CN105977361A - LED packaging method - Google Patents

LED packaging method Download PDF

Info

Publication number
CN105977361A
CN105977361A CN201610496514.XA CN201610496514A CN105977361A CN 105977361 A CN105977361 A CN 105977361A CN 201610496514 A CN201610496514 A CN 201610496514A CN 105977361 A CN105977361 A CN 105977361A
Authority
CN
China
Prior art keywords
glue
chip
led
fluorescent
fluorescent glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610496514.XA
Other languages
Chinese (zh)
Inventor
王玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Chuben Electronic Technology Co Ltd
Original Assignee
Kunshan Chuben Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Chuben Electronic Technology Co Ltd filed Critical Kunshan Chuben Electronic Technology Co Ltd
Priority to CN201610496514.XA priority Critical patent/CN105977361A/en
Publication of CN105977361A publication Critical patent/CN105977361A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

Abstract

The invention discloses an LED packaging method. The method does not employ the mould pressing technology to carry out the filling of fluorescent glue in a packaging process of an LED during the filling of packaging glue, but prints the first fluorescent glue at corresponding positions layer by layer through employing the printing technology. Because the method can achieve the layer-by-layer printing, the position of fluorescent powder in the fluorescent glue is relatively fixed and is not distributed randomly. Compared with the position distribution of the conventional fluorescent powder in fluorescent glue, the distribution of the fluorescent powder in the fluorescent glue is uniform, and the uniformity of light color of the LED can be improved. In addition, when the printing technology is used for printing the first fluorescent glue and the fluorescent glue with the same concentration is employed, the amount of the needed fluorescent glue is smaller than the amount of fluorescent glue needed in the conventional packaging technology because the distribution of fluorescent powder is uniform and centralized, thereby reducing the loss of fluorescent powder, and reducing the manufacture cost of the LED. A structure with a notch can remarkably improve the viscosity of the back surface for a protective material, thereby further improving the durability.

Description

A kind of LED encapsulation method
Technical field
The invention belongs to technical field of semiconductor chip encapsulation, be specifically related to a kind of LED encapsulation method.
Background technology
Need coating protection material after LED chip processing, to reach defencive function, improve its durability degree.Existing encapsulation Technique at least there is problems in that 1, use fluorescent glue consumption that mould pressing technology fills in flip LED chip surrounding greatly, causes Fluorescent material loss is big, and the manufacturing cost of LED is high;2, mould pressing technology is used to fill during fluorescent glue, glimmering in fluorescent glue Light powder position in glue is random distribution, is easily caused fluorescent material skewness in fluorescent glue, and then causes lighting Time, the problem of the white light color lack of homogeneity that LED is sent.
Summary of the invention
For solve the deficiencies in the prior art, it is an object of the invention to can quickly, a kind of LED encapsulation side of even spread Method.
In order to realize above-mentioned target, the present invention adopts the following technical scheme that:
A kind of LED encapsulation method, is characterized in that, described LED chip is to have the chip board of salient point, and the one side with salient point is The front of LED chip, its back side is the back side of chip board, and remaining face of described chip board is the side of chip board;Operation step Rapid as follows:
(1) a ring recess mouth will be carved on the back side of LED core sheet along edge;The cross section of described notch is " convex " type, narrower one End is towards outside;
(2) at LED chip version back up fluorescent glue, fluorescent glue is solidify to form the first glue-line;
(3) chip board of back up fluorescent glue is cut, do not cut to the first glue-line, LED core sheet is cut into Independent chip;
(4) LED chip front printing fluorescent glue after dicing, solidify to form the second glue-line by fluorescent glue;Described second glue-line It it is cambered surface after molding;
(5) cut on first glue-line at the LED chip back side, not cutter LED chip, retain the first glue in notch Layer, exposes the back side and the side of independent chip;
(6) it is coated with protection material at the back side of independent LED chip and side and solidifies;
(7) at protection outer material side printing fluorescent glue, the 3rd glue-line is formed;
(8) LED chip being coated with protection material is cut, do not cut the 3rd glue-line;
(9) LED chip is taken out.
Aforesaid a kind of LED encapsulation method, is characterized in that, by the chip board of back up fluorescent glue in described step (1) Being placed in fixed frame, fixed frame is close in the periphery of chip board;Described fixed frame is metal frame or frame of plastic.
Aforesaid a kind of LED encapsulation method, is characterized in that, chip board is put into cutting machine and cut by described step (3).
Aforesaid a kind of LED encapsulation method, is characterized in that, described step (6), chip is first put into coating machine, protect material The back side and the side of chip board coated by material, then is taken out by chip, puts in solidification equipment, sets time, temperature to protection material Material solidifies.
Aforesaid a kind of LED encapsulation method, is characterized in that, the technology that printing fluorescent glue is used is ink-jet printing technology And/or Microcontact printing technology.
Aforesaid a kind of LED encapsulation method, is characterized in that, the thickness of described fluorescent glue is 30~500 μm.
The invention have benefit that: the present invention, in the encapsulation process of LED, when filling packaging plastic, not uses Mould pressing technology fill fluorescent glue, but use printing technology by the first fluorescent glue in layer be printed on corresponding position, by In can printing in layer, therefore fluorescent material position in fluorescent glue is also relatively fixed, and and Non-random distribution, it is glimmering Distribution in optical cement is also uniform than existing fluorescent material position distribution in fluorescent glue, can improve the uniform of LED glow color Property;During it addition, use printing technology to print the first fluorescent glue, owing to uniform concentration is compared in the distribution of fluorescent material, therefore using During the fluorescent glue of comparable sodium, the consumption of required fluorescent glue is few compared with expense adopted in existing packaging technology, and then can subtract The loss of few fluorescent material, reduces the manufacturing cost of LED;The structure arranging notch can improve the back side for protecting material to glue Stickiness increases significantly, and increases durability degree further.
Detailed description of the invention
Hereinafter the present invention is made concrete introduction.
A kind of LED encapsulation method that the present invention relates to, wherein, LED chip is to have the chip board of salient point, and has salient point The front that one side is LED chip, its back side is the back side of chip board, and remaining face of described chip board is the side of chip board Face.
Operating procedure is as follows:
(1) a ring recess mouth will be carved on the back side of LED core sheet along edge;The cross section of described notch is " convex " type, narrower one End is towards outside;
(2) at LED chip version back up fluorescent glue, fluorescent glue is solidify to form the first glue-line;
(3) chip board of back up fluorescent glue is cut, do not cut to the first glue-line, LED core sheet is cut into Independent chip;
(4) LED chip front printing fluorescent glue after dicing, solidify to form the second glue-line by fluorescent glue;Described second glue-line It it is cambered surface after molding;
(5) cut on first glue-line at the LED chip back side, not cutter LED chip, retain the first glue in notch Layer, exposes the back side and the side of independent chip;
(6) it is coated with protection material at the back side of independent LED chip and side and solidifies;
(7) at protection outer material side printing fluorescent glue, the 3rd glue-line is formed;
(8) LED chip being coated with protection material is cut, do not cut the 3rd glue-line;
(9) LED chip is taken out.
The chip board of back up fluorescent glue is placed in fixed frame in (1) by step, and the periphery of chip board is close to solid Determine framework;Described fixed frame is metal frame or frame of plastic.
Chip board is put into cutting machine and is cut by step (3).
Chip is first put into coating machine by step (6), and protection material is coated the back side and the side of chip board, then taken by chip Going out, put in solidification equipment, protection material is solidified by setting time, temperature.
In the present embodiment, the technology that printing fluorescent glue is used is ink-jet printing technology and/or Microcontact printing technology. The thickness of fluorescent glue is 30~500 μm.
The ultimate principle of the present invention, principal character and advantage have more than been shown and described.The technical staff of the industry should Understanding, above-described embodiment limits the present invention the most in any form, and the mode of all employing equivalents or equivalent transformation is obtained Technical scheme, all falls within protection scope of the present invention.

Claims (6)

1. a LED encapsulation method, is characterized in that, described LED chip is to have the chip board of salient point, and has the one side of salient point For the front of LED chip, its back side is the back side of chip board, and remaining face of described chip board is the side of chip board;Operation Step is as follows:
(1) a ring recess mouth will be carved on the back side of LED core sheet along edge;The cross section of described notch is " convex " type, narrower one End is towards outside;
(2) at LED chip version back up fluorescent glue, fluorescent glue is solidify to form the first glue-line;
(3) chip board of back up fluorescent glue is cut, do not cut to the first glue-line, LED core sheet is cut into Independent chip;
(4) LED chip front printing fluorescent glue after dicing, solidify to form the second glue-line by fluorescent glue;Described second glue-line It it is cambered surface after molding;
(5) cut on first glue-line at the LED chip back side, not cutter LED chip, retain the first glue in notch Layer, exposes the back side and the side of independent chip;
(6) it is coated with protection material at the back side of independent LED chip and side and solidifies;
(7) at protection outer material side printing fluorescent glue, the 3rd glue-line is formed;
(8) LED chip being coated with protection material is cut, do not cut the 3rd glue-line;
(9) LED chip is taken out.
A kind of LED encapsulation method the most according to claim 1, is characterized in that, by back up fluorescence in described step (1) The chip board of glue is placed in fixed frame, and fixed frame is close in the periphery of chip board;Described fixed frame is metal frame or moulds Material frame.
A kind of LED encapsulation method the most according to claim 1, is characterized in that, chip board is put into cutting by described step (3) Machine cuts.
A kind of LED encapsulation method the most according to claim 1, is characterized in that chip is first put into painting by described step (6) Cloth machine, protection material is coated the back side and the side of chip board, then is taken out by chip, put in solidification equipment, sets time, temperature Spend and protection material is solidified.
A kind of LED encapsulation method the most according to claim 1, is characterized in that, the technology that printing fluorescent glue is used is spray Ink print technology and/or Microcontact printing technology.
A kind of LED encapsulation method the most according to claim 1, is characterized in that, the thickness of described fluorescent glue is 30~500 μ m。
CN201610496514.XA 2016-06-30 2016-06-30 LED packaging method Pending CN105977361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610496514.XA CN105977361A (en) 2016-06-30 2016-06-30 LED packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610496514.XA CN105977361A (en) 2016-06-30 2016-06-30 LED packaging method

Publications (1)

Publication Number Publication Date
CN105977361A true CN105977361A (en) 2016-09-28

Family

ID=57020259

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610496514.XA Pending CN105977361A (en) 2016-06-30 2016-06-30 LED packaging method

Country Status (1)

Country Link
CN (1) CN105977361A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070101046A (en) * 2006-04-10 2007-10-16 삼성전기주식회사 Multi-layered white light emitting diode using quantum dots and method of preparing the same
CN102738370A (en) * 2012-07-04 2012-10-17 深圳市聚飞光电股份有限公司 Led packaging method
CN103367344A (en) * 2012-04-11 2013-10-23 光宝电子(广州)有限公司 Connecting plate sheet material, light emitting diode encapsulation product and light emitting diode light bar
CN103972369A (en) * 2014-05-26 2014-08-06 苏州东山精密制造股份有限公司 LED (Light Emitting Diode) lamp bar and manufacturing method thereof
CN105140184A (en) * 2015-07-30 2015-12-09 常州银河世纪微电子有限公司 Chip scale packaging method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070101046A (en) * 2006-04-10 2007-10-16 삼성전기주식회사 Multi-layered white light emitting diode using quantum dots and method of preparing the same
CN103367344A (en) * 2012-04-11 2013-10-23 光宝电子(广州)有限公司 Connecting plate sheet material, light emitting diode encapsulation product and light emitting diode light bar
CN102738370A (en) * 2012-07-04 2012-10-17 深圳市聚飞光电股份有限公司 Led packaging method
CN103972369A (en) * 2014-05-26 2014-08-06 苏州东山精密制造股份有限公司 LED (Light Emitting Diode) lamp bar and manufacturing method thereof
CN105140184A (en) * 2015-07-30 2015-12-09 常州银河世纪微电子有限公司 Chip scale packaging method

Similar Documents

Publication Publication Date Title
US10790418B2 (en) Light emitting diode fabrication method
CN101844482B (en) Method for manufacturing ceramic plate painting
EA032883B1 (en) Method for producing a sheet of selectively etched glass
CN103068544A (en) Process for producing a layer composite made of a luminescence conversion layer and a scattering layer
CN107253266A (en) A kind of method of concrete surface pattern-making
CN108858703A (en) A kind of automation billet surface processing method and system
CN106042408A (en) Powder material used for 3D printing and powder 3D printing forming method
CN108667958A (en) A kind of preparation method of mobile phone faceplate frame porose area substratum transparent
CN103626522A (en) Preparation technology of colored glaze encaustic
CN106585257A (en) Process for gilding on surface of ceramic or jade
CN103129140A (en) Three-dimensional (3D) printing method
CN107167868B (en) production method of glass light guide plate
CN101508224A (en) Production method of ceramic wafer art picture
CN102029643B (en) Process for producing ceramic tile with uneven surface
CN105977361A (en) LED packaging method
CN103331995B (en) A kind of calibration equipment of screen printing of ceramic tiles and use its method
CN103317872B (en) Paper light line typography
TW201515158A (en) Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
CN106025004A (en) Method for coating protection material on LED chip
JP2018089930A (en) Patterning process paper for precast concrete
CN104752588A (en) Fluorescent glue coating method for flip chip
CN106394046A (en) Manufacturing technology and application of transparent plastic sheet with embossment patterns
CN102689394A (en) Inner decoration technology for metal graphic effect molds
CN108973491A (en) Die surface can anti-sandblasting laser engraving technique
CN107902905B (en) Production process of ceramic tile

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20160928