CN105933028A - Transceiver of Ka band very small aperture terminal - Google Patents
Transceiver of Ka band very small aperture terminal Download PDFInfo
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- CN105933028A CN105933028A CN201610411101.7A CN201610411101A CN105933028A CN 105933028 A CN105933028 A CN 105933028A CN 201610411101 A CN201610411101 A CN 201610411101A CN 105933028 A CN105933028 A CN 105933028A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/14—Relay systems
- H04B7/15—Active relay systems
- H04B7/185—Space-based or airborne stations; Stations for satellite systems
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/14—Relay systems
- H04B7/15—Active relay systems
- H04B7/185—Space-based or airborne stations; Stations for satellite systems
- H04B7/18528—Satellite systems for providing two-way communications service to a network of fixed stations, i.e. fixed satellite service or very small aperture terminal [VSAT] system
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
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- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention relates to a transceiver of a Ka band very small aperture terminal. The transceiver comprises a block up converter and a low noise block. Both the block up converter and the low noise block are connected between a modem and an antenna assembly. The block up converter is used for carrying out up-conversion to signals sent by the modem and sending the signals after the up-conversion to the antenna assembly. The low noise block is used for carrying out down-conversion to the signals sent by the antenna assembly and sending the signals after the down-conversion to the modem. The block up converter or the low noise block comprises a plurality of SIP (System In a Package) chips produced by a system in a package technique. Each SIP chip is integrated with a plurality of function chips which are electrically connected and are produced by using a semiconductor technology. According to the transceiver of the Ka band very small aperture terminal, the number of the chip is greatly reduced by using the system in a package technique; the number of the copper wires or microstrip lines among the chips; and the occupied area of the transceiver of the Ka band very small aperture terminal is reduced, which is convenient for realizing the miniaturization design of the product.
Description
Technical field
The present invention relates to Ka band satellite communication technical field, particularly relate to a kind of Ka band satellite small station
Transceiver.
Background technology
In satellite communication in early days, mainly complete main communication requirement by some main websites.Main website passes through
The mode of wired connection is distributed to different areas, therefore main website is mainly distributed on the urban district in city.Main website has
It is inconvenient and expensive that line connected mode makes the framework structure of whole satellite communication system be.
On VSAT (Very Small Aperture Terminal, satellite small station) satellite communication system can overcome
State problem.In VSAT satellite communication system, satellite small station (VSAT) can be widely distributed in difference
Region, except in city proper, additionally it is possible to be distributed in mountain area etc..Meanwhile, VSAT satellite communication system energy
Enough meet Internet service, voice/different communication demand such as fax services, data service, thus got over
More it is widely applied.
As it is shown in figure 1, VSAT satellite communication system generally include a main website 12, satellite repeater 13 and
It is distributed in the satellite small station 11 of regional.Satellite repeater 13 is typically distributed on 36000 km above equator
Geostationary orbit on.Main website 12 is the central communication in whole VSAT satellite communication system and monitors eventually
End, it usually needs all weather operations.Main website 12 is by directly transmitting signal to the satellite being distributed in zones of different
Small station 11 controls and communicates with each satellite small station 11.As in figure 2 it is shown, satellite small station 11 includes one
Individual outdoor unit 15 and an indoor unit 14.Wherein, indoor unit 14 comprises for mutual equipment,
Such as modem, computer equipment, and indoor unit 14 is by wired mode connection outdoor unit 15.
Outdoor unit 15 includes antenna module 17, transceiver 16 and other accessories.Antenna module 17 includes instead
Emitter, feed, mounting seat etc..Transceiver 16 comprise up-converter module (BUC, block up converter),
Down conversion module (LNB, low noise block) and other transmitting-receiving subassembly parts.
It addition, based on the big advantage of available bandwidth transmission capacity and the market demand, Ka band communication satellite market
Demand increasing, Ka wave band is mainly 26.5～40GHz.According to statistics, the whole world more than 30 family's satellite operator
Shang Zhong, have been started up or starting Ka band satellite project have more than 20 families.Correspondingly, ground is eventually
End market also will obtain large development, and it is other that ICBM SHF satellite terminal usage amount is up to million ministerial levels, therefore Global Satellite
Industry enters the paces in Ka epoch and is accelerating.And in VSAT satellite communication system, transceiver is satellite small station
The communication core part of 11.For the Ka wave band that wavelength is shorter, the processing of PCB in transceiver
Technique then has tightened up requirement.Therefore, how to improve the performance of transceiver and to reduce cost be transceiver
Key one step of product commercial presence.
But, in traditional Ka band satellite small station transceiver, up-converter module, down conversion module are all wrapped
Include more functional chip and transistor, and these functional chips and the most discrete correspondence of being arranged in of transistor
In PCB, connected by copper cabling or microstrip line between each discrete functional chip and transistor.Cause
This, the area that traditional Ka band satellite small station transceiver takies is bigger so that the size of whole product cannot
Reduce.
Summary of the invention
Based on this, it is necessary to for the problem that traditional Ka band satellite small station transceiver area occupied is bigger,
A kind of Ka band satellite small station transceiver is provided.
A kind of Ka band satellite small station transceiver, including up-converter module and down conversion module, described up-conversion
Module, down conversion module are all connected between modem and antenna module；
Described up-converter module carries out up-conversion for the signal sending described modem, and by upper change
Signal after frequency processes sends to described antenna module；Described down conversion module is for sending out described antenna module
The signal sent carries out down coversion, and sends the signal after down-converted to described modem；Meanwhile,
Described up-converter module or down conversion module include some SIP chips utilizing System-in-Package technology to manufacture,
And each described SIP integrated chip has some electric connections and the functional chip all using semiconductor technology to manufacture.
Wherein in an embodiment, described up-converter module includes a SIP chip, and a described SIP
Integrated chip has the first local oscillator signal generator and the first local oscillator signal amplifier.
Wherein in an embodiment, described up-converter module also includes the 2nd SIP chip and being connected
Three SIP chips；
Described 2nd SIP integrated chip has the first amplifier and the first frequency mixer, and described first frequency mixer is used
In connecting described modem；Described 3rd SIP integrated chip has the second amplifier and the 3rd amplifier.
Wherein in an embodiment, described up-converter module also includes that microstripline filter and the first power are put
Big device；Described microstripline filter is connected between a described SIP chip and the 2nd SIP chip；Described
Three SIP chips are also connected with described first power amplifier；Described first power amplifier is additionally operable to connect institute
State antenna module.
Wherein in an embodiment, described down conversion module includes the 4th SIP chip；Described 4th SIP
Integrated chip has the second local oscillation signal generator and the second local oscillation signal amplifier.
Wherein in an embodiment, described down conversion module also includes the 5th SIP chip and being connected
Six SIP chips；
Described 5th SIP integrated chip has some grades of amplifiers, and described 5th SIP chip is additionally operable to connect institute
State antenna module；Described 6th SIP integrated chip has some grades of wave filter.
Wherein in an embodiment, described down conversion module also includes local oscillation signal wave filter, the second mixing
Device, mixed frequency signal wave filter and the second power amplifier；
Described local oscillation signal wave filter is connected between described 4th SIP chip and described second frequency mixer；Institute
State the second frequency mixer to be connected with described 6th SIP chip, described mixed frequency signal wave filter the most respectively；Described mixed
Frequency signal filter is also connected with described second power amplifier；Described second power amplifier is additionally operable to connect
Described modem.
Wherein in an embodiment, described SIP chip includes substrate, and each described functional chip is with stacking
Or mode side by side is integrated on described substrate.
Wherein in an embodiment, each described SIP chip is installed on described upper change by surface mounting technology
Frequency module or pcb board corresponding to down conversion module.
Wherein in an embodiment, described up-converter module and down conversion module are installed on same jointly
On pcb board.
Above-mentioned Ka band satellite small station transceiver has the beneficial effect that and receives in this Ka band satellite small station
In the machine of sending out, up-converter module or down conversion module include some SIP cores utilizing System-in-Package technology to manufacture
Sheet, and each SIP integrated chip have some electric connections and all use semiconductor technology manufacture functional chip.
Therefore, this Ka band satellite small station transceiver utilizes System-in-Package technology to make number of chips greatly reduce, and
And decrease copper cabling or the quantity of microstrip line between each chip, thus reduce whole Ka band satellite
The area occupied of small station transceiver, it is simple to realize the Miniaturization Design of product.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement
In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, it is also possible to obtain the accompanying drawing of other embodiments according to these accompanying drawings.
Fig. 1 is the composition structural representation of VSAT satellite communication system；
Fig. 2 is the composition structural representation in the VSAT satellite communication system Satellite small station shown in Fig. 1；
The relevant components structural representation of the Ka band satellite small station transceiver that Fig. 3 provides for an embodiment；
Fig. 4 be embodiment illustrated in fig. 3 Ka band satellite small station transceiver in the electrical connection of up-converter module
Structural representation；
Fig. 5 be embodiment illustrated in fig. 3 Ka band satellite small station transceiver in the electrical connection of down conversion module
Structural representation；
Fig. 6 is that the SIP chip-packaging structure in the Ka band satellite small station transceiver of embodiment illustrated in fig. 3 shows
It is intended to.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.
Accompanying drawing gives presently preferred embodiments of the present invention.But, the present invention can come real in many different forms
Existing, however it is not limited to embodiment described herein.On the contrary, providing the purpose of these embodiments is to make this
The understanding of disclosure of the invention content is more thorough comprehensively.
Unless otherwise defined, all of technology used herein and scientific terminology are led with the technology belonging to invention
The implication that the technical staff in territory is generally understood that is identical.Herein at the term used in the description of invention
It is the purpose in order to describe specific embodiment, it is not intended that limit the present invention.Term as used herein " with
/ or " include the arbitrary and all of combination of one or more relevant Listed Items.
One embodiment provides a kind of Ka band satellite small station transceiver, as it is shown on figure 3, include up-conversion mould
Block 100 and down conversion module 200.Up-converter module 100, down conversion module 200 are all connected to modulation /demodulation
Between device 300 and antenna module 400.Antenna module 400 includes the structure such as antenna, feed, is used for launching
Or receive Ka wave band high-frequency signal.It should be noted that Ka band satellite small station transceiver at least includes
Frequency-variable module 100 and down conversion module 200, it is also possible to include other structures, such as orthomode transducer.
Up-converter module 100 carries out up-conversion for the signal sending modem 300, and by upper change
Signal after frequency processes sends to antenna module 400.Wherein, the signal that modem 300 sends is usually
Intermediate-freuqncy signal, this intermediate-freuqncy signal, after up-converter module 100, is up-converted believing into Ka wave band high-frequency emission
Number, and launch eventually through antenna module 400.
Down conversion module 200 carries out down coversion for the signal sending antenna module 400, and by down coversion
Signal after process sends to modem 300.Wherein, antenna module 400 sends to down conversion module
The signal of 200 is Ka wave band high-frequency received signal, and this Ka wave band high-frequency received signal is through down conversion module
200, it is downconverted as intermediate-freuqncy signal and eventually enters in modem 300, to carry out the phases such as subsequent demodulation
Answer processing procedure.
In the present embodiment, up-converter module 100 or down conversion module 200 include some utilizing system-level envelope
SIP (the System In a Package system in package) chip that packing technique manufactures.System-in-Package technology is
Refer to by several functions integrated chip in one encapsulates, thus realize a basic complete function, i.e. SIP
Chip.Meanwhile, each SIP integrated chip has some electric connections and the function all using semiconductor technology to manufacture
Chip.Semiconductor technology refers to quasiconductor as material, is fabricated to the technology of assembly and integrated circuit, such as
SiGe process.Functional chip refers to each function core of discrete arrangement in conventional up conversion module or down conversion module
Sheet, such as wave filter, frequency mixer etc..
Nude film corresponding for difference in functionality chip in the fabrication process, is passed through system in package by above-mentioned SIP chip
Technology is packaged together, thus forms the SIP chip of correspondence.Simultaneously as each merit being packaged together
Can be electrically connected with and manufacturing process identical (the most all using semiconductor technology manufacture), therefore in technique manufacture by chip
Aspect facilitates implementation.
In sum, in the present embodiment, will up-converter module 100 or down conversion module 200 be electrically connected with
And manufacturing process is the difference in functionality chip package of semiconductor fabrication process together, reduce the number of chip
Amount, decreases copper cabling or the quantity of microstrip line between each chip simultaneously, thus reduces whole Ka ripple
The area occupied of Duan Weixing small station transceiver, reduces the cost of components and parts, it is simple to realize the miniaturization of product
Design, simplifies building and debugging of high band.
Concrete, as shown in Figure 4, up-converter module 100 includes 3 SIP chips, the i.e. the oneth SIP altogether
Chip the 110, the 2nd SIP chip 120 and the 3rd SIP chip 130.Up-converter module 100 also includes simultaneously
Microstripline filter 140 and the first power amplifier 150.Up-converter module 100 also includes other devices 306,
Such as peripheral components, coupling device etc..Wherein, the 2nd SIP chip 120 is connected with the 3rd SIP chip 130.
Microstripline filter 140 is connected between a SIP chip 110 and the 2nd SIP chip 120.3rd SIP
Chip 130 is also connected with the first power amplifier 150.First power amplifier 150 is additionally operable to connect antenna
Assembly 400.
Oneth SIP chip 110, for producing and amplifying the first local oscillation signal that up-conversion is corresponding.This is first years old
SIP chip 110 is integrated with the first local oscillator signal generator 111 and the first local oscillator signal amplifier of electrical connection
112 both functional chips.First local oscillator signal generator 111 is for producing the first local oscillation signal, and sends
To the first local oscillator signal amplifier 112.First local oscillator signal amplifier 112 is for amplifying the first local oscillation signal
And the first local oscillation signal after amplifying sends to microstripline filter 140.
Microstripline filter 140, the first local oscillation signal after amplifying is filtered, and by filtered
First local oscillation signal sends to the 2nd SIP chip 120.Concrete, microstripline filter 140 is bandpass filtering
Device, and microstripline filter 140 adds heavy silver process by copper facing or copper facing and formed, thickness between 17 μm～
34μm.Wherein, heavy silver is possible to prevent copper to aoxidize, thus improves the reliability of microstripline filter 140.
Further, since microstripline filter 140 and the first local oscillator signal generator 111 and the first local oscillation signal amplify
The manufacturing process of device 112 is different, therefore in the present embodiment, microstripline filter 140 is independently arranged into one-level.
2nd SIP chip 120, is used for realizing mixing function, with the intermediate frequency letter sent by modem 300
Number up-convert to Ka wave band high-frequency signal.2nd SIP chip 120 is integrated with the first amplifier 121 of electrical connection
And the first frequency mixer 122 both functional chip.Wherein, the first amplifier 121 connects microstripline filter
140, and the first amplifier 121 is for putting filtered for microstripline filter 140 first local oscillation signal
Greatly.First frequency mixer 121 is used for connecting modem 300, and the first frequency mixer 121 is for putting first
The intermediate-freuqncy signal that the first local oscillation signal after big device 121 amplification and modem 300 transmit is mixed,
Thus draw Ka wave band high-frequency signal.This Ka wave band high-frequency signal is transmitted by microstrip line, and transmits
To the 3rd SIP chip 130.Wherein, micro-strip paster antenna 170 is used for sending and receiving high-frequency signal.
In the present embodiment, the Ka wave band high-frequency signal of the 2nd SIP chip 120 output is by micro-strip paster antenna 170
Transmit to the 3rd SIP chip 130.
3rd SIP chip 130, for Ka wave band high-frequency signal is amplified, and the 3rd SIP chip 130
It is integrated with the second amplifier 131 and the 3rd amplifier 132 both functional chips of electrical connection.Wherein,
Two amplifiers 131 are low-noise amplifier.3rd amplifier 132 is variable gain amplifier.It addition, the
Three SIP chips 130 also include corresponding match circuit, to reach the effect of impedance matching.Therefore, Ka
Wave band high-frequency signal, after the 3rd SIP chip 130, has carried out corresponding multistage amplification process, and has passed through
Micro-strip paster antenna 170 is sent in the first power amplifier 150.
First power amplifier 150, is used for carrying out power amplification so that the 3rd SIP chip 130 send put
Ka wave band high-frequency signal after great produces enough power it is thus possible to wireless transmit is gone out.Due to the first power
Amplifier 150 has high power characteristics, can produce significantly heating, therefore by the first power in the present embodiment
Amplifier 150 is independently arranged into one-level.
Therefore, in the up-converter module 100 that the present embodiment provides, by a SIP chip 110, second
SIP chip 120 and the 3rd SIP chip 130, by each functional chip of arrangement discrete in conventional up conversion module
It is packaged together accordingly according to electric connecting relation and technique, thus decreases in whole up-converter module 100
Copper cabling or the quantity of microstrip line between quantity and each chip of chip.
It is understood that the structure of up-converter module 100 is not limited to above-mentioned a kind of situation, as long as can expire
The small form factor requirements of foot product.Such as, in other embodiments, it is also possible to by the 2nd SIP chip 120
One is encapsulated with each functional chip in the 3rd SIP chip 130；Also can be integrated with in 3rd SIP chip 130
The amplifier of other progression.
Concrete, as it is shown in figure 5, down conversion module 200 includes the 4th SIP chip the 210, the 5th SIP core
Sheet the 220, the 6th SIP chip 230, local oscillation signal wave filter the 240, second frequency mixer 250, mixed frequency signal
Wave filter 260 and the second power amplifier 270.Wherein, the 5th SIP chip 220 and the 6th SIP chip 230
Connect.5th SIP chip 220 is additionally operable to connect antenna module 400.Local oscillation signal wave filter 240 is connected to
Between 4th SIP chip 210 and the second frequency mixer 250.Second frequency mixer 250 the most respectively with the 6th SIP
Chip 230, mixed frequency signal wave filter 260 connect.Mixed frequency signal wave filter 260 also with the second power amplifier
270 connect.Second power amplifier 270 is additionally operable to connect modem 300.
4th SIP chip 210, for producing and amplifying the second local oscillation signal that down coversion is corresponding.Meanwhile,
Four SIP chips 210 are integrated with the second local oscillation signal generator 211 and the second local oscillation signal amplifier of electrical connection
212 both functional chips.Wherein, the second local oscillation signal generator 211 for produce that down coversion is corresponding the
Two local oscillation signals, and send to the second local oscillation signal amplifier 212.Second local oscillation signal amplifier 212
For low-noise amplifier, for amplifying the second local oscillation signal, and the second local oscillation signal after amplifying sends extremely
In local oscillation signal wave filter 240.Filtered second local oscillation signal is sent by local oscillation signal wave filter 240 again
To the second frequency mixer 250.
5th SIP chip 220 is integrated with some grades of amplifiers and for the Ka sending antenna module 400
Band reception signal is amplified.Concrete, the 5th SIP chip 220 is integrated with three grades of low-noise amplifiers,
To improve the signal to noise ratio of signal.5th SIP chip 220 receives Ka wave band by paster antenna 280 and connects simultaneously
The collection of letters number.
6th SIP chip 230 is integrated with some grades of wave filter, and for the 5th SIP chip 220 transmission
Ka band reception signal after amplification is filtered, then sends filtered Ka band reception signal to the
Two frequency mixers 250.Concrete, the 6th SIP chip 230 is integrated with three wave filter.
Second frequency mixer 250 is for by filtered second local oscillation signal and filtered Ka band reception signal
It is mixed, thus forms corresponding intermediate-freuqncy signal, and send to mixed frequency signal wave filter 260.Mixed frequency signal
This intermediate-freuqncy signal is filtered by wave filter 260, and the transmission of filtered intermediate-freuqncy signal is put to the second power
In big device 270.Second power amplifier 270 is used for carrying out power amplification, and the intermediate frequency letter after just amplifying
Number send in modem 300.
Therefore, in the down conversion module 200 that the present embodiment provides, by the 4th SIP chip the 210, the 5th
SIP chip the 220, the 6th SIP chip 230, by discrete each functional chip in tradition down conversion module according to
Electric connecting relation and technique are packaged together accordingly, thus decrease whole down conversion module 200 chips
Quantity and each chip between copper cabling or the quantity of microstrip line.
It is understood that the structure of down conversion module 200 is not limited to above-mentioned a kind of situation, as long as can expire
The small form factor requirements of foot product.
Concrete, as shown in Figure 6, above-mentioned each SIP chip (includes SIP chip the 110, the 2nd SIP
Chip the 120, the 3rd SIP chip the 130, the 4th SIP chip the 210, the 5th SIP chip the 220, the 6th SIP
Chip 230) concrete encapsulating structure principle as follows.
Each SIP chip all includes that each functional chip in substrate 510, and SIP chip is with stacking or side side by side
Formula is integrated on substrate 510.Such as, functional chip 520, functional chip 530 are integrated in the way of stacking
On substrate 510, this laminated construction can reduce the area of whole SIP chip further.Be not suitable for superposition
Functional chip together is integrated on substrate 510 the most in side-by-side fashion, such as functional chip 560 then phase
For functional chip 520 and functional chip 530, it is integrated in side-by-side fashion on substrate 510.It addition, merit
By bonding technique, lead-in wire can be drawn by chip, to realize electrical connection.It is also integrated with it on substrate 510
His element 550, the resistance such as mated, electric capacity or microstrip line
It is understood that the encapsulating structure of SIP chip is not limited to above-mentioned a kind of situation, as long as can be by corresponding
Functional chip be packaged together.
Concrete, each SIP chip is all installed on up-converter module 100 or down coversion by surface mounting technology
The pcb board of module 200 correspondence, thus further reduce the volume of Ka band satellite small station transceiver.
It addition, within the pcb board after installation is placed in wave-guide cavity wave shell, this wave-guide cavity wave shell has ripple
Lead, dispel the heat and the function such as support.
Meanwhile, up-converter module 100 and down conversion module 200 are installed on same pcb board jointly.This
Time, up-converter module 100 and down conversion module 200 then can share local oscillation signal generator, thus enter one
Step reduces the quantity of chip, reduces the volume of product, has saved components and parts cost.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the most right
The all possible combination of each technical characteristic in above-described embodiment is all described, but, if these skills
There is not contradiction in the combination of art feature, is all considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for this area
For those of ordinary skill, without departing from the inventive concept of the premise, it is also possible to make some deformation and change
Entering, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be as the criterion.
Claims (10)
1. a Ka band satellite small station transceiver, including up-converter module and down conversion module, its feature
Being, described up-converter module, down conversion module are all connected between modem and antenna module；
Described up-converter module carries out up-conversion for the signal sending described modem, and by upper change
Signal after frequency processes sends to described antenna module；Described down conversion module is for sending out described antenna module
The signal sent carries out down coversion, and sends the signal after down-converted to described modem；Meanwhile,
Described up-converter module or down conversion module include some SIP chips utilizing System-in-Package technology to manufacture,
And each described SIP integrated chip has some electric connections and the functional chip all using semiconductor technology to manufacture.
Ka band satellite small station the most according to claim 1 transceiver, it is characterised in that on described
Frequency-variable module includes a SIP chip, and a described SIP integrated chip have the first local oscillator signal generator and
First local oscillator signal amplifier.
Ka band satellite small station the most according to claim 2 transceiver, it is characterised in that on described
Frequency-variable module also includes the 2nd SIP chip and the 3rd SIP chip being connected；
Described 2nd SIP integrated chip has the first amplifier and the first frequency mixer, and described first frequency mixer is used
In connecting described modem；Described 3rd SIP integrated chip has the second amplifier and the 3rd amplifier.
Ka band satellite small station the most according to claim 3 transceiver, it is characterised in that on described
Frequency-variable module also includes microstripline filter and the first power amplifier；Described microstripline filter is connected to institute
State between a SIP chip and the 2nd SIP chip；Described 3rd SIP chip also with described first power amplification
Device connects；Described first power amplifier is additionally operable to connect described antenna module.
Ka band satellite small station the most according to claim 1 transceiver, it is characterised in that under described
Frequency-variable module includes the 4th SIP chip；Described 4th SIP integrated chip has the second local oscillation signal generator and
Two local oscillation signal amplifiers.
Ka band satellite small station the most according to claim 5 transceiver, it is characterised in that under described
Frequency-variable module also includes the 5th SIP chip and the 6th SIP chip being connected；
Described 5th SIP integrated chip has some grades of amplifiers, and described 5th SIP chip is additionally operable to connect institute
State antenna module；Described 6th SIP integrated chip has some grades of wave filter.
Ka band satellite small station the most according to claim 6 transceiver, it is characterised in that under described
Frequency-variable module also includes that local oscillation signal wave filter, the second frequency mixer, mixed frequency signal wave filter and the second power are put
Big device；
Described local oscillation signal wave filter is connected between described 4th SIP chip and described second frequency mixer；Institute
State the second frequency mixer to be connected with described 6th SIP chip, described mixed frequency signal wave filter the most respectively；Described mixed
Frequency signal filter is also connected with described second power amplifier；Described second power amplifier is additionally operable to connect
Described modem.
8. according to the Ka band satellite small station transceiver described in any claim in claim 1 to 7,
It is characterized in that, described SIP chip includes substrate, and each described functional chip by stacking or side by side in the way of
It is integrated on described substrate.
9. according to the Ka band satellite small station transceiver described in any claim in claim 1 to 7,
It is characterized in that, each described SIP chip is installed on described up-converter module or lower change by surface mounting technology
The pcb board that frequency module is corresponding.
10. according to the Ka band satellite small station transceiver described in any claim in claim 1 to 7,
It is characterized in that, described up-converter module and down conversion module are installed on same pcb board jointly.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610411101.7A CN105933028A (en) | 2016-06-13 | 2016-06-13 | Transceiver of Ka band very small aperture terminal |
| PCT/CN2016/094685 WO2017215103A1 (en) | 2016-06-13 | 2016-08-11 | Transceiver of ka-band very small aperture terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610411101.7A CN105933028A (en) | 2016-06-13 | 2016-06-13 | Transceiver of Ka band very small aperture terminal |
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| CN105933028A true CN105933028A (en) | 2016-09-07 |
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| CN201610411101.7A Pending CN105933028A (en) | 2016-06-13 | 2016-06-13 | Transceiver of Ka band very small aperture terminal |
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| WO (1) | WO2017215103A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106712799A (en) * | 2017-01-18 | 2017-05-24 | 华讯方舟科技（湖北）有限公司 | Frequency converter and microwave frequency conversion circuit thereof |
| WO2018054152A1 (en) * | 2016-09-26 | 2018-03-29 | 华讯方舟科技有限公司 | Down-conversion device |
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| WO2017215103A1 (en) | 2017-12-21 |
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