CN106008922A - Brominated epoxy resin curing formula - Google Patents
Brominated epoxy resin curing formula Download PDFInfo
- Publication number
- CN106008922A CN106008922A CN201610462445.0A CN201610462445A CN106008922A CN 106008922 A CN106008922 A CN 106008922A CN 201610462445 A CN201610462445 A CN 201610462445A CN 106008922 A CN106008922 A CN 106008922A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- parts
- resin curing
- brominated epoxy
- curing formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a brominated epoxy resin curing formula and belongs to the field of chemical materials. The brominated epoxy resin curing formula comprises raw materials as follows: 100-120 parts of high-molecular tetrabromobisphenol A-type liquid epoxy resin (HBR), 56-64 parts of 4,4-DDM (diaminodiphenylmethane), 0.4-0.8 parts of 2-benzyl imidazole, 30-50 parts of acetone and 22-30 parts of silica powder. According to the brominated epoxy resin curing formula, cured epoxy resin has relatively high glass-transition temperature and good flame retardancy and is low in production cost.
Description
Technical field
The present invention relates to chemical material field, be specifically related to a kind of brominated epoxy resin curing formula
Background technology
Brominated epoxy resin refers to contain bromo element (Br) in molecular structure and have self-extinguishment function
Epoxy resin, low toxicity, be also called brominated epoxy resin.Its important kind have bromination phenol aldehyde type,
Dibromo season pentanediol type epoxy resin and brominated bisphenol a type epoxy resin.This based epoxy resin
Common feature be have excellent self-extinguishment and thermostability, excellent heat stability and light stability,
Excellent melt flow speed, is commonly used for flame-proof composite material, adhesive, coating and structural material,
It is widely used in the industry fields such as building, space flight and aviation, electronic apparatus, instrument.As fire-retardant material
For material, its good physical mechanicalness makes it at grain husk de-with the contrast of other like products
Go out.
Summary of the invention
For above-mentioned, it is an object of the invention to provide a kind of brominated epoxy resin curing formula.
The concrete technical scheme that the present invention takes is:
A kind of brominated epoxy resin curing formula, it is characterised in that by weight, by following former
Material composition: high tetrabromobisphenol A type liquid-state epoxy resin (HBR) 100-120 part, 4,4-diamino
Base diphenyl-methane (DDM) 56-64 part, 2-benzyl imidazole 0.4-0.8 part, acetone 30-50
Part, silicon powder 22-30 part.
The invention have the advantage that curable epoxide thing has higher glass transition temperature, fire-retardant
Function admirable, low production cost.
Detailed description of the invention
Below presently preferred embodiments of the present invention is described in detail so that advantages of the present invention and
Feature can be easier to be readily appreciated by one skilled in the art, thus makes protection scope of the present invention
Apparent clear and definite defining.
Embodiment 1
A kind of brominated epoxy resin curing formula, it is characterised in that by weight, by following former
Material composition: high tetrabromobisphenol A type liquid-state epoxy resin (HBR) 100 parts, 4,4-diaminourea two
Phenylmethane (DDM) 56 parts, 2-benzyl imidazole 0.4 part, 30 parts of acetone, silicon powder 22 parts.
Embodiment 2
A kind of brominated epoxy resin curing formula, it is characterised in that by weight, by following former
Material composition: high tetrabromobisphenol A type liquid-state epoxy resin (HBR) 110 parts, 4,4-diaminourea two
Phenylmethane (DDM) 60 parts, 2-benzyl imidazole 0.6 part, 40 parts of acetone, silicon powder 26 parts.
Embodiment 3
A kind of brominated epoxy resin curing formula, it is characterised in that by weight, by following former
Material composition: high tetrabromobisphenol A type liquid-state epoxy resin (HBR) 120 parts, 4,4-diaminourea two
Phenylmethane (DDM) 64 parts, 2-benzyl imidazole 0.8 part, 50 parts of acetone, silicon powder 30 parts.
Claims (3)
1. a brominated epoxy resin curing formula, it is characterised in that by weight, by with
Lower raw material forms: high tetrabromobisphenol A type liquid-state epoxy resin (HBR) 100-120 part, 4,4-
MDA (DDM) 56-64 part, 2-benzyl imidazole 0.4-0.8 part, acetone 30-50
Part, silicon powder 22-30 part.
Brominated epoxy resin curing formula the most according to claim 1, it is characterised in that
By weight, it is made up of following raw material: high tetrabromobisphenol A type liquid-state epoxy resin
(HBR) 105-115 part, 4,4-MDA (DDM) 58-62 part, 2-benzyl miaow
Azoles 0.5-0.7 part, acetone 35-45 part, silicon powder 24-28 part.
Brominated epoxy resin curing formula the most according to claim 1, it is characterised in that
By weight, it is made up of following raw material: high tetrabromobisphenol A type liquid-state epoxy resin
(HBR) 110 parts, 4,4-MDA (DDM) 60 parts, 2-benzyl imidazole 0.6
Part, 40 parts of acetone, silicon powder 26 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462445.0A CN106008922A (en) | 2016-06-22 | 2016-06-22 | Brominated epoxy resin curing formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462445.0A CN106008922A (en) | 2016-06-22 | 2016-06-22 | Brominated epoxy resin curing formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106008922A true CN106008922A (en) | 2016-10-12 |
Family
ID=57086044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610462445.0A Pending CN106008922A (en) | 2016-06-22 | 2016-06-22 | Brominated epoxy resin curing formula |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106008922A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286321A (en) * | 2017-06-02 | 2017-10-24 | 开美化学科技(南通)有限公司 | The preparation method of environment-friendly type brominated epoxy resin high polymer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101654605A (en) * | 2008-08-21 | 2010-02-24 | 中山市东溢新材料有限公司 | Modified epoxy resin adhesive and preparation method thereof |
| CN101892027A (en) * | 2010-07-08 | 2010-11-24 | 广东生益科技股份有限公司 | Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same |
| CN102618195A (en) * | 2012-01-21 | 2012-08-01 | 金安国纪科技股份有限公司 | Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
-
2016
- 2016-06-22 CN CN201610462445.0A patent/CN106008922A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101654605A (en) * | 2008-08-21 | 2010-02-24 | 中山市东溢新材料有限公司 | Modified epoxy resin adhesive and preparation method thereof |
| CN101892027A (en) * | 2010-07-08 | 2010-11-24 | 广东生益科技股份有限公司 | Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same |
| CN102618195A (en) * | 2012-01-21 | 2012-08-01 | 金安国纪科技股份有限公司 | Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286321A (en) * | 2017-06-02 | 2017-10-24 | 开美化学科技(南通)有限公司 | The preparation method of environment-friendly type brominated epoxy resin high polymer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161012 |