CN105977224A - Encapsulation part surrounding dam structure for preventing from overflowing plastic package material from surface, and manufacturing method thereof - Google Patents

Encapsulation part surrounding dam structure for preventing from overflowing plastic package material from surface, and manufacturing method thereof Download PDF

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Publication number
CN105977224A
CN105977224A CN201610471201.9A CN201610471201A CN105977224A CN 105977224 A CN105977224 A CN 105977224A CN 201610471201 A CN201610471201 A CN 201610471201A CN 105977224 A CN105977224 A CN 105977224A
Authority
CN
China
Prior art keywords
box dam
overflowing
chip
preventing
packaging material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610471201.9A
Other languages
Chinese (zh)
Inventor
谢建友
陈文钊
詹亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huatian Technology Xian Co Ltd
Original Assignee
Huatian Technology Xian Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huatian Technology Xian Co Ltd filed Critical Huatian Technology Xian Co Ltd
Priority to CN201610471201.9A priority Critical patent/CN105977224A/en
Publication of CN105977224A publication Critical patent/CN105977224A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Abstract

The invention discloses an encapsulation part surrounding dam structure for preventing from overflowing a plastic package material from a surface, and a manufacturing method thereof. An encapsulation part comprises a chip, routing areas and a chip induction area; the chip is a rectangular structure on the whole; four corners of one surface are inverted trapezoidal routing areas; the rest part forms a cross structure; a rectangular chip induction area is in the middle part of the cross structure; a ring of surrounding dam is at the edge part near the chip induction area from inside to outside; and the turning part of the surrounding dam is in circular arc transition. The surrounding dam is realized in a wafer photoetching manner; and the structure has the characteristic of preventing from overflowing plastic package material from the surface.

Description

A kind of prevent surface from overflowing the packaging part box dam structure of plastic packaging material and manufacture method thereof
Technical field
The present invention relates to integrated circuit fields, a kind of prevent surface overflow plastic packaging material packaging part box dam knot Structure and manufacture method thereof.
Background technology
In prior art, chip is overall in rectangular structure, and four angles of one side are beating of inverted ladder type space Line region, remainder constitutes cross structure, and turning is right angle；It is a little length in the middle part of cross structure Square chip induction zone.In the fabrication process, glued membrane and chip surface are difficult to accomplish to fit tightly, cross Eight directions of structure all there may exist gap and cause the plastic packaging material that overflows.
As it is shown in figure 1, chip 1, DAF viscose glue 2, substrate 3, bonding wire 4 etc. constitute basic chips structure；
As shown in Figure 2, Figure 3, Figure 4, the plastic packaging based on mold 8 and lower mold 9, the glue in Fig. 3 Film 6 and chip upper surface have gap 7.
Summary of the invention
In order to solve the problem that above-mentioned prior art exists, the invention discloses one and prevent surface from overflowing plastic packaging material Packaging part box dam structure and manufacture method, by the construction of box dam, can effectively prevent surface from overflowing plastic packaging material Problem.
A kind of prevent surface from overflowing the packaging part box dam structure of plastic packaging material, packaging part include chip, routing region and Chip induction zone, chip is overall in rectangular structure, and four angles of one side are the routing district in inverted ladder type space Territory, remainder constitutes cross structure, is the chip induction zone of a small rectangle in the middle part of cross structure, From inside to outside near the marginal portion of chip induction zone, having a corral dam, box dam corner is arc transition.
Described box dam is PA glue.
Described box dam generally rectangle, circle, ellipse or irregular shape.
A kind of preventing surface from overflowing the manufacture method of packaging part box dam structure of plastic packaging material, described box dam passes through wafer Photolithographicallpatterned realizes.
Accompanying drawing explanation
Fig. 1, Fig. 2, Fig. 3, Fig. 4 are prior art diagram；
Fig. 5 is front view of the present invention；
Fig. 6 is left view of the present invention；
Fig. 7 is top view of the present invention.
In figure, 1 be chip, 2 be DAF viscose glue, 3 be substrate, 4 be bonding wire, 5 be plastic packaging material, 6 for glue Film, 7 be gap, 8 for mold, 9 for lower mold, 10 for routing region, 11 for chip induction zone, 12 For box dam, 13 be box dam corner.
Detailed description of the invention
A kind of preventing surface from overflowing the packaging part box dam structure of plastic packaging material, packaging part includes chip 1, routing region 10 and chip induction zone 11, chip 1 entirety is rectangular structure, and four angles of one side are inverted ladder type space Routing region 10, remainder constitute cross structure, be the core of a small rectangle in the middle part of cross structure , from inside to outside near the marginal portion of chip induction zone 11, there is a corral dam 12 sheet induction zone 11, encloses Corner, dam 13 is arc transition.
Described box dam 12 is PA glue.
Described box dam 12 generally rectangle, circle, ellipse or irregular shape.
A kind of preventing surface from overflowing the manufacture method of packaging part box dam structure of plastic packaging material, described box dam 12 is by crystalline substance Circle photolithographicallpatterned realizes.

Claims (4)

1. preventing surface from overflowing the packaging part box dam structure of plastic packaging material and a manufacture method thereof, packaging part includes core Sheet (1), routing region (10) and chip induction zone (11), chip (1) is overall in rectangular structure, Four angles of one side are the routing region (10) in inverted ladder type space, and remainder constitutes cross structure, ten It is the chip induction zone (11) of a small rectangle in the middle part of word structure, it is characterised in that the most close , there is a corral dam (12) marginal portion of chip induction zone (11), and box dam corner (13) are circular arc mistake Cross.
The most according to claim 1 a kind of preventing surface from overflowing the packaging part box dam structure of plastic packaging material, it is special Levying and be, described box dam (12) is PA glue.
The most according to claim 1 a kind of preventing surface from overflowing the packaging part box dam structure of plastic packaging material, it is special Levy and be, described box dam (12) generally rectangle, circle, ellipse or irregular shape.
4. one kind prevents surface from overflowing the manufacture method of packaging part box dam structure of plastic packaging material, it is characterised in that institute State box dam (12) to be realized by wafer photolithography mode.
CN201610471201.9A 2016-06-23 2016-06-23 Encapsulation part surrounding dam structure for preventing from overflowing plastic package material from surface, and manufacturing method thereof Pending CN105977224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610471201.9A CN105977224A (en) 2016-06-23 2016-06-23 Encapsulation part surrounding dam structure for preventing from overflowing plastic package material from surface, and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610471201.9A CN105977224A (en) 2016-06-23 2016-06-23 Encapsulation part surrounding dam structure for preventing from overflowing plastic package material from surface, and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN105977224A true CN105977224A (en) 2016-09-28

Family

ID=57020602

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610471201.9A Pending CN105977224A (en) 2016-06-23 2016-06-23 Encapsulation part surrounding dam structure for preventing from overflowing plastic package material from surface, and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN105977224A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050093176A1 (en) * 2003-10-29 2005-05-05 Meng-Chi Hung Bonding pad structure
CN101221930A (en) * 2007-01-10 2008-07-16 日月光半导体制造股份有限公司 Chip packaging structure and its packaging method
CN101290892A (en) * 2007-04-17 2008-10-22 矽品精密工业股份有限公司 Sensing type semiconductor device and its manufacture
CN104538373A (en) * 2014-12-30 2015-04-22 华天科技（昆山）电子有限公司 Three-dimensional integrated sensor chip packaging structure and packaging method
CN105244289A (en) * 2014-07-08 2016-01-13 台湾积体电路制造股份有限公司 Methods of packaging semiconductor devices and packaged semiconductor devices
CN205810787U (en) * 2016-06-23 2016-12-14 华天科技（西安）有限公司 A kind of prevent surface from overflowing the packaging part box dam structure of plastic packaging material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050093176A1 (en) * 2003-10-29 2005-05-05 Meng-Chi Hung Bonding pad structure
CN101221930A (en) * 2007-01-10 2008-07-16 日月光半导体制造股份有限公司 Chip packaging structure and its packaging method
CN101290892A (en) * 2007-04-17 2008-10-22 矽品精密工业股份有限公司 Sensing type semiconductor device and its manufacture
CN105244289A (en) * 2014-07-08 2016-01-13 台湾积体电路制造股份有限公司 Methods of packaging semiconductor devices and packaged semiconductor devices
CN104538373A (en) * 2014-12-30 2015-04-22 华天科技（昆山）电子有限公司 Three-dimensional integrated sensor chip packaging structure and packaging method
CN205810787U (en) * 2016-06-23 2016-12-14 华天科技（西安）有限公司 A kind of prevent surface from overflowing the packaging part box dam structure of plastic packaging material

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SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20160928