-06 | 苏州东山精密制造股份有限公司 | LED (Light Emitting Diode) lamp bar and manufacturing method thereof |
| CN105140184A (en) * | 2015-07-30 | 2015-12-09 | 常州银河世纪微电子有限公司 | Chip scale packaging method |
-
2016
- 2016-06-30 CN CN201610496512.0A patent/CN106025004A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070246734A1 (en) * | 2006-04-10 | 2007-10-25 | Samsung Electro-Mechanics Co., Ltd. | Multilayered white light emitting diode using quantum dots and method of fabricating the same |
| CN103367344A (en) * | 2012-04-11 | 2013-10-23 | 光宝电子(广州)有限公司 | Connecting plate sheet material, light emitting diode encapsulation product and light emitting diode light bar |
| CN102738370A (en) * | 2012-07-04 | 2012-10-17 | 深圳市聚飞光电股份有限公司 | Led packaging method |
| CN103972369A (en) * | 2014-05-26 | 2014-08-06 | 苏州东山精密制造股份有限公司 | LED (Light Emitting Diode) lamp bar and manufacturing method thereof |
| CN105140184A (en) * | 2015-07-30 | 2015-12-09 | 常州银河世纪微电子有限公司 | Chip scale packaging method |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |