CN105949718A - High-hardness heat-resistant coating for anti-dazzle glass - Google Patents

High-hardness heat-resistant coating for anti-dazzle glass Download PDF

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Publication number
CN105949718A
CN105949718A CN201610304452.8A CN201610304452A CN105949718A CN 105949718 A CN105949718 A CN 105949718A CN 201610304452 A CN201610304452 A CN 201610304452A CN 105949718 A CN105949718 A CN 105949718A
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parts
high rigidity
nano
modified
resisting anti
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凌卫平
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Anhui Herun Special Glass Co Ltd
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Anhui Herun Special Glass Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/16Applications used for films
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The invention discloses a high-hardness heat-resistant coating for anti-dazzle glass. Raw materials of the high-hardness heat-resistant coating comprise organosilicon modified epoxy resin, alkyd resin, polychloroacetic acid, modified vanadium dioxide, a styrene elastomer, nanometer tin antimony oxide, a polysiloxane prepolymer, styrene, o-phenylenediamine, acetylacetone, acrylate, nanometer titania, alumina, mica powder, sodium dodecylbenzenesulphonate, benzophenone, a leveling agent, an antifoaming agent, a dispersing agent, a thickener, a stabilizer and an adhesive. The coating for the anti-dazzle glass has good photopermeability and excellent wear resistance and heat resistance.

Description

A kind of high rigidity heat-resisting anti-dazzle glas film
Technical field
The present invention relates to glass-film Material Field, particularly relate to a kind of high rigidity heat-resisting anti-dazzle glas film.
Background technology
Anti-dazzle glas is also known as anti reflection glass or non-reflecting glass.Anti-dazzle glas reduces glass surface reflectance, Make reflectance≤2%, light transmittance >=80%, glossiness >=60%.Anti-dazzle glas is that glass is carried out spy by one The different glass processed, its principle is high-quality glass single-sided or two-sided to carry out PROCESS FOR TREATMENT so that it is with common glass Glass is compared has relatively low reflectivity, makes the reflectance reduction of light to less than 1%, thus reduces the dry of ambient light Disturb, improve the definition of picture, reduce screen reflecting, make image apparent, true to nature, allow audience enjoy To more preferably visual effect.
The hardness of anti-dazzle glas film of the prior art and heat resistance cannot meet the demand in production, therefore Need exploitation badly and a kind of there is high rigidity heat-resisting anti-dazzle glas film to the demand meeting in actual production.
Summary of the invention
For solving technical problem present in background technology, the present invention proposes a kind of heat-resisting anti-dazzle glas of high rigidity Film, hardness is high, and thermostability and anti-dazzle performance are good.
A kind of high rigidity heat-resisting anti-dazzle glas film that the present invention proposes, its raw material includes by weight: organic Silicon modified epoxy resin 25-45 part, alkyd resin 5-15 part, poly chloroacetic acid 2-8 part, modified vanadium dioxide 3-9 part, styrenic elastomer 1-5 part, nano antimony tin oxide 2-4 part, polysiloxane prepolymers 3-5 part, Styrene 1-3 part, o-phenylenediamine 2-6 part, acetylacetone,2,4-pentanedione 1-4 part, acrylate 2-5 part, nanometer two Titanium oxide 3-5 part, nano silicon 1-4 part, aluminium oxide 2-5 part, mica powder 3-6 part, dodecane Base benzene sulfonic acid sodium salt 1-4 part, benzophenone 2-4 part, levelling agent 3-5 part, defoamer 1-6 part, dispersant 2-7 part, thickening agent 1-3 part, stabilizer 2-5 part, adhesive 1-4 part.
Preferably, modified vanadium dioxide is prepared by following technique: sodium silicate solution is molten with ammonium hydrogen carbonate Liquid is mixed to get material a, then adds in vanadium oxysulfate solution by material a, stirs 1-3h, uses after filtration Washes of absolute alcohol 2-4 time, obtains material b;Material b is done in 40-50 DEG C of vacuum drying 1-3h Dry powder body, is then warming up to 700-800 DEG C by dry powder body with 10 DEG C/min, is then incubated 2-4h, insulation During inject 600-800ml air and obtain modified vanadium dioxide.
Preferably, the substance withdrawl syndrome of sodium silicate solution is 0.05-0.15mol/L;Ammonium bicarbonate soln Substance withdrawl syndrome is 0.01-0.05mol/L;The substance withdrawl syndrome of vanadium oxysulfate solution is 0.15-0.35mol/L。
Preferably, the weight ratio of sodium silicate solution, ammonium bicarbonate soln and vanadium oxysulfate solution is 2-4:3-6: 5-8。
Preferably, modifying epoxy resin by organosilicon, alkyd resin, poly chloroacetic acid, modified vanadium dioxide, benzene The weight ratio of ethylene elastomer, nano antimony tin oxide and polysiloxane prepolymers is 28-42:8-12:3-7: 4-8:2-4:2.5-3.5:3.5-4.5.
Preferably, styrene, o-phenylenediamine, acetylacetone,2,4-pentanedione, acrylate, nano titanium oxide, nanometer The weight ratio of silicon dioxide, aluminium oxide, mica powder and dodecylbenzene sodium sulfonate is 1.5-2.5:3-5:2-3: 3-4:3.5-4.5:2-3:3-4:4-5:2-3.
Preferably, modifying epoxy resin by organosilicon, alkyd resin, poly chloroacetic acid, sodium silicate solution, carbonic acid The weight ratio of hydrogen ammonium salt solution and vanadium oxysulfate solution is 28-42:8-12:3-7:2.5-3.5:4-5:6-7.
Preferably, its raw material includes by weight: modifying epoxy resin by organosilicon 28-42 part, alkyd resin 8-12 part, poly chloroacetic acid 3-7 part, modified vanadium dioxide 4-8 part, styrenic elastomer 2-4 part, nanometer Tin-antiomony oxide 2.5-3.5 part, polysiloxane prepolymers 3.5-4.5 part, styrene 1.5-2.5 part, adjacent benzene Diamidogen 3-5 part, acetylacetone,2,4-pentanedione 2-3 part, acrylate 3-4 part, nano titanium oxide 3.5-4.5 part, Nano silicon 2-3 part, aluminium oxide 3-4 part, mica powder 4-5 part, dodecylbenzene sodium sulfonate 2-3 Part, benzophenone 2.5-3.5 part, levelling agent 3.5-4.5 part, defoamer 2-5 part, dispersant 3-6 part, Thickening agent 1.5-2.5 part, stabilizer 3-4 part, adhesive 2-3 part.
Preferably, its raw material includes by weight: modifying epoxy resin by organosilicon 35 parts, alkyd resin 10 Part, poly chloroacetic acid 5 parts, modified vanadium dioxide 6 parts, styrenic elastomer 3 parts, nano antimony tin oxide 3 Part, polysiloxane prepolymers 4 parts, styrene 2 parts, o-phenylenediamine 4 parts, acetylacetone,2,4-pentanedione 2.5 parts, third Olefin(e) acid ester 3.5 parts, nano titanium oxide 4 parts, nano silicon 2.5 parts, aluminium oxide 3.5 parts, cloud Female 4.5 parts of powder, dodecylbenzene sodium sulfonate 2.5 parts, benzophenone 3 parts, levelling agent 4 parts, defoamer 3.5 Part, dispersant 4.5 parts, thickening agent 2 parts, stabilizer 3.5 parts, adhesive 2.5 parts.
A kind of high rigidity heat-resisting anti-dazzle glas film of the present invention, its raw material include modifying epoxy resin by organosilicon, Alkyd resin, poly chloroacetic acid, modified vanadium dioxide, styrenic elastomer, nano antimony tin oxide, poly-silica Alkane prepolymer, styrene, o-phenylenediamine, acetylacetone,2,4-pentanedione, acrylate, nano titanium oxide, nanometer two Silicon oxide, aluminium oxide, mica powder, dodecylbenzene sodium sulfonate, benzophenone, levelling agent, defoamer, Dispersant, thickening agent, stabilizer and adhesive.With modifying epoxy resin by organosilicon, alkyd resin and polychlorostyrene Acetic acid is as resin base material, and the proportioning of each resin of conservative control, makes modifying epoxy resin by organosilicon as master Material, alkyd resin and poly chloroacetic acid are as auxiliary reinforcement material so that modifying epoxy resin by organosilicon has excellence Wear-resisting and heat resistance;Add styrenic elastomer, nano antimony tin oxide, polysiloxane prepolymers, Styrene, o-phenylenediamine, acetylacetone,2,4-pentanedione, acrylate, nano titanium oxide, nano silicon, oxygen Change aluminum, mica powder, dodecylbenzene sodium sulfonate, benzophenone, levelling agent, defoamer, dispersant, increasing Thick dose, stabilizer and adhesive, as filler and auxiliary agent, conservative control proportioning, are effectively increased the present invention's Anti-dazzle glas film antiwear heat resisting performance so that it is there is the translucidus of excellence;Add modified vanadium dioxide with Vanadium oxysulfate solution and ammonium bicarbonate soln are raw material, prepare presoma, calcining by solution reaction, it is thus achieved that Vanadium dioxide and mix the hypovanadic oxide powder of Si, injects air, it is possible to be effectively improved Si in sintering process Doping efficiency and degree of crystallinity, the hard of anti-dazzle glas film can be effectively improved by adding modified vanadium dioxide Degree and anti-wear performance.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail, it should be appreciated that embodiment is served only for The bright present invention rather than be used for limiting the invention, any made on the basis of the present invention amendment, Equivalents etc. are the most within the scope of the present invention.
In detailed description of the invention, the weight portion of modifying epoxy resin by organosilicon can be 25 parts, 26 parts, 27 Part, 28 parts, 29 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts, 40 parts, 41 parts, 42 parts, 43 parts, 44 parts, 45 parts;The weight portion of alkyd resin Can be 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 Part;The weight portion of poly chloroacetic acid can be 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts;Modified The weight portion of vanadium dioxide can be 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts;Styrene bullet The weight portion of gonosome can be 1 part, 2 parts, 3 parts, 4 parts, 5 parts;The weight portion of nano antimony tin oxide can Think 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts;The weight portion of polysiloxane prepolymers can be 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts;Cinnamic weight portion can be 1 part, 1.5 parts, 2 parts, 2.5 Part, 3 parts;The weight portion of o-phenylenediamine can be 2 parts, 3 parts, 4 parts, 5 parts, 6 parts;Acetylacetone,2,4-pentanedione Weight portion can be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts;The weight of acrylate Amount part can be 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 5 parts;The weight portion of nano titanium oxide can Think 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts;The weight portion of nano silicon can be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts;The weight portion of aluminium oxide can be 2 parts, 2.5 Part, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts;The weight portion of mica powder can be 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts;The weight portion of dodecylbenzene sodium sulfonate can be 1 part, 1.5 Part, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts;The weight portion of benzophenone can be 2.5 parts, 3 parts, 3.5 parts, 4 parts;The weight portion of levelling agent can be 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts;Froth breaking The weight portion of agent can be 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts;The weight portion of dispersant can be 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts;The weight portion of thickening agent can be 1 part, 1.5 Part, 2 parts, 2.5 parts, 3 parts;The weight portion of stabilizer can be 2 parts, 2.5 parts, 3 parts, 3.5 parts, 3.8 parts, 4 parts, 4.2 parts, 4.5 parts, 4.8 parts, 5 parts;The weight portion of adhesive can be 1 part, 1.5 Part, 2 parts, 2.5 parts, 2.8 parts, 3 parts, 3.2 parts, 3.5 parts, 3.8 parts, 4 parts.
Embodiment 1
A kind of high rigidity heat-resisting anti-dazzle glas film that the present invention proposes, its raw material includes by weight: organic Silicon modified epoxy resin 35 parts, alkyd resin 10 parts, poly chloroacetic acid 5 parts, modified vanadium dioxide 6 parts, Styrenic elastomer 3 parts, nano antimony tin oxide 3 parts, polysiloxane prepolymers 4 parts, styrene 2 parts, O-phenylenediamine 4 parts, acetylacetone,2,4-pentanedione 2.5 parts, acrylate 3.5 parts, nano titanium oxide 4 parts, nanometer Silicon dioxide 2.5 parts, aluminium oxide 3.5 parts, mica powder 4.5 parts, dodecylbenzene sodium sulfonate 2.5 parts, Benzophenone 3 parts, levelling agent 4 parts, defoamer 3.5 parts, dispersant 4.5 parts, thickening agent 2 parts, steady Determine agent 3.5 parts, adhesive 2.5 parts.
Modified vanadium dioxide is prepared by following technique: by 3 parts of substance withdrawl syndrome be by weight 0.10mol/L sodium silicate solution and 4.5 parts of substance withdrawl syndrome are that 0.03mol/L ammonium bicarbonate soln mixes To material a, then material a being added 6.5 parts of substance withdrawl syndrome is in 0.25mol/L vanadium oxysulfate solution, Stirring 2h, uses washes of absolute alcohol 3 times after filtration, obtains material b;By material b in 45 DEG C of vacuum drying 2h obtains being dried powder body, then with 10 DEG C/min, dry powder body is warming up to 750 DEG C, is then incubated 3h, protects Inject 700ml air during temperature and obtain modified vanadium dioxide.
Embodiment 2
A kind of high rigidity heat-resisting anti-dazzle glas film that the present invention proposes, its raw material includes by weight: organic Silicon modified epoxy resin 25 parts, alkyd resin 15 parts, poly chloroacetic acid 2 parts, modified vanadium dioxide 9 parts, Styrenic elastomer 1 part, nano antimony tin oxide 4 parts, polysiloxane prepolymers 3 parts, styrene 3 parts, O-phenylenediamine 2 parts, acetylacetone,2,4-pentanedione 4 parts, acrylate 2 parts, nano titanium oxide 5 parts, nano-silica SiClx 1 part, aluminium oxide 5 parts, mica powder 3 parts, dodecylbenzene sodium sulfonate 4 parts, benzophenone 2 parts, Levelling agent 5 parts, defoamer 1 part, dispersant 7 parts, thickening agent 1 part, stabilizer 5 parts, adhesive 1 Part.
Modified vanadium dioxide is prepared by following technique: by 2 parts of substance withdrawl syndrome be by weight 0.15mol/L sodium silicate solution and 3 parts of substance withdrawl syndrome are that 0.05mol/L ammonium bicarbonate soln is mixed to get Material a, then material a being added 5 parts of substance withdrawl syndrome is in 0.35mol/L vanadium oxysulfate solution, stirs Mix 1h, use washes of absolute alcohol 4 times after filtration, obtain material b;Material b is vacuum dried 3h in 40 DEG C Obtain being dried powder body, then dry powder body is warming up to 700 DEG C with 10 DEG C/min, is then incubated 4h, insulation During inject 600ml air and obtain modified vanadium dioxide.
Embodiment 3
A kind of high rigidity heat-resisting anti-dazzle glas film that the present invention proposes, its raw material includes by weight: organic Silicon modified epoxy resin 45 parts, alkyd resin 5 parts, poly chloroacetic acid 8 parts, modified vanadium dioxide 3 parts, benzene Ethylene elastomer 5 parts, nano antimony tin oxide 2 parts, polysiloxane prepolymers 5 parts, styrene 1 part, neighbour Phenylenediamine 6 parts, acetylacetone,2,4-pentanedione 1 part, acrylate 5 parts, nano titanium oxide 3 parts, nanometer titanium dioxide Silicon 4 parts, aluminium oxide 2 parts, mica powder 6 parts, dodecylbenzene sodium sulfonate 1 part, benzophenone 4 parts, Levelling agent 3 parts, defoamer 6 parts, dispersant 2 parts, thickening agent 3 parts, stabilizer 2 parts, adhesive 4 Part.
Modified vanadium dioxide is prepared by following technique: by 4 parts of substance withdrawl syndrome be by weight 0.05mol/L sodium silicate solution and 6 parts of substance withdrawl syndrome are that 0.01mol/L ammonium bicarbonate soln is mixed to get Material a, then material a being added 8 parts of substance withdrawl syndrome is in 0.15mol/L vanadium oxysulfate solution, stirs Mix 3h, use washes of absolute alcohol 2 times after filtration, obtain material b;Material b is vacuum dried 1h in 50 DEG C Obtain being dried powder body, then dry powder body is warming up to 800 DEG C with 10 DEG C/min, is then incubated 2h, insulation During inject 800ml air and obtain modified vanadium dioxide.
Embodiment 4
A kind of high rigidity heat-resisting anti-dazzle glas film that the present invention proposes, its raw material includes by weight: organic Silicon modified epoxy resin 28 parts, alkyd resin 12 parts, poly chloroacetic acid 3 parts, modified vanadium dioxide 8 parts, Styrenic elastomer 2 parts, nano antimony tin oxide 3.5 parts, polysiloxane prepolymers 3.5 parts, styrene 2.5 Part, o-phenylenediamine 3 parts, acetylacetone,2,4-pentanedione 3 parts, acrylate 3 parts, nano titanium oxide 4.5 parts, receive Rice silicon dioxide 2 parts, aluminium oxide 4 parts, mica powder 4 parts, dodecylbenzene sodium sulfonate 3 parts, hexichol first Ketone 2.5 parts, levelling agent 4.5 parts, defoamer 2 parts, dispersant 6 parts, thickening agent 1.5 parts, stabilizer 4 parts, adhesive 2 parts.
Modified vanadium dioxide is prepared by following technique: by 2.5 parts of substance withdrawl syndrome be by weight 0.12mol/L sodium silicate solution and 4 parts of substance withdrawl syndrome are that 0.04mol/L ammonium bicarbonate soln is mixed to get Material a, then material a being added 6 parts of substance withdrawl syndrome is in 0.32mol/L vanadium oxysulfate solution, stirs Mix 1.5h, use washes of absolute alcohol 3.5 times after filtration, obtain material b;Material b is done in 42 DEG C of vacuum Dry 2.5h obtains being dried powder body, then with 10 DEG C/min, dry powder body is warming up to 720 DEG C, is then incubated 3.5h, injects 620ml air and obtains modified vanadium dioxide during insulation.
Embodiment 5
A kind of high rigidity heat-resisting anti-dazzle glas film that the present invention proposes, its raw material includes by weight: organic Silicon modified epoxy resin 42 parts, alkyd resin 8 parts, poly chloroacetic acid 7 parts, modified vanadium dioxide 4 parts, benzene Ethylene elastomer 4 parts, nano antimony tin oxide 2.5 parts, polysiloxane prepolymers 4.5 parts, styrene 1.5 Part, o-phenylenediamine 5 parts, acetylacetone,2,4-pentanedione 2 parts, acrylate 4 parts, nano titanium oxide 3.5 parts, receive Rice silicon dioxide 3 parts, aluminium oxide 3 parts, mica powder 5 parts, dodecylbenzene sodium sulfonate 2 parts, hexichol first Ketone 3.5 parts, levelling agent 3.5 parts, defoamer 5 parts, dispersant 3 parts, thickening agent 2.5 parts, stabilizer 3 parts, adhesive 3 parts.
Modified vanadium dioxide is prepared by following technique: by 3.5 parts of substance withdrawl syndrome be by weight 0.08mol/L sodium silicate solution and 5 parts of substance withdrawl syndrome are that 0.02mol/L ammonium bicarbonate soln is mixed to get Material a, then material a being added 7 parts of substance withdrawl syndrome is in 0.18mol/L vanadium oxysulfate solution, stirs Mix 2.5h, use washes of absolute alcohol 2.5 times after filtration, obtain material b;Material b is done in 48 DEG C of vacuum Dry 1.5h obtains being dried powder body, then with 10 DEG C/min, dry powder body is warming up to 780 DEG C, is then incubated 2.5h, injects 780ml air and obtains modified vanadium dioxide during insulation.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention not office Being limited to this, any those familiar with the art is in the technical scope that the invention discloses, according to this The technical scheme of invention and inventive concept thereof in addition equivalent or change, all should contain the protection in the present invention Within the scope of.

Claims (9)

1. a high rigidity heat-resisting anti-dazzle glas film, it is characterised in that its raw material includes by weight: have Machine silicon modified epoxy resin 25-45 part, alkyd resin 5-15 part, poly chloroacetic acid 2-8 part, modified titanium dioxide Vanadium 3-9 part, styrenic elastomer 1-5 part, nano antimony tin oxide 2-4 part, polysiloxane prepolymers 3-5 Part, styrene 1-3 part, o-phenylenediamine 2-6 part, acetylacetone,2,4-pentanedione 1-4 part, acrylate 2-5 part, receive Rice titanium dioxide 3-5 part, nano silicon 1-4 part, aluminium oxide 2-5 part, mica powder 3-6 part, ten Dialkyl benzene sulfonic acids sodium 1-4 part, benzophenone 2-4 part, levelling agent 3-5 part, defoamer 1-6 part, point Powder 2-7 part, thickening agent 1-3 part, stabilizer 2-5 part, adhesive 1-4 part.
High rigidity the most according to claim 1 heat-resisting anti-dazzle glas film, it is characterised in that modified two Vanadium oxide is prepared by following technique: sodium silicate solution and ammonium bicarbonate soln are mixed to get material a, Then material a is added in vanadium oxysulfate solution, stirs 1-3h, after filtration, use washes of absolute alcohol 2-4 time, Obtain material b;Obtain being dried powder body, then by xeraphium in 40-50 DEG C of vacuum drying 1-3h by material b Body is warming up to 700-800 DEG C with 10 DEG C/min, is then incubated 2-4h, injects 600-800ml during insulation Air obtains modified vanadium dioxide.
High rigidity the most according to claim 1 and 2 heat-resisting anti-dazzle glas film, it is characterised in that silicon The substance withdrawl syndrome of acid sodium solution is 0.05-0.15mol/L;The substance withdrawl syndrome of ammonium bicarbonate soln is 0.01-0.05mol/L;The substance withdrawl syndrome of vanadium oxysulfate solution is 0.15-0.35mol/L.
4. according to the high rigidity heat-resisting anti-dazzle glas film described in any one of claim 1-3, it is characterised in that The weight ratio of sodium silicate solution, ammonium bicarbonate soln and vanadium oxysulfate solution is 2-4:3-6:5-8.
5. according to the high rigidity heat-resisting anti-dazzle glas film described in any one of claim 1-4, it is characterised in that Modifying epoxy resin by organosilicon, alkyd resin, poly chloroacetic acid, modified vanadium dioxide, styrenic elastomer, The weight ratio of nano antimony tin oxide and polysiloxane prepolymers is 28-42:8-12:3-7:4-8:2-4: 2.5-3.5:3.5-4.5.
6. according to the high rigidity heat-resisting anti-dazzle glas film described in any one of claim 1-5, it is characterised in that Styrene, o-phenylenediamine, acetylacetone,2,4-pentanedione, acrylate, nano titanium oxide, nano silicon, oxygen The weight ratio changing aluminum, mica powder and dodecylbenzene sodium sulfonate is 1.5-2.5:3-5:2-3:3-4:3.5-4.5: 2-3:3-4:4-5:2-3.
7. according to the high rigidity heat-resisting anti-dazzle glas film described in any one of claim 1-6, it is characterised in that Modifying epoxy resin by organosilicon, alkyd resin, poly chloroacetic acid, sodium silicate solution, ammonium bicarbonate soln and sulfur The weight ratio of acid vanadyl solution is 28-42:8-12:3-7:2.5-3.5:4-5:6-7.
8. according to the high rigidity heat-resisting anti-dazzle glas film described in any one of claim 1-7, it is characterised in that Its raw material includes by weight: modifying epoxy resin by organosilicon 28-42 part, alkyd resin 8-12 part, polychlorostyrene Acetic acid 3-7 part, modified vanadium dioxide 4-8 part, styrenic elastomer 2-4 part, nano antimony tin oxide 2.5-3.5 Part, polysiloxane prepolymers 3.5-4.5 part, styrene 1.5-2.5 part, o-phenylenediamine 3-5 part, acetyl Acetone 2-3 part, acrylate 3-4 part, nano titanium oxide 3.5-4.5 part, nano silicon 2-3 Part, aluminium oxide 3-4 part, mica powder 4-5 part, dodecylbenzene sodium sulfonate 2-3 part, benzophenone 2.5-3.5 Part, levelling agent 3.5-4.5 part, defoamer 2-5 part, dispersant 3-6 part, thickening agent 1.5-2.5 part, Stabilizer 3-4 part, adhesive 2-3 part.
9. according to the high rigidity heat-resisting anti-dazzle glas film described in any one of claim 1-8, it is characterised in that Its raw material includes by weight: modifying epoxy resin by organosilicon 35 parts, alkyd resin 10 parts, poly chloroacetic acid 5 parts, modified vanadium dioxide 6 parts, styrenic elastomer 3 parts, nano antimony tin oxide 3 parts, polysiloxanes Prepolymer 4 parts, styrene 2 parts, o-phenylenediamine 4 parts, acetylacetone,2,4-pentanedione 2.5 parts, acrylate 3.5 parts, Nano titanium oxide 4 parts, nano silicon 2.5 parts, aluminium oxide 3.5 parts, mica powder 4.5 parts, ten 2.5 parts of dialkyl benzene sulfonic acids sodium, benzophenone 3 parts, levelling agent 4 parts, defoamer 3.5 parts, dispersant 4.5 parts, thickening agent 2 parts, stabilizer 3.5 parts, adhesive 2.5 parts.
CN201610304452.8A 2016-05-06 2016-05-06 High-hardness heat-resistant coating for anti-dazzle glass Pending CN105949718A (en)

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Application publication date: 20160921