CN105951047A - Preparation method for tungsten-nickel alloy with nitrogen-yttrium-zirconium hard coating - Google Patents
Preparation method for tungsten-nickel alloy with nitrogen-yttrium-zirconium hard coating Download PDFInfo
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- CN105951047A CN105951047A CN201610470267.6A CN201610470267A CN105951047A CN 105951047 A CN105951047 A CN 105951047A CN 201610470267 A CN201610470267 A CN 201610470267A CN 105951047 A CN105951047 A CN 105951047A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
- C22C1/051—Making hard metals based on borides, carbides, nitrides, oxides or silicides; Preparation of the powder mixture used as the starting material therefor
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/02—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides
- C22C29/06—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds
- C22C29/08—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on carbides or carbonitrides based on carbides, but not containing other metal compounds based on tungsten carbide
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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Abstract
The invention discloses a preparation method for tungsten-nickel alloy with a nitrogen-yttrium-zirconium hard coating. According to the tungsten-nickel alloy prepared through the preparation method, the problems that 'nickel pools' and holes often occur in the preparation process of traditional fine grain hard alloy are solved so as to improve the comprehensive performance of the alloy. A direct-current and radio frequency reactive co-sputtering method is adopted, and under the conditions such as certain deposition pressure, temperature and nitrogen partial pressure, the high-hardness nitrogen-yttrium-zirconium coating is prepared on the surface of a hard alloy substrate by controlling Y target power.
Description
Technical field
The present invention relates to alloy material and manufacture field, be specifically related to a kind of preparation method possessing nitrogen-yttrium-zirconium hard coat tungsten nickel.
Background technology
Hard alloy has the features such as high intensity, high rigidity, excellent wearability, thermostability and good corrosion resistance, is therefore widely used in the working environments such as high pressure, high rotating speed, high temperature, Korrosionsmedium
WC-Ni hard alloy has the features such as high intensity, high rigidity, excellent wearability, thermostability and good corrosion resistance, is therefore widely used in the working environments such as high pressure, high rotating speed, high temperature, Korrosionsmedium.Owing to Ni belongs to face-centered cubic (F.c.c) crystallographic system, plasticity is fine, is susceptible to plastic deformation during wet grinding, forms the Ni powder ball of lamellar.Commercial production to be grown using Ni as the Ball-milling Time of the hard alloy of binding agent, even if so, cannot guarantee that the uniform refinement of Ni powder, and this is to there is Refining Mechanism distinct with Co powder based on Ni powder.
Mainly by adding alloying element in prior art, refine WC grain, by strict technology controlling and process, reduce the method such as hole and defect and improve the performance of WC-Ni hard alloy.The WC-Ni compound using traditional method to prepare often occurs " nickel pond " and hole under the conditions of vacuum-sintering." nickel pond " and hole can have a strong impact on the combination property of alloy, such as intensity, wearability, corrosion resistance etc..
By selecting suitable coating material and coating production, the hardness of hard alloy, wear-resisting and high temperature oxidation resistance can be improved, thus improve the service life of hard alloy.In these coated carbides, the nitride coatings of transition element has high hardness, excellent wear and corrosion behavior and chemical stability due to it, therefore at twenties years of the past, is widely used in a variety of applications.
Summary of the invention
The present invention provides a kind of preparation method possessing nitrogen-yttrium-zirconium hard coat tungsten nickel, tungsten nickel prepared by the method, solve and tradition fine grained cemented carbide preparation process often occurs " nickel pond " and the problem of hole, to put forward heavy alloyed combination property, use direct current and rf reactive co-sputtering method, under the conditions of certain deposition pressure, temperature, nitrogen partial pressure etc., prepare high rigidity nitrogen-yttrium-zirconium coating by control Y target power output at matrix surface.
To achieve these goals, the invention provides a kind of preparation method possessing nitrogen-yttrium-zirconium hard coat tungsten nickel, the method comprises the steps:
(1) matrix is prepared
Mixed powder is prepared by following composition by weight
Tungsten carbide, 90.1%-92.8%, Fisher particle size 0.8-1 μm；
Nikel powder, 5%-6%, Fisher particle size 0.5-1.0 μm；
Chromium carbide, surplus；
The mixed powder of said ratio is carried out wet grinding；Wherein Ball-milling Time Discrete control；First carbide powder and additive chromium carbide are added ball grinding cylinder wet grinding 12-16 hour, add nikel powder wet grinding 14-18 hour；
Compound slip complete for ball milling is dried；
Dry pack is pressed into the stampings of required form；
Stampings are placed on high temperature sintering in sintering furnace, and sintering temperature is 1450-1470 DEG C, temperature retention time 70-90min, and sintering pressure is 4.5-5.0Mpa, it is thus achieved that tungsten nickel matrix；
(2) substrate pretreated
Described substrate pretreated, can be ground polishing, ultrasonic cleaning and ion source successively and clean；
(3) pre-sputtering
The condition of described pre-sputtering is, substrate temperature is 300 DEG C, it is passed through argon, in regulation sputtering chamber body, operating pressure is to 1Pa, the DC source power of Zr target be the radio-frequency power supply power of 200W, Y target be 100W, the pre-sputtering time is 10min, to remove the nitride of target material surface, oxide etc., improve the sputter rate of target；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%；
(4) sputtering sedimentation
The condition of described sputtering sedimentation is, after pre-sputtering terminates, being passed through argon and nitrogen, total flux is 60sccm, wherein nitrogen flow is 10%-15%, the radio-frequency power supply power that DC source power is 250W, Y target that operating pressure is 0.2-0.3Pa, Zr target of deposition is 100-150W, two target surfaces are 90 °, common aura regional alignment hard alloy substrate, sputtering time is 90min, and substrate temperature is 300 DEG C；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%.
Preferably, in described step (2), described grinding and polishing, can first carry out matrix roughly grinding 10min on the boart boart wheel disc of 600 mesh, then on the boart boart wheel disc of 1200 mesh, carry out fine grinding 10min, it is polished to specimen surface the brightest with the diamond polishing powder of W2.5 again, described ultrasonic cleaning, matrix after grinding and polishing can be cleaned in the following order, acetone ultrasonic cleaning 5min → dehydrated alcohol ultrasonic cleaning 5min → dry is stand-by, described ion source cleans, and can use hall ion source that matrix is carried out 5min, and pressure is 2 × 10-2Pa, substrate temperature is 300 DEG C, and argon flux is 10sccm, biases as-100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, anode voltage is 80V, to remove adsorbed gas and the impurity of matrix surface, improves deposition coating and the bond strength of matrix and quality of forming film.
The tungsten nickel prepared according to said method, can reach the purpose significantly improving and controlling materials microstructure structure so that the tungsten nickel strength of materials of preparation and hardness can reach perfectly to mate, high comprehensive performance.
Detailed description of the invention
Embodiment one
By following composition by weight preparation mixed powder:
Tungsten carbide, 90.1%, Fisher particle size 0.8-1 μm；
Nikel powder, 5%, Fisher particle size 0.5-1.0 μm；
Chromium carbide, surplus.
The mixed powder of said ratio is carried out wet grinding；Wherein Ball-milling Time Discrete control；First carbide powder and additive chromium carbide are added ball grinding cylinder wet grinding 12 hours, add nikel powder wet grinding 14 hours.
Compound slip complete for ball milling is dried.
Dry pack is pressed into the stampings of required form.
Stampings are placed on high temperature sintering in sintering furnace, and sintering temperature is 1450 DEG C, temperature retention time 70-90min, and sintering pressure is 4.5Mpa, it is thus achieved that tungsten nickel matrix.
Substrate pretreated, described substrate pretreated, polishing, ultrasonic cleaning and ion source can be ground successively and clean.Described grinding and polishing, can first carry out matrix roughly grinding 10min on the boart boart wheel disc of 600 mesh, then on the boart boart wheel disc of 1200 mesh, carry out fine grinding 10min, it is polished to specimen surface the brightest with the diamond polishing powder of W2.5 again, described ultrasonic cleaning, matrix after grinding and polishing can be cleaned in the following order, acetone ultrasonic cleaning 5min → dehydrated alcohol ultrasonic cleaning 5min → dry is stand-by, described ion source cleans, can use hall ion source that matrix is carried out 5min, pressure is 2 × 10-2Pa, substrate temperature is 300 DEG C, and argon flux is 10sccm, biases as-100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, anode voltage is 80V, to remove adsorbed gas and the impurity of matrix surface, improves deposition coating and the bond strength of matrix and quality of forming film.
Pre-sputtering, the condition of described pre-sputtering is, substrate temperature is 300 DEG C, being passed through argon, in regulation sputtering chamber body, operating pressure is 200W to the DC source power of 1Pa, Zr target, the radio-frequency power supply power of Y target is 100W, the pre-sputtering time is 10min, to remove the nitride of target material surface, oxide etc., improves the sputter rate of target；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%.
Sputtering sedimentation, the condition of described sputtering sedimentation is, after pre-sputtering terminates, it is passed through argon and nitrogen, total flux is 60sccm, and wherein nitrogen flow is 10%, and the operating pressure of deposition is 0.2Pa, the DC source power of Zr target is 250W, the radio-frequency power supply power of Y target is 100W, and two target surfaces are 90 °, common aura regional alignment hard alloy substrate, sputtering time is 90min, and substrate temperature is 300 DEG C；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%.
Embodiment two
By following composition by weight preparation mixed powder:
Tungsten carbide, 92.8%, Fisher particle size 0.8-1 μm；
Nikel powder, 6%, Fisher particle size 0.5-1.0 μm；
Chromium carbide, surplus.
The mixed powder of said ratio is carried out wet grinding；Wherein Ball-milling Time Discrete control；First carbide powder and additive chromium carbide are added ball grinding cylinder wet grinding 16 hours, add nikel powder wet grinding 18 hours.
Compound slip complete for ball milling is dried.
Dry pack is pressed into the stampings of required form.
Stampings are placed on high temperature sintering in sintering furnace, and sintering temperature is 1470 DEG C, temperature retention time 90min, and sintering pressure is 5.0Mpa, it is thus achieved that tungsten nickel matrix.
Substrate pretreated, described substrate pretreated, polishing, ultrasonic cleaning and ion source can be ground successively and clean.Described grinding and polishing, can first carry out matrix roughly grinding 10min on the boart boart wheel disc of 600 mesh, then on the boart boart wheel disc of 1200 mesh, carry out fine grinding 10min, it is polished to specimen surface the brightest with the diamond polishing powder of W2.5 again, described ultrasonic cleaning, matrix after grinding and polishing can be cleaned in the following order, acetone ultrasonic cleaning 5min → dehydrated alcohol ultrasonic cleaning 5min → dry is stand-by, described ion source cleans, can use hall ion source that matrix is carried out 5min, pressure is 2 × 10-2Pa, substrate temperature is 300 DEG C, and argon flux is 10sccm, biases as-100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, anode voltage is 80V, to remove adsorbed gas and the impurity of matrix surface, improves deposition coating and the bond strength of matrix and quality of forming film.
Pre-sputtering, the condition of described pre-sputtering is, substrate temperature is 300 DEG C, being passed through argon, in regulation sputtering chamber body, operating pressure is 200W to the DC source power of 1Pa, Zr target, the radio-frequency power supply power of Y target is 100W, the pre-sputtering time is 10min, to remove the nitride of target material surface, oxide etc., improves the sputter rate of target；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%.
Sputtering sedimentation, the condition of described sputtering sedimentation is, after pre-sputtering terminates, it is passed through argon and nitrogen, total flux is 60sccm, and wherein nitrogen flow is 15%, and the operating pressure of deposition is 0.3Pa, the DC source power of Zr target is 250W, the radio-frequency power supply power of Y target is 150W, and two target surfaces are 90 °, common aura regional alignment hard alloy substrate, sputtering time is 90min, and substrate temperature is 300 DEG C；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%.
Claims (2)
1. possessing a preparation method for nitrogen-yttrium-zirconium hard coat tungsten nickel, the method comprises the steps:
(1) matrix is prepared
Mixed powder is prepared by following composition by weight
Tungsten carbide, 90.1%-92.8%, Fisher particle size 0.8-1 μm；
Nikel powder, 5%-6%, Fisher particle size 0.5-1.0 μm；
Chromium carbide, surplus；
The mixed powder of said ratio is carried out wet grinding；Wherein Ball-milling Time Discrete control；First carbide powder and additive chromium carbide are added ball grinding cylinder wet grinding 12-16 hour, add nikel powder wet grinding 14-18 hour；
Compound slip complete for ball milling is dried；
Dry pack is pressed into the stampings of required form；
Stampings are placed on high temperature sintering in sintering furnace, and sintering temperature is 1450-1470 DEG C, temperature retention time 70-90min, and sintering pressure is 4.5-5.0Mpa, it is thus achieved that tungsten nickel matrix；
(2) substrate pretreated
Described substrate pretreated, can be ground polishing, ultrasonic cleaning and ion source successively and clean；
(3) pre-sputtering
The condition of described pre-sputtering is, substrate temperature is 300 DEG C, it is passed through argon, in regulation sputtering chamber body, operating pressure is to 1Pa, the DC source power of Zr target be the radio-frequency power supply power of 200W, Y target be 100W, the pre-sputtering time is 10min, to remove the nitride of target material surface, oxide etc., improve the sputter rate of target；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%；
(4) sputtering sedimentation
The condition of described sputtering sedimentation is, after pre-sputtering terminates, being passed through argon and nitrogen, total flux is 60sccm, wherein nitrogen flow is 10%-15%, the radio-frequency power supply power that DC source power is 250W, Y target that operating pressure is 0.2-0.3Pa, Zr target of deposition is 100-150W, two target surfaces are 90 °, common aura regional alignment hard alloy substrate, sputtering time is 90min, and substrate temperature is 300 DEG C；Described argon and nitrogen gas purity can be 99.99%, and the purity of Zr target can be 99.995%, and the purity of Y target can be 99.9%.
2. the method for claim 1, it is characterized in that, in described step (2), described grinding and polishing, can first carry out matrix roughly grinding 10min on the boart boart wheel disc of 600 mesh, then on the boart boart wheel disc of 1200 mesh, carry out fine grinding 10min, it is polished to specimen surface the brightest with the diamond polishing powder of W2.5 again, described ultrasonic cleaning, matrix after grinding and polishing can be cleaned in the following order, acetone ultrasonic cleaning 5min → dehydrated alcohol ultrasonic cleaning 5min → dry is stand-by, described ion source cleans, can use hall ion source that matrix is carried out 5min, pressure is 2 × 10-2Pa, substrate temperature is 300 DEG C, and argon flux is 10sccm, biases as-100V, cathode current is 29.5A, and cathode voltage is 19V, and anode current is 7A, anode voltage is 80V, to remove adsorbed gas and the impurity of matrix surface, improves deposition coating and the bond strength of matrix and quality of forming film.
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| CN201610470267.6A CN105951047A (en) | 2016-06-26 | 2016-06-26 | Preparation method for tungsten-nickel alloy with nitrogen-yttrium-zirconium hard coating |
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| CN201610470267.6A CN105951047A (en) | 2016-06-26 | 2016-06-26 | Preparation method for tungsten-nickel alloy with nitrogen-yttrium-zirconium hard coating |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108286005A (en) * | 2018-03-07 | 2018-07-17 | 瞿凌飞 | A kind of preparation method of the tungsten nickel of rare-earth mamem layer |
| CN110102769A (en) * | 2019-05-14 | 2019-08-09 | 株洲特利亚硬质合金有限公司 | A kind of wet milling process conducive to high bonding phase cemented carbide uniform texture |
| CN115161608A (en) * | 2022-07-06 | 2022-10-11 | 烟台大学 | Preparation method of ZrYAgN nano solid solution film with high hydrophobicity and self-lubrication |
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| CN103898461A (en) * | 2014-04-30 | 2014-07-02 | 厦门大学 | Method for preparing nano-structured hard coating on surface of cemented carbide substrate |
| CN105586572A (en) * | 2016-02-11 | 2016-05-18 | 广东工业大学 | (Ti, Al, Zr) N multi-component composite coating layer, gradient ultrathin hard alloy cutter with composite coating layer and preparation method thereof |
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| US5660881A (en) * | 1991-02-21 | 1997-08-26 | Mitsubishi Materials Corporation | Method of manufacturing CVD diamond coated cutting tools |
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| CN105695837A (en) * | 2014-11-26 | 2016-06-22 | 自贡硬质合金有限责任公司 | Preparation method of WC-Ni fine grain cemented carbide |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108286005A (en) * | 2018-03-07 | 2018-07-17 | 瞿凌飞 | A kind of preparation method of the tungsten nickel of rare-earth mamem layer |
| CN110102769A (en) * | 2019-05-14 | 2019-08-09 | 株洲特利亚硬质合金有限公司 | A kind of wet milling process conducive to high bonding phase cemented carbide uniform texture |
| CN110102769B (en) * | 2019-05-14 | 2022-07-01 | 株洲特利亚硬质合金有限公司 | Wet grinding method beneficial to uniformity of high-binder phase hard alloy tissue structure |
| CN115161608A (en) * | 2022-07-06 | 2022-10-11 | 烟台大学 | Preparation method of ZrYAgN nano solid solution film with high hydrophobicity and self-lubrication |
| CN115161608B (en) * | 2022-07-06 | 2023-10-27 | 烟台大学 | Preparation method of ZrYAgN nano solid solution film with high hydrophobicity and self-lubrication |
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