CN105899063B - Electronic component mounting apparatus and electronic component mounting method - Google Patents
Electronic component mounting apparatus and electronic component mounting method Download PDFInfo
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- CN105899063B CN105899063B CN201610087547.9A CN201610087547A CN105899063B CN 105899063 B CN105899063 B CN 105899063B CN 201610087547 A CN201610087547 A CN 201610087547A CN 105899063 B CN105899063 B CN 105899063B
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- Prior art keywords
- suction nozzle
- lead
- axial members
- electronic component
- bulge quantity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A kind of electronic component mounting apparatus is provided, the bulge quantity of lead can be managed, axial members are installed well to substrate.It has: electronic part feeder, supplies the axial members with lead；Mounting head has the suction nozzle for being able to maintain axial members；Head moving device is installed, mounting head can be made to move in the predetermined surface comprising the component supply position opposite with axial members and the installation site opposite with substrate；Suction nozzle mobile device can be such that suction nozzle moves relative to mounting head along the prescribed direction orthogonal with predetermined surface；Detection device is set to mounting head, detects the suction nozzle position of the prescribed direction under primary condition and the position of the axial members lead kept by suction nozzle；Calculation part, the testing result based on detection device calculate the bulge quantity of the lead protruded from suction nozzle front end；Correction unit, the calculated result based on calculation part, the correcting value of the position of suction nozzle when output is at component supply position by suction nozzle holding axial members.
Description
Technical field
The present invention relates to a kind of electronic component mounting apparatus and electronic component mounting methods.
Background technique
In the manufacturing process of electronic equipment, the electronic component mounting apparatus for installing electronic component to substrate is used.Make
For the electronic component installed to substrate, it is known that lead-type electronic-part, which has inserts into the hole of substrate
The lead entered.An example for disclosing electronic component mounting apparatus in patent document 1, based on the length of lead to will draw
Line style electronic component is determined to the condition that substrate is installed.Electronic component automatic insertion machine is disclosed in patent document 2
One example installs a kind of axial members as lead-type electronic-part to substrate.So-called axial members refer to tool
The electronic component of a pair of lead wires for thering is article body and the both ends from article body to extend outward.A pair of lead wires is set to
On same axis.
Patent document 1: Japanese Unexamined Patent Publication 2013-162105
Patent document 2: Japanese Patent No. 2850388
Axial members are kept from the suction nozzle of mounting head and are installed to substrate.Suction nozzle so that a part of lead before suction nozzle
The mode of end protrusion keeps axial members, its lead is inserted into the hole of substrate.It is convex in the front end from suction nozzle
In the biggish situation of the bulge quantity of lead out, thus it is for example possible to which, due to the flexible deformation of lead, the interval of a pair of lead wires can not
It is maintained desired size, lead can not be smoothly inserted into the hole of substrate.In the lead protruded from the front end of suction nozzle
In the lesser situation of bulge quantity, lead is possible to be inserted into the hole of substrate with being unable to fully.Therefore, it is necessary to before suction nozzle
The bulge quantity of the lead of end protrusion is managed.On the other hand, in an installation, it will use the axis of the lead with various length
To component.Therefore, it is intended that using a kind of technology, that is, even if the length of lead changes, can also be protruded to from the front end of suction nozzle
The bulge quantity of lead be managed well.
Summary of the invention
The purpose of mode of the invention is that the bulge quantity of lead can be managed by providing one kind, by axial members
The electronic component mounting apparatus and electronic component mounting method installed well to substrate.
1st mode according to the invention, provides a kind of electronic component mounting apparatus, which has:
Electronic part feeder supplies the axial members with lead；Mounting head has and is able to maintain the axial direction
The suction nozzle of component；Head moving device is installed, the mounting head can be made comprising supplying with from the electronic part feeder
The opposite component supply position of the axial members given and the installation site opposite with the substrate for installing the axial members
It is moved in predetermined surface；Suction nozzle mobile device, the suction nozzle can be made relative to the mounting head and along with the predetermined surface just
The prescribed direction of friendship is mobile；Detection device is set to the mounting head, to described in the prescribed direction under primary condition
It is detected the position of the lead of the position of suction nozzle and the axial members kept by the suction nozzle；Calculation part, base
In the testing result of the detection device, the bulge quantity of the lead protruded from the front end of the suction nozzle is calculated；
And correction unit, based on the calculated result of the calculation part, output is directed at the component supply position by the suction nozzle
The correcting value of the position of suction nozzle when keeping the axial members.
1st mode according to the present invention, position to the suction nozzle of the prescribed direction under primary condition and is kept by suction nozzle
The position of the prescribed direction of the lead of axial members is detected, its testing result is based on, to what is protruded from the front end of suction nozzle
The bulge quantity of lead is calculated, its calculated result is based on, and output, which is directed to, keeps axial members by suction nozzle in component supply position
When suction nozzle prescribed direction position correcting value, therefore the suction nozzle by being configured at the position after the correction carries out axial members
It keeps, thus, it is possible to be desired value by the bulge quantity management of lead.Therefore, axial members can be pacified well to substrate
Dress.In addition, according to the present embodiment, it, also can be to the lead protruded from the front end of suction nozzle even if the length of lead changes
Bulge quantity is managed well.
Can be in the 1st mode of the invention, the correction unit exports the correcting value, so that the axial members exist
From between the bulge quantity and aim parameter for the lead that the front end of the suction nozzle is protruded in the state of being kept by the suction nozzle
Difference becomes smaller.
Thereby, it is possible to make bulge quantity and aim parameter coincide, axial members can be installed well to substrate.
Can have control unit in the 1st mode of the invention, the control unit is based on the correction exported from the correction unit
Amount, Xiang Suoshu suction nozzle mobile device output control signal, so that kept at the component supply position by the suction nozzle
The bulge quantity of the lead of the axial members becomes aim parameter, and the suction nozzle is adjusted based on the control signal
At the position of the prescribed direction, the axial members of the electronic part feeder are kept, Xiang Suoshu substrate
Installation.
Thereby, it is possible to which the lead of desired bulge quantity to be inserted into the hole of substrate, well to substrate by axial members
Installation.
Can have storage unit in the 1st mode of the invention, which is detected expression by the detection device
The suction nozzle position suction nozzle position data and indicate that the wire locations data of the position of the lead are stored, institute
Calculation part is stated based on the difference between the suction nozzle position data and the wire locations data, calculates the bulge quantity.
As a result, calculation part can based on the difference between the suction nozzle position data that storage unit is stored and wire locations data,
Successfully calculate bulge quantity.
Can have in the 1st mode of the invention: determination unit, to by the calculated lead of the calculation part
Bulge quantity whether be in permissible range and determined；And portion is retried, it is being determined as that the bulge quantity is not at the appearance
Perhaps when range, make the detection device to based on the correcting value by the position of the prescribed direction suction nozzle institute adjusted
The position of the lead of the axial members kept, is detected again.
It, also can be in the state after reducing the difference even if the difference between the bulge quantity and aim parameter of lead becomes larger as a result,
Under detection executed by detection device again, therefore being capable of accurately output calibration amount.
2nd mode according to the invention, provides a kind of electronic component mounting method, under which includes
State step: in an initial condition, the detection device by being set to mounting head detects the position of suction nozzle, which can
Comprising the component supply position opposite with the axial members supplied from electronic part feeder and with installation axial members
Moved in the predetermined surface of the opposite installation site of substrate, which is set to the mounting head, can along with the predetermined surface just
The direction of friendship is mobile；Under the primary condition, by the detection device to the axial members kept by the suction nozzle
It is detected the position of the lead；The position of position and the lead based on the suction nozzle detected by the detection device
It sets, the bulge quantity of the lead protruded from the front end of the suction nozzle is calculated；Based on the calculated lead
Bulge quantity, position of the output for suction nozzle when keeping the axial members by the suction nozzle at the component supply position
The correcting value set；Based on the correcting value, when to keeping the axial members by the suction nozzle at the component supply position
The position of the suction nozzle be corrected, the axial members are kept by the suction nozzle；And it will be protected by the suction nozzle
The axial members held are installed to substrate.
2nd mode according to the present invention keeps axial members by the suction nozzle by being configured at the position after correcting,
So as to by the bulge quantity management of lead be desired value.Therefore, axial members can be installed well to substrate.Separately
It outside, according to the present embodiment, also can be to the bulge quantity of the lead protruded from the front end of suction nozzle even if the length of lead changes
It is managed well.
The effect of invention
Mode according to the present invention, provide it is a kind of the bulge quantity of lead can be managed, by axial members to substrate
The electronic component mounting apparatus and electronic component mounting method installed well.
Detailed description of the invention
Fig. 1 is the oblique view for indicating an example of electronic component mounting apparatus involved in present embodiment.
Fig. 2 is the figure for schematically showing an example of mounting head involved in present embodiment.
Fig. 3 is the figure for indicating an example of electronic component involved in present embodiment.
Fig. 4 is the side view for indicating an example of electronic part feeder involved in present embodiment.
Fig. 5 is the oblique view for indicating an example of lead processing mechanism and conveying mechanism involved in present embodiment.
Fig. 6 is the cross-sectional view for indicating an example of conveying mechanism involved in present embodiment.
Fig. 7 is the overall structure figure for indicating an example of lead processing mechanism involved in present embodiment.
Fig. 8 is the oblique view for indicating the mian part of lead processing mechanism involved in present embodiment.
Fig. 9 is the top view for indicating an example of lead processing mechanism involved in present embodiment.
Figure 10 is the front view for indicating an example of lead processing mechanism involved in present embodiment.
Figure 11 is the exploded perspective view for indicating a part of lead processing mechanism involved in present embodiment.
Figure 12 is the figure for indicating an example of movable cutter and fixed cutting tool involved in present embodiment.
Figure 13 is the figure for an example for indicating shaping mould involved in present embodiment and being fixed into pattern.
Figure 14 is the figure of an example of the movement for indicating shaping mould involved in present embodiment and being fixed into pattern.
Figure 15 is the figure of an example of the movement for indicating shaping mould involved in present embodiment and being fixed into pattern.
Figure 16 is the front view for indicating a part of lead processing mechanism involved in present embodiment.
Figure 17 is the side view for indicating an example of suction nozzle involved in present embodiment.
Figure 18 is the figure for observing from below suction nozzle involved in present embodiment.
Figure 19 is the sectional view for indicating an example of suction nozzle involved in present embodiment.
Figure 20 is to indicate the lead processing mechanism of the electronic part feeder involved in the present embodiment by the ministry of electronics industry
Part is supplied to the figure of an example of the state of suction nozzle.
Figure 21 is the side view for indicating an example of detection device involved in present embodiment.
Figure 22 is the top view for indicating an example of detection device involved in present embodiment.
Figure 23 is the shape for indicating detection device involved in present embodiment and detecting to the position of the front end of suction nozzle
The schematic diagram of one example of state.
Figure 24 is the lead for indicating detection device involved in present embodiment to the axial members kept by suction nozzle
The schematic diagram of one example of the state that the position of front end is being detected.
Figure 25 is the figure for indicating an example of axial members.
Figure 26 is to indicate that suction nozzle involved in present embodiment maintains the figure of an example of the state of axial members.
Figure 27 is the figure for indicating an example of axial members.
Figure 28 is to indicate that suction nozzle involved in present embodiment maintains the figure of an example of the state of axial members.
Figure 29 is the functional block diagram for indicating an example of control device involved in present embodiment.
Figure 30 is the flow chart for indicating an example of electronic component mounting method involved in present embodiment.
Figure 31 is to indicate that the suction nozzle for being moved to elemental height maintains the state of the axial members of electronic part feeder
Figure.
Figure 32 is the schematic diagram of the relationship between the height for indicating the front end of suction nozzle and the height of the front end of lead.
Figure 33 is to indicate suction nozzle keeps the axial members of electronic part feeder in installation process state
Figure.
The explanation of label
10 detection devices
30 suction nozzles
100 electronic component mounting apparatus
106 mounting heads
107 installation head moving devices
120 control devices
122 calculation parts
123 correction units
124 control units
125 storage units
126 determination units
127 retry portion
140 suction nozzle mobile devices
200 electronic part feeders
C axial members
L lead
P substrate
PJa component supply position
PJb installation site
Specific embodiment
In the following, being illustrated to embodiment according to the present invention, but the present invention is not limited to this referring to attached drawing.
The structural element of embodiment described below can be appropriately combined.Sometimes without using the structural element of a part.
In the following description, setting XYZ orthogonal coordinate system, referring to the XYZ orthogonal coordinate system to the position in each portion
Relationship is illustrated.The direction parallel with the 1st axis is set as X-direction (the 1st axis direction) in predetermined surface, it will in predetermined surface
The direction parallel with the 2nd orthogonal axis of the 1st axis is set as Y direction (the 2nd axis direction), will distinguish just with the 1st axis and the 2nd axis
The parallel direction of the 3rd axis handed over is set as Z-direction (the 3rd axis direction).It will be by the direction of rotation (inclination centered on the 1st axis (X-axis)
Direction) it is set as θ X-direction, the direction of rotation (inclined direction) centered on the 2nd axis (Y-axis) is set as θ Y-direction, it will be with the 3rd axis
Direction of rotation (inclined direction) centered on (Z axis) is set as θ Z-direction.Predetermined surface is X/Y plane.In the present embodiment, it is specified that
Face is set as being parallel to the horizontal plane.Z-direction is the direction orthogonal with predetermined surface.In the present embodiment, Z-direction is vertical side
To (up and down direction).
[summary of electronic component mounting apparatus]
Fig. 1 is the oblique view for indicating an example of electronic component mounting apparatus 100 involved in present embodiment.Such as figure
Shown in 1, electronic component mounting apparatus 100 has: pedestal 114；Electronic part feeder 200 supplies electronic component C；If
Portion 102 is set, is used to be arranged electronic part feeder 200；Substrate transfer apparatus 103, carries substrate P；Substrate
Clamp system 104 is set to the transport path of substrate transfer apparatus 103, keeps to substrate P；Mounting head 106, tool
There is the suction nozzle 30 for being able to maintain electronic component C；Head moving device 107 is installed, in X/Y plane mounting head 106 can move
It is dynamic；Suction nozzle mobile device 140 is set to mounting head 106, suction nozzle 30 can be made relative to mounting head 106 and along Z-direction and
θ Z-direction is mobile；Detection device 10 is set to mounting head 106, detects to the position of the suction nozzle 30 of Z-direction；And
Control device 120 controls electronic component mounting apparatus 100.
Electronic part feeder 200 is also referred to as feeder.Setting unit 102 is also referred to as feeder receptacle.Setting unit
102, substrate transfer apparatus 103, substrate clamp system 104, mounting head 106 and installation head moving device 107 etc. are by pedestal 114
Support.
[substrate transfer apparatus]
Substrate transfer apparatus 103 includes base plate 400；And carry strap, it can be carried in the top of base plate 400
Substrate P.In the present embodiment, substrate P is carried along the x axis by the carry strap of substrate transfer apparatus 103.Substrate clamp system
104 keep substrate P in the transport path of substrate transfer apparatus 103.Substrate clamp system 104 is by the base of Y direction
The both ends of plate P clamp.
Substrate P is fixed on the installation site PJb of installation process to be implemented by substrate clamp system 104.Installation site PJb is
The position that electronic component C is carried out to the installation process that substrate P is installed.Installation site PJb includes to be mounted with electronic component C
The opposite position of substrate P.
Electronic component mounting apparatus 100 has a supporting pin 300, and the supporting pin 300 by substrate clamp system 104 to being kept
The back side of substrate P is supported.Supporting pin 300 is supported in base plate 400.Using supporting pin 300, inhibit the flexure of substrate P.
[mounting head]
Mounting head 106 protects the electronic component C supplied from electronic part feeder 200 to by substrate clamp system 104
The front installation for the substrate P held.Mounting head 106 can be in component supply position PJa and reality comprising implementing component supply processing
It applies and is moved in the X/Y plane including the installation site PJb of installation process.Component supply position PJa be implement by electronic component C from
Electronic part feeder 200 is supplied to the position of the component supply processing of mounting head 106.Component supply position PJa include with
The opposite position of at least part of electronic part feeder 200, comprising with the electricity that is supplied from electronic part feeder 200
Subassembly C opposite position.
Installation head moving device 107 makes mounting head 106 in the top of substrate P and the top of electronic part feeder 200
It is mobile.Installation head moving device 107 can make mounting head 106 comprising with the electronics that is supplied from electronic part feeder 200
XY including component C opposite component supply position PJa and the installation site PJb opposite with the installation substrate P of electronic component C
It is moved in plane.By the movable range for the mounting head 106 that installation head moving device 107 is realized, the operation comprising mounting head 106
Region.By installing the work of head moving device 107, mounting head 106 can be made to move in X/Y plane.
Installation head moving device 107 has: X-axis guide rail 107a guides mounting head 106 along the x axis；Y-axis guide rail
107b guides X-axis guide rail 107a along the y axis；X driving portion 109 is generated for moving mounting head 106 along the x axis
Power；And Y driving portion 110, generate the power for moving mounting head 106 along the y axis.
In the present embodiment, mounting head 106 is supported by X-axis guide rail 107a.X driving portion 109 includes such as motor
Actuator generates the power for moving the mounting head supported by X-axis guide rail 107a 106 along the x axis.Pass through X driving portion
109 work, mounting head 106 on one side by X-axis guide rail 107a guidance, while along the x axis and move.
X-axis guide rail 107a is supported by Y-axis guide rail 107b.Y driving portion 110 includes the actuator of such as motor, generates use
In the power for moving the X-axis guide rail 107a supported by Y-axis guide rail 107b along the y axis.Pass through the work of Y driving portion 110, X
Axis rail 107a on one side by Y-axis guide rail 107b guidance, while along the y axis and move.If X guide rail 107a is moved along the y axis,
Then moved along the y axis together with X-axis guide rail 107a by the mounting head 106 that the X guide rail 107a is supported.In the present embodiment, Y
Driving portion 110 moves mounting head 106 along the y axis via X-axis guide rail 107a.
Fig. 2 is the figure for schematically showing an example of mounting head 106 involved in present embodiment.Mounting head 106
With the suction nozzle 30 for detachably keeping electronic component C.Mounting head 106 can move in X/Y plane, so that by suction nozzle
30 are respectively arranged at component supply position PJa and installation site PJb.Mounting head 106 is supplied using suction nozzle 30 to from electronic component
The electronic component C that device 200 supplies is kept and is installed to substrate P.
Suction nozzle 30 carries out the electronic component C supplied from electronic part feeder 200 at the PJa of component supply position
It keeps.After suction nozzle 30 keeps electronic component C at the PJa of component supply position, it is carried to installation site PJb, is installed to substrate P.
After installing electronic component C to substrate P at installation site PJb, suction nozzle 30 decontrols electronic component C.Electronic component C as a result,
It is mounted to substrate P.
Mounting head 106 can movably support suction nozzle 30 along Z-direction and θ Z-direction.Mounting head 106 have can make to inhale
The suction nozzle mobile device 140 that mouth 30 is moved along Z-direction and θ Z-direction.Suction nozzle mobile device 140 includes: Z driving portion 150,
Move suction nozzle 30 along Z-direction；And θ Z driving portion 160, so that suction nozzle 30 is moved (rotation) along θ Z-direction.Z driving portion 150
Actuator comprising such as motor generates the power for moving suction nozzle 30 along Z-direction.θ Z driving portion 160 includes all
Such as the actuator of motor, the power for moving suction nozzle 30 along θ Z-direction is generated.
That is, in the present embodiment, suction nozzle 30 is using installation head moving device 107 and is set to the suction nozzle of mounting head 106
Mobile device 140 can be moved in this 4 directions along X-axis, Y-axis, Z axis and θ Z.In addition, suction nozzle 30 can also be along X-axis, Y
Axis, Z axis, θ X, θ Y and θ Z are moved in this 6 directions.
Mounting head 106 has: head camera 170 can obtain the image data of object；Range sensor 180,
It is detected to opposite the distance between object；And detection device 10, the position of the suction nozzle 30 of Z-direction is carried out
Detection.It is mobile by making mounting head 106, to make head camera 170, range sensor 180 and detection device 10 and installation
First 106 move together.
Head camera 170 can obtain the image data of electronic component C, the image data of substrate P and be installed on substrate
The image data of the electronic component C of P.Head camera 170 can obtain the figure of electronic component C at the PJa of component supply position
As data.Head camera 170 can obtain the image data of substrate P at installation site PJb and be installed on the electricity of substrate P
The image data of subassembly C.Based on the image data obtained by head camera 170, to the electronics of X-direction and Y direction
The relative position of the relative position of component C and suction nozzle 30, the relative position of substrate P and suction nozzle 30 and substrate P and electronic component C
It is adjusted.
Range sensor 180 detects the position of electronic component C of Z-direction and the position of substrate P.Distance-sensing
Device 180 carries out light to electronic component C and substrate P irradiating and detecting light, to electronic component C and the substrate P detection light reflected, by
This detects the position of electronic component C of Z-direction and the position of substrate P.Detection knot based on range sensor 180
Fruit, the relative position of electronic component C and suction nozzle 30, the relative position of substrate P and suction nozzle 30 and substrate P and electricity to Z-direction
The relative position of subassembly C is adjusted.
Detection device 10 carries out the position of the suction nozzle 30 of Z-direction and the position of the electronic component C kept by suction nozzle 30
Detection.Detection device 10 includes line sensor.Detection device 10 is by being set to frame parts 11 of the lower part of mounting head 106
Support.Detection device 10 includes light source 12, projects detection light；And light receiving element 13, it being capable of inspection to being projected from light source 12
Survey at least part light of light.In the present embodiment, laser is used as detection light.Light source 12 is sharp comprising that can project
The light-emitting component of light.Light receiving element 13 is configured at the position opposite with light source 12.The position of the light source 12 of Z-direction and light member
The position of part 13 is substantially the same.Detection device 10 carries out the position of the suction nozzle 30 of Z-direction to 30 irradiating and detecting light of suction nozzle
Detection.Detection device 10 is to the electronic component C irradiating and detecting light kept by suction nozzle 30, to the position of the electronic component C of Z-direction
It is detected.
[electronic component]
Fig. 3 is the figure for indicating an example of electronic component C involved in present embodiment.In the present embodiment, electric
Subassembly C is the axial members C with lead C.Axial members C includes article body M；And a pair of lead wires L, they are from portion
The both ends of part main body M extend outward.A pair of lead wires L is set on same axis.In the following description, by electronic component C
It is properly termed as axial members C.
Axial members C is held in holding band T.Holding is kept with front end of the T to lead L.Keeping band T includes to one
The holding for the side that the lead L of side is kept is with T and to the holding band of the other side kept the lead L of the other side
T.By being kept the multiple axial members C component parts union body K kept with T.Axial members C is along length direction of the holding with T
It is arranged multiple.
[electronic part feeder]
Electronic part feeder 200 supplies axial members C.Electronic part feeder 200 is set to setting
Portion 102.In addition, in fig. 1 it is illustrated that 1 electronic part feeder 200 out.It can be by multiple electronic part feeders 200
It is set to setting unit 102.
Fig. 4 is the side view for indicating an example of electronic part feeder 200 involved in present embodiment.Electronics
Assembly supply device 200 has: frame 210；Tep reel maintaining part 220 is supported by frame 210, is rolled by component union body K
Tep reel R kept；Transport path 211 removes the component union body K extracted out from the tep reel R of tep reel maintaining part 220
Fortune；Lead processing mechanism 230 implements the axis of the component union body K supplied via transport path 211 from tep reel maintaining part 220
Cutting and molding to the lead L of component C；Component union body K is delivered to along transport path 211 and draws by conveying mechanism 260
Line processing mechanism 230；And discharge path 212, by by lead processing mechanism 230 cut off after lead L front end and
The band of holding accompanying by the front end of lead L T is carried.
Frame 210 includes a pair of side plates.In addition, frame 210 has positioning protrusion 213.Using positioning protrusion 213, carry out
Positioning relative to setting unit 102.
Tep reel maintaining part 220 has the support shaft 221 being supported to tep reel R.Tep reel maintaining part 220 can rotate twelve Earthly Branches
Support tep reel R.
The component union body K for being wound in tep reel R is delivered to lead processing mechanism 230 by conveying mechanism 260.Component union body
K is handled upside down along transport path 211.
Lead processing mechanism 230 cuts off the front end of lead L, and the lead L connecting with article body M is bent.Pass through
The front end of lead L is cut off, thus by the front end of lead L and the band T of the holding accompanying by the front end of lead L from portion
Part main body M separation.The front end of lead L and holding band T are discharged via discharge path 212.
Component supply position PJa includes the position opposite with lead processing mechanism 230.Electronic part feeder 200 will
It is supplied from treated the electronic component C of lead processing mechanism 230 to the suction nozzle 30 for the top for being moved to lead processing mechanism 230.
[conveying mechanism]
Fig. 5 be indicate lead processing mechanism 230 and conveying mechanism 260 involved in present embodiment an example it is oblique
View.Fig. 6 is the cross-sectional view for indicating an example of conveying mechanism 260 involved in present embodiment.
In the following description, component union body K is properly termed as conveying direction by the direction that conveying mechanism 260 is carried
The direction opposite with conveyance direction downstream side is properly termed as conveying direction upstream side by downstream side.
Conveying mechanism 260 has: cylinder 261, generates the power for conveying component union body K；Pedestal 262,
Cylinder 261 is supported；Transport platform 264 can be guided by sliding guide portion 263, relative to pedestal 262 along conveying
Direction moves back and forth；Conveying arm 265 is set to transport platform 264；It keeps belt roller 266 and keeps band guide portion 267, it
Be set to transport platform 264, the holding of component union body K band T is guided；Arm of ratchet 268 links with conveying arm 265；
Retainer 269 provides the conveying stroke of conveying mechanism 260；And release lever 270, conveying arm 265 is occurring
Forcibly component union body K is decontroled from conveying arm 265 when conveying bad.
The cylinder main body of cylinder 261 is fixed on pedestal 262.The plunger portion and transport platform 264 of cylinder 261 link.Transport platform
264 have abutting plate 264a.If using cylinder 261 that transport platform 264 is mobile to conveyance direction downstream side, plate 264a is abutted
It is contacted with retainer 269.The conveying stroke of the conveying mechanism 260 of conveyance direction downstream side is prescribed as a result,.
Retainer 269 is fixed on pedestal 262.The position of the retainer 269 of conveying direction can adjust.By to retainer
269 position is adjusted, so that the conveying stroke to conveying mechanism 260 is adjusted.The conveying stroke quilt of conveying mechanism 260
It is adjusted to, it is consistent with the interval of multiple axial members C of component union body K.
Conveying arm 265 links via rotation axis 271 with transport platform 264.Conveying arm 265 is supported by rotation axis 271, thus
The front end of the conveying arm 265 of conveyance direction downstream side can be swung along the vertical direction.
Arm of ratchet 268 links via rotation axis 272 with frame 210.Arm of ratchet 268 is supported by rotation axis 272, thus defeated
Sending the front end of the arm of ratchet 268 of direction upstream side can swing along the vertical direction.
Conveying arm 265 has the multiple conveying tooth 265a for being set to conveying direction.Arm of ratchet 268, which has, is set to conveying side
To multiple conveying tooth 268a.In the carrying of component union body K, the lead L of axial members C is configured at conveying tooth 265a and defeated
Send tooth 268a.
Conveying tooth 265a and conveying tooth 268a are respectively facing conveyance direction downstream side, have and substantially parallel vertical of Z axis
Face and towards the inclined inclined surface in conveyance direction downstream side.When component union body K is conveyed to conveyance direction downstream side, portion
The inclination face contact of the lead L and conveying tooth 265a of part union body K.In the shape of the inclination face contact of lead L and conveying tooth 265a
Under state, component union body K is mobile to conveyance direction downstream side, and thus the front end of conveying arm 265 is moved upward.Similarly,
When component union body K is conveyed to conveyance direction downstream side, the inclination face contact of lead L and conveying tooth 268a.Lead L with
In the state of the inclination face contact for conveying tooth 268a, component union body K is mobile to conveyance direction downstream side, thus arm of ratchet 268
Front end be moved upward.Component union body K can be moved smoothly as a result,.
When conveying arm 265 is mobile to conveying direction upstream side via transport platform 264, the conveying tooth 265a of conveying arm 265
Inclined surface boosted by the lead L of component union body K, the front end of conveying arm 265 is moved upward.On the other hand, component connects
The vertical face contact of the conveying tooth 268a of the lead L of knot body K and arm of ratchet 268, therefore component union body K is to conveying direction upstream
Side carries out movement and is restricted.As previously discussed, move back and forth transport platform 264 by the work using cylinder 261, from
And component union body K can be made mobile to conveyance direction downstream side with 1 conveying path increment.
Release lever 270 links via rotation axis 273 and transport platform 264.There is pin 270a, the pin at release lever 270
270a is inserted into the long hole 265b for being formed in conveying arm 265.It is operated by the front end to release lever 270, thus defeated
The front end of arm 265 is sent to be moved upward via pin 270a.The engagement of the lead L of tooth 265a and component union body K is conveyed as a result,
It is released from.
[lead processing mechanism]
Fig. 7 is the overall structure figure for indicating an example of lead processing mechanism 230 involved in present embodiment.Fig. 8
It is the oblique view for indicating the mian part of lead processing mechanism 230 involved in present embodiment.Fig. 9 is to indicate lead processing mechanism
The top view of 230 example.Figure 10 is an example for indicating lead processing mechanism 230 involved in present embodiment
Front view.Figure 11 is the exploded perspective view for indicating a part of lead processing mechanism 230 involved in present embodiment.
As shown in figs. 7 to 11, lead processing mechanism 230 has: sidewall portion 231, it includes fixed cutting tool 234 and fixes
Shaping mould 235；Movable cutter 232, is set to the outside of sidewall portion 231；Shaping mould 233 is set to the interior of sidewall portion 231
Side；Framework 239 to movable cutter 232, fixed cutting tool 234, shaping mould 233 and is fixed into pattern 235 and keeps；And
Actuating mechanism 250 can be such that movable cutter 232 and shaping mould 233 moves along the vertical direction.
Lead L is cut off using fixed cutting tool 234 and movable cutter 232.Movable cutter 232, which has, cuts off lead L
Blade.Lead L is bent using pattern 235 and shaping mould 233 is fixed into.Shaping mould 233 has the molding for bending lead L
Portion.
Fixed cutting tool 234 is supported by cutter holding frame 236, which has movable cutter 232 vertically
The guiding groove 236a that direction guides.It is fixed into pattern 235 to be supported by mould holding frame 237, which has will be at
The guiding groove 237a that pattern 233 guides along the vertical direction.Cutter holding frame 236 and mould holding frame 237 connect via bar 238
Knot.
Fixed cutting tool 234 has the lead introduction part 234a for receiving lead L.Be fixed into pattern 235 have receive lead L's
Lead introduction part 235a.Lead introduction part 234a and lead introduction part 235a has opening towards conveying direction upstream side.By defeated
The lead L of the axial members C of the starting for the component union body K for sending mechanism 260 to convey is inserted into lead introduction part 234a and draws
Line introduction part 235a.
Figure 12 is the figure for indicating an example of movable cutter 232 and fixed cutting tool 234 involved in present embodiment.Such as
Shown in Figure 12, movable cutter 232 has blade 232a.Fixed cutting tool 234 has the blade for being set to lead introduction part 234a
234b.Movable cutter 232 can move along the vertical direction relative to fixed cutting tool 234.It is imported by being inserted into lead in lead L
In the state of portion 234a, movable cutter 232 rises, so that the front end of lead L be cut off.
Figure 13 is the figure for an example for indicating shaping mould 233 involved in present embodiment and being fixed into pattern 235.Such as
Shown in Figure 13, it is fixed into pattern 235 and includes relief portion 235b, be set to the lower edge of lead introduction part 235a；Recess portion
235d is set to the rising wood of lead introduction part 235a；And guiding groove 235c, it is connect with recess portion 235d.
Figure 14 and Figure 15 is the one of the movement for indicating shaping mould 233 involved in present embodiment and being fixed into pattern 235
The figure of a example.As shown in figure 14, in the state that lead L is inserted into lead introduction part 235a, shaping mould 233 rises, thus
As shown in figure 15, lead L is bent in such a way that the front end of lead L is moved downwards.Match the front end of lead L after bending
It is placed in relief portion 235b.In addition, a part of the lead L after bending is configured at guiding groove 235c.
Actuating mechanism 250 has: cylinder 251；Base body 252 is fixed on frame 210, keeps to cylinder 251；
Drive rod 253, part of it are rotatably supported in base body 252, and a part and the plunger of cylinder 251 link；Crank
254, rotatably it is supported in mould holding frame 237；Connecting rod 255, drive rod 253 and crank 254 are linked；Drive shaft
256, it is inserted into the through hole 232b of the movable cutter 232 and through hole 233b (referring to Fig.1 1) of shaping mould 233, is held in song
Handle 254；And retainer 257, it is set to base body 252, the stroke of the plunger of cylinder 251 is limited.
If the plunger of cylinder 251 works, connecting rod 255 advances via drive rod 253, and crank 254 rotates.As a result,
Drive shaft 256 is moved upward, and the movable cutter 232 and shaping mould 233 linked with drive shaft 256 rises.Implement lead as a result,
The cutting of L and bending forming.
Figure 16 is the front view for indicating a part of lead processing mechanism 230.As shown in figure 16, movable cutter 232 is upper
End is configured at the position higher than the upper end of shaping mould 233.As a result, if cylinder 251 works, movable cutter 232 at
Pattern 233 is implemented before the bending forming for being carried out lead L using shaping mould 233 compared to the lead L for first reaching axial members C
The cutting of lead L.
Retainer 257 can adjust the position of conveying direction.The stroke of the plunger of cylinder 251 is adjusted as a result, it is right
The highest arrival point of the movable cutter 232 and shaping mould 233 that rise is adjusted.
[suction nozzle]
In the following, referring to Fig.1 7 to Figure 19, suction nozzle 30 involved in present embodiment is illustrated.Figure 17 is to indicate this reality
Apply the side view of an example of suction nozzle 30 involved in mode.Figure 18 is to observe from below suction nozzle involved in present embodiment
30 figure.Figure 19 is the sectional view for indicating an example of suction nozzle 30 involved in present embodiment.
As noted above, suction nozzle 30 can be moved relative to mounting head 106 along Z-direction and θ Z-direction.
Suction nozzle 30 has: main part 31；A pair of of arm 32, they are set to the lower end of main part 31, are able to maintain axis
To component C；Plunger part 33 can movably be supported in main part 31 along the vertical direction, will be by arm 32 to axial part
The holding of part C releases；Reset spring 34, is configured at the inside of main part 31, and generation is moved upward plunger part 33
Power；And piston rod 35, it is configured at the inside of main part 31, generates the power for moving plunger part 33 downwards.
Arm 32 is set as extending downward from main part 31.Arm 32 has sidewall portion 36.A pair of sidewalls portion 36 is phase
Pair.The guiding groove 37 for receiving the lead L of axial members C is formed in the medial surface of sidewall portion 36.Guiding groove 37 is along the vertical direction
Extend.The distance between the inner face of the guiding groove 37 of the arm 32 of side and the inner face of guiding groove 37 of arm 32 of the other side W,
Less than the distance between the lead L and the lead L of the other side of the side after bending.
In addition, arm 32 has the opposite face 32a opposite with axial members C when maintaining axial members C.Opposite face
32a is not contacted with axial members C, opposite with axial members C across gap.
Plunger part 33 is moved downwards by the work of piston rod 35.It is moved downwards by plunger part 33, from
And plunger part 33 is configured between a pair of of arm 32.Opposite face 32a is at least moved to by the lower end of plunger part 33
Lower section, so that the article body M kept by arm 32 be pressed downwards.As a result, by the guarantor by arm 32 to axial members C
Hold releasing.
Reset spring 34 generates the power for being moved upward plunger part 33.It is multiple in the idle situation of piston rod 35
Position spring 34 is to 33 applied force of plunger part, so that the lower end of plunger part 33 to be configured to the top of opposite face 32a.
Figure 20 is indicated electronic component C from the supply of the lead processing mechanism 230 of electronic part feeder 200 to suction nozzle
The figure of one example of 30 state.As shown in figure 20, suction nozzle 30 is moved to the component supply position of electronic part feeder 200
Set PJa.Declined by suction nozzle 30, so that axial members C be kept by suction nozzle 30.That is, if suction nozzle 30 declines, axial members
The lead L of C is inserted into the guiding groove 37 of arm 32.The distance W of a pair of of guiding groove 37 is slightly smaller than the distance of a pair of lead wires L, therefore
Arm 32 can stably keep axial members C.
In the state that axial members C is kept by arm 32, the opposite face 32a of arm 32 is across gap and axial members C
Relatively.
In addition, suction nozzle 30 is so that front end (lower end) 36a of lead L from the sidewall portion 36 of axial members C is convex downwards
Mode out keeps axial members C.In the present embodiment, with lead L from the front end 36a of suction nozzle 30 according to the protrusion of regulation
The mode for measuring H protrusion, keeps axial members C by suction nozzle 30.
[detection device]
In the following, being illustrated to detection device 10 involved in present embodiment.Figure 21 is indicated involved by present embodiment
And detection device 10 an example side view.Figure 22 is one for indicating detection device 10 involved in present embodiment
The top view of example.
Detection device 10 is set to mounting head 106, is capable of the position of suction nozzle 30 to Z-direction and is kept by suction nozzle 30
The position of lead L of Z-direction of axial members C detected.Detection device 10 is fixed on mounting head 106.Mounting head 106
And do not change comprising the relative position between the detection device 10 including light source 12 and light receiving element 13.On the other hand, suction nozzle 30
It can be moved relative to mounting head 106 along Z-direction.The relative position of Z-direction between mounting head 106 and suction nozzle 30 becomes
Change.Similarly, the relative position of the Z-direction between mounting head 106 and the axial members C kept by suction nozzle 30 changes.Detection
Device 10 can detect suction nozzle 30 relative to the position of the Z-direction of mounting head 106.Detection device 10 can be to by inhaling
The lead L for the axial members C that mouth 30 is kept is detected relative to the position of the Z-direction of mounting head 106.
As shown in Figure 21 and Figure 22, detection device 10 has: frame parts 11 is fixed on the lower part of mounting head 106, with
The mode for surrounding suction nozzle 30 configures；Light source 12 is set to the wall portion 11a of the side of frame parts 11, projects inspection along the y axis
Survey light；And light receiving element 13, it is set to the wall portion of the other side of frame parts 11 opposite with the wall portion 11a of side
11b carries out light to the detection light from light source 12.Light source 12 includes a plurality of light-emitting elements configured along the x axis.Multiple hairs
Optical element projects detection light respectively.Detection light includes laser.Light source 12 projects the linear multiple detections configured along the x axis
Light.
A pair of lead wires L is configured along the x axis.A pair of sidewalls portion 36 also configures along the x axis.The detection projected from light source 12
The size of the X-direction of the irradiation area of light is greater than the lead L of side and the distance between the lead L of the other side and side
The distance between sidewall portion 36 and the sidewall portion of the other side 36.That is, a pair of lead wires L and a pair of sidewalls portion 36 fall into the photograph of detection light
It penetrates in region.
Figure 23 is the state for indicating detection device 10 and detecting to the position of the Z-direction of the front end 36a of suction nozzle 30
An example schematic diagram.On one side move suction nozzle 30 along Z-direction relative to mounting head 106, while follow light source 12 project
Detection light.Suction nozzle mobile device 140 with from the optical path of detection light be configured with suction nozzle 30 at least part of state and
There is no to configure a state change in the state of suction nozzle 30 in the optical path of detection light to the mode of another state for suction nozzle 30
It is moved along Z-direction.At least part of state in the optical path of detection light configured with suction nozzle 30 and the optical path in detection light
In without configuration suction nozzle 30 in the state of, the detection light that is obtained by light receiving element 13 by light state difference.In the light of detection light
Under at least part of state in road configured with suction nozzle 30, at least part of detection light is blocked, in light receiving element 13
Detection light is become the low light income state that light income reduces by light state.Do not have to configure suction nozzle 30 in the optical path of detection light
Under state, detection light is not blocked, and the detection light in light receiving element 13 is become the high light income that light income increases by light state
State.Detection device 10 on one side move suction nozzle 30 along Z-direction, while follow light source 12 project detection light, will be by light receiving element
13 obtained detection lights by light state from a state change in low light income state and high light income state to another
The position of the Z-direction of suction nozzle 30 when state is set as the position of the Z-direction of the front end 36a of suction nozzle 30.
Figure 24 is to indicate detection device 10 to the front end (lower end of the lead L of the axial members C kept by suction nozzle 30
Portion) La Z-direction the schematic diagram of an example of state that is detecting of position.Make to maintain axial members C's on one side
Suction nozzle 30 is moved relative to mounting head 106 along Z-direction, on one side from the injection detection light of light source 12.Suction nozzle mobile device 140 with from
At least part of state in the optical path of detection light configured with lead L and no configuration lead L in the optical path of detection light
State in the mode of a state change to another state will maintain the suction nozzle 30 of axial members C and be moved along Z-direction
It is dynamic.It is configured at least part of state of lead L in the optical path of detection light and draws in the optical path of detection light without configuration
In the state of line L, the detection light that is obtained by light receiving element 13 by light state difference.Lead is configured in the optical path of detection light
Under at least part of state of L, at least part of detection light is blocked, the detection light in light receiving element 13 by light state
The low light income state reduced as light income.In the optical path of detection light without configuration lead L in the state of, detection light not by
It blocks, the detection light in light receiving element 13 is become the high light income state that light income increases, detection device 10 1 by light state
While move the suction nozzle for maintaining axial members C 30 along Z-direction, on one side from the injection detection light of light source 12, it will be by light receiving element
13 obtained detection lights by light state from a state change in low light income state and high light income state to another
The position of the Z-direction of lead L when state is set as the position of the Z-direction of the front end La of lead L.
[by an example of the axial members that suction nozzle is kept]
In the present embodiment, suction nozzle 30 is to make axial members C and opposite face 32a across the opposite mode in gap to axial direction
Component C is kept.As a result, suction nozzle 30 can on one side by lead L from the bulge quantity H of front end 36a be adjusted to constant basis, while
The axial members C of lead L with various length is kept.
Figure 25 is the figure for indicating an example of axial members C1.Figure 26 indicates that suction nozzle 30 maintains axial members C1
The figure of one example of state.Figure 27 is the figure for indicating an example of axial members C2.Figure 28 is to indicate that suction nozzle 30 maintains
The figure of one example of the state of axial members C2.
For example, to shown in Figure 25, in the case that the axial members C1 of the lead L with the 1st length A1 is kept,
As shown in figure 26, suction nozzle 30 can the dimension D 1 to the gap between axial members C1 and opposite face 32a be adjusted, by lead
L is set as aim parameter from the bulge quantity H of front end 36a.
In addition, to shown in Figure 27, the axial members C2 of the lead L with the 2nd length A2 than the 1st length A1 long into
In the case that row is kept, as shown in figure 28, suction nozzle 30 being capable of dimension D 2 to the gap between axial members C2 and opposite face 32a
It is adjusted, lead L is set as aim parameter R from the bulge quantity H of front end 36a.Dimension D 2 is less than dimension D 1.
When axial members C is installed to substrate P, suction nozzle 30 so that a part of lead L from the front end 36a of suction nozzle 30
The mode of protrusion keeps axial members C, its lead L is inserted into the hole of substrate P.In lead L before suction nozzle 30
In the biggish situation of bulge quantity H of end 36a, thus it is for example possible to due to the flexible deformation of lead L, the interval nothing of a pair of lead wires L
Method is maintained desired size, and lead L can not be smoothly inserted into the hole of substrate P.In lead L from the front end of suction nozzle 30
In the lesser situation of bulge quantity H of 36a, lead L is possible to be inserted into the hole of substrate P with being unable to fully.Therefore, need by
In the case that the axial members C of lead L with various length is installed to substrate P, even if the length A of preferably lead L changes, draw
The bulge quantity H of line L from the front end 36a of suction nozzle 30 are also constant basis.In the present embodiment, sidewall portion 36 is sufficiently long, by
In the case that suction nozzle 30 keeps the axial members C of the lead L with any length A, with opposite face 32a and axial part
The discontiguous state of part C is managed its bulge quantity H, so that bulge quantity H is maintained steady state value.
[control device]
In the present embodiment, control device 120 is managed the bulge quantity H of lead L.Figure 29 is to indicate this embodiment party
The functional block diagram of one example of control device 120 involved in formula.Control device 120 includes computer system.Department of computer science
System includes memory as processor as such as CPU and such as ROM or RAM.
The testing result of detection device 10 is output to control device 120.As described in reference Figure 23 explanation, detection device 10
It detects the position for capableing of the Z-direction of front end 36a to suction nozzle 30.As described in reference Figure 24 explanation, detection device 10
The position of the Z-direction of the front end La of the lead L of the axial members C kept by suction nozzle 30 can be detected.
In addition, testing result of the control device 120 based on detection device 10, moves installation head moving device 107 and suction nozzle
Dynamic device 140 is controlled.Installing head moving device 107 includes X driving portion 109 and Y driving portion 110.Suction nozzle mobile device 140
Include Z driving portion 150 and θ Z driving portion 160.
Control device 120 has: data acquisition 121, and obtaining from detection device 10 indicates to be detected by detection device 10
What the suction nozzle position data of the position of the Z-direction of the front end 36a of suction nozzle 30 out and expression were detected by detection device 10
The wire locations data of the position of the Z-direction of the front end La of lead L；Calculation part 122, based on by data acquisition 121
The testing result of the detection device 10 of acquirement calculates the bulge quantity H of the lead L protruded from the front end 36a of suction nozzle 30；
Correction unit 123, based on the calculated result of calculation part 122, output is directed at the PJa of component supply position by 30 holding shaft of suction nozzle
The correcting value of the position of the Z-direction of suction nozzle 30 when to component C；Control unit 124, based on from the school that correction unit 123 exports
Positive quantity exports control signal to suction nozzle mobile device 140；And storage unit 125.
In addition, control device 120 has: determination unit 126, to the bulge quantity H by the calculated lead L of calculation part 122
Whether determined in permissible range；And portion 127 is retried, when being determined as that bulge quantity H is not at permissible range, will use
In the control signal output for making detection device 10 execute detection again.
[electronic component mounting method]
In the following, being illustrated referring to an example of the Figure 30 to electronic component mounting method involved in present embodiment.
Figure 30 is the flow chart for indicating an example of electronic component mounting method involved in present embodiment.As shown in figure 30, originally
Electronic component mounting method involved in embodiment includes from step S10 to the processing of step S130.From step S10 to step
S90, step S120 and step S130 are that the production of changing determined to the operating condition for implementing installation process is handled (at adjustment
Reason, output with conditions processing).Step S100 and step S110 is the installation process to substrate P installation electronic component C.
(changing production processing)
Firstly, exchange production processing is illustrated.To the height of the position of the Z-direction for the front end 36a for indicating suction nozzle 30
Zn is detected (step S10).Referring to as described in Figure 23 explanation, height Zn is detected by detection device 10.
The height Zn detected is obtained by data acquisition 121, is stored to storage unit 125 (step S20).
In the following, keeping mounting head 106 mobile, so that suction nozzle 30 is configured at component supply position PJa (step S30).
The rough contraposition for implementing suction nozzle 30, enabled to by 30 pairs of drawing by electronic part feeder 200 of suction nozzle
Treated that electronic component C is kept for line processing mechanism 230.Suction nozzle 30, which is moved to, indicates the Z-direction under primary condition
The elemental height Zns of position.Elemental height Zns is set by control unit 124.In addition, elemental height Zns can also be set by operator
It is fixed.The suction nozzle 30 for being moved to elemental height Zns is kept (step to the axial members C of electronic part feeder 200
S40)。
Figure 31 is to indicate that the suction nozzle 30 for being moved to elemental height Zns maintains the axial part of electronic part feeder 200
The figure of the state of part C.As shown in figure 31, suction nozzle 30 is in such a way that lead L is from the front end 36a of suction nozzle 30 protrusion to axial members
C is kept.
In the following, the front end of the lead L to the axial members C for indicating to be kept by the suction nozzle 30 for being moved to elemental height Zns
The height ZI of the position of the Z-direction of portion La is detected (step S50).Referring to as described in Figure 24 explanation, height ZI is by detecting
Device 10 detects.
The height ZI detected is obtained by data acquisition 121, is stored to storage unit 125 (step S60).
Calculation part 122 is based on the height Zn and height ZI detected by detection device 10, to the front end 36a from suction nozzle 30
The bulge quantity H of the lead L of protrusion is calculated (step S70).
Figure 32 is the schematic diagram for indicating the relationship between the height ZI of the height Zn and front end La of front end 36a.Such as figure
Shown in 32, the bulge quantity H of lead L is equal to the height Zn detected by detection device 10 and the height detected by detection device 10
The difference of ZI.Calculation part 122 implements operation (Zn-ZI), calculates bulge quantity H.
Determination unit 126 allows the bulge quantity H by the calculated lead L of calculation part 122 relative to whether aim parameter R is in
Range is determined (step S80).In other words, determination unit 126 is to the bulge quantity H and mesh by the calculated lead L of calculation part 122
Whether the poor Δ h between scalar R, which is in permissible range, is determined.
As an example, the aim parameter R of bulge quantity H is 1.0 [mm].Poor Δ h indicates bulge quantity H relative to aim parameter R
Departure.
In the present embodiment, permissible range is further divided into 2 grades of permissible range.1st permissible range is by calculation part
The range that difference between 122 calculated bulge quantity H and aim parameter R is Δ ha.1st permissible range includes to be counted by calculation part 122
Bulge quantity H and aim parameter the R unanimous circumstances of calculating include difference between bulge quantity H and aim parameter R the case where being zero.As
One example, in the case where aim parameter R is 1 [mm], the 1st permissible range is to be less than or equal to more than or equal to 0.9 [mm]
The range of 1.1 [mm].That is, difference Δ ha is ± 0.1 [mm] relative to aim parameter R.
2nd permissible range is the range for being Δ hb by the difference between 122 calculated bulge quantity H and aim parameter R of calculation part.
2nd permissible range as an example, is greater than or equal to 0.5 [mm] and is less than or equal to the range of 1.5 [mm].That is, poor Δ
Hb is ± 0.5 [mm] relative to aim parameter R.
More than 2 permissible range, that is, by 122 calculated bulge quantity H and aim parameter R of calculation part it
Between difference be the Δ hc bigger than Δ hb in the case where, be determined as that bulge quantity H is not at permissible range.In this example, in bulge quantity H
In the case where shorter than 0.5 [mm] or in the case where being longer than 1.5 [mm], it is determined as that bulge quantity H is not at permissible range.
In step S80, in the case where being determined as that the bulge quantity H of lead L is in permissible range (step S80:Yes),
Calculated result of the correction unit 123 based on calculation part 122, output keep axial by suction nozzle 30 at the PJa of component supply position
The correcting value (step S90) of the position of the Z-direction of suction nozzle 30 when component C.
In the present embodiment, in the case where being determined as that bulge quantity H is 1 permissible range in step S80, correction unit
123 as correcting value export zero.
In the case where being determined as that bulge quantity H is 2 permissible range in step S80,123 output calibration amount of correction unit, with
So that axial members C by suction nozzle 30 keep in the state of from the front end 36a of suction nozzle 30 protrude lead L bulge quantity H and
Poor Δ hb between aim parameter R becomes smaller.
(installation process)
Distinguishing lead L's when keeping axial members C by the suction nozzle 30 for being moved to elemental height Zns in changing production processing
In the case that bulge quantity H is the 2nd permissible range, that is, in the case where distinguishing the difference between bulge quantity H and aim parameter R is Δ hb,
To the position of the Z-direction of the suction nozzle 30 when suction nozzle 30 keeps axial members C at the PJa of component supply position in installation process
It is corrected.
Figure 33 is to indicate that suction nozzle 30 keeps the axial members C of electronic part feeder 200 in installation process
State figure.Control unit 124 exports control letter based on the correcting value exported from correction unit 123, to suction nozzle mobile device 140
Number, so that the bulge quantity H of the lead L of the axial members C kept at the PJa of component supply position by suction nozzle 30 becomes aim parameter
R。
For example, in changing production processing, in the case where distinguishing bulge quantity H difference Δ hb bigger than aim parameter R (H=R+ Δ hb),
If suction nozzle 30 is moved to based on the calibrated altitude Znr after poor Δ hb correction and is kept to axial members C, bulge quantity
H is close to aim parameter R.As shown in figure 33, if from after the value that elemental height Zns declines poor Δ hb calibrated altitude Znr (=
Zns- Δ hb) at axial members C is kept by suction nozzle 30, then bulge quantity H and aim parameter R can be made to coincide.
Control unit 124 finds out the calibrated altitude of the suction nozzle 30 in installation process based on the correcting value exported from correction unit 123
The position for keeping the Z-direction of the suction nozzle 30 when axial members C by suction nozzle 30 at the PJa of component supply position is adjusted to by Znr
Calibrated altitude Znr makes the suction nozzle 30 be kept (step S100) to axial members C.Suction nozzle 30 is at calibrated altitude Znr to electricity
The axial members C of subassembly feedway 200 is kept, and calibrated altitude Znr is indicated based on the control exported from control unit 124
The position for the Z-direction that signal processed is adjusted.Thereby, it is possible in the state that bulge quantity H is adjusted to aim parameter R, by suction nozzle
30 couples of axial members C are kept.
Mounting head 106 is moved to installation site PJb by control device 120, by the axial members C kept from suction nozzle 30 to base
Plate P installs (step S110).The lead L of axial members C is smoothly inserted into the hole of substrate P as a result,.
(changing other movements for producing processing)
In addition, in the case where being determined as bulge quantity H is 1 permissible range, pacifying in changing the step S80 for producing processing
Suction nozzle 30 keeps the height of the suction nozzle 30 when axial members C to be controlled as in dress processing, with the elemental height Zns changed in production processing
As identical.That is, signal output will be controlled from control unit 124 in a manner of " calibrated altitude Znr=elemental height Zns ".
In step S80, in the case where being determined as that the bulge quantity H of lead L is not at permissible range (step S80:No),
123 output calibration amount of correction unit, so that axial members C by suction nozzle 30 in the state of being kept from the front end 36a of suction nozzle 30
Poor Δ h (Δ hc) between the bulge quantity H and aim parameter R of the lead L of protrusion becomes smaller (step S120).
For example, calculated in calculation part 122 bulge quantity H be 2.0 [mm] in the case where, with its bulge quantity H and aim parameter R
Between the mode that becomes smaller of poor Δ hc correcting value is exported.Based on the correcting value exported, resets and set in step s 40
Elemental height Zns out is the elemental height Zns ' of different value.
Suction nozzle 30 is moved to the elemental height Zns ' reset out.It is moved to the suction nozzle 30 of elemental height Zns ', to electricity
The axial members C of subassembly feedway 200 is kept (step S130).
Later, return step S50 is executed change production processing again.That is, control device 120 retries portion 127 by based in step
The correcting value exported in rapid S120 the position of Z-direction is adjusted to the suction nozzle 30 after elemental height Zns ' to axial members C into
Row is kept, and detects detection device 10 again to the position of the lead L of the axial members C kept by the suction nozzle 30.
As described above, in the bulge quantity H and target of the lead L of the axial members C kept by the suction nozzle 30 of elemental height Zns
It measures in the poor biggish situation of Δ h (Δ hc) between R, executes change production processing again.By by the initial height reset out
The suction nozzle 30 of degree Zns ' keeps axial members C, so that the poor Δ h between the bulge quantity H and aim parameter R of lead L becomes
It is executed again in the state of small and changes production processing.
[effect]
As described above, according to the present embodiment, in changing production processing, to the Z-direction indicated under primary condition
Suction nozzle 30 position elemental height Zns and indicate the axial members C kept by suction nozzle 30 lead L position height
ZI is detected, and is based on its testing result, is calculated the bulge quantity H of the lead L protruded from the front end 36a of suction nozzle 30,
Based on its calculated result, in installation process, when by at the PJa of component supply position by the holding axial members C of suction nozzle 30
The related correcting value output in the position of the Z-direction of suction nozzle 30, finds out calibrated altitude Zns, therefore can be by the bulge quantity of lead L
H management is desired value.Therefore, axial members C can be installed well to substrate P.In addition, according to the present embodiment, i.e.,
Change the length of lead L, also can carry out well pipe to the bulge quantity H of the lead L protruded from the front end 36a of suction nozzle 30
Reason.
In addition, according to the present embodiment, 123 output calibration amount of correction unit, so that axial members C is kept by suction nozzle 30
In the state of from the front end 36a of suction nozzle 30 protrude lead L bulge quantity H and aim parameter R between poor Δ h become smaller.As a result,
Bulge quantity H and aim parameter R can be made to coincide.Therefore, further axial members C can be installed well to substrate P.
In addition, in the present embodiment, it is mobile from control unit 124 to suction nozzle based on the correcting value exported from correction unit 123
The output control signal of device 140, so that the axial part kept at the PJa of component supply position by suction nozzle 30 in installation process
The bulge quantity H of the lead L of part C becomes aim parameter R.Thereby, it is possible to the lead L of desired bulge quantity H is inserted into the hole of substrate P
In, axial members C can be installed well to substrate P.
In addition, in the present embodiment, will indicate the position of the Z-direction of the suction nozzle 30 detected by detection device 10
The wire locations data of the position of suction nozzle position data and the Z-direction of expression lead L are stored to storage unit 125.Therefore, it counts
Calculation portion 122 can successfully calculate bulge quantity H based on the difference between suction nozzle position data and wire locations data.
In addition, in the present embodiment, using determination unit to the bulge quantity H by the calculated lead L of calculation part 122 whether
Determined in permissible range, it is first by being reset out based on correcting value when being determined as that bulge quantity H is not at permissible range
Beginning height Zns ' export, using detection device 10 to the suction nozzle 30 after being adjusted to elemental height Zns ' by the position of Z-direction
It is detected again the position of the Z-direction of the lead L of the axial members C kept.As a result, by the bulge quantity H of lead L and
It in the state that poor Δ h between aim parameter R reduces, executes change production processing again, therefore include changing including the output of correcting value
The precision for producing processing improves.
Claims (10)
1. a kind of electronic component mounting apparatus, has:
Electronic part feeder supplies the axial members with lead；
Mounting head has the suction nozzle for being able to maintain the axial members；
Install head moving device, can make the mounting head comprising with from the electronic part feeder supply described in
In the predetermined surface of the opposite component supply position of axial members and the installation site opposite with the substrate for installing the axial members
It is mobile；
Suction nozzle mobile device can make the suction nozzle relative to the mounting head and the edge regulation side orthogonal with the predetermined surface
To movement；
Detection device is set to the mounting head, position to the suction nozzle of the prescribed direction under primary condition and
It is detected the position of the lead of the axial members kept by the suction nozzle；
Calculation part, based on the testing result of the detection device, to the lead protruded from the front end of the suction nozzle
Bulge quantity is calculated；And
Correction unit, based on the calculated result of the calculation part, output is directed at the component supply position by the suction nozzle
The correcting value of the position of suction nozzle when keeping the axial members.
2. electronic component mounting apparatus according to claim 1, wherein
The correction unit exports the correcting value, so that the axial members by the suction nozzle in the state of being kept from described
Difference between the bulge quantity and aim parameter of the lead of the front end protrusion of suction nozzle becomes smaller.
3. electronic component mounting apparatus according to claim 1 or 2, wherein
Has control unit, the control unit is based on the correcting value exported from the correction unit, the output control of Xiang Suoshu suction nozzle mobile device
Signal processed, so that the protrusion of the lead of the axial members kept at the component supply position by the suction nozzle
Amount becomes aim parameter,
The suction nozzle supplies the electronic component based on the control signal and at the position of the prescribed direction adjusted
It is kept to the axial members of device, the installation of Xiang Suoshu substrate.
4. electronic component mounting apparatus according to claim 1 or 2, wherein
Has storage unit, suction nozzle positional number of the storage unit to the position for the suction nozzle for indicating to be detected by the detection device
According to and indicate that the wire locations data of position of the lead are stored,
The calculation part calculates the bulge quantity based on the difference between the suction nozzle position data and the wire locations data.
5. electronic component mounting apparatus according to claim 3, wherein
Has storage unit, suction nozzle positional number of the storage unit to the position for the suction nozzle for indicating to be detected by the detection device
According to and indicate that the wire locations data of position of the lead are stored,
The calculation part calculates the bulge quantity based on the difference between the suction nozzle position data and the wire locations data.
6. electronic component mounting apparatus according to claim 1 or 2, wherein have:
Determination unit determines whether the bulge quantity by the calculated lead of the calculation part is in permissible range；
And
Portion is retried, when being determined as that the bulge quantity is not at the permissible range, makes the detection device to based on described
The position of the lead for the axial members that correcting value is kept the position of the prescribed direction suction nozzle adjusted
It sets, is detected again.
7. electronic component mounting apparatus according to claim 3, wherein have:
Determination unit determines whether the bulge quantity by the calculated lead of the calculation part is in permissible range；
And
Portion is retried, when being determined as that the bulge quantity is not at the permissible range, makes the detection device to based on described
The position of the lead for the axial members that correcting value is kept the position of the prescribed direction suction nozzle adjusted
It sets, is detected again.
8. electronic component mounting apparatus according to claim 4, wherein have:
Determination unit determines whether the bulge quantity by the calculated lead of the calculation part is in permissible range；
And
Portion is retried, when being determined as that the bulge quantity is not at the permissible range, makes the detection device to based on described
The position of the lead for the axial members that correcting value is kept the position of the prescribed direction suction nozzle adjusted
It sets, is detected again.
9. electronic component mounting apparatus according to claim 5, wherein have:
Determination unit determines whether the bulge quantity by the calculated lead of the calculation part is in permissible range；
And
Portion is retried, when being determined as that the bulge quantity is not at the permissible range, makes the detection device to based on described
The position of the lead for the axial members that correcting value is kept the position of the prescribed direction suction nozzle adjusted
It sets, is detected again.
10. a kind of electronic component mounting method, it includes following step:
In an initial condition, the position of suction nozzle is detected by the detection device for being set to mounting head, which can be
Base comprising the component supply position opposite with the axial members supplied from electronic part feeder and with installation axial members
It is moved in the predetermined surface of the opposite installation site of plate, which is set to the mounting head, can be along orthogonal with the predetermined surface
Direction it is mobile；
Under the primary condition, by the detection device to the position of the lead of the axial members kept by the suction nozzle
It is detected；
The position of position and the lead based on the suction nozzle detected by the detection device, to before the suction nozzle
The bulge quantity of the lead of end protrusion is calculated；
Based on the bulge quantity of the calculated lead, output keeps institute by the suction nozzle at the component supply position
The correcting value of the position of suction nozzle when stating axial members；
Based on the correcting value, to suction when keeping the axial members by the suction nozzle at the component supply position
The position of mouth is corrected, and is kept by the suction nozzle to the axial members；And
It will be installed from the axial members that the suction nozzle is kept to substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015027360A JP6479497B2 (en) | 2015-02-16 | 2015-02-16 | Electronic component mounting apparatus and electronic component mounting method |
| JP2015-027360 | 2015-02-16 |
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| CN105899063A CN105899063A (en) | 2016-08-24 |
| CN105899063B true CN105899063B (en) | 2019-11-08 |
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| CN201610087547.9A Active CN105899063B (en) | 2015-02-16 | 2016-02-16 | Electronic component mounting apparatus and electronic component mounting method |
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| CN (1) | CN105899063B (en) |
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| JP6534016B2 (en) | 2017-03-06 | 2019-06-26 | パナソニックＩｐマネジメント株式会社 | Component mounting apparatus and component mounting method |
| JP2019021709A (en) * | 2017-07-13 | 2019-02-07 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| EP3664590B1 (en) * | 2017-08-04 | 2022-06-29 | Fuji Corporation | Tape feeder |
| JP7181013B2 (en) * | 2018-06-20 | 2022-11-30 | Juki株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| CN109047580A (en) * | 2018-07-19 | 2018-12-21 | 苏州盟川自动化科技有限公司 | Braid material cuts off molding machine |
| CN108994211A (en) * | 2018-07-19 | 2018-12-14 | 苏州盟川自动化科技有限公司 | Cutting molding machine for braid material loader |
| CN108966629A (en) * | 2018-07-19 | 2018-12-07 | 苏州盟川自动化科技有限公司 | Power device for braid material loader |
| JP7145498B2 (en) * | 2018-10-15 | 2022-10-03 | パナソニックＩｐマネジメント株式会社 | Component mounting device and component mounting method |
| DE102021105594B3 (en) * | 2021-03-09 | 2022-06-09 | Asm Assembly Systems Gmbh & Co. Kg | Method for correcting the position of components with a recording device, recording device, computer program product and computer-readable medium |
| CN112938490B (en) * | 2021-03-17 | 2023-02-17 | 苏州华兴源创科技股份有限公司 | Suction nozzle spacing adjusting method and system |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6479497B2 (en) | 2019-03-06 |
| JP2016152245A (en) | 2016-08-22 |
| CN105899063A (en) | 2016-08-24 |
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