CN105934079A - Flexible circuit board preventing elements from being overheated - Google Patents
Flexible circuit board preventing elements from being overheated Download PDFInfo
- Publication number
- CN105934079A CN105934079A CN201610570242.3A CN201610570242A CN105934079A CN 105934079 A CN105934079 A CN 105934079A CN 201610570242 A CN201610570242 A CN 201610570242A CN 105934079 A CN105934079 A CN 105934079A
- Authority
- CN
- China
- Prior art keywords
- layer
- elements
- insulating layer
- fpc
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible circuit board preventing elements from being overheated. The flexible circuit board preventing the elements from being overheated comprises a top insulating layer and a circuit layer, wherein the circuit layer is arranged below the top insulating layer; a heat dissipation assembly is arranged in the top insulating layer in the length direction and comprises a plurality of ventilating pipes which are arranged at intervals; the elements which are connected with the circuit layer are arranged on the top insulating layer; connecting holes are respectively formed below the elements; the connecting holes downwards extend from spaces among the adjacent ventilating pipes; and a bottom insulating layer is arranged below the circuit layer. By the mode, the ventilating pipes of the flexible circuit board preventing the elements from being overheated can be externally connected with ventilating equipment to conduct heat of the top insulating layer and cool down the top insulating layer, so that heat of the elements and heat of the circuit layer are taken away, the problem of local overheating is avoided, the elements are not directly blown, damage of the elements is reduced, and the service lives of the elements are prolonged.
Description
Technical field
The present invention relates to field of circuit boards, particularly relate to a kind of FPC avoiding element over-temperature.
Background technology
Along with the progress of production technology, the volume controlling casing of part numerical control device is more and more less, just towards lightening development.Due to reduced space, installing space is limited, generally uses FPC to carry out the hardboard that Substitute For Partial is traditional in control cabinet body.
FPC space availability ratio is high, flexible arrangement, and the control casing being suitable for narrow space uses, but due to limited space, the heat that element produces is assembled and is difficult to dispel the heat, and easily causes hot-spot and the problem damaged, needs improvement.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of FPC avoiding element over-temperature, the heat radiation at reinforcing element, it is to avoid the problem that local stability is too high.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide a kind of FPC avoiding element over-temperature, including: top layer and line layer, described line layer is arranged on the lower section of top layer, described top layer is provided with radiating subassembly along its length, described radiating subassembly includes several spaced ventilation duct, the element being connected with line layer it is provided with in described top layer, described element be respectively arranged below connecting hole, described connecting hole downwardly extends between adjacent ventilation duct, the lower section of described line layer is provided with bottom insulation layer.
In a preferred embodiment of the present invention, described ventilation duct is the copper pipe of hollow.
In a preferred embodiment of the present invention, described top layer and bottom insulation layer are respectively polyimides soft board.
In a preferred embodiment of the present invention, it is provided with the first tack coat between described top layer and line layer and is connected.
In a preferred embodiment of the present invention, it is provided with the second tack coat between described bottom insulation layer and line layer and is connected.
The invention has the beneficial effects as follows: a kind of FPC avoiding element over-temperature that the present invention points out, ventilation duct can carry out heat conduction and cooling with external ventilation equipment to top layer, thus taken away the heat of element and line layer, the problem avoiding hot-spot, and directly element is not blown, decrease the damage of element, extend the service life of element.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in describing embodiment below, the required accompanying drawing used is briefly described, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of FPC one preferred embodiment avoiding element over-temperature of the present invention.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
Referring to Fig. 1, the embodiment of the present invention includes:
A kind of FPC avoiding element over-temperature, including: top layer 2 and line layer 5, described line layer 5 is arranged on the lower section of top layer 2, described top layer 2 is provided with radiating subassembly 3 along its length, described radiating subassembly 3 includes several spaced ventilation duct, ventilation duct can carry out heat conduction and cooling with external ventilation equipment to top layer 2, thus taken away element 1 and the heat of line layer 5, the problem avoiding hot-spot, and directly element 1 is not blown, facilitate top layer 2 and the sealing and dustproof of element 1, promote safety in utilization and stability.
The element 1 being connected with line layer 5 it is provided with in described top layer 2, described element 1 be respectively arranged below connecting hole 21, described connecting hole 21 downwardly extends between adjacent ventilation duct, leaves the gap of connecting hole 21 test between adjacent ventilation duct, facilitates the installation of element 1.
The lower section of described line layer 5 is provided with bottom insulation layer 7, described top layer 2 and bottom insulation layer 7 and is respectively polyimides soft board, and the insulation effect of polyimides soft board is good, strengthens the protection to line layer 5, and flexible, facilitates the bending of wiring board to construct.
Described ventilation duct is the copper pipe of hollow, and the thermal conductivity of copper pipe is good, and flexible, can bend to arc, and the convenience of bending construction is good.
It is provided with the first tack coat 4 between described top layer 2 and line layer 5 to be connected, is provided with the second tack coat 6 between described bottom insulation layer 7 and line layer 5 and is connected.Line layer 5 both can be positioned by the first tack coat 4 and the second tack coat 6, again can connection between reinforced top insulating barrier 2 and bottom insulation layer 7, structure is more firm.
In sum, a kind of FPC avoiding element over-temperature that the present invention points out, sound construction, flexible, convenient bending construction, and also the performance of ventilation and heat dispersion of top layer 2 is good, improves the stability in use of element.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the invention content to be made or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, the most in like manner it is included in the scope of patent protection of the present invention.
Claims (5)
1. the FPC avoiding element over-temperature, including: top layer and line layer, described line layer is arranged on the lower section of top layer, it is characterized in that, described top layer is provided with radiating subassembly along its length, described radiating subassembly includes several spaced ventilation duct, the element being connected with line layer it is provided with in described top layer, described element be respectively arranged below connecting hole, described connecting hole downwardly extends between adjacent ventilation duct, and the lower section of described line layer is provided with bottom insulation layer.
The FPC avoiding element over-temperature the most according to claim 1, it is characterised in that described ventilation duct is the copper pipe of hollow.
The FPC avoiding element over-temperature the most according to claim 1, it is characterised in that described top layer and bottom insulation layer are respectively polyimides soft board.
The FPC avoiding element over-temperature the most according to claim 1, it is characterised in that be provided with the first tack coat between described top layer and line layer and be connected.
The FPC avoiding element over-temperature the most according to claim 1, it is characterised in that be provided with the second tack coat between described bottom insulation layer and line layer and be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610570242.3A CN105934079A (en) | 2016-07-20 | 2016-07-20 | Flexible circuit board preventing elements from being overheated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610570242.3A CN105934079A (en) | 2016-07-20 | 2016-07-20 | Flexible circuit board preventing elements from being overheated |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105934079A true CN105934079A (en) | 2016-09-07 |
Family
ID=56828175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610570242.3A Pending CN105934079A (en) | 2016-07-20 | 2016-07-20 | Flexible circuit board preventing elements from being overheated |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105934079A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201178096Y (en) * | 2008-02-18 | 2009-01-07 | 杨良智 | Radiating construction of inserting pin type LED |
| CN101594739A (en) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | Device embedded circuit board heat abstractor and processing method |
| CN201947548U (en) * | 2010-10-29 | 2011-08-24 | 中山市晶明光电科技有限公司 | Circuit board |
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN205079274U (en) * | 2015-09-28 | 2016-03-09 | 杭州信多达电器有限公司 | Novel electromagnetism stove cooling system |
-
2016
- 2016-07-20 CN CN201610570242.3A patent/CN105934079A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201178096Y (en) * | 2008-02-18 | 2009-01-07 | 杨良智 | Radiating construction of inserting pin type LED |
| CN101594739A (en) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | Device embedded circuit board heat abstractor and processing method |
| CN201947548U (en) * | 2010-10-29 | 2011-08-24 | 中山市晶明光电科技有限公司 | Circuit board |
| CN102595783A (en) * | 2011-07-27 | 2012-07-18 | 田茂福 | Novel LED circuit board and method |
| CN205079274U (en) * | 2015-09-28 | 2016-03-09 | 杭州信多达电器有限公司 | Novel electromagnetism stove cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160907 |
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| RJ01 | Rejection of invention patent application after publication |