CN106001827B - A kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering - Google Patents
A kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering Download PDFInfo
- Publication number
- CN106001827B CN106001827B CN201610414635.5A CN201610414635A CN106001827B CN 106001827 B CN106001827 B CN 106001827B CN 201610414635 A CN201610414635 A CN 201610414635A CN 106001827 B CN106001827 B CN 106001827B
- Authority
- CN
- China
- Prior art keywords
- fiber grating
- thin film
- magnetostrictive thin
- silicon chip
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 65
- 238000005476 soldering Methods 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000010409 thin film Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000010408 film Substances 0.000 claims abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 8
- 238000004544 sputter deposition Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910001329 Terfenol-D Inorganic materials 0.000 claims description 3
- 238000009736 wetting Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000007774 longterm Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- BCAARMUWIRURQS-UHFFFAOYSA-N dicalcium;oxocalcium;silicate Chemical compound [Ca+2].[Ca+2].[Ca]=O.[O-][Si]([O-])([O-])[O-] BCAARMUWIRURQS-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/242—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
The invention discloses a kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering, this method comprises the following steps:1) choose the silicon chip of rectangular shape and be cleaned by ultrasonic;2) one layer of certain thickness magnetostrictive thin film is sputtered on silicon chip with the method for magnetron sputtering;3) choose the fiber grating that can be used under the high temperature conditions and be cleaned by ultrasonic;4) one layer of certain thickness metallic film is sputtered on fiber grating with the method for magnetron sputtering;5) fiber grating for having plated metallic film is fixed on magnetostrictive thin film;6) method for using Reflow Soldering, the fiber grating for having plated metallic film is welded on magnetostrictive thin film, forms reliable solder joint, so as to establish long-term mechanical connection between fiber grating and magnetostrictive thin film.The inventive method technique is simple, easy to operate, and the sensor performance of manufacture is good.
Description
Technical field
The invention belongs to fiber grating Magnetic Sensor field, more particularly, to a kind of system of fiber grating Magnetic Sensor
Standby technique and connection method.
Background technology
Fiber grating Magnetic Sensor is the device for realizing magnetic signal and optical signal conversion, and it is to utilize magnetostrictive thin film pair
The magnetic signal of change produces telescopic shape change, and this deformation can cause the stress variation on magnetostrictive thin film, fiber grating pair
Stress variation is sensitive, because stress variation can cause the centre wavelength that fiber grating reflects to drift about, passes through survey
Sensing of the drift value can realization to stress of wavelength is measured, and then realizes the measurement to magnetic signal.Fiber grating realizes that magnetic is believed
Number measurement key be fiber grating and magnetostrictive thin film complex method, this is also that fiber grating Magnetic Sensor application faces
Challenge.The traditional complex method of fiber grating Magnetic Sensor has epoxy resin mounting method etc..The main of conventional composite method is asked
Topic is that fiber grating is low with the combined efficiency of magnetostrictive thin film, is mainly shown as following three points:(1) the Young mould of epoxy resin
Amount than relatively low, and the size of Young's modulus be into combined efficiency it is positively related;(2) what epoxide-resin glue manually applied is uneven,
The transmission of magnetostrictive thin film stress variation can so be influenceed;(3) epoxy resin has been grown in the presence of the time pasted and can become loosely
Solid hidden danger, this can have a strong impact on the combined efficiency of fiber grating.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of fiber grating based on Reflow Soldering
The preparation method of Magnetic Sensor, its object is to prepare a kind of fiber grating Magnetic Sensor of high efficiency composition, thus solves optical fiber
The technical problem of the high efficiency composition of grating and magnetostrictive thin film.
To achieve the above object, the preparation side of a kind of fiber grating Magnetic Sensor based on Reflow Soldering provided by the invention
Method, it is characterised in that this method comprises the following steps:
(1) silicon chip of rectangular shape is chosen, wherein, the die size is defined by the size for adapting to fiber grating;
(2) silicon chip is passed sequentially through into acetone, alcohol, deionized water to be cleaned by ultrasonic totally, then splashed with radio frequency magnetron
It is 1000nm~2000nm magnetostrictive thin films to penetrate instrument and a layer thickness is sputtered in the upper surface of silicon chip, forms magnetostrictive thin film silicon
Piece;
(3) fiber grating is cleaned by ultrasonic totally, with rf magnetron sputtering instrument on fiber grating surface by deionized water
Sputtering a layer thickness is 300nm~800nm metallic films;
(4) magnetostrictive thin film silicon chip is fixed on slide, the fiber grating is then fixed on magnetostriction
Relevant position on film surface, ensure that fiber grating and film contacts do not have gap by being watched under magnifying glass;With silk
Print machine uniformly bites appropriate solder(ing) paste the part do not blocked by fiber grating on magnetostrictive thin film surface;Welded having bitten
The magnetostrictive thin film silicon chip of tin cream is sent into solder reflow device, makes dry solder(ing) paste experience, preheating, fusing, wetting, cooling,
The welding process of fiber grating and magnetostrictive thin film is completed, is finally completed the making of fiber grating Magnetic Sensor.
Further, the magnetostrictive thin film sputtered in the step (2) include but is not limited to FeCoSiB films,
Terfenol-D films.
Further, the metallic film sputtered in the step (3) includes but is not limited to nickel, Ag films.
Further, the sputtering parameter in the step (2), (3) is:Vacuum is 7 × 10-4Hereinafter, target spacing is
7cm, sputtering power 100W-300W.
Further, the time being cleaned by ultrasonic in the step (3) is 10min.
In general, by the contemplated above technical scheme of the present invention compared with prior art, it can obtain down and show
Beneficial effect:
1) scheme used is novel, enormously simplify technological process;
2) scolding tin applied using the method for Reflow Soldering is uniform, and being formed between fiber grating and magnetostrictive thin film to form
Reliable solder joint, and mechanical connection steady in a long-term can be reached, so as to realize fiber grating and magnetostrictive thin film it
Between it is efficient compound.
3) the fiber grating magnetic sensing head stable performance prepared, can keep good performance, optical fiber under circumstances
Grating can use under the high temperature conditions.
4) material construction used is cheap, and technological process is easy to use, greatly reduces production cost.
Brief description of the drawings
Fig. 1 (a) is fiber grating, position of the gap portions by carving grating on optical fiber, and the black portions in Fig. 1 (b) are
To the structural representation of fiber grating sputtered metal film in the present invention, technique stream that Fig. 1 (a) to Fig. 1 (b) black arrow refers to
Journey;
Fig. 2 (a) is silicon chip, and Fig. 2 (b) is the structural representation that the present invention sputters magnetostrictive thin film on silicon chip, Fig. 2
(a) technological process referred to Fig. 2 (b) black arrow;
Fig. 3 is that the fiber grating of the metallic film by magnetron sputtering in the present invention is fixed on the knot on magnetostrictive thin film surface
Structure schematic diagram, the technological process that Fig. 3 to Fig. 4 black arrow refers to;
Fig. 4 is the structural representation for the fiber grating Magnetic Sensor that the present invention completes.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Conflict can is not formed each other to be mutually combined.
In electronic product production technology, the good and bad q&r to product of welding procedure has material impact,
Reflow soldering is the visual plant for realizing welding.Reflow Soldering is also referred to as reflow welding, and Reflow Soldering is allocated in advance by dissolving again
Solder on printed board pad, realize the mechanical connection between the welding end of component and printed board.Before Reflow Soldering, silk-screen is used
Machine is bitten appropriate solder(ing) paste on the dry disk of substrate, and component is attached on relevant position with chip mounter, posting first device
The substrate of part is sent into solder reflow device, and solder(ing) paste experienced drying, preheating, trainingization, wetting, cooling, component is connected into printing
Welding process is completed on plate.Show through various theoretical researches and simulation result, fiber grating is realized using the method for Reflow Soldering
Compound with magnetostrictive thin film is a kind of feasible solution.
Reference picture 1 (a), Fig. 1 (b) are the processes of the sputtered metal film on fiber grating, and Fig. 2 (a), Fig. 2 (b) are in silicon
The process of magnetostrictive thin film is sputtered on piece, Fig. 3-Fig. 4 is that fiber grating is fixed on magnetostrictive thin film and welded to show
It is intended to, it is known that the invention provides the preparation technology flow of the fiber grating Magnetic Sensor based on Reflow Soldering.Its technological process letter
It is single, magnetostrictive thin film is not only prepared for, and a kind of efficient fiber grating and the compound method of magnetostrictive thin film are designed,
And tested by magnetic field generator and fiber Bragg grating (FBG) demodulator etc., it was demonstrated that this is a kind of effective scheme.
Case step:
1) cut into slices, cut a length of 2cm, wide 1cm silicon chip;
2) develop a film, the silicon chip cut is cleaned, be cleaned by ultrasonic 10min with acetone first, it is then clear with EtOH Sonicate
10min is washed, is finally cleaned by ultrasonic 10min with deionized water.
3) preparation of magnetostrictive thin film, sputtered with rf magnetron sputtering instrument on silicon chip one layer of Terfenol-D and
FeCoSiB laminated films, thickness are 2 μm.Sputtering parameter:Sputtering time is that 45min (can in the time so long under this power
With 2 μm of film of growth), vacuum is 7 × 10-4Below Pa, target spacing are 7cm, sputtering power 300W, and air pressure is
3.5mTorr, substrate use water-cooling pattern.
4) preparation of fiber grating surface nickel film, it is to be cleaned by ultrasonic fiber grating with deionized water respectively first
10min, one layer of 300nm nickel film is sputtered on fiber grating with rf magnetron sputtering instrument.Sputtering parameter:Sputtering time is
12min (film that can grow 300nm in the time so long under this power), vacuum are 7 × 10-4Below Pa, between target
Away from using water-cooling pattern for 7cm, sputtering power 100W, air pressure 3.5mTorr, substrate.
5) fiber grating that sputtering has nickel is fixed on the relevant position of magnetostrictive thin film, with screen printer appropriate
Solder(ing) paste, which bites sputtering, to be had on the silicon chip of magnetostrictive thin film, and the magnetostrictive thin film for posting fiber grating is sent into Reflow Soldering
In equipment, solder(ing) paste, which experienced, to be dried, preheats, melting, soaking, cooling down, and so far completes fiber grating and magnetostrictive thin film
Welding process, it is achieved thereby that the preparation of the fiber grating Magnetic Sensor based on reflow method.
Influence fiber grating mainly has following reason with magnetostrictive thin film high efficiency composition:1) that pastes is reliable
Property, namely fastness;2) Young's modulus of adhesive material;3) uniformity that adhesive material applies.And Reflow Soldering proposed by the present invention
Method realize fiber grating and magnetostrictive thin film it is compound on, it is possible, firstly, to establish permanent machinery between making them even
Connect, because being to realize to connect by scolding tin between them, its feature is to be connected firmly;Then, fiber grating is stretched with mangneto
The combined efficiency of contracting film is directly proportional to the Young's modulus of adhesive material, and the Young's modulus of scolding tin is more viscous than epoxy resin etc.
Big more of Young's modulus of material are pasted, and the stress that Young's modulus is also beneficial to more greatly magnetostrictive thin film is delivered to fiber grating
On, and it is very sensitive during fiber grating pair stress variation, the efficient sensing of stress can be thus realized, and then realize magnetic field etc.
The efficient sensing of signal;Finally, the uniformity that alite paste applies is mainly the stress for influenceing magnetostrictive thin film to fiber grating
Stress transmission, the transmission that is more uniform more being advantageous to stress that alite paste applies, and method proposed by the present invention painting is relatively more uniform.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (5)
1. a kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering, it is characterised in that this method includes following step
Suddenly:
(1) silicon chip of rectangular shape is chosen, wherein, the die size is defined by the size for adapting to fiber grating;
(2) silicon chip is passed sequentially through into acetone, alcohol, deionized water to be cleaned by ultrasonic totally, then with rf magnetron sputtering instrument
It is 1000nm~2000nm magnetostrictive thin films that a layer thickness is sputtered in the upper surface of silicon chip, forms magnetostrictive thin film silicon chip;
(3) fiber grating is cleaned by ultrasonic totally by deionized water, sputtered with rf magnetron sputtering instrument on fiber grating surface
A layer thickness is 300nm~800nm metallic films;
(4) magnetostrictive thin film silicon chip is fixed on slide, the fiber grating is then fixed on magnetostrictive thin film
Relevant position on surface, ensure that fiber grating and film contacts do not have gap by being watched under magnifying glass;Use screen printer
Appropriate solder(ing) paste is uniformly bitten the part do not blocked by fiber grating on magnetostrictive thin film surface;Having bitten solder(ing) paste
Magnetostrictive thin film silicon chip be sent into solder reflow device in, make solder(ing) paste experience dry, preheating, fusing, wetting, cooling, complete
The welding process of fiber grating and magnetostrictive thin film, it is finally completed the making of fiber grating Magnetic Sensor.
2. preparation method according to claim 1, it is characterised in that the magnetostriction sputtered in the step (2) is thin
Film includes but is not limited to FeCoSiB films, Terfenol-D films.
3. preparation method according to claim 1 or 2, it is characterised in that the metallic film sputtered in the step (3)
Including but not limited to nickel, Ag films.
4. preparation method according to claim 1, it is characterised in that the sputtering parameter in the step (3) is:Vacuum
For 7 × 10-4Hereinafter, target spacing is 7cm, sputtering power 100W-300W.
5. the preparation method according to claim 1 or 4, it is characterised in that the time of ultrasonic cleaning is in the step (3)
10min。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610414635.5A CN106001827B (en) | 2016-06-14 | 2016-06-14 | A kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610414635.5A CN106001827B (en) | 2016-06-14 | 2016-06-14 | A kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106001827A CN106001827A (en) | 2016-10-12 |
CN106001827B true CN106001827B (en) | 2018-03-09 |
Family
ID=57087783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610414635.5A Active CN106001827B (en) | 2016-06-14 | 2016-06-14 | A kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106001827B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114019430A (en) * | 2021-11-01 | 2022-02-08 | 南京大学 | Micro-optical fiber magnetic field sensor based on magnetostrictive material and preparation method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101915865A (en) * | 2010-07-05 | 2010-12-15 | 武汉理工大学 | Miniature optical fiber current sensor probe and making method thereof |
CN102788603A (en) * | 2012-07-27 | 2012-11-21 | 华东理工大学 | All-metal packaged high-temperature resistant fiber bragg grating sensor and manufacture method thereof |
WO2013083192A1 (en) * | 2011-12-07 | 2013-06-13 | Aktiebolaget Skf | Optical angle encoder |
CN104040844A (en) * | 2011-07-27 | 2014-09-10 | 西门子能源公司 | Fiber optic magnetic flux sensor for application in high voltage generator stator bars |
CN104406625A (en) * | 2014-10-29 | 2015-03-11 | 安徽省科普产品工程研究中心有限责任公司 | Preparation method of nickel-plated fiber grating sensor |
-
2016
- 2016-06-14 CN CN201610414635.5A patent/CN106001827B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101915865A (en) * | 2010-07-05 | 2010-12-15 | 武汉理工大学 | Miniature optical fiber current sensor probe and making method thereof |
CN104040844A (en) * | 2011-07-27 | 2014-09-10 | 西门子能源公司 | Fiber optic magnetic flux sensor for application in high voltage generator stator bars |
WO2013083192A1 (en) * | 2011-12-07 | 2013-06-13 | Aktiebolaget Skf | Optical angle encoder |
CN102788603A (en) * | 2012-07-27 | 2012-11-21 | 华东理工大学 | All-metal packaged high-temperature resistant fiber bragg grating sensor and manufacture method thereof |
CN104406625A (en) * | 2014-10-29 | 2015-03-11 | 安徽省科普产品工程研究中心有限责任公司 | Preparation method of nickel-plated fiber grating sensor |
Also Published As
Publication number | Publication date |
---|---|
CN106001827A (en) | 2016-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102034580B (en) | Surface-mounting high-precision large-power NTC (Negative Temperature Coefficient) thermistor and making method thereof | |
EP3413693B1 (en) | Highly conductive transparent glass-based circuit board | |
CN106132113B (en) | The production method of component pcb board built in a kind of cover film protectionization is golden | |
KR20230074824A (en) | Sintering materials and attachment methods using same | |
CN106211564B (en) | A kind of flexible circuit panel element and ground connection steel disc attachment device and method | |
CN107160862B (en) | Thermal printing head heating base plate and its manufacturing method | |
CN103796446A (en) | High-efficiency manufacturing method of large-scale array type photoelectric transmit-receive sensor | |
KR20160118984A (en) | A method for the manufacture of a substrate arrangement, a substrate arrangement, a method for bonding an electronic component with a substrate arrangement, and an electronic component | |
CN109716872A (en) | The flexible printed circuit board for manufacturing the method for flexible printed circuit board and being produced from it | |
CN102683220A (en) | Method for manufacturing multilayer organic liquid crystal polymer substrate structure | |
CN106001827B (en) | A kind of preparation method of the fiber grating Magnetic Sensor based on Reflow Soldering | |
CN105405487A (en) | Conductive silver paste, preparation method therefor, conductive circuit, and preparation method for conductive circuit | |
CN201499374U (en) | Double-side copper foil baseplate structure | |
CN102354597B (en) | Manufacturing method of miniature annular piezoresistor and special device thereof | |
JP2017037929A (en) | Multilayer wiring board, and method of manufacturing the same | |
CN203722914U (en) | Flexible printed circuit board | |
WO2019041366A1 (en) | Method for manufacturing coil, coil, and electronic device | |
TWI438787B (en) | Micro-resistive product having bonding layer and method for manufacturing the same | |
US9820388B2 (en) | Printed circuit board and method for manufacturing same | |
CN104332299B (en) | Preparation method of chip type inductor | |
CN104781925A (en) | Discrete device mounted on substrate | |
CN102307436B (en) | Method for manufacturing flexible printed circuit board | |
TWI678289B (en) | Manufacturing method of thermal head | |
CN109427596A (en) | Base of ceramic and preparation method thereof | |
WO2019196510A1 (en) | Manufacturing method for flexible thermoelectric device and flexible thermoelectric device resulting from said method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |