CN106011858A - High copper content etching solution regeneration cycle system - Google Patents
High copper content etching solution regeneration cycle system Download PDFInfo
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- CN106011858A CN106011858A CN201610646322.2A CN201610646322A CN106011858A CN 106011858 A CN106011858 A CN 106011858A CN 201610646322 A CN201610646322 A CN 201610646322A CN 106011858 A CN106011858 A CN 106011858A
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- Prior art keywords
- pipeline
- etching
- regeneration
- elevator pump
- solution
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a high copper content etching solution regeneration cycle system. The system comprises an etching line (1), a dissolution regeneration cylinder (3) and a filter (10). The etching line (1) is connected to the dissolution regeneration cylinder (3) through a pipe and the pipe is provided with a waste liquid elevator pump (2). The dissolution regeneration cylinder (3) is connected to the filter (10) through a pipe and the pipe is provided with an etching solution elevator pump (11). The filter (10) is communicated with the etching line (1). The system has the advantages of zero discharge, no pollution and low production cost.
Description
Technical field
The present invention relates to technical field, particularly a kind of high regeneration cycle system Han copper etchant solution.
Background technology
Acidic etching liquid is the etching solution that a kind of applicable printed circuit board fine-line makes, multi-layer sheet internal layer makes.Along with the carrying out of dynamic etch, cuprous complex ion concentration and total copper concentration in etching solution are continuously increased, and show as the oxidation-reduction potential of etching solution and constantly reduce and be continuously increased with density.When the oxidation-reduction potential of etching solution is less than set-point, it is necessary for carrying out chemical regeneration and could remain stable, quickly etch.
At present, domestic typically with the oxidant such as sodium chlorate solution or hydrogen peroxide carry out chemical regeneration (Zhang Zhi is auspicious. the discussion of sodium chlorate/salt acid type etch copper regenerative agent. " printed circuit information " 2002 (3): 40～42), i.e. utilize the strong oxidizing property of sodium chlorate or hydrogen peroxide, cuprous complex ion is oxidized to copper complex ion, thus recover the etching usefulness of etching solution, add pure water auxiliary simultaneously and reduce the density of etching solution, make the oxidation-reduction potential of etching solution and density all in the range of etch process requires.The method is usually according to the situation of change of etching solution oxidation-reduction potential in measuring flume, it is interrupted and adds the oxidant such as sodium chlorate solution or hydrogen peroxide to etching in cylinder, the chemical reagent of the chloride ion-containings such as hydrochloric acid must also be added, to ensure the chlorine complex ion having abundance in etching solution simultaneously.For maintaining the liquid level of etching solution in etching cylinder constant, it is necessary to externally discharge etching waste liquor.This etching waste liquor is transferred to strange land, simply recycles with the form of copper or copper compound, and other ions are with discharge of wastewater, it is clear that this way had both polluted environment, wasted again resource.
Summary of the invention
It is an object of the invention to overcome the shortcoming of prior art, it is provided that a kind of zero-emission, high regeneration cycle system Han copper etchant solution that pollution-free and production cost is low.
The purpose of the present invention is achieved through the following technical solutions: a kind of high regeneration cycle system Han copper etchant solution, it includes etching line, dissolve regeneration cylinder, filter, described etching line is connected by pipeline with dissolving regeneration cylinder, and on this pipeline, it is provided with waste liquid elevator pump, described dissolving regeneration cylinder is connected by pipeline with filter, and is provided with etching solution elevator pump on this pipeline, and described filter connects with etching line.
Described dissolving regeneration cylinder is also communicated with mother liquor tank by pipeline, and described mother liquor tank is by pipeline and acidity etching liquid recycling system connectivity, and is provided with mother solution elevator pump on this pipeline, and described acidity etching liquid recycling system is connected with carrying copper device.
Described acidity etching liquid recycling system is connected by pipeline regenerated liquid holding vessel, and on this pipeline, it is provided with circular regeneration liquid elevator pump, described regenerated liquid holding vessel is connected with dissolving regeneration cylinder by pipeline, and is provided with regenerated liquid elevator pump on this pipeline.
Described acidity etching liquid recycling system is connected with dissolving regeneration cylinder by powerful oxidation corrosion resistance pipeline.
The invention have the advantages that high regeneration cycle system Han copper etchant solution of the present invention, regenerate by dissolving regeneration cylinder, achieve the high regeneration containing copper etchant solution, and this blood circulation is additionally provided with acidity etching liquid recycling system, unnecessary etching solution can be carried out regeneration and carry copper, mother solution and Strong oxdiative gas can be provided again for dissolving regeneration cylinder, in whole blood circulation, without noxious gas emission, without discharging of waste liquid, and sour gas can be made to obtain secondary utilization, thus save production cost, it is achieved that zero-emission, pollution-free purpose.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention
In figure, 1-etching line, 2-waste liquid elevator pump, 3-dissolves regeneration cylinder, 4-mother liquor tank, 5-mother solution elevator pump, 6-acidity etching liquid recycling system, 7-circular regeneration liquid elevator pump, 8-regenerated liquid holding vessel, 9-regenerated liquid elevator pump, 10-filter, 11-etching solution elevator pump, 12-carries copper device.
Detailed description of the invention
The present invention will be further described below in conjunction with the accompanying drawings, and protection scope of the present invention is not limited to the following stated:
nullAs shown in Figure 1，A kind of high regeneration cycle system Han copper etchant solution，It includes etching line 1，Dissolve regeneration cylinder 3、Filter 10，Described etching line 1 is connected by pipeline with dissolving regeneration cylinder 3，And on this pipeline, it is provided with waste liquid elevator pump 2，Described dissolving regeneration cylinder 3 is connected by pipeline with filter 10，And on this pipeline, it is provided with etching solution elevator pump 11，Described filter 10 connects with etching line 1，Height in etching line 1 is sent in dissolving regeneration cylinder 3 by waste liquid elevator pump 2 containing copper etchant solution，Strong oxidizer and regenerated liquid is added in dissolving regeneration cylinder 3，So that the height dissolved in regeneration cylinder 3 is regenerated as cupric containing the monovalence copper in copper etchant solution，And the OPR of etching solution and proportion are reduced，Etching solution is made to reply strong etching performance，Etching solution after regeneration is sent to filter 10 by etching solution elevator pump 11 again，Etching solution is after filter 10 filters，Then enter back in etching line 1，Thus ensure that the etching efficiency of etching line 1.
In the present embodiment, described dissolving regeneration cylinder 3 is also communicated with mother liquor tank 4 by pipeline, after dissolving the etching solution regenerated in cylinder 3 and be too much, during then etching solution overflow enters into mother liquor tank 4, described mother liquor tank 4 is connected with acidity etching liquid recycling system 6 by pipeline, and on this pipeline, it is provided with mother solution elevator pump 5, mother solution is sent to acidity etching liquid recycling system 6 by mother solution elevator pump 5, mother solution is regenerated, and described acidity etching liquid recycling system 6 is connected with carrying copper device 12, by carrying copper device 12, the copper in mother solution is extracted.
In the present embodiment, described acidity etching liquid recycling system 6 is connected by pipeline regenerated liquid holding vessel 8, and on this pipeline, it is provided with circular regeneration liquid elevator pump 7, described regenerated liquid holding vessel 8 is connected with dissolving regeneration cylinder 3 by pipeline, and on this pipeline, it is provided with regenerated liquid elevator pump 9, mother solution obtains regenerated liquid after being regenerated by acidity etching liquid recycling system 6, regenerated liquid is sent in regenerated liquid holding vessel 8 store by circular regeneration liquid elevator pump 7, when dissolving regeneration cylinder 3 and needing regenerated liquid, then regenerated liquid is sent to dissolve regeneration cylinder by regenerated liquid elevator pump 9.
In the present embodiment, described acidity etching liquid recycling system 6 is connected with dissolving regeneration cylinder 3 by powerful oxidation corrosion resistance pipeline, acidity etching liquid recycling system 6 is in regenerative process, the sour gas produced, such as chlorine, it has strong oxidizing property, in the present invention, chlorine is led into dissolving regeneration cylinder 3 by pipeline, by the strong oxidizing property of chlorine, monovalence copper is made to be converted into cupric, so that the sour gas in acidity etching liquid recycling system 6 is without discharge, and achieve exhaust gas utilization, i.e. save production cost, reach again the purpose of environmental protection, and eliminate the process technique of sour gas in acidity etching liquid recycling system 6, thus reduce equipment cost.
The work process of the present invention is as follows: the height in etching line 1 is sent in dissolving regeneration cylinder 3 containing copper etchant solution by waste liquid elevator pump 2, strong oxidizer and regenerated liquid is added in dissolving regeneration cylinder 3, so that the height dissolved in regeneration cylinder 3 is regenerated as cupric containing the monovalence copper in copper etchant solution, and the OPR of etching solution and proportion are reduced, etching solution is made to reply strong etching performance, etching solution after regeneration is sent to filter 10 by etching solution elevator pump 11 again, etching solution is after filter 10 filters, then enter back in etching line 1, thus ensure that the etching efficiency of etching line 1.
Claims (4)
1. one kind high containing copper etchant solution regeneration cycle system, it is characterized in that: it includes etching line (1), dissolve regeneration cylinder (3), filter (10), described etching line (1) is connected by pipeline with dissolving regeneration cylinder (3), and on this pipeline, it is provided with waste liquid elevator pump (2), described dissolving regeneration cylinder (3) is connected by pipeline with filter (10), and is provided with etching solution elevator pump (11) on this pipeline, and described filter (10) connects with etching line (1).
A kind of high regeneration cycle system Han copper etchant solution the most according to claim 1, it is characterized in that: described dissolving regeneration cylinder (3) is also communicated with mother liquor tank (4) by pipeline, described mother liquor tank (4) is connected with acidity etching liquid recycling system (6) by pipeline, and on this pipeline, it being provided with mother solution elevator pump (5), described acidity etching liquid recycling system (6) is connected with carrying copper device (12).
A kind of high regeneration cycle system Han copper etchant solution the most according to claim 2, it is characterized in that: described acidity etching liquid recycling system (6) is connected by pipeline regenerated liquid holding vessel (8), and on this pipeline, it is provided with circular regeneration liquid elevator pump (7), described regenerated liquid holding vessel (8) is connected with dissolving regeneration cylinder (3) by pipeline, and is provided with regenerated liquid elevator pump (9) on this pipeline.
A kind of high regeneration cycle system Han copper etchant solution the most according to claim 2, it is characterised in that: described acidity etching liquid recycling system (6) is connected with dissolving regeneration cylinder (3) by powerful oxidation corrosion resistance pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610646322.2A CN106011858A (en) | 2016-08-09 | 2016-08-09 | High copper content etching solution regeneration cycle system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610646322.2A CN106011858A (en) | 2016-08-09 | 2016-08-09 | High copper content etching solution regeneration cycle system |
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| CN106011858A true CN106011858A (en) | 2016-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610646322.2A Pending CN106011858A (en) | 2016-08-09 | 2016-08-09 | High copper content etching solution regeneration cycle system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111926334A (en) * | 2020-09-08 | 2020-11-13 | 深圳市志凌伟业光电有限公司 | Regeneration system and regeneration method for acidic copper chloride etching solution |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105177584A (en) * | 2015-09-09 | 2015-12-23 | 成都虹华环保科技股份有限公司 | Acidic waste etching solution cyclic regeneration system with regenerated liquid treatment function |
| CN205974669U (en) * | 2016-08-09 | 2017-02-22 | 成都虹华环保科技股份有限公司 | High copper -containing etching solution regeneration cycle system |
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2016
- 2016-08-09 CN CN201610646322.2A patent/CN106011858A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105177584A (en) * | 2015-09-09 | 2015-12-23 | 成都虹华环保科技股份有限公司 | Acidic waste etching solution cyclic regeneration system with regenerated liquid treatment function |
| CN205974669U (en) * | 2016-08-09 | 2017-02-22 | 成都虹华环保科技股份有限公司 | High copper -containing etching solution regeneration cycle system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111926334A (en) * | 2020-09-08 | 2020-11-13 | 深圳市志凌伟业光电有限公司 | Regeneration system and regeneration method for acidic copper chloride etching solution |
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Application publication date: 20161012 |
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