CN105931840A - Low thermal resistance thin-film capacitor and production method thereof - Google Patents
Low thermal resistance thin-film capacitor and production method thereof Download PDFInfo
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- CN105931840A CN105931840A CN201610351504.7A CN201610351504A CN105931840A CN 105931840 A CN105931840 A CN 105931840A CN 201610351504 A CN201610351504 A CN 201610351504A CN 105931840 A CN105931840 A CN 105931840A
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- cabinet
- capacitor
- metallic plate
- thermal resistance
- electrodes
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- 239000003990 capacitor Substances 0.000 title claims abstract description 117
- 239000010409 thin film Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 229920003023 plastic Polymers 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000005507 spraying Methods 0.000 claims abstract description 17
- 238000004804 winding Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 10
- 239000012774 insulation material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 7
- 239000000565 sealant Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 6
- 239000010408 film Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 abstract 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- 230000005611 electricity Effects 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a low thermal resistance thin-film capacitor and a production method thereof. The capacitor comprises a capacitor core, electrodes, an encapsulating material body and a plastic casing; one or two of four walls of the plastic casing, which are immediately adjacent to an opening, are replaced by a metal plate; one end of each of the two electrodes is respectively connected with metal spraying structures at the two ends of the capacitor core, and the other end of each of the two electrodes is respectively led out from the opening of the plastic casing; and one side of one section of one of the two electrodes is also pasted at the internal side of the metal plate, and an insulating material layer is arranged between one side of this section of electrode and the internal side of the metal plate. According to the low thermal resistance thin-film capacitor and the production method thereof provided by the invention, by replacing one or two sides of the plastic casing into the metal plate and optimizing an internal cooling path, the thermal resistance of a path for cooling heat generated by the capacitor core can be greatly reduced, the environmental temperature of the capacitor and the use current value of the capacitor can be improved, and the production process is simple and feasible.
Description
Technical field
The present invention relates to thin film capacitor technical field, particularly relate to a kind of low thermal resistance thin film capacitor and preparation method thereof.
Background technology
Thin film capacitor is to work as electrode with metal forming, by itself and poly-ethyl ester, polypropylene, the plastics such as polystyrene or Merlon
Thin film, after the overlap of two ends, is wound into the capacitor of the structure of cylindrical shape.Thin film capacitor has nonpolarity, and insulation impedance is very
Height, frequency characteristic excellent (frequency response is broad), and the characteristic that dielectric loss is the least, therefore, thin film capacitor is by extensively
It is applied to electronics, household electrical appliances, communication, electric power, electric railway, hybrid vehicle, wind-power electricity generation, solar electrical energy generation etc. many
In individual industry.Along with thin film capacitor is widely used in above the new-energy automobile such as electric motor car and hybrid electric vehicle, to thin-film electro
Container meets the application of new-energy automobile and it is also proposed higher use requirement, such as, the application with hybrid vehicle as representative
Ambient temperature has had been increased to 115 DEG C, and the use temperature that the polypropylene film that thin film capacitor is commonly used allows for a long time is also only
Having about 105 DEG C, this means that thin film capacitor needs the radiating surface of a low thermal resistance to eliminate what capacitor itself produced
The heat that it is applied by heat and environment.And existing thin film capacitor generally uses cabinet, belong to high thermal resistance, be unfavorable for
The heat radiation of capacitor body.Existing a kind of thin film capacitor, as disclosed by notification number CN204577247U, is that employing will
Busbar directly exposes and realizes heat radiation, the thin film capacitor of this structure, is primarily present following drawback: one is, also needs outside busbar
Insulation system is set, it has not been convenient to install in client；Two are, the busbar exposed easily produces warping phenomenon under high/low-temperature impact,
Of long duration it is easily generated cavity on the contact surface, causes dispelling the heat bad；Three are, the busbar exposed can only use slab design, dissipate
Thermal effect is not ideal enough, also needs to configure cooled plate；Four are, expose the capacitor of busbar design, and its embedding mouth is generally located on mother
Arrange in this one side, the least in order to not affect area of dissipation embedding mouth, cause embedding difficulty very big.
Summary of the invention
It is an object of the invention to overcome the deficiency of prior art, it is provided that a kind of low thermal resistance thin film capacitor and preparation method thereof,
By the improvement to capacitor arrangement, greatly reduce the thermal resistance carrying out the path dispelled the heat for capacitor body generation heat, carry
The uses ambient temperature of high capacitor and the use current value that improve capacitor, and its manufacturing process is easy, easy.
The technical solution adopted for the present invention to solve the technical problems is: a kind of low thermal resistance thin film capacitor, including capacitor core
Son, electrode, Embedding Material body and cabinet；This cabinet is the square body with an opening, capacitor body and electrode
Entering along opening and be contained in cabinet, Embedding Material body is filled in the inwall of capacitor body, electrode and cabinet
Between；One or both of which in four walls of next-door neighbour's opening of cabinet is also replaced by employing metal material and makes
Metallic plate, capacitor body along winding axis be respectively arranged at two ends with metal spraying structure, the most each one end of two electrodes is divided
Not being connected with the metal spraying structure at the two ends of capacitor body, the most each other end of two electrodes is respectively from the opening of cabinet
Draw；The wherein wherein one side of a section of one of them in two electrodes is also attached at the medial surface of metallic plate, and this segment electrode
Wherein one side and the medial surface of metallic plate between be additionally provided with insulation material layer.
The winding axis of described capacitor body is set to perpendicular with metallic plate.
The winding axis of described capacitor body is set to parallel with metallic plate.
The lateral surface of described metallic plate has also protruded out some fin.
Described metallic plate is additionally provided with some tanks.
Described metallic plate is slab design.
Fluid sealant or other sealing means is used to be connected to a fixed between described metallic plate and the plastic plate of cabinet.
A kind of manufacture method of low thermal resistance thin film capacitor, including:
Make the cabinet of the shape that is square with two or three openings, make this cabinet contain three pieces or four pieces
Plastic plate；
Sealing means is used to be fixed on cabinet and make one piece or two pieces of metallic plate correspondences closings one piece or two pieces of metallic plates
In wherein one or two opening of cabinet, shell is made to become the cabinet containing metallic plate；
By each one end of two electrodes respectively with the metal spraying structure welding at two ends along winding axis of capacitor body one
Rise；
Electrode and capacitor body are put into cabinet from the residue opening of cabinet, makes in two electrodes wherein
The wherein wherein one side also correspondence of a section of one or two is attached at the medial surface of one piece or two pieces metallic plate, and this segment electrode
Wherein it is accompanied by insulation material layer between one side and the medial surface of corresponding blocks metallic plate；The most each other end of two electrodes then divides
Do not draw from the residue opening of cabinet；
Resin is poured in cabinet from the residue opening of cabinet, makes resin be filled in capacitor body, electrode and mould
Embedding Material body is formed between the inwall of material shell.
The manufacture method of another kind low thermal resistance thin film capacitor of the present invention, including:
Make the cabinet of the shape that is square with two or three openings, make this cabinet contain three pieces or four pieces
Plastic plate；
The wherein wherein one side of a section of one of them in two electrodes or two is fixed on by the dielectric film of double-sided belt glue
At the medial surface of one piece or two pieces corresponding metallic plate；
By each one end of two electrodes respectively with the metal spraying structure welding at two ends along winding axis of capacitor body one
Rise；
Electrode and capacitor body are put into from the opening of cabinet cabinet, and one piece or two pieces of metallic plates are adopted
It is fixed on cabinet and makes one piece with fluid sealant or other sealing means or two pieces of metallic plate correspondences are closed in cabinet
Wherein one or two opening, makes shell become the cabinet containing metallic plate, and the most each other end of two electrodes then divides
Do not draw from the residue opening of cabinet；
Resin is poured in cabinet from the residue opening of cabinet, makes resin be filled in capacitor body, electrode and mould
Embedding Material body is formed between the inwall of material shell.
Compared with prior art, the invention has the beneficial effects as follows:
1, present invention employs and wherein one or two wall of cabinet replaced with the metallic plate using metal material to make,
Utilizing metallic plate to realize heat radiation, have low thermal resistance and path is controlled, the feature of convenient heat radiation, this invention can be by major part electricity
The thermal resistance of container is reduced to below 1K/W；
2, present invention employs and wherein one or two wall of cabinet replaced with the metallic plate using metal material to make,
During installation, the design directly exposed compared with busbar, the metallic plate of the present invention, without insulation, facilitates client to install；
3, present invention employs metallic plate and be used as heat sink, the design directly exposed compared with busbar, the capacitor of the present invention exists
Under high/low-temperature impact, heat sink does not have warping phenomenon, maintains good thermal diffusivity.
4, present invention employs metallic plate and be used as heat sink, metallic heat radiating plate can be not limited to flat board, it is also possible to is fabricated to
Flange-cooled heat-dissipating metal sheet, it is also possible to make tank on metallic heat radiating plate and be connected with water channel, thus substantially increase heat radiation
Effect；
5, embedding mouth of the present invention is to be located at the face beyond metallic heat radiating plate, and embedding open area can be the area of whole, compares
Designing compared with the poroid embedding mouth exposing busbar, its manufacture difficulty is substantially reduced.
Below in conjunction with drawings and Examples, the present invention is described in further detail；But a kind of low thermal resistance thin-film capacitor of the present invention
Device and preparation method thereof is not limited to embodiment.
Accompanying drawing explanation
Fig. 1 is the D structure schematic diagram of embodiment one present invention；
Fig. 2 is the front view of embodiment one present invention；
Fig. 3 is the top view of embodiment one present invention；
Fig. 4 is the sectional view of line A-A along Fig. 2；
Fig. 5 is the D structure schematic diagram of embodiment two present invention；
Fig. 6 is the D structure schematic diagram of embodiment three present invention；
Fig. 7 is the D structure schematic diagram of embodiment four present invention；
Fig. 8 is the front view of embodiment four present invention；
Fig. 9 is the top view of embodiment four present invention；
Figure 10 is the sectional view of line B-B along Fig. 8.
Detailed description of the invention
Embodiment one
See shown in Fig. 1 to Fig. 4, a kind of low thermal resistance thin film capacitor of the present invention, including capacitor body 1, electrode 2,
Embedding Material body 3 and cabinet 4；This cabinet 4 is the square body with an opening 41, capacitor body 1 and electricity
Pole 2 enters along opening 41 and is contained in cabinet 4, and Embedding Material body 3 is filled in capacitor body 1, electrode 2
And between the inwall of cabinet 4；One of them in four walls of next-door neighbour's opening of cabinet 4 is also replaced by employing
The metallic plate 5 that metal material is made, capacitor body 1 be respectively arranged at two ends with metal spraying structure 11 along winding axis, two
The most each one end of electrode (for positive and negative electrode) metal spraying structure 11 with the two ends of capacitor body 1 respectively uses and is weldingly connected
Connecing, the most each other end of two electrodes 2 is drawn from the opening 41 of cabinet respectively；One of them in two electrodes 2
Wherein one section wherein one side be also attached at the medial surface of metallic plate 5, and this segment electrode wherein one side with in metallic plate 5
Insulation material layer 6 it is additionally provided with between side.Fluid sealant is used to be connected to a fixed between the plastic plate of metallic plate 5 and cabinet 4,
Cabinet 4 is removed outside an opening and a metallic plate, and also having four sides is plastic plate.
The metallic plate 5 of the present embodiment is slab design.
The winding axis of the capacitor body 1 of the present embodiment is set to parallel with metallic plate 5, so, and capacitor body 1
One end is near the opening 41 of cabinet 4, and the other end of capacitor body 1 is then in the most inboard of cabinet 4, and two
One of them electrode 21 in individual electrode (for positive and negative electrode) is at another of the most inboard of cabinet 4 and capacitor body 1
The metal spraying structure 11 of end is connected, and this electrode 21 will be from the most inboard opening outwards causing cabinet 4 of cabinet 4
At 41, therefore, this electrode 21 has the wherein one side of a section 211 to be just attached to the medial surface of metallic plate 5 by insulation material layer 6
Place, with electricity at the close opening 41 in cabinet 4 of the other in which electrode 22 in two electrodes (for positive and negative electrode)
The metal spraying structure 11 of one end of container fuse 1 is connected, and this electrode 22 can directly lead out from the opening 41 of cabinet 4,
This electrode 22 is also to the inboard extension of cabinet 4 one section 221, and this section 221 is located at the top of the section 211 of electrode 21.
A kind of manufacture method of the low thermal resistance thin film capacitor of the present invention, including:
Make the cabinet of the shape that is square with two openings, make this cabinet contain four pieces of plastic plates；
Use fluid sealant to be fixed on cabinet one piece of metallic plate 5 and make this metallic plate 5 be closed in cabinet wherein
One opening, makes shell become the cabinet 4 containing metallic plate；
Each one end of two electrodes 2 is welded with the metal spraying structure 11 along the two ends of winding axis of capacitor body 1 respectively
Together；
Electrode 21,22 and capacitor body 1 are put into cabinet 4 from the residue opening 41 of cabinet 4, makes
One of them electrode 21 in two electrodes wherein one section 211 wherein one side be also attached at the medial surface of metallic plate 5, and
This segment electrode wherein one side and the medial surface of metallic plate between be accompanied by insulation material layer 6；And its of two electrodes 21,22
In each other end draw from the residue opening of cabinet the most respectively；
Resin is poured in cabinet 4 from the residue opening 41 of cabinet, makes resin be filled in capacitor body 1, electricity
Embedding Material body 3 is formed between the inwall of pole 2 and cabinet 4.
The manufacture method of another kind low thermal resistance thin film capacitor of the present invention, including:
Make the cabinet of the shape that is square with two openings, make this cabinet contain four pieces of plastic plates；
By the wherein wherein one side of a section 211 of one of them electrode 21 in two electrodes 2 by the dielectric film of double-sided belt glue
(being equivalent to insulation material layer) is fixed at the medial surface of metallic plate 5；
By each one end of two electrodes 21,22 respectively with the metal spraying structure 11 at two ends along winding axis of capacitor body 1
Weld together；
Electrode 21,22 and capacitor body 1 are put into cabinet from the opening of cabinet, and metallic plate 5 is adopted
It is fixed on cabinet with fluid sealant and makes this metallic plate 5 to be closed in one of them opening of cabinet, make shell become and contain
The cabinet 4 of metallic plate, the most each other end of two electrodes 21,22 is had to open from the residue of cabinet 4 the most respectively
Mouth 41 is drawn；
Resin is poured in cabinet 4 from the residue opening 41 of cabinet, makes resin be filled in capacitor body, electrode
And between the inwall of cabinet, form Embedding Material body 3.
A kind of low thermal resistance thin film capacitor of the present invention, metallic plate 5 can be by silica gel or other seal approach and cabinet 4
In conjunction with, become one of them face of cabinet 4.Capacitor body 1 and positive and negative electrode 2 are placed on the plastic housing of band metallic plate
In 4, electrode 2 can use lamination combination process to be combined in advance with metallic plate 5, then with body seal；Or at electrode 2 and gold
Belong to and between plate 5, use the thinnest insulant (i.e. forming insulation material layer 6), the most both can ensure that the pole shell of capacitor was exhausted
Edge ability can ensure that again relatively low thermal resistance between electrode and metallic plate.The wherein one side of plastic capacitor shell is replaced by the present invention
Change metallic heat radiating plate into, by sealing technologies such as silica gel sealings by metallic heat radiating plate and body seal, thus ensure band heat dissipation metal
The shell of plate during encapsulating will not material leakage, encapsulating mouth is then designed into other housing region beyond metallic heat radiating plate, convenient electricity
Container embedding.The capacitor metal heat sink of the present invention is in state of insulation, nothing in user's use with the capacitor internal high laminate of electricity
Metallic heat radiating plate need to be done insulation processing, can directly it be dispelled the heat.
According to the heat conductivity of the various material of capacitor body, it is about 0.12W/m.k according to its heat conductivity during PP thin film,
The aluminum heat conductivity of the coat of metal is about 220W/m.k, and the zinc heat conductivity in gilding layer is about 112W/m.k, leading of stannum
Hot coefficient is 64W/m.k.All it is far longer than the heat conductivity of PP thin film.By mathematical model, and substitute into leading of each material
Hot coefficient calculates, and can be nearly all polypropylene film thickness in the hope of the capacitor body heat conductivity in coat of metal direction
More than 5 times of direction.
The electrode of capacitor typically uses copper material, and heat conductivity is about 380W/m.k, metallic plate can use copper, aluminum or
The alloy material that heat conduction is good.Insulant between heat sink (i.e. metallic plate) and capacitor can use PET film or its
His some materials insulated, thickness is the thinnest, thus reduces the thermal resistance of capacitor body and metallic heat radiating plate.
The heat of the capacitor body of capacitor is shed by following approach: through gilding layer, through copper electrode, through insulation
Layer, through metallic plate.
Below 1K/W is typically can reach through emulating and calculate the thermal resistance value in this path.
Other faces of capacitor then use cabinet and casting glue parcel, and ensure certain thickness.The heat conduction system of enclosure material
Number is generally not more than 0.3W/m.k, and casting glue is the most also not higher than 0.8W/m.k, and this makes other masks have good heat insulation merit
Can, prevent capacitor by high ambient temperature.
A kind of low thermal resistance thin film capacitor of the present invention and preparation method thereof, owing to have employed one of them wall of cabinet
Replace with and use the metallic plate 5 made of metal material, utilize metallic plate 5 to realize heat radiation, there is low thermal resistance and path is controlled,
The feature of convenient heat radiation；During installation, the design directly exposed compared with busbar, the metallic plate of the present invention, without insulation, facilitates client
Install；The design directly exposed compared with busbar, the capacitor of present invention heat sink under high/low-temperature impact does not have warping phenomenon,
Maintain good thermal diffusivity；The metallic plate of the present invention can be not limited to flat board, it is also possible to is fabricated to flange-cooled heat radiation gold
Belong to plate, it is also possible to make tank on a metal plate and be connected with water channel, thus substantially increase radiating effect；The embedding mouth of the present invention
Being to be located at the face beyond metallic heat radiating plate, embedding open area can be the area of whole, is compared to expose busbar design, its
Manufacture difficulty is substantially reduced.When using this capacitor, directly metallic heat radiating plate to capacitor single radiating treatment can be done,
The hot(test)-spot temperature of capacitor is controlled so that capacitor can reliably use by the temperature controlling capacitor metal heat sink
In the environment of high temperature or high current density.
Embodiment two
Shown in Figure 5, a kind of low thermal resistance thin film capacitor of the present invention and preparation method thereof, different from embodiment one it
Place is, the lateral surface of metallic plate 5 has also protruded out some fin 51, can accelerate dissipating of metallic plate 5 by fin 51
Heat.
Embodiment three
Shown in Figure 6, a kind of low thermal resistance thin film capacitor of the present invention and preparation method thereof, different from embodiment one it
Place is, is additionally provided with some tanks 52 in metallic plate 5, can accelerate the heat radiation of metallic plate 5 by being passed through cold water to tank 52.
Embodiment four
Seeing shown in Fig. 7 to Figure 10, a kind of low thermal resistance thin film capacitor of the present invention and preparation method thereof, with embodiment one
Difference is, the winding axis of capacitor body 1 is set to perpendicular with metallic plate 5.So, the two of capacitor body 1
End is in upper-lower position as shown in Figure 10 respectively, and one of them electrode 23 in two electrodes (for positive and negative electrode) is at plastics
The downside of shell 4 is connected with the metal spraying structure 11 of one end of capacitor body 1 and draws from opening 41, this electrode 23 with
This section 231 that metal spraying structure 11 is connected just is attached at the medial surface of metallic plate 5 by insulation material layer 6, two electrodes
The spray in the downside of cabinet 4 Yu the other end of capacitor body 1 of the other in which electrode 24 in (for positive and negative electrode)
Gold structure 11 is connected and draws from opening 41, this cabinet 4 corresponding to electrode 24 for plastic plate, certainly, should
Plastic plate can also replace to metallic plate, and so, cabinet 4 just has two pieces of metallic plates for dispelling the heat.
Above-mentioned simply presently preferred embodiments of the present invention, not makees any pro forma restriction to the present invention.Although the present invention with
Preferred embodiment is disclosed above, but is not limited to the present invention.Any those of ordinary skill in the art, without departing from this
In the case of inventive technique aspects, technical solution of the present invention is made many possible by the technology contents that all may utilize the disclosure above
Variation and modification, or be revised as equivalents Equivalent embodiments.Therefore, every content without departing from technical solution of the present invention,
According to the technology of the present invention essence to any simple modification made for any of the above embodiments, equivalent variations and modification, all should fall in the present invention
In the range of technical scheme protection.
Claims (9)
1. a low thermal resistance thin film capacitor, including capacitor body, electrode, Embedding Material body and cabinet；
This cabinet is that the square body with an opening, capacitor body and electrode enter along opening and be contained in outside plastics
In shell, Embedding Material body is filled between capacitor body, electrode and the inwall of cabinet；It is characterized in that:
Wherein one or two in four walls of next-door neighbour's opening of cabinet is also replaced by and uses metal material to make
Metallic plate, capacitor body along winding axis be respectively arranged at two ends with metal spraying structure, the most each the one of two electrodes
End metal spraying structure with the two ends of capacitor body respectively is connected, and the most each other end of two electrodes is respectively from plastics
The opening of shell is drawn；The wherein wherein one side of a section of one of them in two electrodes is also attached to the inner side of metallic plate
At face, and this segment electrode wherein one side and the medial surface of metallic plate between be additionally provided with insulation material layer.
Low thermal resistance thin film capacitor the most according to claim 1, it is characterised in that: described capacitor body
Winding axis is set to perpendicular with metallic plate.
Low thermal resistance thin film capacitor the most according to claim 1, it is characterised in that: described capacitor body
Winding axis is set to parallel with metallic plate.
4. according to the low thermal resistance thin film capacitor described in claim 1 or 2 or 3, it is characterised in that: described metal
The lateral surface of plate has also protruded out some fin.
5. according to the low thermal resistance thin film capacitor described in claim 1 or 2 or 3, it is characterised in that: described metal
Plate is additionally provided with some tanks.
6. according to the low thermal resistance thin film capacitor described in claim 1 or 2 or 3, it is characterised in that: described metal
Plate is slab design.
7. according to the low thermal resistance thin film capacitor described in claim 1 or 2 or 3, it is characterised in that: described metal
Fluid sealant is used to be connected to a fixed between plate and the plastic plate of cabinet.
8. the manufacture method of a low thermal resistance thin film capacitor, it is characterised in that: including:
Make the cabinet of the shape that is square with two or three openings, make this cabinet contain three pieces or
Four pieces of plastic plates；
Sealing means is used to be fixed on cabinet and make one piece or two pieces of metallic plates pair one piece or two pieces of metallic plates
Wherein one or two opening of cabinet should be closed in, make shell become the cabinet containing metallic plate；
By each one end of two electrodes respectively with the metal spraying structure welding at two ends along winding axis of capacitor body
Together；
Electrode and capacitor body are put into cabinet from the residue opening of cabinet, makes in two electrodes
The wherein wherein one side also correspondence of a section of one of them or two is attached at the medial surface of one piece or two pieces metallic plate, and
This segment electrode wherein one side and the medial surface of corresponding blocks metallic plate between be accompanied by insulation material layer；And two electrodes
The most each other end is drawn from the residue opening of cabinet the most respectively；
Resin is poured in cabinet from the residue opening of cabinet, makes resin be filled in capacitor body, electrode
And between the inwall of cabinet, form Embedding Material body.
9. the manufacture method of a low thermal resistance thin film capacitor, it is characterised in that: including:
Make the cabinet of the shape that is square with two or three openings, make this cabinet contain three pieces or
Four pieces of plastic plates；
By the wherein wherein one side dielectric film by double-sided belt glue of a section of one of them in two electrodes or two
At the medial surface of one piece or the two pieces metallic plate being fixed on correspondence；
By each one end of two electrodes respectively with the metal spraying structure welding at two ends along winding axis of capacitor body
Together；
Electrode and capacitor body are put into from the opening of cabinet cabinet, and by nugget to one piece or two genus
Plate uses fluid sealant or other sealing means to be fixed on cabinet and make one piece or two pieces of metallic plate correspondences are closed in
Wherein one or two opening of cabinet, makes shell become the cabinet containing metallic plate, and two electrodes
The most each other end is drawn from the residue opening of cabinet the most respectively；
Resin is poured in cabinet from the residue opening of cabinet, makes resin be filled in capacitor body, electrode
And between the inwall of cabinet, form Embedding Material body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610351504.7A CN105931840A (en) | 2016-05-24 | 2016-05-24 | Low thermal resistance thin-film capacitor and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610351504.7A CN105931840A (en) | 2016-05-24 | 2016-05-24 | Low thermal resistance thin-film capacitor and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105931840A true CN105931840A (en) | 2016-09-07 |
Family
ID=56842257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610351504.7A Pending CN105931840A (en) | 2016-05-24 | 2016-05-24 | Low thermal resistance thin-film capacitor and production method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981365A (en) * | 2016-12-02 | 2017-07-25 | 厦门法拉电子股份有限公司 | A kind of aluminum-casing capacitor with inner fin and preparation method thereof |
| WO2022163278A1 (en) * | 2021-01-28 | 2022-08-04 | パナソニックＩｐマネジメント株式会社 | Capacitor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090040685A1 (en) * | 2005-04-19 | 2009-02-12 | Gerhard Hiemer | Power capacitor |
| CN201352503Y (en) * | 2009-01-22 | 2009-11-25 | 佛山市顺德区创格电子实业有限公司 | Novel capacitor for self-healing microwave oven |
| CN202217583U (en) * | 2011-08-21 | 2012-05-09 | 比亚迪股份有限公司 | Capacitor |
| CN205645541U (en) * | 2016-05-24 | 2016-10-12 | 厦门法拉电子股份有限公司 | Low thermal resistance film capacitor |
-
2016
- 2016-05-24 CN CN201610351504.7A patent/CN105931840A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090040685A1 (en) * | 2005-04-19 | 2009-02-12 | Gerhard Hiemer | Power capacitor |
| CN201352503Y (en) * | 2009-01-22 | 2009-11-25 | 佛山市顺德区创格电子实业有限公司 | Novel capacitor for self-healing microwave oven |
| CN202217583U (en) * | 2011-08-21 | 2012-05-09 | 比亚迪股份有限公司 | Capacitor |
| CN205645541U (en) * | 2016-05-24 | 2016-10-12 | 厦门法拉电子股份有限公司 | Low thermal resistance film capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981365A (en) * | 2016-12-02 | 2017-07-25 | 厦门法拉电子股份有限公司 | A kind of aluminum-casing capacitor with inner fin and preparation method thereof |
| WO2022163278A1 (en) * | 2021-01-28 | 2022-08-04 | パナソニックＩｐマネジメント株式会社 | Capacitor |
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