CN106019121A - Converter assembly semiconductor switch component fault locating device and converter assembly - Google Patents
Converter assembly semiconductor switch component fault locating device and converter assembly Download PDFInfo
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- CN106019121A CN106019121A CN201610315832.1A CN201610315832A CN106019121A CN 106019121 A CN106019121 A CN 106019121A CN 201610315832 A CN201610315832 A CN 201610315832A CN 106019121 A CN106019121 A CN 106019121A
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
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Abstract
The invention discloses a converter assembly semiconductor switch component fault locating device and a converter assembly. The device comprises a signal generating module which is electrically connected with the output ends of at least two semiconductor switch components in the converter assembly and is used for generating a working signal according to the current output by the semiconductor switch components in a rectification period, a fault triggering module which is electrically connected with the signal generating module and is used for receiving the working signal generated by the signal generating module and outputting a first fault feedback signal according to the working signal when a rectification fault occurs to the semiconductor switch components, and a locating module which is electrically connected with the fault triggering module and is used for latching the working signal when receiving the first fault feedback signal, so as to locate the faulty semiconductor switch component according to the latched working signal. A fault feedback signal can be output quickly, and a faulty semiconductor switch component module can be located accurately.
Description
Technical field
The present invention relates to change of current component faults detection technique field, particularly relate to quasiconductor in a kind of change of current assembly
Switch block fault locator and change of current assembly.
Background technology
Semiconductor switch parts have high voltage, big electric current, the characteristic such as are prone to drive, operating frequency is wide and quilt
It is widely used in frequency conversion equipment.Along with semiconductor switch component voltage, electric current, constantly the carrying of frequency level
Rise, semiconductor switch parts in use, often because of and very short time cross flow, overvoltage cause damage
Bad.Affect the normal use of frequency conversion equipment.In semiconductor switch unit Series circuit, a quasiconductor is opened
Close parts damages, the voltage that other semiconductor switch parts are born can be increased, and then increase other quasiconductors
The probability that switch block damages；When situation is serious, the control of whole semiconductor switch unit Series circuit can be destroyed
System processed, thus cause bigger system loss and security incident.Accordingly, it would be desirable to timely to frequency conversion equipment
Middle semiconductor switch parts detect, and position malfunctioning semiconductor switch block, with in time to fault
Semiconductor switch parts place under repair or replace.
At present, solution to the problems described above mainly by testing circuit detection semiconductor switch part set electrode-
Whether emitter voltage drops to 0, it is judged that whether current semiconductor switch block is malfunctioning semiconductor switch block
Block.Although the method can accurately determine in frequency conversion equipment, whether current semiconductor switch block is trouble unit.
But, owing to the circuit of frequency conversion equipment frequently including multiple semiconductor switch parts, if partly led each
Body switch block all configures the testing circuit of correspondence, then whole frequency conversion equipment is accomplished by multiple testing circuit,
I.e. reduce the reliability of frequency conversion equipment, too increase the cost of frequency conversion equipment simultaneously.
Summary of the invention
In view of this, semiconductor switch unit failure location dress during the embodiment of the present invention provides a kind of change of current assembly
Put and change of current assembly, to realize the purpose of the location malfunctioning semiconductor switch block of fast and reliable.
First aspect, embodiments provides semiconductor switch unit failure location in a kind of change of current assembly
Device, including:
Signal generation module, described signal generation module and at least two semiconductor switch in described change of current assembly
The outfan of parts is electrically connected, for according to described semiconductor switch parts within a commutation cycle defeated
The electric current gone out generates working signal, and described working signal includes: normal working signal and fail operation signal；
Fault trigger module, described fault trigger module electrically connects with described signal generation module, is used for receiving
The working signal that described signal generation module generates, and when described semiconductor switch parts rectification failure, root
Fisrt fault feedback signal is exported according to described working signal；
Locating module, described locating module electrically connects with fault trigger module, for receiving described first
During fault feedback signal, latch described working signal, with according to the working signal location malfunctioning semiconductor latched
Switch block.
Further, described fault trigger module is multi input and door.
Further, described locating module includes:
Latch units, electrically connects with described fault trigger module, for receiving described Fisrt fault feedback
During signal, latch described working signal；
Signal source searches unit, is connected with latch units, for searching fault work according to the working signal latched
Make the signal source of multi input corresponding to signal and door；
Positioning unit, searches unit with described signal source and is connected, for the signal source that finds of basis with partly lead
The corresponding relation of body switch block, positions malfunctioning semiconductor switch block.
Further, described locating module uses on-site programmable gate array FPGA to realize.
Further, described device also includes: logic protection module, and the load with described change of current assembly is connected,
For when receiving described Fisrt fault feedback signal, starting virtual protection, described logic protection module uses
Described FPGA realizes.
Further, described device also includes: Digital Signal Processing DSP, described DSP and described locating module
Electrical connection；
Described locating module is used for: when receiving described Fisrt fault feedback signal, sends second to DSP
Fault feedback signal；
Described DSP is used for: when receiving described second fault feedback signal, starts programmed protection.
Further, described DSP is additionally operable to: when receiving described second fault feedback signal, by changing
The current peak of the current sensor sampling change of current assembly outfan that stream assembly outfan connects.
Further, described multi input includes with door: rectification multi input and door and inversion multi input and door；
Described rectification multi input and door, for receiving the semiconductor switch parts of rectifier stack in change of current assembly
Rectification working signal, and when described semiconductor switch parts rectification failure, defeated according to described rectification working signal
Be out of order feedback signal；
Described inversion multi input and door, for receiving the semiconductor switch parts of inversion assembly in change of current assembly
Inversion working signal, and when described semiconductor switch parts inversion fault, defeated according to described inversion working signal
Be out of order feedback signal.
Further, described multi input includes with door: rectification multi input and door and inversion multi input and door；
Described rectification multi input and door, for receiving the semiconductor switch parts of rectifier stack in change of current assembly
Rectification working signal, and when described semiconductor switch parts rectification failure, defeated according to described rectification working signal
Be out of order feedback signal；
Described inversion multi input and door, for receiving the semiconductor switch parts of inversion assembly in change of current assembly
Inversion working signal, and when described semiconductor switch parts inversion fault, defeated according to described inversion working signal
Be out of order feedback signal.
Second aspect, embodiments provides a kind of change of current assembly, including arbitrary change of current of above-mentioned offer
Semiconductor switch unit failure positioner in assembly.
The positioner of semiconductor switch unit failure and change of current group in the change of current assembly that the embodiment of the present invention provides
Part, by the fault-signal generated according to the working signal of semiconductor switch component models at fault trigger module
Time, the working signal of quasiconductor switch block module is latched by locating module, and can be according to the work latched
The position of the semiconductor switch component models broken down is determined as signal.Semiconductor switch in change of current assembly
During unit failure, can quickly export fault feedback signal, and location malfunctioning semiconductor switch portion accurately
Part, facilitates test and the maintenance of semiconductor switch parts in change of current assembly, decreases workload, reduce dimension
Protect cost.
Accompanying drawing explanation
The detailed description that non-limiting example is made made with reference to the following drawings by reading, the present invention
Other features, objects and advantages will become more apparent upon:
Fig. 1 is the positioner of semiconductor switch unit failure in the change of current assembly that the embodiment of the present invention one provides
Circuit connection diagram；
Fig. 2 is the positioner of semiconductor switch unit failure in the change of current assembly that the embodiment of the present invention two provides
Circuit connection diagram；
Fig. 3 is the positioner of semiconductor switch unit failure in the change of current assembly that the embodiment of the present invention three provides
Circuit connection diagram；；
The positioner of semiconductor switch unit failure in the change of current assembly that Fig. 4 embodiment of the present invention four provides
Circuit connection diagram.
The technical characteristic that reference in figure refers to respectively is:
1, semiconductor switch parts；2, signal generation module；3, fault trigger module；
4, locating module；5、DSP；6, rectification multi input and door；7, inversion multi input and door；
8, photoelectrical coupler.
Detailed description of the invention
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.It is understood that this
Specific embodiment described by place is used only for explaining the present invention, rather than limitation of the invention.The most also need
Be noted that for the ease of describing, accompanying drawing illustrate only part related to the present invention and not all in
Hold.
In embodiments of the present invention, in the case of illustrating on the contrary, the noun of locality of use is as " above,
Under, top, the end " be typically for for direction shown in the drawings or for vertical, vertical or gravity
Each parts mutual alignment relationship description word on direction.
Embodiment one
The embodiment of the present invention one provides the positioner of semiconductor switch unit failure in a kind of change of current assembly.
Fig. 1 is the electricity of the positioner of semiconductor switch unit failure in the change of current assembly that the embodiment of the present invention one provides
Road connection diagram.As it is shown in figure 1, the location of semiconductor switch component models fault in described change of current assembly
Device includes: signal generation module, and described signal generation module is partly led with at least two in described change of current assembly
The outfan of body switch block 1 is electrically connected, for whole at one according to described semiconductor switch parts 1
In the stream cycle, the electric current of output generates working signal, and described working signal includes: normal working signal and fault
Working signal；Fault trigger module 3, described fault trigger module 3 is electrically connected with described signal generation module 2
Connect, for receiving the working signal that described signal generation module 2 generates, and at described semiconductor switch parts 1
During rectification failure, export Fisrt fault feedback signal according to described working signal；Locating module 4, described fixed
Position module 4 electrically connects with fault trigger module 3, is used for when receiving described Fisrt fault feedback signal,
Latch described working signal, position malfunctioning semiconductor switch block 1 with the working signal according to described latch.
Change of current assembly includes at least two semiconductor switch parts 1, in signal generation module 2 and change of current parts
Semiconductor switch parts 1 are connected respectively, can be according to described semiconductor switch parts 1 a rectification
In cycle, the electric current of output generates working signal.Fault trigger module 3 connects respectively with signal generation module 2
Connect, the working signal of semiconductor switch parts 1 module of change of current assembly, this working signal bag can be received
Include: normal working signal and fail operation signal.Exemplary, described normal working signal can be numeral
Signal " 1 ", represents semiconductor switch parts 1 and normally works, and fail operation signal can be digital signal
" 0 " represents semiconductor switch parts 1 module failure.In the present embodiment, how defeated fault trigger module 3 be
Entering and door, fault trigger module 3 can be realized by the IC with above-mentioned functions.Exemplary, can include
Multiple 2 input and doors, or by a multi input and door.Fault trigger module 3 letter can be to the work of input
Carry out and computing as signal, when all semiconductor switch parts 1 can normally work, fault trigger module 3
The working signal received is all 1, then through with computing after, it is 1 that fault trigger module 3 exports result；?
When in all semiconductor switch parts 1, at least semiconductor switch parts 1 can not normally work, i.e.
Output result at least one 0 time, fault trigger module 3 through and computing output result be 0, much the most defeated
Entering and export fault-signal with door, fault trigger module 3 electrically connects with locating module 4, and locating module 4 is used for
When receiving described Fisrt fault feedback signal, latch described working signal, with the work according to described latch
Make signal framing malfunctioning semiconductor switch block 1.Concrete, locating module 4 includes: latch units, with institute
State fault trigger module 3 to electrically connect, for when receiving described Fisrt fault feedback signal, latch described
Working signal；Signal source searches unit, is connected with latch units, for searching according to the working signal latched
The signal source of multi input corresponding to fail operation signal and door；Positioning unit, searches unit with described signal source
It is connected, for the corresponding relation according to the signal source found with semiconductor switch parts 1, location fault half
Conductor switch block 1.Latch each semiconductor switch parts 1 working signal in current period.Can root
Malfunctioning semiconductor switch block 1 is positioned according to the working signal of described latch.Locating module 4 can use has latch
The integrated chip IC of function realizes above-mentioned functions.
In the present embodiment, locating module 4 uses on-site programmable gate array FPGA, and FPGA can be used to
Realize the combination of some basic logic gates (such as AND, OR, XOR, NOT) or more more complicated
Function such as decoder or mathematical equation.Inside most FPGA, in these editable elements also
Comprise memory cell such as trigger (Flip-flop) or other more complete block of memory.Although FPGA
In general the speed than ASIC (special IC) is slow, it is achieved same function is than ASIC circuit face
Long-pending big.But it has cost and the advantage of quick finished product.Exemplary, semiconductor switch parts 1
During raw fault, checked each semiconductor switch portion of current latch successively by on-site programmable gate array FPGA
The working signal of part 1, if the working signal latching semiconductor switch parts 1 is 0, then the half of location correspondence
Conductor switch block 1 module failure；If the working signal latching semiconductor switch parts 1 is 1, then position
Corresponding semiconductor switch parts 1 module is normal.Concrete, due to for each semiconductor switch parts 1
Multi input has corresponding interface with door, can search fault-signal according to the working signal of described latch corresponding
The signal source of multi input and door；According to the corresponding relation of described signal source Yu semiconductor switch parts 1, fixed
Position malfunctioning semiconductor switch block 1.Locating module 4 may be used without having the integrated chip IC of latch function to be come
Realize above-mentioned functions.
Additionally, semiconductor switch parts can be in the present embodiment: in IGBT, GTO, IGCT or IEGT
Any one or multiple combination.
The positioner of semiconductor switch unit failure in the change of current assembly that the present embodiment provides, by fault
During the fault-signal that trigger module generates according to the working signal of semiconductor switch parts, locating module is half-and-half led
The working signal of body switch block latches, and can determine half broken down according to the working signal latched
The position of conductor switch block.In the change of current assembly during semiconductor switch unit failure, can quickly export event
Barrier feedback signal, and location malfunctioning semiconductor switch block accurately, facilitate quasiconductor in change of current assembly to open
Close test and the maintenance of parts, decrease workload, reduce maintenance cost.
Embodiment two
Fig. 2 is the positioner of semiconductor switch unit failure in the change of current assembly that the embodiment of the present invention two provides
Circuit connection diagram.The present embodiment is based on above-described embodiment.Further, described multi input with
Door includes: rectification multi input and door 6 and inversion multi input and door 7；Described rectification multi input and door 6, be used for
Receive the rectification working signal of the semiconductor switch parts of rectifier stack in change of current assembly, and at described quasiconductor
During switch block rectification failure, how defeated according to inversion described in described rectification working signal output fault feedback signal
Enter and door 7, for receiving the inversion working signal of the semiconductor switch parts of inversion assembly in change of current assembly, and
When described semiconductor switch parts inversion fault, export fault feedback letter according to described inversion working signal
Number.
As seen from Figure 2, the described multi input that the present embodiment provides includes with door: rectification multi input and door 6
With inversion multi input and door 7, described rectification multi input and door 6, receive the semiconductor switch parts of rectifier stack
The rectification working signal of 1 module, and when described semiconductor switch parts 1 rectification module fault, according to described whole
Stream working signal output fault feedback signal；Described inversion multi input and door 7 receive inversion semiconductor switch portion
The inversion working signal of part 1 module, and when described semiconductor switch parts 1 inversion module fault, according to institute
State inversion working signal output fault feedback signal.
In general, the change of current includes that rectification and two steps of inversion, i.e. electric current produce AC-DC-exchange and become
Change.Rectification circuit is circuit AC energy being converted to direct current energy.Rectified three-phase circuit mainly completes three
Cross streams electricity to galvanic conversion, is used widely in the field such as speed governing of dc motor.In this reality
Execute in example, in switching process, the AC of three phase semiconductor switch block rectifier circuit and external communication
Power supply connect, DC side connect load, the signal output part of semiconductor switch parts 1 commutation driver circuit and
The pulse signal input terminal of three phase semiconductor switch block inverter bridge circuit connects；Three phase semiconductor switch block
How defeated the outfan of each semiconductor switch parts 1 of inverter bridge circuit is with rectification by signal generation module 2
Introduction is connected, and rectification multi input door receives the working signal that signal generation module 2 generates.By said structure
It can be seen that include 6 semiconductor switch parts 1 altogether in rectifier terminal, rectification multi input and door 6 are 6 inputs
With door, the working signal of 6 semiconductor switch parts 1 correspondences in rectified three-phase circuit can be received.
Accordingly, in reversals, the rectification side of three phase semiconductor switch block inverter bridge circuit and rectification
The DC source of bridge output connects, and AC connects load, the letter of semiconductor switch parts inverse changing driving circuit
The pulse signal input terminal of number outfan and three phase semiconductor switch block inverter bridge circuit connects；Three-phase is partly led
The outfan of each semiconductor switch parts 1 of body switch block inverter bridge circuit passes through signal generation module 2
It is connected with inversion multi input door.Inversion multi input door receives the working signal that signal generation module 2 generates.
Include that 6 semiconductor switch parts 1 inversion multi input and door 7 are 6 inputs and door altogether at inversion end, permissible
Receive the working signal that in rectified three-phase circuit, inversion semiconductor switch parts are corresponding.
The present embodiment is by being optimized for rectification multi input and door and inversion multi input and door by multi input and door, logical
With door, over commutation multi input may determine that the semiconductor switch parts of current failure belong to door and inversion multi input
Rectification part or inversion parts, the convenient test to quasiconductor switch block module and maintenance, decrease work
Measure, reduce maintenance cost.
Embodiment three
Fig. 3 is the positioner of semiconductor switch unit failure in the change of current assembly that the embodiment of the present invention three provides
Circuit connection diagram.The present embodiment is based on above-described embodiment.Further, in change of current assembly partly
The positioner of conductor switch block fault also includes: logic protection module, with the load of described change of current assembly
It is connected, for when receiving described Fisrt fault feedback signal, starts virtual protection, described virtual protection mould
Block uses described FPGA to realize.With digital signal processor DSP5, described DSP5 and described locating module 4
Electrical connection；Described locating module 4 is used for: when receiving described Fisrt fault feedback signal, send out to DSP5
Send the second fault feedback signal；Described DSP5 is used for: when receiving described second fault feedback signal, open
Dynamic program is protected.In the present embodiment, locating module 4 is realized by FPGA, and FPGA is due to its logical process energy
Power is relatively strong, and is better than DSP5 in the sequential receiving fault-signal, starts first class of protection, i.e. by logic
Reason opens virtual protection.And the inside of DSP5 uses program and the separate Harvard structure of data, have special
Hardware multiplier, widely used pile line operation, it is provided that special DSP5 instruction, can be used to quick reality
Existing various digital signal processing algorithms, it is adaptable to motor control, Electric Drive, data collecting and processing in situ
In field.Its superiority shows themselves in that 1. motilities are good: when processing method and parameter change, and processes
System only need to be by changing software design to adapt to change accordingly.2. precision is high: signal processing system is permissible
The figure place, the word length of processor and the suitable algorithm that are converted by A/D meet required precision.3. good reliability:
The impact that processing system is caused by the interference of ambient temperature, humidity, noise and electromagnetic field is less.In this reality
Executing in example, DSP5 and FPGA is collectively as the control unit of change of current assembly, when receiving fault-signal, and association
Protect with to change of current assembly and load thereof.；DSP5 is due to the advantage in terms of its sequential operation, for connecing
When receiving the second fault-signal that locating module 4 sends, start second class protection, i.e. opened by routine processes
Programmed protection.By the coordinated of DSP5 and FPGA, it is achieved when semiconductor switch parts 1 fault,
Protection can be opened in time, so that change of current assembly and load are avoided owing to semiconductor switch parts 1 fault is led
The infringement caused.
Additionally, in the present embodiment, current sensor, described electricity can be provided with at the outfan of change of current assembly
Flow sensor is connected with change of current assembly outfan, can collect the current value of change of current assembly.Current sense
Device is connected with DSP5, and when DSP5 receives the second fault-signal that locating module 4 sends, DSP5 is permissible
By the current peak of current sensor sampling change of current assembly outfan, and store this peak value, convenient work people
Member checks.
The present embodiment by increase digital signal processor DSP, can with logic protection module collaborative work,
During semiconductor switch unit failure, it is possible to open protection in time so that the load of change of current assembly avoid due to
The infringement that semiconductor switch unit failure causes.
Embodiment four
Fig. 4 is the positioner of semiconductor switch unit failure in the change of current assembly that the embodiment of the present invention four provides
Circuit connection diagram.The present embodiment is based on above-described embodiment, further, by signal generating unit
Part is specifically optimized for photoelectrical coupler 8, and described photoelectrical coupler 8 gathers the telecommunications of semiconductor switch parts output
Number, and the described signal of telecommunication is converted to digital signal.
Photoelectrical coupler 8 is with light for the media transmission signal of telecommunication.It input, the output signal of telecommunication are had good every
From effect.One of photoelectric device that it has become most species, purposes is the widest at present.See Fig. 4, at this
In embodiment, described photoelectrical coupler 8 defeated with each semiconductor switch parts 1 in change of current assembly respectively
Go out end and multi input electrically connects with door, exemplary, it is allowed to send the light of certain wavelength, by photo-detector
Receive and produce photoelectric current, then export after amplifying further.This completes the conversion of electrical-optical-electrical,
Thus play input, the effect exporting, isolating.Every with change of current assembly of the luminous source of photoelectrical coupler 8
The outfan electrical connection of individual semiconductor switch parts 1, when the outfan of conductor switch block exports electric current,
Signal of telecommunication driven for emitting lights diode (LED) luminous source of input produces optical signal, and by optical fiber by optical signal
Being transferred to the light-receiving device of photoelectrical coupler 8, light-receiving device is mainly made up of light-sensitive device, and light-sensitive device is the most all
It is optical transistor, is converted to high level digital signal receiving optical signal.
The present embodiment, by signal generating unit is specifically optimized for photoelectrical coupler, utilizes photoelectrical coupler to incite somebody to action
The signal of telecommunication transfers corresponding high level signal to.Owing to photoelectrical coupler has good buffer action, can keep away
Exempt to be disturbed by the electromagnetic signal of other parts in change of current assembly when converting electrical signals to digital signal, have
Effect improves the accuracy of working signal.
The embodiment of the present invention also provides for a kind of change of current assembly, and this change of current assembly includes that any of the above-described embodiment is retouched
In the change of current assembly stated, the positioner of semiconductor switch unit failure, has the merit that above-described embodiment is identical
Energy.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.Those skilled in the art
It will be appreciated that the invention is not restricted to specific embodiment described here, can enter for a person skilled in the art
Row various obvious changes, readjust and substitute without departing from protection scope of the present invention.Therefore, though
So by above example, the present invention is described in further detail, but the present invention be not limited only to
Upper embodiment, without departing from the inventive concept, it is also possible to include other Equivalent embodiments more,
And the scope of the present invention is determined by scope of the appended claims.
Claims (10)
1. the positioner of semiconductor switch unit failure in a change of current assembly, it is characterised in that including:
Signal generation module, described signal generation module and at least two semiconductor switch in described change of current assembly
The outfan of parts is electrically connected, for according to described semiconductor switch parts within a commutation cycle defeated
The electric current gone out generates working signal, and described working signal includes: normal working signal and fail operation signal；
Fault trigger module, described fault trigger module electrically connects with described signal generation module, is used for receiving
The working signal that described signal generation module generates, and when described semiconductor switch parts rectification failure, root
Fisrt fault feedback signal is exported according to described working signal；
Locating module, described locating module electrically connects with fault trigger module, for receiving described first
During fault feedback signal, latch described working signal, with according to the working signal location malfunctioning semiconductor latched
Switch block.
Device the most according to claim 1, it is characterised in that: described fault trigger module is multi input
With door.
Device the most according to claim 1, it is characterised in that described locating module includes:
Latch units, electrically connects with described fault trigger module, for receiving described Fisrt fault feedback
During signal, latch described working signal；
Signal source searches unit, is connected with latch units, for searching fault work according to the working signal latched
Make the signal source of multi input corresponding to signal and door；
Positioning unit, searches unit with described signal source and is connected, for the signal source that finds of basis with partly lead
The corresponding relation of body switch block, positions malfunctioning semiconductor switch block.
Device the most according to claim 1, it is characterised in that described locating module uses scene to compile
Journey gate array FPGA realizes.
Device the most according to claim 4, it is characterised in that described device also includes:
Logic protection module, the load with described change of current assembly is connected, for receiving described Fisrt fault
During feedback signal, starting virtual protection, described logic protection module uses described FPGA to realize.
Device the most according to claim 1, it is characterised in that described device also includes: digital signal
Process DSP, described DSP to electrically connect with described locating module；
Described locating module is used for: when receiving described Fisrt fault feedback signal, sends second to DSP
Fault feedback signal；
Described DSP is used for: when receiving described second fault feedback signal, starts programmed protection.
Device the most according to claim 6, it is characterised in that described DSP is additionally operable to: receiving
During described second fault feedback signal, the current sensor sampling change of current group connected by change of current assembly outfan
The current peak of part outfan.
Device the most according to claim 2, it is characterised in that described multi input includes with door: rectification
Multi input and door and inversion multi input and door；
Described rectification multi input and door, for receiving the semiconductor switch parts of rectifier stack in change of current assembly
Rectification working signal, and when described semiconductor switch parts rectification failure, defeated according to described rectification working signal
Be out of order feedback signal；
Described inversion multi input and door, for receiving the semiconductor switch parts of inversion assembly in change of current assembly
Inversion working signal, and when described semiconductor switch parts inversion fault, defeated according to described inversion working signal
Be out of order feedback signal.
Device the most according to claim 1, it is characterised in that described signal generating unit includes: light
Electric coupler, described electric coupler gathers the current signal of semiconductor switch parts output, and by described electric current
Signal is converted to digital signal.
10. a change of current assembly, it is characterised in that including: the arbitrary described change of current assembly of claim 1-9
The positioner of middle semiconductor switch unit failure.
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| CN201610315832.1A CN106019121B (en) | 2016-05-12 | 2016-05-12 | Semiconductor switch component fault positioning device in converter assembly and converter assembly |
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| CN201610315832.1A CN106019121B (en) | 2016-05-12 | 2016-05-12 | Semiconductor switch component fault positioning device in converter assembly and converter assembly |
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| CN106019121B CN106019121B (en) | 2023-12-01 |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101686044A (en) * | 2009-03-25 | 2010-03-31 | 深圳市科陆变频器有限公司 | IGBT drive protection circuit |
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| CN204993289U (en) * | 2015-07-16 | 2016-01-20 | 艾恩格电气（北京）有限公司 | Igbt drive circuit |
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