A kind of chip high voltage ceramic capacitor
Technical field
The application relates to a kind of capacitor, particularly a kind of chip high voltage ceramic capacitor.
Background technology
The high-voltage ceramic capacitor produced at present, has disk high-voltage ceramic capacitor, chip multilayer
Ceramic capacitor etc..Disk high-voltage ceramic capacitor is traditional structure, and ceramic two thin long leads of being burn-on on silver strip, surface bag last layer epoxy resin, the circuit board of installation has two apertures to capacitor plug-in mounting.This installation form manufacturability is poor, it is impossible to tolerate high mechanical vibration or impact,
And due to lead-in inductance, use upper frequency limit to be restricted.For adapting to miniaturization, the development trend of slimming, electronic component structure form is changed into, by tradition plug-in, the trend that SMT mounted type becomes irresistible.Chip multilayer ceramic capacitor can meet the needs that SMT attachment produces, as being superimposed as lamellar by ceramic membrane, the chip multilayer ceramic capacitor of two ends coating external electrode structure, it can be made into high pressure larger capacity capacitor, there is certain difficulty in the capacitor making relatively low capacity, and its process equipment and technology want complicated a lot, cause industrialization cost high, pin
Price lattice are the highest.Under this background, the present invention the most just arises at the historic moment.
Summary of the invention
The application to solve the technical problem that being for above-mentioned the deficiencies in the prior art, and a kind of chip high voltage ceramic capacitor is provided, this chip high voltage ceramic capacitor can make single plate shape, neat appearance, can be rest directly upon on wiring board, without plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.Meanwhile, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor is simple, industrialization cost and market cheaper.
For solving above-mentioned technical problem, the application the technical scheme is that
A kind of chip high voltage ceramic capacitor, including by silver ceramics, mould shell, metal lead-outs and electric insulating sealant.
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics;A metal lead-outs respectively it is welded with on first electrode and the second electrode.
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal lead-outs all includes transverse weld portion, vertical bending part and transverse fit portion;Transverse weld portion is for welding with the first electrode or the second electrode;Transverse fit portion is for being electrically connected with device to be mounted;Vertical bending part is used for connecting transverse weld portion and transverse fit portion.
Mould shell and be coated on by silver ceramics and the periphery of part metals lead-out wire, mould and shell is provided with two wire lead slots, each wire lead slot is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for placing the vertical slot of the vertical bending part of metal lead-outs and for placing the opening translot in metal lead-outs transverse fit portion.
It is positioned in the transverse fit portion moulded outside shell and is provided with removable component, be placed with in the wire lead slot of metal lead-outs and be filled with the liquid electric insulating sealant that can solidify.
Described removable component is vacuum forming mould.
Described liquid electric insulating sealant is epoxy resin liquid silica gel.
Described shell of moulding is cube.
Described shell of moulding is epoxy resin.
After the application uses said structure, have the advantages that
The most above-mentioned setting by silver ceramics, can make chip high voltage ceramic capacitor can make single plate shape, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor simple, industrialization cost and market cheaper.
The most above-mentioned structure moulding wire lead slot and metal lead-outs in shell is arranged, and can make chip high voltage ceramic capacitor neat appearance, can be rest directly upon on wiring board, it is not necessary to plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.Meanwhile, metal lead-outs is short, and bending is few, the setting of metal lead-outs flat, and big with the bonding area of the first electrode or the second electrode, big with wiring board fitting area to be fit, contact is reliable.
3. the setting of aforesaid liquid shape electric insulating sealant so that metal lead-outs with mould the fixing the most firm of shell, mould the good insulation preformance of shell, rapid heat dissipation.
The setting of the most above-mentioned removable component, when the filling of liquid electric insulating sealant or fill, can prevent liquid electric insulating sealant from floating in the air to the transverse fit portion of metal lead-outs, thus affect the electric conductivity of metal lead-outs.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of chip high voltage ceramic capacitor of the application.
Detailed description of the invention
With concrete better embodiment, the application is described in further detail below in conjunction with the accompanying drawings.
As shown in Figure 1, a kind of chip high voltage ceramic capacitor, wherein has by porcelain silver strip the 1, first electrode the 11, second electrode 12, moulds the technical characteristics such as shell 2, wire lead slot 21, electrode translot 211, vertical slot 212, opening translot 213, metal lead-outs 3, transverse weld portion 31, vertical bending part 32, transverse fit portion 33, removable component 34 and liquid electric insulating sealant 4.
A kind of chip high voltage ceramic capacitor, including by silver ceramics, mould shell, metal lead-outs and electric insulating sealant.
The above-mentioned setting by silver ceramics, can make chip high voltage ceramic capacitor can make single plate shape, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor simple, industrialization cost and market cheaper.
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics;A metal lead-outs respectively it is welded with on first electrode and the second electrode.
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal lead-outs all includes transverse weld portion, vertical bending part and transverse fit portion;Transverse weld portion is for welding with the first electrode or the second electrode;Transverse fit portion is for being electrically connected with device to be mounted;Vertical bending part is used for connecting transverse weld portion and transverse fit portion.
Moulding shell to be coated on by silver ceramics and the periphery of part metals lead-out wire, that moulds shell is preferably shaped to cube, and the material moulding shell is preferably epoxy resin.
Mould and shell is provided with two wire lead slots, each wire lead slot is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for placing the vertical slot of the vertical bending part of metal lead-outs and for placing the opening translot in metal lead-outs transverse fit portion.
The above-mentioned structure moulding wire lead slot and metal lead-outs in shell is arranged, and can make chip high voltage ceramic capacitor neat appearance, can be rest directly upon on wiring board, it is not necessary to plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.Meanwhile, metal lead-outs is short, and bending is few, the setting of metal lead-outs flat, and big with the bonding area of the first electrode or the second electrode, big with wiring board fitting area to be fit, contact is reliable.
It is positioned in the transverse fit portion moulded outside shell and is provided with removable component, be placed with in the wire lead slot of metal lead-outs and be filled with the liquid electric insulating sealant that can solidify.
The setting of aforesaid liquid shape electric insulating sealant so that metal lead-outs with mould the fixing the most firm of shell, mould the good insulation preformance of shell, rapid heat dissipation.
The setting of above-mentioned removable component, when the filling of liquid electric insulating sealant or fill, can prevent liquid electric insulating sealant from floating in the air to the transverse fit portion of metal lead-outs, thus affect the electric conductivity of metal lead-outs.
Further, above-mentioned removable component is preferably vacuum forming mould.
Further, aforesaid liquid shape electric insulating sealant is preferably epoxy resin liquid silica gel.
The preferred implementation of the application described in detail above; but, the application is not limited to the detail in above-mentioned embodiment, in the technology concept of the application; the technical scheme of the application can be carried out multiple equivalents, these equivalents belong to the protection domain of the application.