CN106024385A - Chip high voltage ceramic dielectric capacitor - Google Patents
Chip high voltage ceramic dielectric capacitor Download PDFInfo
- Publication number
- CN106024385A CN106024385A CN201610555945.9A CN201610555945A CN106024385A CN 106024385 A CN106024385 A CN 106024385A CN 201610555945 A CN201610555945 A CN 201610555945A CN 106024385 A CN106024385 A CN 106024385A
- Authority
- CN
- China
- Prior art keywords
- outs
- transverse
- electrode
- metal lead
- high voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 18
- 239000003990 capacitor Substances 0.000 title abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000000565 sealant Substances 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 6
- 239000003985 ceramic capacitor Substances 0.000 claims description 29
- 239000007788 liquid Substances 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 238000000465 moulding Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000007666 vacuum forming Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007667 floating Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a chip high voltage ceramic dielectric capacitor, which comprises a silver-plated ceramic chip, a plastic case, metal outgoing wires and an insulated sealant, wherein the section of each metal outgoing wire is long strip-shaped; each metal outgoing wire is U-type on the whole; each metal outgoing wire comprises a transverse welding part, a vertical bending part and a transverse fitting part; the transverse welding part is used for being welded with a first electrode or a second electrode; the transverse fitting part is used for being electrically connected with a to-be-mounted device; the vertical bending part is used for being connected with the transverse welding part and the transverse fitting part; a removable assembly is arranged on the transverse fitting part located at the outer side of the plastic shell; and a lead groove is filled with the liquid-shaped insulated sealant capable of being cured. After the above structure is adopted, a single chip shape can be made, the appearance is regular, the chip high voltage ceramic dielectric capacitor can be directly mounted on a circuit board, insertion like a wafer ceramic dielectric capacitor is not needed, and high-efficiency SMT mounting production can be better met.
Description
Technical field
The application relates to a kind of capacitor, particularly a kind of chip high voltage ceramic capacitor.
Background technology
The high-voltage ceramic capacitor produced at present, has disk high-voltage ceramic capacitor, chip multilayer
Ceramic capacitor etc..Disk high-voltage ceramic capacitor is traditional structure, and ceramic two thin long leads of being burn-on on silver strip, surface bag last layer epoxy resin, the circuit board of installation has two apertures to capacitor plug-in mounting.This installation form manufacturability is poor, it is impossible to tolerate high mechanical vibration or impact,
And due to lead-in inductance, use upper frequency limit to be restricted.For adapting to miniaturization, the development trend of slimming, electronic component structure form is changed into, by tradition plug-in, the trend that SMT mounted type becomes irresistible.Chip multilayer ceramic capacitor can meet the needs that SMT attachment produces, as being superimposed as lamellar by ceramic membrane, the chip multilayer ceramic capacitor of two ends coating external electrode structure, it can be made into high pressure larger capacity capacitor, there is certain difficulty in the capacitor making relatively low capacity, and its process equipment and technology want complicated a lot, cause industrialization cost high, pin
Price lattice are the highest.Under this background, the present invention the most just arises at the historic moment.
Summary of the invention
The application to solve the technical problem that being for above-mentioned the deficiencies in the prior art, and a kind of chip high voltage ceramic capacitor is provided, this chip high voltage ceramic capacitor can make single plate shape, neat appearance, can be rest directly upon on wiring board, without plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.Meanwhile, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor is simple, industrialization cost and market cheaper.
For solving above-mentioned technical problem, the application the technical scheme is that
A kind of chip high voltage ceramic capacitor, including by silver ceramics, mould shell, metal lead-outs and electric insulating sealant.
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics；A metal lead-outs respectively it is welded with on first electrode and the second electrode.
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal lead-outs all includes transverse weld portion, vertical bending part and transverse fit portion；Transverse weld portion is for welding with the first electrode or the second electrode；Transverse fit portion is for being electrically connected with device to be mounted；Vertical bending part is used for connecting transverse weld portion and transverse fit portion.
Mould shell and be coated on by silver ceramics and the periphery of part metals lead-out wire, mould and shell is provided with two wire lead slots, each wire lead slot is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for placing the vertical slot of the vertical bending part of metal lead-outs and for placing the opening translot in metal lead-outs transverse fit portion.
It is positioned in the transverse fit portion moulded outside shell and is provided with removable component, be placed with in the wire lead slot of metal lead-outs and be filled with the liquid electric insulating sealant that can solidify.
Described removable component is vacuum forming mould.
Described liquid electric insulating sealant is epoxy resin liquid silica gel.
Described shell of moulding is cube.
Described shell of moulding is epoxy resin.
After the application uses said structure, have the advantages that
The most above-mentioned setting by silver ceramics, can make chip high voltage ceramic capacitor can make single plate shape, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor simple, industrialization cost and market cheaper.
The most above-mentioned structure moulding wire lead slot and metal lead-outs in shell is arranged, and can make chip high voltage ceramic capacitor neat appearance, can be rest directly upon on wiring board, it is not necessary to plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.Meanwhile, metal lead-outs is short, and bending is few, the setting of metal lead-outs flat, and big with the bonding area of the first electrode or the second electrode, big with wiring board fitting area to be fit, contact is reliable.
3. the setting of aforesaid liquid shape electric insulating sealant so that metal lead-outs with mould the fixing the most firm of shell, mould the good insulation preformance of shell, rapid heat dissipation.
The setting of the most above-mentioned removable component, when the filling of liquid electric insulating sealant or fill, can prevent liquid electric insulating sealant from floating in the air to the transverse fit portion of metal lead-outs, thus affect the electric conductivity of metal lead-outs.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of chip high voltage ceramic capacitor of the application.
Detailed description of the invention
With concrete better embodiment, the application is described in further detail below in conjunction with the accompanying drawings.
As shown in Figure 1, a kind of chip high voltage ceramic capacitor, wherein has by porcelain silver strip the 1, first electrode the 11, second electrode 12, moulds the technical characteristics such as shell 2, wire lead slot 21, electrode translot 211, vertical slot 212, opening translot 213, metal lead-outs 3, transverse weld portion 31, vertical bending part 32, transverse fit portion 33, removable component 34 and liquid electric insulating sealant 4.
A kind of chip high voltage ceramic capacitor, including by silver ceramics, mould shell, metal lead-outs and electric insulating sealant.
The above-mentioned setting by silver ceramics, can make chip high voltage ceramic capacitor can make single plate shape, simple in construction, production process equipment and technique relatively chip multilayer ceramic capacitor simple, industrialization cost and market cheaper.
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics；A metal lead-outs respectively it is welded with on first electrode and the second electrode.
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal lead-outs all includes transverse weld portion, vertical bending part and transverse fit portion；Transverse weld portion is for welding with the first electrode or the second electrode；Transverse fit portion is for being electrically connected with device to be mounted；Vertical bending part is used for connecting transverse weld portion and transverse fit portion.
Moulding shell to be coated on by silver ceramics and the periphery of part metals lead-out wire, that moulds shell is preferably shaped to cube, and the material moulding shell is preferably epoxy resin.
Mould and shell is provided with two wire lead slots, each wire lead slot is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for placing the vertical slot of the vertical bending part of metal lead-outs and for placing the opening translot in metal lead-outs transverse fit portion.
The above-mentioned structure moulding wire lead slot and metal lead-outs in shell is arranged, and can make chip high voltage ceramic capacitor neat appearance, can be rest directly upon on wiring board, it is not necessary to plug-in mounting as disk ceramic capacitor, more can be suitable for high efficiency SMT attachment and produce.Meanwhile, metal lead-outs is short, and bending is few, the setting of metal lead-outs flat, and big with the bonding area of the first electrode or the second electrode, big with wiring board fitting area to be fit, contact is reliable.
It is positioned in the transverse fit portion moulded outside shell and is provided with removable component, be placed with in the wire lead slot of metal lead-outs and be filled with the liquid electric insulating sealant that can solidify.
The setting of aforesaid liquid shape electric insulating sealant so that metal lead-outs with mould the fixing the most firm of shell, mould the good insulation preformance of shell, rapid heat dissipation.
The setting of above-mentioned removable component, when the filling of liquid electric insulating sealant or fill, can prevent liquid electric insulating sealant from floating in the air to the transverse fit portion of metal lead-outs, thus affect the electric conductivity of metal lead-outs.
Further, above-mentioned removable component is preferably vacuum forming mould.
Further, aforesaid liquid shape electric insulating sealant is preferably epoxy resin liquid silica gel.
The preferred implementation of the application described in detail above; but, the application is not limited to the detail in above-mentioned embodiment, in the technology concept of the application; the technical scheme of the application can be carried out multiple equivalents, these equivalents belong to the protection domain of the application.
Claims (5)
1. a chip high voltage ceramic capacitor, it is characterised in that: include by silver ceramics, mould shell, metal lead-outs and electric insulating sealant；
Included being positioned at the first electrode of upper surface and being positioned at the second electrode of lower surface by silver ceramics；A metal lead-outs respectively it is welded with on first electrode and the second electrode；
The cross section of every metal lead-outs is strip, and every metal lead-outs entirety is the most U-shaped, and every metal lead-outs all includes transverse weld portion, vertical bending part and transverse fit portion；Transverse weld portion is for welding with the first electrode or the second electrode；Transverse fit portion is for being electrically connected with device to be mounted；Vertical bending part is used for connecting transverse weld portion and transverse fit portion；
Mould shell and be coated on by silver ceramics and the periphery of part metals lead-out wire, mould and shell is provided with two wire lead slots, each wire lead slot is the most U-shaped, and each wire lead slot all includes the electrode translot for placing metal lead-outs transverse weld portion, for placing the vertical slot of the vertical bending part of metal lead-outs and for placing the opening translot in metal lead-outs transverse fit portion；
It is positioned in the transverse fit portion moulded outside shell and is provided with removable component, be placed with in the wire lead slot of metal lead-outs and be filled with the liquid electric insulating sealant that can solidify.
Chip high voltage ceramic capacitor the most according to claim 1, it is characterised in that: described removable component is vacuum forming mould.
Chip high voltage ceramic capacitor the most according to claim 1, it is characterised in that: described liquid electric insulating sealant is epoxy resin liquid silica gel.
Chip high voltage ceramic capacitor the most according to claim 1, it is characterised in that moulding shell described in: is cube.
Chip high voltage ceramic capacitor the most according to claim 1, it is characterised in that moulding shell described in: is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610555945.9A CN106024385B (en) | 2016-07-15 | 2016-07-15 | A kind of chip high voltage ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610555945.9A CN106024385B (en) | 2016-07-15 | 2016-07-15 | A kind of chip high voltage ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106024385A true CN106024385A (en) | 2016-10-12 |
| CN106024385B CN106024385B (en) | 2018-04-20 |
Family
ID=57117882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610555945.9A Active CN106024385B (en) | 2016-07-15 | 2016-07-15 | A kind of chip high voltage ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106024385B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347806A (en) * | 2021-05-31 | 2021-09-03 | 中国科学院长春光学精密机械与物理研究所 | Ceramic dielectric capacitor protection method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3638342A1 (en) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Electrical component, made of ceramic and having multilayer metallisation, and a method for its production |
| JPH05299290A (en) * | 1992-04-24 | 1993-11-12 | Matsushita Electric Ind Co Ltd | Porcelain capacitor |
| CN2541937Y (en) * | 2002-04-29 | 2003-03-26 | 广东南方宏明电子科技股份有限公司 | Chip high voltage ceramic capacitor |
| CN2720593Y (en) * | 2004-07-27 | 2005-08-24 | 广东南方宏明电子科技股份有限公司 | Sheet-type ac. ceramic-medium capacitor |
| CN101685706A (en) * | 2008-09-25 | 2010-03-31 | Tdk株式会社 | Electronic component unit and method for manufacturing same |
| CN205845710U (en) * | 2016-07-15 | 2016-12-28 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic capacitor |
-
2016
- 2016-07-15 CN CN201610555945.9A patent/CN106024385B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3638342A1 (en) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Electrical component, made of ceramic and having multilayer metallisation, and a method for its production |
| JPH05299290A (en) * | 1992-04-24 | 1993-11-12 | Matsushita Electric Ind Co Ltd | Porcelain capacitor |
| CN2541937Y (en) * | 2002-04-29 | 2003-03-26 | 广东南方宏明电子科技股份有限公司 | Chip high voltage ceramic capacitor |
| CN2720593Y (en) * | 2004-07-27 | 2005-08-24 | 广东南方宏明电子科技股份有限公司 | Sheet-type ac. ceramic-medium capacitor |
| CN101685706A (en) * | 2008-09-25 | 2010-03-31 | Tdk株式会社 | Electronic component unit and method for manufacturing same |
| CN205845710U (en) * | 2016-07-15 | 2016-12-28 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347806A (en) * | 2021-05-31 | 2021-09-03 | 中国科学院长春光学精密机械与物理研究所 | Ceramic dielectric capacitor protection method |
| CN113347806B (en) * | 2021-05-31 | 2023-03-24 | 中国科学院长春光学精密机械与物理研究所 | Ceramic dielectric capacitor protection method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106024385B (en) | 2018-04-20 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |