CN105989829A - Multi-layer diaphragm type composite resonance sound absorption module - Google Patents
Multi-layer diaphragm type composite resonance sound absorption module Download PDFInfo
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- CN105989829A CN105989829A CN201510093770.XA CN201510093770A CN105989829A CN 105989829 A CN105989829 A CN 105989829A CN 201510093770 A CN201510093770 A CN 201510093770A CN 105989829 A CN105989829 A CN 105989829A
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Abstract
The invention relates to a multi-layer diaphragm type composite resonance sound absorption module, which comprises an enclosed cavity, a multi-layer vibration thin plate, an elastic rod and a porous sound absorption material, wherein the enclosed cavity is formed by a perforated plate, side plates and a bottom plate; the free multi-layer vibration thin plate with free boundary is fixed on the perforated plate by using an elastic/damping rubber material; the elastic rod is connected with and fixes the multi-layer vibration thin plate; and the enclosed cavity is filled with the porous sound absorption material. In the structure of the multi-layer diaphragm type composite resonance sound absorption module, the sound absorption structure is formed by compositing a sound absorption structure (which is composed of the perforated plate and the porous sound absorption material) and a mass-multistage spring resonance sound absorption structure (which has free boundary and is composed of the multi-layer vibration thin plate and the sound absorption material). The multi-layer diaphragm type composite resonance sound absorption module has large sound absorption coefficient, and can achieve low and medium frequency broadband sound absorption since the sound absorption structure of the multi-layer diaphragm type composite resonance sound absorption module can form a low and medium frequency resonant cavity with multiple frequencies. The multi-layer diaphragm type composite resonance sound absorption module is widely used in the field of abatement of various noises, and can serve as a basic module and be widely applied to various kinds of noise reduction equipment such as a silencer, sound absorption and insulation wall body covers and the like.
Description
Technical field
The present invention relates to field of noise control, especially with regard to a kind of composite resonant sound absorption structure being applicable to medium and low frequency broad band sound absorption.
Background technology
For sound absorption material and structure, divide by principle and can be divided into sound-absorbing porous material and the big class of resonance sound-absorbing structure two.?
In acoustic engineering, the medium, high frequency sound wave sound absorption for more than 500Hz is easier, and general employing sound-absorbing porous material just has pole
Good assimilation effect, but due to the low frequency absorption poor performance of porous material, for solving the medium and low frequency sound absorption problem of less than 500,
The all-bottom sound of particularly below 200Hz controls, and generally requires employing resonance sound-absorbing structure, such as perforation board resonance sound absorption structure, thin
Plate resonance sound-absorbing structure, micropunch (slit) resonance sound-absorbing structure etc..But tradition sees resonance sound-absorbing structure Sound absorbing spectrum with resonance
Occurring absworption peak centered by frequency, when away from resonant frequency, acoustic absorptivity is the lowest, and frequency selectivity is relatively strong, wide band sound absorption
Narrower, it is difficult to meet the requirement that broadband (100Hz～4000Hz) absorbs sound.
How to make the medium and low frequency wide band sound absorption of expansion sound absorption structure, improve sound absorption structure effect of low-frequency sound absorption, be acoustical material and knot
The research emphasis of structure.
Summary of the invention
Based on the problems referred to above, it is an object of the invention to provide one, in medium and low frequency wide frequency range class, there is higher coefficient, sound absorption frequency
Band is wider, the wideband composite resonance sound absorption module that high frequency sound absorbing capabilities is excellent simultaneously, and the thickness of single sound absorber module is less than 150mm,
Broad frequency range class acoustic absorptivity at 100Hz-4000Hz is more than 0.8, and modular structure is simple, it is easy to processing and fabricating.
The multilayer film chip concrete technical scheme of composite resonance sound absorption module is as follows:
The multilayer film chip composite resonance sound absorption module of the present invention includes the closing cavity being made up of perforated plate, side plate and base plate, makes
The border multi-layer vibration thin plate freely that is fixed on perforated plate with elasticity/damping rubber material, connect fixing multilayer film chip vibrating
The elastic rod of thin plate and the sound-absorbing porous material of full cavity.In above-mentioned modular structure, sound absorption structure is to be shaken by multilayer film chip
Move thin plate and the border quality freely-multistage spring resonance sound absorption structure of sound-absorbing material composition and perforated plate and sound-absorbing porous material
Constitute sound absorption structure to be composited.
The multilayer film chip composite resonance sound absorption module of the present invention, wherein said multi-layer vibration thin plate is circular or square, linearly
Yardstick successively reduces, the flexible connecting rod being positioned at multi-layer vibration thin plate center be fixedly connected, and is formed multiple various sizes of
Resonant cavity, these resonant cavities, in the range of medium and low frequency, produce the sound absorption peak of different frequency, and absorb sound the effect of intercoupling between peak,
Thus form wide medium and low frequency sound sucting band.
The multilayer film chip composite resonance sound absorption module of the present invention, wherein said multi-layer vibration thin plate is border hard plate freely,
Its thickness is 0.2mm-5mm, and the vibration thin plate number of plies is 3-10 layer, and interlamellar spacing is 1.0mm-20.0mm.
The multilayer film chip composite resonance sound absorption module of the present invention, wherein said hard sheet be metallic plate, glass plate, plank,
Fibre board etc..
The multilayer film chip composite resonance sound absorption module of the present invention, wherein said multi-layer vibration thin plate is border flexible board freely,
Its thickness is 0.2mm-5mm, and the vibration thin plate number of plies is 3-10 layer, and interlamellar spacing is 1.0mm-20.0mm.
The multilayer film chip composite resonance sound absorption module of the present invention, wherein said flexible thin is rubber slab, polymer plastic flitch
Deng.
The multilayer film chip composite resonance sound absorption module of the present invention, wherein said sound-absorbing porous material, there is damping sound absorbing capabilities,
It is full of in the closed cavity being filled in base plate, side plate, perforated plate composition.Generally inorganic or high-molecular porous sound-absorbing material, as
Ultra-fine centrifugally glass-wool, rock wool, tripolycyanamide open cell foamed plastic, polyurethane open cell foamed plastic etc..
The multilayer film chip composite resonance sound absorption module of the present invention, wherein said perforated plate thickness is 0.2mm-2mm, hole thereon
Hole dia d=0.2mm-6mm；Its punching rate is 3%-70%.
The multilayer film chip composite resonance sound absorption module of the present invention has the advantage that
1, in the multi-layer vibration thin plate freely of border, the thin plate of each layer all has the bending vibration normal frequency of self, due to often
The sheet size of one layer all differs, and therefore multi-layer vibration thin-slab structure has multiple normal frequency.Multi-layer vibration thin plate knot simultaneously
Structure combines with the sound-absorbing porous material in cavity, due to the damping action of sound-absorbing material, thus forms quality-multistage spring resonance
Sound absorption structure, due to intercoupling between each normal frequency peak, so that this structure has the widest sound sucting band, visitor
The clothes tradition shortcoming that resonance sound-absorbing structure peak value is single, frequency band is narrow.
2, the multilayer film chip composite resonance sound absorption modular structure of the present invention is simple, it is simple to scale is produced in batches.
Accompanying drawing explanation
Fig. 1 is the structural representation of multilayer film chip composite resonance sound absorption module of the present invention.
Fig. 2 is multi-layer vibration thin-slab structure schematic diagram in embodiment.
Fig. 3 is that the vertical incidence sound absorbing capabilities curve chart of multilayer film chip composite resonance sound absorption module of the present invention (is tested at impedance tube
In, test by transfer matrix method).
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, to this
Bright it is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not used to
Limit the present invention.
As it is shown in figure 1, the multilayer film chip composite resonance sound absorption module of the present invention, gross thickness is 120mm, including by base plate 1,
The closing cavity that side plate 2, perforated plate 3 surround, multi-layer vibration thin plate 4, the fixing flexible connecting rod 5 of 4 of connecting are by elastic/resistance
Buddhist nun's elastomeric material 6 is connected on 3, is full of sound-absorbing porous material 7 in closed cavity.
Described sound-absorbing material is the melamine foam that 120mm is thick, and its density is 8kg/m3；Described perforated plate is thickness
The perforation galvanized steel plain sheet of 2.0mm；Aperture 3mm thereon；Punching rate 30%；Described elasticity/damping rubber material is that 3mm thickness is gathered
Urethane rubber；Described base plate is the steel plate of thickness 2.0mm.
As in figure 2 it is shown, described multi-layer vibration thin plate is 0.5mm thickness square plate, totally 5 layers, interlamellar spacing is 5cm, and the 2nd layer is shaken
The dynamic thin plate length of side is the 80% of the 1st layer of thin plate length of side, and the 3rd layer of vibration thin plate length of side is the 60% of the 1st layer of thin plate length of side, the 4th layer
The vibration thin plate length of side is the 40% of the 1st layer of thin plate length of side, and the 5th layer of vibration thin plate length of side is the 20% of the 1st layer of thin plate length of side.
Fig. 3 is the vertical incidence sound absorbing capabilities curve chart of embodiment, and test equipment is the impedance tube of B&K, uses transfer matrix
Method is tested.Test result is it will be seen that the low-frequency range sound absorbing capabilities of below material 500Hz has the most significantly than traditional sound-absorbing material
Lifting, in 100Hz-4000Hz band limits, acoustic absorptivity, all more than 0.8, is a kind of wide band high-effect sound-absorbing body.
Claims (9)
1. multilayer film chip composite resonance sound absorption module, including the closing chamber being made up of base plate (1), side plate (2), perforated plate (3)
Body, it is characterised in that: use flexible connecting rod (5) that multi-layer vibration thin plate (4) is fixedly connected to form multistage spring resonance and inhale
Acoustic form, is full of sound-absorbing porous material (7) and connects the elasticity/damping rubber material of above-mentioned (3) and (4) in closed cavity
(6).Above-mentioned module defines the border quality freely-multistage spring being made up of multilayer film chip vibrating thin plate and sound-absorbing material
The sound absorption structure that resonance sound-absorbing structure and perforated plate and sound-absorbing porous material are constituted.
Multilayer film chip composite resonance sound absorption module the most according to claim 1, it is characterised in that: described multi-layer vibration thin plate (4)
For circular or square, linear-scale successively reduces, and forms multiple various sizes of resonant cavity, and flexible connecting rod (5) is positioned at multilamellar
The center of vibration thin plate (4).
Multilayer film chip composite resonance sound absorption module the most according to claim 1, it is characterised in that: described multi-layer vibration thin plate (4)
For border hard plate freely, its thickness is 0.2mm-5mm, and the vibration thin plate number of plies is 3-10 layer, and interlamellar spacing is
1.0mm-20.0mm。
Multilayer film chip composite resonance sound absorption module the most according to claim 2, it is characterised in that: described hard sheet is metal
Plate, glass plate, plank, fibre board etc..
Multilayer film chip composite resonance sound absorption module the most according to claim 1, it is characterised in that: described multi-layer vibration thin plate (4)
For border flexible board freely, its thickness is 0.2mm-5mm, and the vibration thin plate number of plies is 3-10 layer, and interlamellar spacing is
1.0mm-20.0mm。
Multilayer film chip composite resonance sound absorption module the most according to claim 5, it is characterised in that: described flexible thin is rubber
Plate, polymer plastic flitch etc..
Multilayer film chip composite resonance sound absorption module the most as claimed in any of claims 1 to 6, it is characterised in that: described
Sound-absorbing porous material (7), has damping sound absorbing capabilities, is full of and is filled in base plate (1), side plate (2), perforated plate (3) composition
Closed cavity in.
Multilayer film chip composite resonance sound absorption module the most according to claim 7, it is characterised in that: described sound-absorbing material is inorganic
Or high-molecular porous sound-absorbing material, such as ultra-fine centrifugally glass-wool, rock wool, tripolycyanamide open cell foamed plastic, polyurethane perforate bubble
Foam plastics etc..
Multilayer film chip composite resonance sound absorption module the most as claimed in any of claims 1 to 8, it is characterised in that: described
Perforated plate thickness is 0.2mm-2mm, hole diameter d=0.2mm-6mm thereon；Its punching rate is 3%-70%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510093770.XA CN105989829A (en) | 2015-03-03 | 2015-03-03 | Multi-layer diaphragm type composite resonance sound absorption module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510093770.XA CN105989829A (en) | 2015-03-03 | 2015-03-03 | Multi-layer diaphragm type composite resonance sound absorption module |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110459393A (en) * | 2019-08-02 | 2019-11-15 | 全球能源互联网研究院有限公司 | A kind of sound absorption composite members and a kind of transformer |
| CN110473512A (en) * | 2019-07-26 | 2019-11-19 | 中国铁路设计集团有限公司 | Fast metamaterial layer and the metamaterial composite structure for the middle low frequency high efficiency sound absorption being made from it in a low voice |
| CN112109843A (en) * | 2020-09-30 | 2020-12-22 | 苏州静声泰科技有限公司 | Dynamic resistance reducing device |
| CN112382264A (en) * | 2020-10-29 | 2021-02-19 | 上海超颖声学科技有限公司 | Broadband sound absorption structure |
| CN113077777A (en) * | 2021-03-19 | 2021-07-06 | 南京大学 | Ultra-thin low frequency ventilation acoustics sound absorption unit and sound absorber |
| CN113593512A (en) * | 2021-07-08 | 2021-11-02 | 中南大学 | Multi-cavity composite sound absorption structure |
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| JP2012021405A (en) * | 2010-07-12 | 2012-02-02 | Mitsui Eng & Shipbuild Co Ltd | Sound absorbing structure |
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| JPH0546180A (en) * | 1991-08-13 | 1993-02-26 | Matsushita Electric Ind Co Ltd | Sound absorber |
| JP2012021405A (en) * | 2010-07-12 | 2012-02-02 | Mitsui Eng & Shipbuild Co Ltd | Sound absorbing structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473512A (en) * | 2019-07-26 | 2019-11-19 | 中国铁路设计集团有限公司 | Fast metamaterial layer and the metamaterial composite structure for the middle low frequency high efficiency sound absorption being made from it in a low voice |
| CN110473512B (en) * | 2019-07-26 | 2024-04-16 | 中国铁路设计集团有限公司 | Low sound velocity metamaterial layer and medium-low frequency high-efficiency sound absorption metamaterial composite structure made of same |
| CN110459393A (en) * | 2019-08-02 | 2019-11-15 | 全球能源互联网研究院有限公司 | A kind of sound absorption composite members and a kind of transformer |
| CN112109843A (en) * | 2020-09-30 | 2020-12-22 | 苏州静声泰科技有限公司 | Dynamic resistance reducing device |
| CN112109843B (en) * | 2020-09-30 | 2022-03-08 | 苏州静声泰科技有限公司 | Dynamic resistance reducing device |
| CN112382264A (en) * | 2020-10-29 | 2021-02-19 | 上海超颖声学科技有限公司 | Broadband sound absorption structure |
| CN113077777A (en) * | 2021-03-19 | 2021-07-06 | 南京大学 | Ultra-thin low frequency ventilation acoustics sound absorption unit and sound absorber |
| CN113593512A (en) * | 2021-07-08 | 2021-11-02 | 中南大学 | Multi-cavity composite sound absorption structure |
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