CN105348488A - Crystallizing epoxy resin, epoxy resin composition and molding compound - Google Patents

Crystallizing epoxy resin, epoxy resin composition and molding compound Download PDF

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Publication number
CN105348488A
CN105348488A CN201510867179.5A CN201510867179A CN105348488A CN 105348488 A CN105348488 A CN 105348488A CN 201510867179 A CN201510867179 A CN 201510867179A CN 105348488 A CN105348488 A CN 105348488A
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China
Prior art keywords
epoxy resin
substituted
formula
type epoxy
filler
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CN201510867179.5A
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Chinese (zh)
Inventor
潘庆崇
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GUANG SHAN NEW MATERIALS Co Ltd
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GUANG SHAN NEW MATERIALS Co Ltd
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Priority to CN201510867179.5A priority Critical patent/CN105348488A/en
Publication of CN105348488A publication Critical patent/CN105348488A/en
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Abstract

The invention relates to crystallizing epoxy resin. Epoxy resin is the crystallizing epoxy resin and has low melt viscosity and high filler filling performance at the melting temperature or above. The crystallizing epoxy resin is an epoxy resin material which is good in water resistance, heat resistance and mechanical strength and is high in fluidity and filler filling performance.

Description

Crystal type epoxy resin, composition epoxy resin and plastic cement
Technical field
The present invention relates to a kind of epoxy resin, particularly relate to a kind of crystal type epoxy resin; The invention still further relates to the preparation method of this epoxy resin and the composition containing this epoxy resin; The invention still further relates to the plastic cement containing composition epoxy resin.
Background technology
Epoxy resin due to have good agglutinating value(of coal), water tolerance, thermotolerance and easy to use and be widely used in electronics, electrically, the aspect such as coating, sizing agent, potting compound.For the epoxy resins insulation constituent of such use, general use is as the solid-state or liquid bisphenol-type epoxy resin such as dihydroxyphenyl propane, Bisphenol F; The multifunctional phenol aldehyde type epoxy resin that aldehydes matter and the aldehyde materials etc. such as o-cresol aldehyde, bisphenol-A phenolic, phenol formaldehyde type obtain for raw material reaction.
The solidifying agent that epoxy resin is conventional is generally and tires out the amine substances such as resol class, DDM, DDS such as material, novolac, bisphenol A phenolic resin as the phthalic anhydride such as phthalic anhydride, methyl tetrahydro phthalic anhydride.If desired, also usually add as fillers such as silicon-dioxide, talcum powder, calcium carbonate, aluminium hydroxide, titanium oxide and as subsidiary material such as coupling agent, defoamer, curing catalysts.
Along with the high speed development of electronic industry, communicating machine etc., require its epoxy resin insulation material, particularly electronics, the packaged material of the components and parts such as IC, diode, triode of the purposes such as electric has more the performances such as thermotolerance, water tolerance, high mechanical strength, high exothermicity, agglutinating value(of coal), low linear expansion.
Summary of the invention
An object of the present invention is to provide a kind of epoxy resin, and this epoxy resin is crystal type epoxy resin, and it has low-down melt viscosity and high filler fillibility more than melting temperature.
Two of object of the present invention is to provide a kind of preparation method of epoxy resin, this preparation method's easy handling, and the epoxy resin prepared by the method is crystal type epoxy resin, and it has low-down melt viscosity and high filler fillibility more than melting temperature.
Three of object of the present invention is to provide a kind of composition epoxy resin, and it comprises above-mentioned crystal type epoxy resin, solidifying agent and filler, thus reduces linear expansivity, water-intake rate, and improves physical strength, effectively reduces cost simultaneously.
Four of object of the present invention is to provide a kind of plastic cement, and it comprises above-mentioned composition epoxy resin, and the linear expansivity of plastic cement of the present invention and water-intake rate are able to effective reduction, and physical strength is significantly improved simultaneously.
Crystal type epoxy resin of the present invention, it has such as formula the molecular structure shown in I:
In formula I, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
Preferably, above-mentioned crystal type epoxy resin has such as formula the molecular structure shown in II:
In formula II, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
Preferably, in formula II, R 1with R 3identical, and/or R 2with R 4identical.
Crystal type epoxy resin of the present invention reacts obtained in the basic conditions by dihydric phenolic compounds with epichlorohydrin reaction; Described dihydric phenolic compounds has the molecular structure as shown in formula III:
In formula III, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
Above-mentioned preparation method is the customary preparation methods of epoxy resin, mixes, be stirred to dissolving by the dihydric phenolic compounds shown in formula III with basic solution, then in lysate, add epoxy chloropropane, heating, and then be washed to neutrality, dehydration, obtains epoxy resin.Above-mentioned preparation method is simple to operate, easy handling.
Preferably, in above-mentioned preparation method, described dihydric phenolic compounds has such as formula the molecular structure shown in IV:
In formula IV, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
It is the epoxy resin of contraposition that the dihydric phenolic compounds of said structure can obtain two epoxy group(ing).
Wherein, in formula IV, R 1with R 3identical, or/and R 2with R 4identical.
A kind of composition epoxy resin of the present invention, containing above-mentioned crystal type epoxy resin, solidifying agent and filler.
Preferably, in the total mass of composition epoxy resin for 100%, the massfraction of described filler is more than 55%, is preferably 60% ~ 92%, more preferably 85% ~ 91%;
Preferably, described filler is mineral filler;
Preferably, described filler is silica filler, more preferably preparing spherical SiO 2 filler.
Above-mentioned crystal type epoxy resin has low-down melt viscosity and high filler fillibility under melting temperature; When the epoxy resin of itself and other routine is used in combination, the melt viscosity of epoxy resin composition also greatly can be reduced.The epoxy resin of other routines comprise in difunctional epoxy resin, polyfunctional epoxy resin, cycloaliphatic epoxy resin, straight chain formula epoxy resin one or more;
Preferably, described difunctional epoxy resin is one or more in liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, solid-state bisphenol A type epoxy resin, solid-state bisphenol f type epoxy resin and bisphenol-s epoxy resin, biphenyl type epoxy resin;
Preferably, described polyfunctional epoxy resin epoxy resin is one or more of phenol aldehyde type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin and acyclic isoprenoid type epoxy resin.
The present invention to the concrete kind of the solidifying agent in composition epoxy resin without special regulation; Can adopt the solidifying agent that this area is general, solidifying agent of the present invention is one or more in acid anhydride type curing agent, amine curing agent, phenols curing agent, acids solidifying agent.
Composition epoxy resin kind solidifying agent specifically uses the solidifying agent of which kind of type, will set according to the embody rule of this composition epoxy resin.If when composition epoxy resin is used in the packaging insulating material of the components and parts such as electronics, electrically middle IC, diode, triode, solidifying agent should use phenol aldehyde type phenols curing agent, acid anhydride type curing agent and aromatic amine curing agent.
Preferably, described composition epoxy resin is epoxy resin molding compound.
The concrete kind of the present invention to mineral filler does not limit, the mineral filler that this area is general can be adopted, technical ability filler or the economy fillers such as such as silicon-dioxide, aluminum oxide, aluminium hydroxide, magnesium hydroxide, talcum powder, kaolin, calcium carbonate, barium sulfate, boron nitride.
Composition epoxy resin of the present invention also according to actual needs, can comprise curing catalyst, as subsidiary material such as flow agent, defoamer, pigment, releasing agent, toughner.
Wherein, the present invention does not have special stipulation to the concrete curing catalyst used, conventional as imidazoles, ammonium salt class, triphenylphosphine and derivative, tertiary amine etc., but from the angle of electrical property and other over-all properties, triphenylphosphine and derivative thereof, imidazoles curing catalyst are more suitable.
The present invention has no particular limits the type and quantity that use subsidiary material, usually, and subsidiary material conventional when epoxy resin uses, but its consumption is advisable with the total amount sum being no more than constituent epoxy resin and solidifying agent.
Plastic cement of the present invention, comprises above-mentioned composition epoxy resin.
Compared with prior art, the invention has the advantages that: epoxy resin of the present invention is crystal type epoxy resin, it has low-down melt viscosity and high filler fillibility more than melting temperature; In addition, crystal type epoxy resin of the present invention is a kind ofly have good water tolerance, thermotolerance, the high workability of physical strength, the epoxide resin material of high filler fillibility.
The insulation-encapsulated of the components and parts such as coating, sizing agent, electronics, electric IC, diode, triode is can be applicable to containing composition epoxy resin of the present invention.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment 1
The structural formula of the crystal type epoxy resin of the present embodiment is as shown in Equation 1:
The preparation method of this crystal type epoxy resin is: the duroquinol of 1mol and the epoxy chloropropane of 2mol react obtained in the basic conditions.Concrete, first duroquinol is mixed with basic solution (if mass concentration is the NaOH solution of 8 ~ 10%), be stirred to dissolving, then in lysate, add epoxy chloropropane, heating, at 50 ~ 100 DEG C, react 2 ~ 3.5h, be washed to neutrality, dehydration, obtain above-mentioned crystal type epoxy resin A, the general property of epoxy resin A as shown in Table-1.
Table-1, the performance of epoxy resin A
Analysis project Unit Result
Epoxy equivalent (weight) g/eq 153
Cone-plate viscosity ps/at150℃ 0.08
DSC fusing point ℃ 124
In crystal type epoxy resin A prepared by the present embodiment, the infrared signature peak value of each group is as follows:
ν asc=C1650cm -1(phenyl ring); δ scH1380cm -1(-CH 3-); ν scH2853cm -1(-CH 2-); ν C-O1200cm -1; ν scH2900cm -1(-CH-); ν asc-O-C1300cm -1(-Ar-O-CH 2-); ν asc-O-C1210cm -1(-CH-O-CH 2-).
Above-mentioned infrared signature peak value shows, material prepared by above-mentioned preparation method is exactly the epoxy resin shown in formula 1.
Embodiment 2
The epoxy resin ingredient that the epoxy resin A prepared with embodiment 1 is plastic cement component, the resol that softening temperature is 65 DEG C, phenolic hydroxyl equivalent is 105g/eq is solidifying agent; Median size is the preparing spherical SiO 2 of 11 microns is packing material, the use degree when Spiral flow length of molding compound is 40cm when usage quantity is 175 DEG C; Use triphenyl phosphorus is curing catalyst, and usage quantity is the amount of gel time when 175 DEG C required for 35 seconds; In system, add conventional pigment, coupling agent and other additive, within 120 seconds, obtain plastic cement a with 3 axle hot drum-type rubber mixing machine refining glue, the formula of plastic cement a and performance are respectively in Table-3 and table-4.
Embodiment 3
Epoxy resin prepared by embodiment 1 is crystal type epoxy resin A, and it mixes with other epoxy resin, can obtain blending epoxy B.Specific as follows:
With drop into 420g epoxy resin A in three mouthfuls of 1000ml glass reactors of whipping appts and softening temperature be 60 DEG C, epoxy equivalent (weight) is the o-cresol formaldehyde epoxy resin 420g of 196g/eq; Under nitrogen atmosphere, after heating and melting mixing, 840g epoxy resin composition is obtained, this epoxy resin composition called after epoxy resin B.The fundamental property of epoxy resin B is as shown in table-2:
The performance of table-2. epoxy resin B
Analysis project Unit Result
Epoxy equivalent (weight) g/eq 174.5
Cone-plate viscosity ps/at150℃ 0.3
DSC fusing point ℃ 105
Above-mentioned mixed type epoxy resin adds solidifying agent, solidifying agent promotor, filler, subsidiary material etc., can be mixed with composition epoxy resin, this composition epoxy resin can be applied to the insulation-encapsulated of the components and parts such as coating, sizing agent, electronics, electric IC, diode, triode.
Embodiment 4
With the epoxy resin ingredient of epoxy resin B for plastic cement component, the resol that softening temperature is 65 DEG C, phenolic hydroxyl equivalent is 105g/eq is solidifying agent; Median size is the preparing spherical SiO 2 of 11 microns is packing material, the use degree when Spiral flow length of molding compound is 40cm when usage quantity is 175 DEG C; Use triphenyl phosphorus is curing catalyst, and usage quantity is the amount of gel time when 175 DEG C required for 35 seconds; In system, add conventional pigment, coupling agent and other additive, within 120 seconds, obtain plastic cement b with 3 axle hot drum-type rubber mixing machine refining glue, the formula of plastic cement b and performance are respectively in Table-3 and table-4.
Comparative example 1
The softening temperature getting market sale is 60 DEG C, and epoxy equivalent (weight) is 196g/eq, and Cone & Plate viscosity when 150 DEG C is the o-cresol formaldehyde epoxy resin of 1.5Ps is epoxy resin C.
In above-mentioned epoxy resin C, add solidifying agent, solidifying agent promotor, filler, subsidiary material etc., can composition epoxy resin be mixed with.
Comparative example 2
With the epoxy resin ingredient of epoxy resin C for plastic cement component, the resol that softening temperature is 65 DEG C, phenolic hydroxyl equivalent is 105g/eq is solidifying agent; Median size is the preparing spherical SiO 2 of 11 microns is packing material, the use degree when Spiral flow length of molding compound is 40cm when usage quantity is 175 DEG C; Use triphenyl phosphorus is curing catalyst, and usage quantity is the amount of gel time when 175 DEG C required for 35 seconds; In system, add conventional pigment, coupling agent and other additive, within 120 seconds, obtain plastic cement c with 3 axle hot drum-type rubber mixing machine refining glue, the formula of plastic cement c and performance are respectively in Table-3 and table-4.
Embodiment plastic cement a, plastic cement b and comparative example plastic cement c fill a prescription as shown in table-4.
The formula of table-3. each embodiments, comparative example plastic cement
Title Unit Plastic cement a Plastic cement b Plastic cement c
Epoxy resin g 100 100 100
Solidifying agent g 60.2 68.6 53.6
Silicon-dioxide wt％ 91 89 78
Additive g 2 2 2
The performance of table-4. each embodiments, comparative example plastic cement
Title Unit Plastic cement a Plastic cement b Plastic cement c
Second-order transition temperature ℃/TMA 154 152 148
α1 10-5/℃ 0.6 0.82 1.65
α2 10-5/℃ 4.2 4.8 6.2
Saturated water absorption wt％ 0.12 0.14 0.29
Flexural strength Kg/mm 2 18.4 17.6 12.4
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.

Claims (10)

1. a crystal type epoxy resin, is characterized in that, it has such as formula the molecular structure shown in I:
In formula I, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
2. crystal type epoxy resin according to claim 1, is characterized in that, it has such as formula the molecular structure shown in II:
In formula II, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
3. crystal type epoxy resin according to claim 2, is characterized in that: in formula II, R 1with R 3identical, or/and R 2with R 4identical.
4. a preparation method for crystal type epoxy resin described in claims 1 to 3, is characterized in that: described epoxy resin is obtained with epichlorohydrin reaction in the basic conditions by dihydric phenolic compounds; Described dihydric phenolic compounds has the molecular structure as shown in formula III:
In formula III, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
5. preparation method according to claim 4, is characterized in that, described dihydric phenolic compounds has such as formula the molecular structure shown in IV:
In formula IV, R 1, R 2, R 3, R 4independently be selected from H, substituted or non-substituted aromatic base, substituted or non-substituted alkyl or halogen atom;
Wherein, R 1, R 2, R 3, R 4identical or different.
6. preparation method according to claim 5, is characterized in that: in formula IV, R 1with R 3identical, and/or R 2with R 4identical.
7. a composition epoxy resin, is characterized in that: containing crystal type epoxy resin, solidifying agent and filler described in claims 1 to 3;
Preferably, in the total mass of composition epoxy resin for 100%, the massfraction of described filler is more than 55%, is preferably 60% ~ 92%, more preferably 85% ~ 91%;
Preferably, described filler is mineral filler;
Preferably, described mineral filler is silica filler, more preferably preparing spherical SiO 2 filler.
8. composition epoxy resin according to claim 7, is characterized in that: also containing one or more in difunctional epoxy resin, polyfunctional epoxy resin, cycloaliphatic epoxy resin, straight chain formula epoxy resin;
Preferably, described difunctional epoxy resin is one or more in liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, solid-state bisphenol A type epoxy resin, solid-state bisphenol f type epoxy resin and bisphenol-s epoxy resin, biphenyl type epoxy resin;
Preferably, described polyfunctional epoxy resin epoxy resin is one or more of phenol aldehyde type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin and acyclic isoprenoid type epoxy resin.
9. composition epoxy resin according to claim 7, is characterized in that: described solidifying agent is one or more in acid anhydride type curing agent, amine curing agent, phenols curing agent, acids solidifying agent;
Preferably, described composition epoxy resin is epoxy resin molding compound.
10. a plastic cement, is characterized in that: comprise the composition epoxy resin described in any one of claim 7 ~ 9.
CN201510867179.5A 2015-11-30 2015-11-30 Crystallizing epoxy resin, epoxy resin composition and molding compound Pending CN105348488A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3216814A1 (en) * 2016-03-08 2017-09-13 Guangdong Guangshan New Materials Co., Ltd. Isocyanate-modified epoxy resin and uses thereof
CN115260703A (en) * 2021-04-30 2022-11-01 长鑫存储技术有限公司 High-temperature-resistant plastic packaging material with small thermal expansion coefficient and preparation method thereof
CN116515360A (en) * 2023-02-24 2023-08-01 广东睿智环保科技股份有限公司 Ultralow-temperature cured powder coating and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102336890A (en) * 2006-03-29 2012-02-01 汉高股份两合公司 Radiation or heat curable anti-seepage sealant
CN103450632A (en) * 2012-05-28 2013-12-18 汉高华威电子有限公司 Epoxy resin composition for electronic packaging and preparation method thereof
CN103842434A (en) * 2011-07-28 2014-06-04 Lg伊诺特有限公司 Epoxy resin compound and radiant heat circuit board using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102336890A (en) * 2006-03-29 2012-02-01 汉高股份两合公司 Radiation or heat curable anti-seepage sealant
CN103842434A (en) * 2011-07-28 2014-06-04 Lg伊诺特有限公司 Epoxy resin compound and radiant heat circuit board using the same
CN103450632A (en) * 2012-05-28 2013-12-18 汉高华威电子有限公司 Epoxy resin composition for electronic packaging and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3216814A1 (en) * 2016-03-08 2017-09-13 Guangdong Guangshan New Materials Co., Ltd. Isocyanate-modified epoxy resin and uses thereof
KR101830510B1 (en) 2016-03-08 2018-02-20 광동 광산 뉴 머터리얼즈 씨오., 엘티디. Isocyanate modified epoxy resin and the uses thereof
CN115260703A (en) * 2021-04-30 2022-11-01 长鑫存储技术有限公司 High-temperature-resistant plastic packaging material with small thermal expansion coefficient and preparation method thereof
CN115260703B (en) * 2021-04-30 2023-07-04 长鑫存储技术有限公司 Plastic packaging material with high temperature resistance and small thermal expansion coefficient and preparation method thereof
CN116515360A (en) * 2023-02-24 2023-08-01 广东睿智环保科技股份有限公司 Ultralow-temperature cured powder coating and preparation method thereof

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Application publication date: 20160224