CN105898113B - Image collection module and its assemble method - Google Patents
Image collection module and its assemble method Download PDFInfo
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- CN105898113B CN105898113B CN201410191478.7A CN201410191478A CN105898113B CN 105898113 B CN105898113 B CN 105898113B CN 201410191478 A CN201410191478 A CN 201410191478A CN 105898113 B CN105898113 B CN 105898113B
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Abstract
A kind of image collection module and its assemble method.The top of image sensing chip has one by first level upper surface resulting after the level correction of a LASER Light Source.The top of filter element has one by the second upper horizontal surface resulting after the level correction of LASER Light Source, and distance definition of the second upper horizontal surface of filter element at a distance of the first level upper surface of image sensing chip is a default fixed focussing distance.Moveable mirror head assembly is set directly in the second upper horizontal surface of filter element, to save focusing time of the moveable mirror head assembly relative to image sensing chip.The first level upper surface of image sensing chip and the second upper horizontal surface of filter element are parallel to each other, to increase assembling flatness of the moveable mirror head assembly relative to image sensing chip.
Description
Technical field
The present invention relates to a kind of image collection module and its assemble method, and espespecially one kind saves the focusing time and increase is smooth
The image collection module and its assemble method of degree.
Background technology
In recent years, the trend that there is image extraction module to be equipped with for such as mobile phone, PDA handheld apparatus is more prevalent,
And along with the market demand that the handheld device functional requirement of product market is more preferable and volume is smaller, image extraction module has faced
To higher-definition and the double requirements of miniaturization.On the one hand it is to improve pixel, market becomes for the lifting of image extraction module image quality
Gesture be by 30 pixels of former VGA grades, it is progressive to common two mega pixels, three mega pixels on the market at present, more very
Person has released ranks more than eight mega pixels of greater degree.On the other hand it is to be concerned about capture in addition to the lifting of pixel
Definition, therefore the image extraction module of handheld apparatus is also by focusing capture function towards the auto-optical focusing work(of similar camera
Even can, be optical zoom function development.
The operating principle of auto-optical focusing function be according to subject matter difference it is remote, closely, taken with suitably movement
As the camera lens in module, so cause capture target object optical imagery be able to focus on exactly on the image sensor, with
Produce clearly image.With general at present common to the activation manners that camera lens movement is driven in image extraction module, it includes step
Enter the modes such as motor actuated, piezoelectric actuated and voice coil motor (Voice Coil Motor, VCM) actuating.However, taken when known
When sequentially being stacked thereon as stacking reference plane with circuit board as the imaging sensor in module and support, it will cause support
It is excessive relative to the assembling inclination angle of imaging sensor, cause the image quality accessed by known image extraction module can not obtain effectively
Improvement.Additionally, it is known that image extraction module relative to imaging sensor used by artificial focusing can expend many times.
The content of the invention
The embodiment of the present invention is to provide a kind of image collection module and its group saved the focusing time and increase flatness
Dress method, it can be effectively solved " when the imaging sensor in known image extraction module and support are used as stacking reference plane using circuit board
And when sequentially stacking thereon, it will cause support excessive relative to the assembling inclination angle of imaging sensor, cause known image extraction module
Accessed image quality can not be improved " and " used by known image extraction module is relative to imaging sensor
Artificial focusing can expend many times " the defects of.
A kind of image collection module saved the focusing time and increase flatness that a wherein embodiment of the invention is provided,
It includes：One image sensing unit, a frame case, an actuator structure and a filter element.Described image sensing unit bag
Include a bearing substrate and one be arranged on the bearing substrate and be electrically connected at the image sensing chip of the bearing substrate, its
Described in image sensing chip top have one pass through after the level correction of a LASER Light Source obtained by first level upper table
Face.The frame case is arranged on the bearing substrate and surrounds described image sensor chip.The actuator structure is set
In the frame case and positioned at the top of described image sensor chip, wherein the actuator structure is arranged on institute including one
State the lens bearing seat in frame case and one be arranged in the lens bearing seat and positioned at the upper of described image sensor chip
The moveable mirror head assembly of side, the inside of the lens bearing seat have one to surround shape movable piece, the moveable mirror head assembly
It is described in shape movable piece to be fixed on by least two fixation colloids, and the moveable mirror head assembly is enclosed by described
Around the drive of shape movable piece to be movably disposed in the lens bearing seat.The filter element is arranged on the frame shell
On body and between described image sensor chip and the moveable mirror head assembly, wherein the top of the filter element has
One by the second upper horizontal surface obtained by after the level correction of the LASER Light Source, and described the second of the filter element
Distance definition of the upper horizontal surface at a distance of the first level upper surface of described image sensor chip is a default fixed tune
Defocus distance.Wherein, the moveable mirror head assembly is set directly in second upper horizontal surface of the filter element, with
Save focusing time of the moveable mirror head assembly relative to described image sensor chip.Wherein, described image sensor chip
The first level upper surface and second upper horizontal surface of the filter element it is parallel to each other, with can described in increase
Moving lens component relative to described image sensor chip assembling flatness.
A kind of image collection module saved the focusing time and increase flatness that the other embodiment of the present invention is provided,
It includes：One image sensing unit, a frame case, an actuator structure and a filter element.Described image sensing unit bag
Include a bearing substrate and one be arranged on the bearing substrate and be electrically connected at the image sensing chip of the bearing substrate, its
Described in the top of image sensing chip there is a first level upper surface.The frame case is arranged on the bearing substrate
And surround described image sensor chip.The actuator structure is arranged in the frame case and positioned at described image sensing core
The top of piece, wherein the actuator structure includes a lens bearing seat and one being arranged in the frame case movably
It is arranged in the lens bearing seat and positioned at the moveable mirror head assembly of the top of described image sensor chip.The member that filters
Part is arranged in the frame case and between described image sensor chip and the moveable mirror head assembly, wherein described
The top of filter element has one second upper horizontal surface, and second upper horizontal surface of the filter element is at a distance of described
The distance definition of the first level upper surface of image sensing chip is a default fixed focussing distance.Wherein, it is described can
Moving lens component is set directly in second upper horizontal surface of the filter element, to save the movable lens
Component relative to described image sensor chip the focusing time.Wherein, the first level upper table of described image sensor chip
Face and second upper horizontal surface of the filter element are parallel to each other, to increase the moveable mirror head assembly relative to institute
State the assembling flatness of image sensing chip.
A kind of image for saving the focusing time and increasing flatness that another embodiment in addition of the invention is provided obtains mould
The assemble method of block, it comprises the following steps：An image sensing unit and a frame case are provided, wherein described image sensing is single
Member is arranged on the bearing substrate including a bearing substrate and one and is electrically connected at the image sensing core of the bearing substrate
Piece, and the frame case is arranged on the bearing substrate and surrounds described image sensor chip；Described image sensor chip
By the level correction of a LASER Light Source, to obtain a first level upper table on the top of described image sensor chip
Face；One filter element is arranged in the frame case and positioned at the surface of described image sensor chip；The member that filters
Part is by the level correction of the LASER Light Source, to obtain a second horizontal upper table on the top of the filter element
Face, wherein the first level upper table of second upper horizontal surface of the filter element at a distance of described image sensor chip
The distance definition in face is a default fixed focussing distance；An actuator structure is provided, wherein the actuator structure is arranged on
In the frame case and positioned at described image sensor chip top, wherein the actuator structure include one be arranged on described in
Lens bearing seat and one in frame case are arranged in the lens bearing seat and positioned at the top of described image sensor chip
Moveable mirror head assembly, and the inside of the lens bearing seat has and one surrounds shape movable piece, wherein the movable lens
Component is set directly in second upper horizontal surface of the filter element, relative to save the moveable mirror head assembly
In the focusing time of described image sensor chip, and the first level upper surface of described image sensor chip and the optical filtering
Second upper horizontal surface of element is parallel to each other, and core is sensed relative to described image to increase the moveable mirror head assembly
The assembling flatness of piece；And colloid is fixed by least two, the moveable mirror head assembly is fixed on described surround
In shape movable piece, wherein the movable lens component is by the drive around shape movable piece, to be movably disposed in
In the lens bearing seat.
Beneficial effects of the present invention can be, the image collection module and its assembling side that the embodiment of the present invention is provided
Method, it can be by the way that " top of described image sensor chip has one by the obtained by after the level correction of a LASER Light Source
One upper horizontal surface, the top of the filter element have one by second obtained by after the level correction of the LASER Light Source
Upper horizontal surface, and the first level upper surface of described image sensor chip and second level of the filter element
Upper surface is parallel to each other " design, effectively to reduce group of the moveable mirror head assembly relative to described image sensor chip
Inclination angle is filled, thereby to ensure planarization of the moveable mirror head assembly relative to described image sensor chip.Therefore, when described
Distance quilt of second upper horizontal surface of filter element at a distance of the first level upper surface of described image sensor chip
When being defined previously as a default fixed focussing distance, the moveable mirror head assembly can is set directly at the member that filters
In second upper horizontal surface of part, thereby to save the moveable mirror head assembly relative to described image sensor chip
Focus the time.
For the enabled feature and technology contents for being further understood that the present invention, refer to below in connection with the present invention specifically
Bright and accompanying drawing, but institute's accompanying drawings are only provided and used with reference to explanation, are not used for the present invention person of being any limitation as.
Brief description of the drawings
Fig. 1 is that the present invention saves the focusing time and increases the flow chart of the assemble method of the image collection module of flatness.
Fig. 2 is step S100 and S102 of the present invention side elevational cross-section schematic diagram.
Fig. 3 is step S104 and S106 of the present invention side elevational cross-section schematic diagram.
Fig. 4 is step S108 and S110 of the present invention side elevational cross-section schematic diagram.
【Symbol description】
Image collection module M
Image sensing unit 1
Bearing substrate 10
Image sensing chip 11
First level upper surface 110
Frame case 2
Top end opening 200
Actuator structure 3
Lens bearing seat 30
It is interior to surround surface 300
Moveable mirror head assembly 31
Bottom plane 310
Outside surface 311
Around shape movable piece 30M
Filter element 4
Second upper horizontal surface 400
Fixed colloid H
LASER Light Source S
Precalculated position P
First laser light beam L1
First the reflected beams R1
Second laser light beam L2
Second the reflected beams R2
Fixed focussing distance D
Focussing distance F
Embodiment
Below by way of specific instantiation illustrate it is presently disclosed " save focusing the time and increase flatness image
The embodiment of acquisition module and its assemble method ", one of ordinary skill in the art can be as the contents disclosed by this specification
It will readily appreciate that other advantages and effect of the present invention.The present invention can also be implemented by other different specific embodiments or should
With the various details in this specification may be based on different viewpoints and application, various in lower progress without departing from the spirit
Modification and change.The schema of the present invention is only to briefly describe again, is not described according to actual size, namely unreacted goes out related composition
Actual size, first give chat it is bright.The correlation technique content of the present invention is further described in following embodiment, but not uses
With the technology category of the limitation present invention.
Refer to shown in Fig. 1 to Fig. 4, the present invention provides a kind of image for saving the focusing time and increasing flatness and obtains mould
Block M assemble method, it generally may include following several steps：
First, step S100 is：Coordinate shown in Fig. 1 and Fig. 2, there is provided an image sensing unit 1 and a frame case 2, its
Middle image sensing unit 1 is arranged on bearing substrate 10 including a bearing substrate 10 and one and is electrically connected at bearing substrate 10
Image sensing chip 11, and frame case 2 is arranged on bearing substrate 10 and surrounds image sensing chip 11.For example,
As shown in Fig. 2 image sensing chip 11 can be cmos image sensor chip, and image sensing chip 11 can pass through adhesion colloid
(non-label, such as UV adhesion glues, thermmohardening glue or oven curing glue etc.), to be arranged on bearing substrate 10.In addition, frame
Frame housing 2 also can be by adhesion colloid (such as UV adhesion glues, thermmohardening glue or oven curing glue etc.), to be arranged on carrying
On substrate 10.In addition, bearing substrate 10 can be the circuit substrate that a upper surface has multiple conductive welding pads (non-label), image sense
The upper surface for surveying chip 11 has multiple conductive welding pads (non-label), and each conductive welding pad of image sensing chip 11 can
By a conductor wire (non-label), to be electrically connected at the conductive welding pad of bearing substrate 10, thereby to reach image sensing chip
Electrically conducting between 11 and bearing substrate 10.
Then, step S102 is：Coordinate shown in Fig. 1 and Fig. 2, the level that image sensing chip 11 passes through a LASER Light Source S
Correction, to obtain a first level upper surface 110 on the top of image sensing chip 11.For further, laser
Light source S is arranged on a precalculated position P (such as fixed position) of the top of image sensing chip 11, for producing always
Meet first laser light beam L1 of the perpendicular projection on the first level upper surface 110 of image sensing chip 11.LASER Light Source S is produced
Raw first laser light beam L1 can be direct to form one by the reflection of the first level upper surface 110 of image sensing chip 11
Perpendicular projection precalculated position P first the reflected beams R1 on the P of precalculated position or closely.In other words, when image sensing core
When the top of piece 11 is adjusted to horizontality, produced by reflections of the first laser light beam L1 by the top of image sensing chip 11
The first the reflected beams R1 directly will vertically be back on the P of precalculated position, or the first the reflected beams R1 can produce one
It may be allowed the deflection in error range and very close precalculated position P.Now, the top of image sensing chip 11 be exactly can conduct
The first level upper surface 110 of level reference.
Then, step S104 is：Coordinate shown in Fig. 1 and Fig. 3, a filter element 4 is arranged in frame case 2 and is located at
The surface of image sensing chip 11.For further, as shown in figure 3, the top of frame case 2 has one to be located at image sense
The top end opening 200 of the surface of chip 11 is surveyed, and the top end opening 200 of frame case 2 is closed by filter element 4.Lift
For example, filter element 4 can be the flat glass plate that a surface is coated with infrared resistant (IR) layer and/or antireflection (AR) layer,
And filter element 4 can by multiple first adhesion colloids (non-label), to be fixed in a dented space of frame case 2,
With the top end opening 200 of closed frame housing 2.
And then, step S106 is：Coordinate shown in Fig. 1 and Fig. 3, filter element 4 by LASER Light Source S level correction,
To obtain second upper horizontal surface 400 on the top of filter element 4, the wherein horizontal upper table of the second of filter element 4
Distance definition of the face 400 at a distance of the first level upper surface 110 of image sensing chip 11 is a default fixed focussing distance D.
Further for, LASER Light Source S (such as laser leveler) is arranged on the precalculated position P of the top of filter element 4, with
In second laser light beam L2 of the one direct perpendicular projection of generation in the second upper horizontal surface 400 of filter element 4.LASER Light Source
Second laser light beam L2 caused by S can be direct to form one by the reflection of the second upper horizontal surface 400 of filter element 4
Perpendicular projection precalculated position P second the reflected beams R2 on the P of precalculated position or closely.In other words, when filter element 4
When top is adjusted to horizontality, second laser light beam L2 passes through the second reflection caused by the reflection on the top of filter element 4
Light beam R2 directly will be vertically back on the P of precalculated position, or the second the reflected beams R2 can produce one in tolerable error
In the range of deflection and very close precalculated position P.Now, the top of filter element 4 will be formed in parallel with first level
Second upper horizontal surface 400 on surface 110.
It is noted that first laser light beam L1 caused by LASER Light Source S can also tilt to be incident upon image sense
Survey on the first level upper surface 110 of chip 11, and second laser light beam L2 caused by LASER Light Source S can also be tilted
It is incident upon in the second upper horizontal surface 400 of filter element 4, as long as enable to that " first laser light beam L1 passes through image sense
Survey the first the reflected beams R1 " and " top that second laser light beam L2 passes through filter element 4 caused by the reflection on the top of chip 11
The mode that second the reflected beams R2 " caused by the reflection at end can be reflexed in same point, also can reach " image sensing chip 11
Top and the top of filter element 4 can be parallel to each other, to increase moveable mirror head assembly 31 relative to image sensing chip 11
Assembling flatness " purpose.
Then, step S108 is：Coordinate shown in Fig. 1 and Fig. 3, there is provided an actuator structure 3, wherein actuator structure 3 are set
Put in frame case 2 and be arranged on frame case including one positioned at the top of image sensing chip 11, wherein actuator structure 3
Lens bearing seat 30 (lens holder) and one on 2 are arranged in lens bearing seat 30 and positioned at image sensing chip 11
The moveable mirror head assembly 31 of top, and the inside of lens bearing seat 30 has one to surround shape movable piece 30M, wherein removable
Lens assembly 31 is set directly in the second upper horizontal surface 400 of filter element 4, relative to save moveable mirror head assembly 31
In the focusing time of image sensing chip 11, and the of the first level upper surface 110 of image sensing chip 11 and filter element 4
Two upper horizontal surfaces 400 are parallel to each other, with increase " being set directly in the second upper horizontal surface 400 of filter element 4 " can
Moving lens component 31 relative to image sensing chip 11 assembling flatness.Thereby, due to the first of image sensing chip 11
Upper horizontal surface 110 and the second upper horizontal surface 400 of filter element 4 can be parallel to each other, so working as moveable mirror head assembly 31
When being set directly in the second upper horizontal surface 400 of filter element 4, the present invention not only can effectively reduce movable lens group
Part 31 relative to image sensing chip 11 assembling inclination angle, to ensure moveable mirror head assembly 31 relative to image sensing chip
11 planarization, and can also save focusing time of the moveable mirror head assembly 31 relative to image sensing chip 11.
For further, the bottom of moveable mirror head assembly 31 has second level for directly contacting filter element 4
The bottom plane 310 of upper surface 400, the bottom plane 310 of moveable mirror head assembly 31 is at a distance of the first of image sensing chip 11
One focussing distance F of upper horizontal surface 110 can be fully or substantially upper equal to " the second upper horizontal surface 400 of filter element 4 is apart
The default fixed focussing distance D of the first level upper surface 110 " of image sensing chip 11.
For example, around surface 300 and an outside of moveable mirror head assembly 31 in the one of shape movable piece 30M
Surface 311 is all no thread surface.Lens bearing seat 30 and can by adhesion colloid (such as UV adhesion glues, thermmohardening glue,
Or oven curing glue etc.), to be arranged in frame case 2, and moveable mirror head assembly 31 can be by multiple optical lenses (not
Label) formed.In addition, it is noted that as shown in figure 4, actuator structure 3 can be a voice coil actuator (voice
coil actuator).However, the present invention is not limited, actuator structure 3 of the invention one can also have and fix
The optics supplementary structure of formula lens assembly substitutes.
Finally, step S110 is：Coordinate shown in Fig. 1 and Fig. 4, in " the first level upper surface 110 of image sensing chip 11
It is parallel to each other with the second upper horizontal surface 400 of filter element 4 " and " moveable mirror head assembly 31 is set directly at filter element 4
The second upper horizontal surface 400 on " in the case of, can by least two fix colloid H, moveable mirror head assembly 31 is consolidated
It is scheduled in shape movable piece 30M, wherein moveable mirror head assembly 31 can be by the drive around shape movable piece 30M, that can live
It is arranged on dynamicly in lens bearing seat 30.
Thereby, by above-mentioned steps S100 to step S110 disclosed by assembling mode, the present invention can provide one kind and save
The image collection module M for time and the increase flatness of focusing, it includes：One image sensing unit 1, a frame case 2, one actuating
After the filter element 4 of device structure 3 and one, the wherein top of image sensing chip 11 have a level correction by LASER Light Source S
Resulting first level upper surface 110, and the top of filter element 4 is with after a level correction by LASER Light Source S
The second resulting upper horizontal surface 400.Therefore, when the second upper horizontal surface 400 of filter element 4 is at a distance of image sensing core
The distance of the first level upper surface 110 of piece 11 be predefined for a default fixed focussing distance D when, movable lens group
The can of part 31 is set directly in the second upper horizontal surface 400 of filter element 4, thereby to save moveable mirror head assembly 31
Relative to the focusing time of image sensing chip 11, and the first level upper surface 110 of image sensing chip 11 is first with filtering
Second upper horizontal surface 400 of part 4 can be parallel to each other, to increase moveable mirror head assembly 31 relative to image sensing chip 11
Assemble flatness.
(the possibility effect of embodiment)
In summary, beneficial effects of the present invention can be, image collection module M that the embodiment of the present invention is provided and
Its assemble method, it can be by the way that " top of image sensing chip 11 has one by resulting after LASER Light Source S level correction
First level upper surface 110, the top of filter element 4 has one by the obtained by after LASER Light Source S level correction
Two upper horizontal surfaces 400, and the first level upper surface 110 of image sensing chip 11 and the second horizontal upper table of filter element 4
Face 400 is parallel to each other " design, inclined with effectively reducing moveable mirror head assembly 31 relative to the assembling of image sensing chip 11
Angle, thereby to ensure planarization of the moveable mirror head assembly 31 relative to image sensing chip 11.Therefore, when filter element 4
Distance of second upper horizontal surface 400 at a distance of the first level upper surface 110 of image sensing chip 11 is predefined pre- for one
If fixation focussing distance D when, the can of moveable mirror head assembly 31 is set directly at the second upper horizontal surface of filter element 4
On 400, thereby to save focusing time of the moveable mirror head assembly 31 relative to image sensing chip 11.
It the foregoing is only the preferred possible embodiments of the present invention, non-therefore the limitation present invention the scope of the claims, therefore such as
The equivalence techniques done with description of the invention and schema content changes, and is both contained in protection scope of the present invention.
Claims (10)
1. a kind of image collection module, it is characterised in that described image acquisition module includes：
One image sensing unit, described image sensing unit is arranged on including a bearing substrate and one on the bearing substrate and electricity
Property be connected to the image sensing chip of the bearing substrate, the wherein top of described image sensor chip has one to pass through a laser
First level upper surface obtained by after the level correction of light source；
One frame case, the frame case are arranged on the bearing substrate and surround described image sensor chip；
One actuator structure, the actuator structure are arranged in the frame case and positioned at the upper of described image sensor chip
Side, wherein the actuator structure is arranged on the camera lens including a lens bearing seat being arranged in the frame case and one
In load bearing seat and positioned at the moveable mirror head assembly of the top of described image sensor chip, the inside of the lens bearing seat has
One surrounds shape movable piece, and the moveable mirror head assembly is fixed on by least two fixation colloids and described surrounds shape movable piece
It is interior, and the moveable mirror head assembly can be movably arranged as the camera lens carrying by the drive around shape movable piece
In seat；And
One filter element, the filter element be arranged in the frame case and positioned at described image sensor chip with it is described can
Between moving lens component, wherein the top of the filter element has one as obtained by after the level correction of the LASER Light Source
The second upper horizontal surface arrived, and second upper horizontal surface of the filter element is at a distance of the institute of described image sensor chip
The distance definition for stating first level upper surface is a default fixed focussing distance；
Wherein, the moveable mirror head assembly is set directly in second upper horizontal surface of the filter element, to save
Go focusing time of the moveable mirror head assembly relative to described image sensor chip；
Wherein, the first level upper surface of described image sensor chip and the described second horizontal upper table of the filter element
It is parallel to each other after the level correction twice that face passes through the LASER Light Source, to increase the moveable mirror head assembly relative to institute
State the assembling flatness of image sensing chip.
2. image collection module according to claim 1, it is characterised in that the top of the frame case has one to be located at
Top end opening between described image sensor chip and the moveable mirror head assembly, and the top of the frame case is opened
Mouth is closed by the filter element, wherein the bottom of the movable lens component has one directly to contact the filter element
Second upper horizontal surface bottom plane, the bottom plane of the moveable mirror head assembly is at a distance of described image sense
The focussing distance for surveying the first level upper surface of chip is equal to the second upper horizontal surface phase of the filter element
The default fixed focussing distance of the first level upper surface away from described image sensor chip, and it is described can around shape
It is all no thread surface that surface and an outside surface of the moveable mirror head assembly are surrounded in the one of moving part.
3. image collection module according to claim 1, it is characterised in that the LASER Light Source is arranged on described image sense
Survey on a precalculated position of the top of chip, for producing first water for being directly incident upon described image sensor chip
First laser light beam on flat upper surface, the first laser light beam caused by the LASER Light Source are sensed by described image
The reflection of the first level upper surface of chip and form one and be directly incident upon on the precalculated position or very close described
First the reflected beams in precalculated position.
4. image collection module according to claim 1, it is characterised in that the LASER Light Source is arranged on the member that filters
On one precalculated position of the top of part, for producing second upper horizontal surface for being directly incident upon the filter element
On second laser light beam, the second laser light beam caused by the LASER Light Source pass through the filter element described
The reflection of two upper horizontal surfaces and formed one be directly incident upon on the precalculated position or the very close precalculated position the
Two the reflected beams.
5. a kind of image collection module, it is characterised in that described image acquisition module includes：
One image sensing unit, described image sensing unit is arranged on including a bearing substrate and one on the bearing substrate and electricity
Property be connected to the image sensing chip of the bearing substrate, the wherein top of described image sensor chip has in a first level
Surface；
One frame case, the frame case are arranged on the bearing substrate and surround described image sensor chip；
One actuator structure, the actuator structure are arranged in the frame case and positioned at the upper of described image sensor chip
Side, wherein the actuator structure can be movably arranged as including a lens bearing seat being arranged in the frame case and one
In the lens bearing seat and positioned at the moveable mirror head assembly of the top of described image sensor chip；And
One filter element, the filter element be arranged in the frame case and positioned at described image sensor chip with it is described can
Between moving lens component, wherein the top of the filter element has one second upper horizontal surface, and the filter element
Distance definition of second upper horizontal surface at a distance of the first level upper surface of described image sensor chip is default for one
Fixation focussing distance；
Wherein, the moveable mirror head assembly is set directly in second upper horizontal surface of the filter element, to save
Go focusing time of the moveable mirror head assembly relative to described image sensor chip；
Wherein, the first level upper surface of described image sensor chip and the described second horizontal upper table of the filter element
It is parallel to each other after the level correction twice that face passes through the LASER Light Source, to increase the moveable mirror head assembly relative to institute
State the assembling flatness of image sensing chip.
6. image collection module according to claim 5, it is characterised in that the top of the frame case has one to be located at
Top end opening between described image sensor chip and the moveable mirror head assembly, and the top of the frame case is opened
Mouth is closed by the filter element, wherein the bottom of the movable lens component has one directly to contact the filter element
Second upper horizontal surface bottom plane, and the bottom plane of the moveable mirror head assembly is at a distance of described image
One focussing distance of the first level upper surface of sensor chip is equal to second upper horizontal surface of the filter element
The default fixed focussing distance at a distance of the first level upper surface of described image sensor chip.
7. a kind of assemble method of image collection module, it is characterised in that under the assemble method of described image acquisition module includes
Row step：
An image sensing unit and a frame case are provided, wherein described image sensing unit includes a bearing substrate and a setting
On the bearing substrate and the image sensing chip of the bearing substrate is electrically connected at, and the frame case is arranged on institute
State on bearing substrate and surround described image sensor chip；
Described image sensor chip obtains a top for being located at described image sensor chip by the level correction of a LASER Light Source
First level upper surface on end；
One filter element is arranged in the frame case and positioned at the surface of described image sensor chip；
The filter element obtains one on the top of the filter element by the level correction of the LASER Light Source
Second upper horizontal surface, wherein second upper horizontal surface of the filter element is at a distance of described in described image sensor chip
The distance definition of first level upper surface is a default fixed focussing distance；
An actuator structure is provided, wherein the actuator structure is arranged in the frame case and sensed positioned at described image
The top of chip, wherein the actuator structure is arranged on including a lens bearing seat being arranged in the frame case and one
The lens bearing seat is interior and is located at the moveable mirror head assembly of the top of described image sensor chip, and the lens bearing seat
Inside have and one surround shape movable piece, wherein the movable lens component is set directly at described the of the filter element
In two upper horizontal surfaces, to save focusing time of the moveable mirror head assembly relative to described image sensor chip, and institute
State the first level upper surface of image sensing chip pass through with second upper horizontal surface of the filter element it is described
It is parallel to each other after the level correction twice of LASER Light Source, is sensed with increasing the moveable mirror head assembly relative to described image
The assembling flatness of chip；And
The moveable mirror head assembly is fixed on by least two fixation colloids it is described in shape movable piece, wherein described
Moveable mirror head assembly can be movably arranged as in the lens bearing seat by the drive around shape movable piece.
8. the assemble method of image collection module according to claim 7, it is characterised in that the top of the frame case
Top end opening with one between described image sensor chip and the moveable mirror head assembly, and the frame case
The top end opening is closed by the filter element, wherein the bottom of the movable lens component has one directly to contact institute
The bottom plane of second upper horizontal surface of filter element is stated, the bottom plane of the moveable mirror head assembly is apart
One focussing distance of the first level upper surface of described image sensor chip is equal to second water of the filter element
Flat upper surface is at a distance of the default fixed focussing distance of the first level upper surface of described image sensor chip, and institute
It is all no thread surface to state and surface and an outside surface of the moveable mirror head assembly are surrounded in the one of shape movable piece.
9. the assemble method of image collection module according to claim 7, it is characterised in that the LASER Light Source is arranged on
On one precalculated position of the top of described image sensor chip, described image sensor chip is directly incident upon for producing one
First laser light beam on the first level upper surface, the first laser light beam caused by the LASER Light Source pass through institute
State the reflection of the first level upper surface of image sensing chip and formed one be directly incident upon it is on the precalculated position or non-
Very close to first the reflected beams in the precalculated position.
10. the assemble method of image collection module according to claim 7, it is characterised in that the LASER Light Source is set
On a precalculated position of the top of the filter element, for produce one be directly incident upon the filter element described the
Second laser light beam in two upper horizontal surfaces, the second laser light beam caused by the LASER Light Source pass through the optical filtering
The reflection of second upper horizontal surface of element and form one and be directly incident upon on the precalculated position or very close described
Second the reflected beams in precalculated position.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI768106B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module、system and manufacturing method thereof |
| TWI768105B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, system and manufacturing method thereof |
| TWI768103B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module、system and manufacturing method thereof |
| TWI768102B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, system and manufacturing method thereof |
| TWI768128B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
| TWI768127B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, optical image system and optical image capturing manufacture method |
| TWI768125B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| CN111464751B (en) * | 2020-05-14 | 2021-10-26 | 歌尔光学科技有限公司 | Focusing method, focusing apparatus, and readable storage medium |
| CN112616003B (en) * | 2020-12-30 | 2022-05-06 | 维沃移动通信有限公司 | Camera module and electronic equipment |
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