CN105981186A - A wavelength converting element, a light emitting module and a luminaire - Google Patents

A wavelength converting element, a light emitting module and a luminaire Download PDF

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Publication number
CN105981186A
CN105981186A CN201580008069.1A CN201580008069A CN105981186A CN 105981186 A CN105981186 A CN 105981186A CN 201580008069 A CN201580008069 A CN 201580008069A CN 105981186 A CN105981186 A CN 105981186A
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CN
China
Prior art keywords
light
luminescent material
support member
wavelength changing
changing element
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Pending
Application number
CN201580008069.1A
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Chinese (zh)
Inventor
M·伦兹
L·J·M·科普曼斯
P·朱伊德玛
H·J·B·贾格特
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Koninklijke Philips NV
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Koninklijke Philips NV
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Publication of CN105981186A publication Critical patent/CN105981186A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/12—Combinations of only three kinds of elements
    • F21V13/14—Combinations of only three kinds of elements the elements being filters or photoluminescent elements, reflectors and refractors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/08—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for producing coloured light, e.g. monochromatic; for reducing intensity of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

A wavelength converting element (100), a light emitting module and a luminaire are provided. The wavelength converting element comprises a luminescent element (104) and a light transmitting cooling support (112). The luminescent element comprises a luminescent material (102) and a light transmitting sealing envelope (108) for protecting the luminescent material against environmental influences. The sealing envelope has a first thermal conductivity. The cooling support has a second thermal conductivity that is at least two times the first thermal conductivity. The cooling support comprises a first surface (113) and the sealing envelope comprises a second surface (105). The first surface and the second surface face towards each other. The first surface is thermally coupled to the second surface for allowing through the second surface a conduction of heat towards the cooling support to enable a redistribution of the heat generated in the luminescent element.

Description

Wavelength changing element, light emitting module and light fixture
Technical field
The wavelength that the present invention relates to the light for the light of the first color is converted to another color turns Change element.
The invention still further relates to light emitting module and light fixture.
Background technology
Phosphor converted is normally used for light emitting diode (LED) or module, and it includes LED To generate white light or the light of particular color that can not be directly efficiently generated by LED.But, Some currently used phosphors have to be launched the most widely, and it extends beyond the sensitivity of human eye Property, therefore generates the photon of human eye " invisible ", and this causes the fall of usefulness of LED module Low.In order to improve usefulness, arrowband is red and green emitter is considered for this LED mould Block.But, most of narrow band emitter stand: a) to oxygen or the sensitivity of water, i.e. cause Permanent degradation；B) high temperature, i.e. time more than 100-120 DEG C, performance reduces and reduces Stability；And c) high blue flux, this reduction also resulting in performance accelerated deterioration. In order to prevent high blue flux, it is close to reduce flux that phosphor is generally positioned distal from LED Degree.When phosphor is not set directly on LED, it is less by the temperature institute of LED die Impact.But, phosphor still can become relative warmth, because as the stoke of phosphor The result of this displacement, a light absorbing part is also converted to heat by it.When phosphor to oxygen or During water sensitive, its generally by airtight or half gas-tight seal (this means relatively fewer, be well subject to The gas of control or the amount of dampness can penetrate sealing).Such as, document US2013/0094176A1 Disclosing the phosphor of gas-tight seal, its content is hereby expressly incorporated by reference.Disclosed sealing Material is applied not only to seal phosphor, but also for supporting phosphor the phosphorus for gas-tight seal Body of light provides sufficiently strong structure.In other words, sealant is relatively thick, because they are still The phosphor shaping this gas-tight seal the structure member such as preventing them from rupturing.But, greatly Most seal problematically, the material sealed has relatively low thermal conductivity, and relatively Thick sealant causes the overheated of phosphor material together.Specifically, in the phase of phosphor material Substantial amounts of light strikes against particular portion office thereon, and light is converted into the light of another color, and And so these parts can become the hottest.It is close that patent is applied to such as being made of ceramic materials Envelope, this ceramic material is transparent or semitransparent, and has of a relatively high thermal conductivity.So And, it is relatively difficult to the price that can bear with this sealing of sufficiently high accurate manufacturing technique.
Document US 2014/0021503 discloses a kind of light emitting semiconductor device, and it has sealing Phosphor layer in the glass envelope operated as light-emitting component.Glass envelope is included pottery The resin bed of fine particles supports.Fine particles adds the thermal conductivity of resin so that can suppress by The heat that phosphor layer causes increases.
Summary of the invention
It is an object of the invention to provide a kind of Wavelength changing element with more preferable heat management.
One aspect of the present invention provides a kind of Wavelength changing element.Another aspect of the present invention Provide a kind of light emitting module.It is yet another aspect of the present invention to provide a kind of light fixture.At appurtenance Profit defines advantageous embodiment in requiring.
Wavelength changing element according to a first aspect of the present invention includes that light-emitting component and light transmission are cold But support member.Light-emitting component includes luminescent material and for protecting luminescent material from environmental effect The light transmissive encapsulation shell of (such as, air and/or dampness).Luminescent material is configured to be absorbed into Penetrate a part for light and a light absorbing part is converted to the light of another color.Capsul bag Including two glassy layers, luminescent material is disposed there between.Capsul (material) has One thermal conductivity.Cooling support member has the second thermal conductivity, and it is at least the twice of the first thermal conductivity. Cooling support member includes first surface, and capsul includes second surface.First surface and Two surfaces face each other.First surface is thermally coupled to second surface, is used for making heat pass through second Surface conduction is towards cooling support member such that it is able to the heat that redistribution generates in light-emitting component Amount.
The heat management of light-emitting component is improved by cooling support member.Cooling support member has relatively Higher thermal conductivity, therefore when it receives the heat of self-emission device, it is by cooling Support member (so, entirely through Wavelength changing element) diffusion heat.Thus, this prevents spy At fixed focus, light-emitting component becomes the hottest.Additionally, due to heat preferably diffuses through whole Individual Wavelength changing element, so the interface between Wavelength changing element, heat is via relatively Bigger surface is supplied to the environment of Wavelength changing element, it is hereby achieved that preferably cool down. Specifically, compared with the situation of the heat along whole surface distributed focus, when object (such as, Light-emitting component) only there are some little focuses, and time the coldest at its most surfaces, relatively Few heat can provide to environment.Additionally, cooling support member can serve as towards wavelength convert unit The heat conductor of the radiator that part can be coupled to, thus provide for radiator and there is relative low-heat The hot path of resistance.
Second surface (that is, the side of capsul) is in the face of first surface (that is, cooling support member Surface).Specifically, about the whole second surface of capsul, capsul is thermally coupled to cold But support member, this represents that the whole surface heat of the light-emitting component towards cooling support member coupled to cold But support member.Therefore, in relatively large surface, can be by a glass of capsul Glass layer conduction heat towards cooling support member, and from luminescent material to cooling support member the shortest Through be positioned at luminescent material and the second surface of capsul, (it is directed towards cooling down support member hot path Surface) between glassy layer.Thus, preventing can be towards cooling support member conduction at heat Before, the heat from focus is advanced through capsul in the horizontal and arrives light-emitting component thermal coupling To the position cooling down support member.
The thermal conductivity of glassy layer and the glass being arranged between luminescent material and cooling support member First ratio of the thickness of glass layer is more than 200W/m2K.When the first ratio is sufficiently large, seal The thermal resistance of shell is the least to prevent capsul from negatively affecting the heat expansion towards cooling support member Dissipate.Note, along (remote to the outer surface of capsul from the surface towards luminescent material of capsul Surface from luminescent material) line of shortest length measure capsul thickness.In other words, along from Luminescent material is measured between thickness, and capsul and this line towards the line of shortest length of cooling support member Crossing distance be capsul be at least arranged in luminescent material and cooling support member between glass The thickness of glass layer.
Light-emitting component includes capsul, and it includes having relatively low thermal conductivity (typically about Two glassy layers 1.1W/mK).Inventors realized that, the first thermal conductivity and the second thermal conductivity Between difference must sufficiently large, and the first ratio sufficiently large be relatively to overcome glass shell The fact that the heat conductor differed from.
Alternatively, the first thermal conductivity is more than 10W/mK less than 5W/mK and/or the second thermal conductivity. In another embodiment, the second thermal conductivity is more than three times of the first thermal conductivity.In this embodiment, Difference is even more big, and therefore heat preferably redistributes along whole Wavelength changing element. In another embodiment, the second thermal conductivity is more than four times of the first thermal conductivity.
Capsul includes at least two glassy layer in the both sides of luminescent material, but, capsul can To be made up of glass completely.It is known how manufacture under affordable price with sufficiently high precision Glass capsulation.Therefore, the solution of Wavelength changing element discussed above can manufacture relatively Cheap Wavelength changing element.
The live part (it is the part of the necessary transmission of light) of capsul is by as light transmitting material Glass make so that light-emitting component is also light transmission.Light transmission represents: if light enters Be mapped on the side of capsul, then at least some light is transmitted through capsul and is transmitted into sealing In the environment of another surface of shell.In one embodiment, the incident illumination of at least 70% is launched Pass through capsul.It is also noted that (such as, the light of even more vast scale can be emitted through capsul , and light can be transmitted into ring at all surface of capsul at least 80% or at least 90%) In border.Alternatively, capsul is transparent.Alternatively, capsul is translucent.
In one embodiment, the material of capsul parts makes the capsul can be with relatively low Temperature Guan Bi (such as, pass through glue), or capsul can be only close by being locally heated by The material of capsule closes.Owing to two glassy layers of capsul have relatively low heat conduction Rate, then can be locally heated by two glassy layers, without in other positions towards capsul Terminate in the case of conduction heat thus damage luminescent material.For example, it is possible to be locally heated by setting Put material between two glassy layers with such as by use laser beam to obtain to seal air and The capsul of dampness.In this paragraph, " closed " represents that manufacture is complete around luminescent material Shell, thus formed for air and the stop of dampness.In one embodiment, luminescent material Partly it is hermetically sealed in capsul, this air representing relatively small number of controlled quatity and/or dampness Capsul can be penetrated.In another embodiment, luminescent material is hermetically sealed by glass shell (being therefore protected from the impact of air and dampness).In this embodiment, there is no dampness or sky Gas can penetrate capsul, thus prevent due to air or dampness contact the deterioration institute caused The minimizing in the life-span of the luminescent material caused.
Additionally, cooling support member can also have the function as supporting layer, this allows manufacture good Seal luminescent material well but the strongst capsul supporting itself and luminescent material.Cause This, cooling support member allow capsul be made to relatively thin (relative to air and / or the degree of moisture seal), so, capsul less can stop heat.
Capsul is used for protecting luminescent material to affect from environment (such as air and/or dampness). So, alternatively, luminescent material can be sensitive to environmental condition (such as air and/or dampness). As discussed later below, certain types of luminescent material is sensitive to environmental condition.
Alternatively, Wavelength changing element forms lamination, and wherein, lamination includes the first of capsul Layer, light emitting element layer, the second layer of capsul, optional glue-line and by cooling support member The layer formed.Alternatively, the order in lamination middle level is: the ground floor of capsul, luminescent material Layer and the second layer of capsul, optional glue-line and the layer by cooling support member formation.The Two surfaces are formed by the surface of the second glassy layer of capsul, and be towards optional glue-line and / or by cooling down the surface in the direction of the layer that support member is formed.First surface is to be supported by cooling Part formed layer towards optional glue-line and/or the surface of the second layer of capsul.
Alternatively, capsul provides for dampness and/or air that (it has less than 10-6mbar l/s Permeability) stop.If permeability is less than 10-6Mbar l/s, then capsul only allows Dampness and/or the air of controlled relatively small number of amount pass.Thus, Wavelength changing element is permissible Obtain the relatively long life-span.Life-span can be further by the space sealed by capsul Come including getter (thus, including getter in the space identical with arranging luminescent material) Extend.In alternative embodiment above, capsul provide at least half gas-tight seal.By little In 10-7The permeability of mbar l/s defines airtight.In the case of helium is tested, when helium is revealed Time, by less than 10-9The permeability of mbar l/s defines gas-tight seal, has this hypotonic It is airtight that the sealing of saturating rate is referred to as UHV.
Alternatively, capsul includes two glassy layers, arranges luminescent material between which.Glass Glass has good sealing characteristics, therefore can obtain relatively good when using two glassy layers Sealing.Furthermore it is known that the most accurately and effectively manufacture the glassy layer being suitable for this application, Therefore, capsul can have relatively low cost price.Due to the excellent sealing characteristic of glass, Glassy layer can be relatively thin to prevent glassy layer to be constituted the biggest stop for heat.Optional Ground, when luminescent material is arranged between two glassy layers, capsul also includes being arranged on two Between glassy layer and the encapsulant that is arranged in around luminescent material, thus provide for dampness And/or the stop of air.Therefore, only at relatively small region, (district of luminescent material is set Edge, territory), it is necessary to this encapsulant is set, even if the therefore incomplete gas-tight seal of encapsulant Luminescent material, the amount that can arrive the dampness of luminescent material and/or air is the most relatively fewer.Optional Ground, cooling support member or a layer, and cool down support member and a glassy layer directly contacts, Thus obtain good thermal coupling.
In one embodiment, the first ratio is more than 3500W/m2K。
Alternatively, cooling support member is thermally coupled to light-emitting component via light transmission glue-line.Preferably, The thermal conductivity of light transmission glue is big as far as possible, but in an actual embodiment, it is frequently not very Greatly (such as, less than 10W/mK, or even less than 5W/mK).Note, this area Technical staff uses another layer to there is prejudice between light-emitting component and cooling support member, and this is another One layer of thermal barrier properties that can be formed for the heat generated in light-emitting component, but invention Crinis Carbonisatus Existing, add thermal conductivity be not the biggest glue-line to from light-emitting component to the heat of cooling support member Conduction has limited negative effect.Therefore, even if when using the glue-line with limited thermal conductivity Time, the use of cooling support member still results in the more preferable heat through whole Wavelength changing element Diffusion.Alternatively, the second ratio of the thickness of the layer of the thermal conductivity of light transmission glue and light transmission glue More than 100W/m2K.When the second ratio is sufficiently large, the thermal resistance of light transmission glue the least in case Only along from luminescent material to the heat of cooling support member (or even further towards radiator) The entire thermal resistance in path becomes the biggest.In one embodiment, the second ratio is more than 2000 W/m2K.Assume that term " glue " also includes binding agent, the most suitable acrylates or epoxy Resin.
Alternatively, supporting layer includes ceramic alumina, sapphire, spinelle, AlON, SiC Or a kind of material of MgO.These materials have good optical transmission characteristics, and have phase To higher thermal conductivity.Alternatively, cooling support member is the layer with the thickness more than 0.1mm, And it is alternatively less than 2.0mm.In another embodiment, the thickness of cooling support member is more than 0.4mm.In another embodiment, the thickness of cooling support member is more than 0.7mm.
Alternatively, Wavelength changing element includes the layer of another luminescent material, and it is configured to absorb The part of incident illumination and absorption is partially converted to another color light (its color be different from by This another color of the light that luminescent material generates).Another luminescent material compared with luminescent material not Too sensitive to environmental condition.In one embodiment, another luminescent material is not to environmental condition (example As, dampness and/or air) sensitive.The function of another luminescent material is to generate the light of another color, But it also has can provide additional light scattering and can help to more uniform light output Advantage.The layer of another luminescent material can be arranged on light-emitting component surface (such as, towards Away from cooling support member surface), cooling support member surface (such as, be directed away from luminescence The surface of element) between place, and/or light-emitting component and cooling support member.In one embodiment, Wavelength changing element includes the optical layers with specific optical characteristics (being different from luminescence). Optical layers can include scattering material, can be color filter or can include for reorientation or The particular optical structure (being similar to decoupling structure or lenticule) of refraction light.
Alternatively, light-emitting component be configured to narrow light emission distribution (have and be expressed as half Gao Quan The spectral width less than 75nm of wide (FWHM) value) the middle light launching another color.? The distribution of this relative narrower light emission launches many luminescent materials of light to environmental condition (such as Dampness and/or air) sensitive.The example of this luminescent material is to illustrate that quantum limits and at one There is in dimension the granule of the size of nanometer range.Illustrate that quantum restriction means that granule has and takes Certainly in the optical characteristics of size of granule.The example of this material is quantum dot, quantum rod and amount Sub-tetrapod (tetrapod).Other typical arrowband luminescence materials to air and/or moisture-sensitive Material is some inorganic phosphor, such as thiogallate, such as strontium thiogallate.To dampness and/ Or other examples of the inorganic phosphor of air-sensitive are CaSSe and SSON:Eu.SSON:Eu Less to moisture-sensitive, this represents that it is less quick to dampness compared with most types of quantum dot Sense.
According to a further aspect in the invention, it is provided that a kind of light emitting module, it includes optical transmitting set Wavelength changing element with the previously discussed any embodiment according to Wavelength changing element.Light is sent out Emitter is configured to launch light and be arranged to launch light towards Wavelength changing element.Wavelength Conversion element is configured to receive the light from optical transmitting set.Light emitting module provides and according to this The advantage that the Wavelength changing element of bright aspect discussed above is identical, and there is similar reality Executing example, it has the effect similar with the corresponding embodiment of Wavelength changing element.
Alternatively, light emitting module also includes heat conduction shell, and the cooling of Wavelength changing element supports Part is thermally coupled to heat conduction shell.In this alternative embodiment, cooling support member is formed and leads to luminous mould The hot path with low thermal resistance of the housing of block, so, in this alternative embodiment, heat is also Can conduct towards housing, thus preferably cool down light-emitting component.Alternatively, heat conduction shell includes Light exit window, and Wavelength changing element is configured at light exit window.Therefore, wavelength convert Element forms light exit window.Optical transmitting set is configured to launch light towards light exit window.Cooling The edge of support member is thermally coupled to heat conduction shell.According to this alternative embodiment, obtain easily collecting Become to the light emitting module in light fixture and lamp, and light fixture or lamp can be coupled to via heat conduction shell Radiator.
According to another aspect of the invention, it is provided that a kind of light fixture, it includes according to discussed above The Wavelength changing element of one of embodiment, or include according to one of embodiment discussed above Light emitting module.Light fixture provides and the Wavelength changing element of the aspect according to present invention discussed above Or the advantage that light emitting module is identical, and there is similar embodiment, it has and long conversion unit The effect that the corresponding embodiment of part or light emitting module is similar.
These and other aspects of the present invention are with reference to embodiment described below the most also And illustrated.
It should be appreciated by those skilled in the art that can by any be considered as useful in the way of combine two Or option, embodiment and/or the aspect of the multiple present invention above-mentioned.
Those skilled in the art can perform light emitting module and/or the amendment of light fixture based on description And change, it is corresponding to the described modifications and variations of Wavelength changing element.
Accompanying drawing explanation
In the accompanying drawings:
Fig. 1 diagrammatically illustrates three realities of the Wavelength changing element according to one aspect of the invention Execute example,
Fig. 2 a and Fig. 2 b diagrammatically illustrates the reality of light emitting module according to a further aspect of the invention Execute example,
Fig. 3 diagrammatically illustrates three other embodiments of Wavelength changing element, be provided with and One luminous material layer,
Fig. 4 diagrammatically illustrates the embodiment of Wavelength changing element, wherein sets in light-emitting component Put another luminescent material,
Fig. 5 a diagrammatically illustrates the embodiment of lamp, and
Fig. 5 b diagrammatically illustrates the embodiment of light fixture.
It should be noted that the item being denoted by the same reference numerals in different accompanying drawing has identical knot Structure feature and identical function, or be identical signal.Explain these function and/ Or during structure, it is not necessary to repeat specification in detailed description.
Accompanying drawing is merely schematic, and is not drawn to scale.Specifically, in order to clear, Significantly exaggerate some sizes.
Detailed description of the invention
Fig. 1 diagrammatically illustrate Wavelength changing element according to one aspect of the invention 100,130, Three embodiments of 160.First enforcement of Wavelength changing element 100 is shown at the top of Fig. 1 Example.Wavelength changing element 100 includes light-emitting component 104, and it includes being arranged on is made up of glass Capsul 108 in luminescent material 102.Capsul 108 is thermally coupled to cool down support member 112. Thermal coupling between capsul 108 and cooling support member such as can be carried by glue-line 110 Supply.Cooling support member 112 includes the first surface 113 towards light-emitting component 104.Luminous unit Part 104 has the second surface 105 towards cooling support member 112.Second surface is by sealing The surface of shell 108 is formed.Second surface 105 (alternatively along its whole surface) hot coupling It is bonded to first surface 113.
Luminescent material 102 is configured to absorb according to absorption spectrum distribution one of incident illumination Point, and according to optical emission spectroscopy distribution, absorbing light is converted to the light of another color.Luminous material Material 102 is sensitive to environmental condition (such as air and/or dampness).Typically, launch relatively The luminescent material of the light of narrow optical emission spectroscopy distribution (represents that the full width at half maximum of this distribution is less than 75 Nanometer) to dampness and/or air-sensitive.The example of this luminescent material is to demonstrate that quantum limits And there is at least one dimension the granule of the size of nanometer range.Display quantum limits meaning Granule and there is the optical characteristics of the size depending on granule.The example of this material is quantum Point, quantum rod and quantum tetrapod (tetrapod).Other are typically quick to air and/or dampness The arrowband luminescent material of sense is some inorganic phosphor, such as thiogallate (Thiogallate), Such as strontium thiogallate.Other materials can be CaSSe and SSON:Eu.As it is shown in figure 1, Luminescent material 102 could be arranged to layer.This layer has specific thickness, and it is in FIG by th1 Represent.The thickness of this layer allows to provide the luminescent material 102 of required amount to obtain being wanted The light conversion asked.This thickness is generally in the range of 0.05mm to 1mm.Luminescent material 102 A kind of certain types of luminescent material can be included, it is also possible to include different types of luminous material The mixture of material, it such as has different optical emission spectroscopies.Luminescent material 102 can be to deposit Be in capsul 108 only has material, but in other embodiments, luminescent material is permissible There is provided in the liquid to substrate (such as, matrix polymer) or such as capsul 108.
Capsul 108 is configured to protect luminescent material 102 from air and/or the shadow of dampness Ring.Therefore, the material of capsul 108 provides for air and/or the stop of dampness.At one In embodiment, the thermal conductivity of the material of capsul 108 is less than 5W/mK.In another embodiment In, the thermal conductivity of the material of capsul 108 is less than 3W/mK.In another embodiment, close The thermal conductivity of the material of capsule 108 is less than 2W/mK.Capsul is printing opacity, to allow light Transmission generates in luminescent material 102 to luminescent material 102 and allowing will be away from luminous material The light launched on the direction of material 102.The thickness of capsul 108 is relatively small, because capsul 108 otherwise will form the biggest thermal barrier properties for the heat generated in luminescent material 102.Seal The typical thickness of shell is in the range of 200 microns to 1mm.From luminescent material 102 to cold But thickness is measured on the direction of support member.In FIG, the thickness th2 of capsul represents. The thermal conductivity of the material of capsul is less than with first ratio of the thickness th2 of capsul 200W/m2K, to prevent capsul to be constituted the biggest stop to heat.Alternatively, the first ratio Rate is more than 3500W/m2K。
The largest portion of capsul can be by glass manufacture.Obtain the technology example of this glass capsulation shell Glass blowing in this way, glass solder, by use LASER HEATING frit glass-glass frit Engage or such as sealed by the glass-glass of glue and (and alternatively, use and seal space Interior getter is to absorb air and/or dampness, and this technology is sealing the neck of Organic Light Emitting Diode Territory is known).Glass has the typical thermal rate of about 0.7 to 1.4W/mK.The Silicon stone of fusing With the thermal conductivity that quartz has up to 1.4W/mK.Different types of borosilicate (includes AF45 With eagle glass (eagle glass)) there is the thermal conductivity in the range of 0.9 to 1.2W/mK. Different types of soda-lime glass has the thermal conductivity in the range of 0.7 to 1.3W/mK.
Glue-line 110 can be used for light-emitting component 104 is fixed on cooling support member 112, and carries For the thermal coupling between light-emitting component 104 and cooling support member 112.Glue-line 110 has at figure The thickness of th3 it is expressed as in 1.The thickness of glue-line 110 can be relatively thin, and for example, 100 Or the rank of hundreds of micron.The thermal conductivity of glue be more than 0.1W/mK, but in one embodiment More than 0.2W/mK.Alternatively, the thermal conductivity of light transmission glue and the thickness th3 of light transmission glue-line The second ratio more than 100W/m2K, to prevent glue-line 110 to have the biggest thermal resistance.Optional Ground, the second ratio is more than 2000W/m2K.Glue-line 110 or printing opacity, to allow from cooling Support member 112 is to the transmission of the light of light-emitting component 104, and vice versa.Owing to glue-line 110 can To become relative warmth, glue should be stable, and such as, glue can be LED level material, This means incident illumination high flux (high flux of such as incident blue light) and raise temperature It is stable under degree.There is not optical degradation in stable at least expression, and in gluing each other Leafing is not had between two parts.Such as, silicones KJR9222 and KJR9224 (Shin-Etsu) tested out as having this characteristic with Lumisil400 (Wacker) Glue.Other binding agents spendable are suitable acrylates or epoxy resin, such as Delo-family(Katiobond)。
Schematically shown by arrow 106, luminescent material 102 heat generated can be fine Ground conducts towards cooling support member 112, as long as through capsul 108 and the hot road of glue-line 110 The thermal resistance in footpath is relatively small.By selecting the suitable material of glue and selecting for glass capsulation shell 108 and the suitable layer thickness of glue-line 110, generate in luminescent material 102 is relatively great amount of Heat can conduct towards cooling support member 112.Cooling support member 112 redistributes heat, makes More uniform temperature must be obtained by Wavelength changing element 100 to be distributed.
Cooling support member 112 is made up of light transmitting material, and has of a relatively high thermal conductivity. In one embodiment, the thermal conductivity of the material of cooling support member 112 is more than 10W/mK, or Person is in another embodiment more than 15W/mK, or is more than 20W/mK in another embodiment. The thickness of cooling support member is represented by th4 in FIG.Thickness th4 is sufficiently large so that Substantial amounts of heat can be transmitted by cooling support member 112, but can not be too big so that it can not The biggest thermal resistance is being introduced from luminescent material to the hot path of possible radiator.Thickness th4 It is greater than 0.1mm, or in another embodiment more than 0.5mm, or in another enforcement More than 0.8mm in example.The thickness th4 e.g., less than 2mm of cooling support member.Thus, cooling Support member contributes to redistributing the heat in whole Wavelength changing element 100 forcefully so that There is not the focus of relative warmth, other parts of Wavelength changing element 100 are the coldest simultaneously.
Other binding agents spendable are suitable acrylates or epoxy resin, such as Delo-family (Katiobond), additionally aids heat preferably towards ripple via glue 112 The fact that the surroundings of long conversion element 100.It is pottery for cooling down the useful materials of support member Porcelain aluminium oxide, sapphire, spinelle, AlON, SiC, MgO.
In FIG, current embodiment is drawn with sectional view.Cutting of Wavelength changing element 100 Face figure can be plate-like Wavelength changing element 100 or square or rectangular box shape wavelength convert The cross section of element 100.So, light-emitting component 104 and/or the three-dimensional shaped of cooling support member 112 Shape can also is that the one in plate-like or square or rectangular box shape.In a particular embodiment, Cooling support member 112 cambium layer, and luminescent material 102 is additionally arranged between the two-layer of glass Layer in.
Wavelength changing element 130 has different sectional views.Except Wavelength changing element 130 Outside the embodiment of the capsul of shape and Wavelength changing element 130, Wavelength changing element 130 are similar to Wavelength changing element 100 discussed above.Shown cross sectional shape has semiellipse Shape (or in another embodiment, for semicircle).This represents Wavelength changing element 130 3D shape can be shape or the shape in tunnel of dome.This hint light-emitting component and cooling Support member 142 also has this shape.The embodiment of the light-emitting component of Wavelength changing element 130 Including two dome-shaped or tunnel-shaped glassy layers 138,139, luminescent material is set between them Layer 132.In the edge of luminous material layer 132, seal two by encapsulant 137 Opening between glassy layer 138,139.Encapsulant 137 can be the glue of private type, It is formed for dampness and/or the relatively good stop of air.Encapsulant 137 can be with base In glass, and two glassy layers can be soldered to by local heating material and adjacent glass 138、139.The heating of this local can be by must be welded to two glass to encapsulant 137 The position of glass layer 138,139 applies relatively small but strong laser beam and obtains.? Between one of glassy layer 138,139 and cooling support member 142, light transmission glue-line 140 is set. Glue, luminescent material 132 and wavelength convert is discussed in the case of Wavelength changing element 100 The embodiment of other characteristics of the element of element 130.
Lower end at Fig. 1, it is shown that another embodiment of Wavelength changing element 160.Except cold But, outside the shape of support member 172 and the embodiment of capsul, Wavelength changing element 160 is similar to In Wavelength changing element 100.Consistent with Wavelength changing element 130, capsul includes two glass Glass layer 168,169.Two glassy layers 168,169 have the shape of relatively flat, and can To be plate-like, square or rectangular shape or there is any other suitable even shape. Luminescent material 102 is arranged between two glassy layers 168,169, and at luminescent material 102 Edge (close to the edge of two glassy layers 168,169), two glassy layers 168,169 Between space sealed by encapsulant 167 that (embodiment has been described above being begged for Opinion).Wavelength changing element 160 also includes the hypocrateriform cooling support member of (circular or rectangle) 172.Formed by two glassy layers 168,169, luminescent material 102 and encapsulant 167 Light-emitting component be arranged on hypocrateriform cooling support member 172 in.Will by light transmission glue-line 170 Light-emitting component is glued to cool down support member 172.In this embodiment, in light-emitting component and cooling Obtain preferable thermal coupling between support member because the major part of light-emitting component via glue with cold But support member contact.Glue, luminous material has been discussed in the case of Wavelength changing element 100 The embodiment of other characteristics of the element of material 102 and Wavelength changing element 160.
Fig. 2 a and Fig. 2 b diagrammatically illustrate light emitting module 200 according to a further aspect of the invention, The embodiment of 250.Fig. 2 a shows light emitting module 200, it ripple including can be similar to Fig. 1 The Wavelength changing element 201 of long conversion element 100 or 160.Light emitting module 200 also includes leading Hot housing 204, and include one or more optical transmitting set 208.Heat conduction shell 204 surrounds Such as it is filled with the space 202 of air.The inwall 210 of the space-oriented 202 of heat conduction shell 204 Optical reflection coating or layer (not shown) can be provided with so that strike the light on inwall 210 It is reflected rather than being absorbed.One or more optical transmitting set 208 is set in space 202. Alternatively, optical transmitting set 208 is provided with dome-shaped optical element 209, and it such as contributes to good Extract light from optical transmitting set 208 well and/or the light launched by optical transmitting set 208 can be reflected, Make to be launched wider light beam by optical transmitting set 208.In the side of heat conduction shell, light is set and Penetrate window 212.Wavelength changing element 201 is set at light exit window 212.Cooling support member 112 At least edge be thermally coupled to heat conduction shell 204.(it has and fills such as can to pass through thin adhesive layer The high thermal conductivity divided, but in an actual embodiment, the thermal conductivity of glue is actually not the highest) Obtain this thermal coupling.Cooling support member 112 is also configured as straight with heat conduction shell 204 Contact.As shown in Figure 2 a, the edge of capsul 108 can also direct and heat conduction shell 204 Contact, or the edge of capsul 108 can also be thermally coupled to heat conduction shell by thin adhesive layer 204.By arrow 106, schematically show how via capsul 208, glue-line 110 and cold But heat is conducted to heat conduction shell 204 by support member 112 from luminescent material 102.
In one embodiment, the wall of heat conduction shell 204 can also have relatively thick bottom, And can have relatively thin top (top is the part close to light exit window 212) to make The wall of heat conduction shell has the profile that Wavelength changing element 201 is suitable for (this represents wavelength convert Element 201 can be placed/gluing).Thus, cooling support member 112 is in the face of space 202 The part on surface also with the upper contact of heat conducting wall, to obtain more preferable thermal coupling.
As shown in Figure 2 a, light emitting module 200 can have radiator 206 alternatively.Radiator (specifically, 206 can be thermally coupled to heat conduction shell 204 is directed away from the surface in space 202 In fig. 2 a for the surface relative with the surface arranging optical transmitting set 208).Heat conduction shell 204 The heat received from Wavelength changing element can be conducted to radiator 206.
In fig. 2 a, it is shown that cooling support member 112 is towards the space arranging optical transmitting set 208 202.In another embodiment, Wavelength changing element 201 can be with flip-chip configuration at heat conduction shell In body 204 so that cooling supporting layer in the face of surrounding, and a part for capsul towards Space 202.
In fig. 2 a, three optical transmitting sets 208 are depicted.The embodiment of light emitting module can be wrapped Include the optical transmitting set 208 of one, two, three or more.In one embodiment, light is sent out Emitter is solid-state light emitters.Such as, optical transmitting set 208 is light emitting diode (LED). Optical transmitting set 208 can launch blue light, and the luminescent material 102 of Wavelength changing element can quilt It is configured to a part for the blue light of reception is converted to gold-tinted so that the combination of gold-tinted and blue light can To produce white light emission.Luminescent material 102 can be additionally configured to the part conversion of blue light For HONGGUANG so that the light launched by light emitting module 200 includes smoother light emission distribution, and And can have higher color rendering index (CRI).Noting, the embodiment of luminescent material 102 does not limits In yellow or red illuminating material.
In figure 2b, it is shown that another embodiment of light emitting module 250.Light emitting module 250 Including heat conduction shell 254, it surrounds chamber and arranges optical transmitting set 208 at this intracavity.Chamber Wall can be provided with optical reflection coating or layer.Light emitting module 250 also includes Wavelength changing element 251, it is similar to the Wavelength changing element 100,160 of Fig. 1, except cooling support member 262 Relatively thick and fill the major part in the chamber surrounded by heat conduction shell 254.An embodiment In, cooling support member 262 directly can contact with optical transmitting set 208 so that by optical transmitting set 208 light launched coupled to cool down in support member 262 well.Enforcement in another reality In example, light transmission medium 264 (such as, silicones) is arranged on optical transmitting set 208 with cold But between support member 262.Light transmission medium 264 help light from the decoupling of optical transmitting set 208, And allow light transmission toward and into cooling support member 262.Cooling support member 262 is along phase Bigger surface is thermally contacted with heat conduction shell 254 so that can will connect from luminescent material 102 The relatively large partial conductance of the heat received is to heat conduction shell 254.As shown in Figure 2 b, it is not required to The light-emitting component of capsul 108 to be had and luminescent material 102 is arranged in heat conduction shell 254 Between wall, light-emitting component can protrude through outside heat conduction shell 254.
Fig. 3 diagrammatically illustrates three other enforcements of Wavelength changing element 300,330,360 Example, is provided with another luminous material layer.Substantially, Wavelength changing element 300,330,360 The configuration of the Wavelength changing element 100,160 being configured similarly to Fig. 1, another except arranging The extra play 302 of luminescent material.Compared with luminescent material 102, another luminescent material is the most right Air and/or moisture-sensitive, so, another luminescent material is not sealed and is protected from air And/or the impact of dampness.Another luminescent material is configured to absorb a part for incident illumination, and Absorption is partially converted to the light of another color.Such as, another luminescent material can be yellow/ Orange emission inorganic phosphor (such as, YAG:Ce (such as, NYAG) or LuAG:Ce). Generally, these another luminescent materials have relatively wide optical emission spectroscopy.In wavelength convert unit In the different embodiments of part 300,330,360, the extra play 302 of another luminescent material is joined Put in various location.In Wavelength changing element 300, the extra play 302 of another luminescent material It is arranged in a surface of cooling support member 112, this surface and the cooling hot coupling of support member 112 The surface being bonded to luminescence converter 104 is relative.In Wavelength changing element 330, another luminescence The extra play 302 of material is arranged in a surface of luminescence converter 104, this surface with send out The surface being thermally coupled to cool down support member 112 of photoconverter 104 is relative.In wavelength convert unit In part 360, the extra play 302 of another luminescent material is arranged in cooling support member 112 and luminescence Between transducer 104.
In another embodiment, layer 302 be have specific optical characteristics optical layers (its not It is same as luminescence).Optical layers can include scattering material, can be color filter or can include For reorientation or the particular optical structure (being similar to decoupling structure or lenticule) of refraction light. Noting, this optical layers can also combine with the extra play of another luminescent material.
Fig. 4 diagrammatically illustrates the embodiment of Wavelength changing element 400, wherein, another luminescence Material 402 is arranged in light-emitting component 404.In addition to the interpolation of another luminescent material 402, Wavelength changing element 400 is similar to the Wavelength changing element 100,160 of Fig. 1.Although need not Seal another luminescent material (as discussed at the context of Fig. 3), but this another luminescence Material 402 can also be arranged on close together with the luminescent material 102 to air and/or moisture-sensitive In capsule 108.In the diagram, two different layers (each have luminescent material 102, One in 402) it is depicted as in capsul 108, but in other embodiments, no Same luminescent material 102,402 could be arranged to the mixture in capsul 108.
Fig. 5 a diagrammatically illustrates the embodiment of lamp 500.Lamp 500 such as has conventional incandescent The shape of lamp, and so for the electric filament lamp of repacking.Lamp 500 such as can include one or many The light emitting module (not shown) of the individual embodiment according to previously discussed light emitting module, or lamp 500 ripples that can include one or more embodiment according to previously discussed Wavelength changing element Long conversion element (not shown).
Fig. 5 b diagrammatically illustrates the embodiment of light fixture 550.According to previously discussed luminous mould The embodiment of block, light fixture 550 such as includes one or more light emitting module (not shown).? In another embodiment, according to the embodiment of Fig. 5 a, light fixture 550 includes one or more lamp (not Illustrate).In another embodiment, light fixture 550 includes one or more according to previously discussed The Wavelength changing element (not shown) of the embodiment of Wavelength changing element.
Generally speaking, it is provided that Wavelength changing element, light emitting module and light fixture.Wavelength convert unit Part includes light-emitting component and light transmission cooling support member.Lamp component include luminescent material and for Protection luminescent material is from the light transmissive encapsulation shell of environmental effect.Capsul has the first heat conduction Rate.Cooling support member has the second thermal conductivity, and it is at least the twice of the first thermal conductivity.Cooling Support member includes first surface, and capsul includes second surface.First surface and the second table Face faces each other.First surface is thermally coupled to second surface, will by second surface for permission Heat conduction is towards cooling support member, can redistribute the heat generated in light-emitting component.
It should be noted that the illustrative not limiting present invention of above-described embodiment, and people in the art Member can design many alternative embodiments without departing from the scope of the appended claims.
In the claims, any reference marks in bracket is not construed as limiting claim. Use verb " include " and conjugations be not excluded in claim outside element or step Existence.Article " one " before element is not excluded for the existence of multiple this element.In phase The fact that only has of the certain measures quoted in the most different dependent claims is not offered as these The combination of measure cannot be used for benefiting.

Claims (15)

1. a Wavelength changing element (100,130,160,201,251,300,330, 360,400), including:
Light-emitting component (104,404), including luminescent material (102,132) and capsul (108)；
Described luminescent material (102,132) is configured to absorb a part for incident illumination and will inhale The part receiving light is converted to the light of another color, and described luminescent material (102,132) is arranged In described capsul (108)；
Described capsul (108) includes two glassy layers (138,139,168,169), institute State luminescent material (102,132) to be arranged between said two glassy layer, described capsul (108) Be light transmissive, there is the first thermal conductivity and be configured to protect described luminescent material from environment Impact,
The cooling support member (112,142,172,262) being made up of light transmitting material, its tool Having the second thermal conductivity, described second thermal conductivity is more than described first thermal conductivity of twice,
Wherein, described cooling support member (112,142,172,262) includes first surface (113), Described capsul (108) includes second surface (105), faced by described first surface (113) Described second surface (105), and described first surface (113) is thermally coupled to described second Surface (105), is used for making heat be propped up towards described cooling by described second surface (105) Support member (112,142,172,262) is conducted such that it is able to redistribution is at described light-emitting component The heat generated in (104,404), wherein, in the thermal conductivity of glassy layer and described glassy layer The thickness of the glassy layer being arranged between described luminescent material and described cooling support member (th2) the first ratio is more than 200W/m2K。
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein,
Described first thermal conductivity is less than 5W/mK, or
Described second thermal conductivity is more than 10W/mK, or
Described first thermal conductivity is more than 10W/mK less than 5W/mK and described second thermal conductivity.
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein, described capsul (108) provides for wet Gas and/or the stop of air, and have less than 10-6The permeability of mbar l/s.
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein, described capsul (108) includes being arranged on Between said two glassy layer (138,139,168,169) and be arranged in described luminous material Material (102,132) encapsulant (137,167) around, described encapsulant (137, 167) stop for dampness and/or air it is configured to supply.
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein, described first ratio is more than 3500W/m2K。
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein, described cooling support member (112,142,172, 262) it is thermally coupled to described light-emitting component (104,404) via the layer (110) of light transmission glue.
Wavelength changing element the most according to claim 6 (100,130,160,201, 251,300,330,360,400), wherein, the thermal conductivity of described smooth transmission glue and described light Second ratio of the thickness (th3) of the layer (110) of transmission glue is more than 100W/m2K。
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein, described cooling support member (112,142,172, 262) in material oxidation aluminum, sapphire, spinelle, AlON, SiC or MgO is included Plant material.
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein, described cooling support member (112,142,172, 262) it is layer, and the thickness (th4) of this layer more than 0.1mm and is alternatively less than 2.0mm.
Wavelength changing element the most according to claim 1 (100,130,160,201, 251,300,330,360,400), including the layer (302) of another luminescent material, described again The layer of one luminescent material is configured to absorb a part for incident illumination and will absorb fractional conversion For the light of another color, described another luminescent material and described luminescent material (102,132) phase More less sensitive than effect on environment.
11. Wavelength changing elements according to claim 1 (100,130,160,201, 251,300,330,360,400), wherein, described luminescent material (102,132) is joined Being set to launch the light of another color described with the distribution of narrow light emission, the distribution of described narrow light emission has It is expressed as the spectral width being not more than 75nm of full width at half maximum value.
12. 1 kinds of light emitting modules (200,250), including:
Optical transmitting set (208), is used for launching light；
According to Wavelength changing element in any one of the preceding claims wherein (100,130,160, 201,251,300,330,360,400), described Wavelength changing element (100,130, 160,201,251,300,330,360,400) it is configured to receive send out from described light The light of emitter (208).
13. light emitting modules according to claim 12 (200,250), wherein, described Light emitting module (200,250) also includes heat conduction shell (204,254), and described wavelength The institute of conversion element (100,130,160,201,251,300,330,360,400) State cooling support member (112,142,172,262) be thermally coupled to described heat conduction shell (204, 254)。
14. light emitting modules according to claim 13 (200,250), wherein, described Heat conduction shell (204,254) includes light exit window (212), described optical transmitting set (208) Be configured to towards described smooth exit window (212) launch light, described Wavelength changing element (100, 130,160,201,251,300,330,360,400) described smooth exit window (212) is formed, And the edge of described cooling support member is thermally coupled to described heat conduction shell (204,254).
15. 1 kinds of light fixtures (550), including Wavelength changing element according to claim 1 (100,130,160,201,251,300,330,360,400) or include basis Light emitting module (200,250) described in claim 12.
CN201580008069.1A 2014-02-11 2015-01-30 A wavelength converting element, a light emitting module and a luminaire Pending CN105981186A (en)

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